Abstract: Disclosed is a substrate processing apparatus, a substrate processing method and a computer-readable medium capable of recovering an extended amount of discharged solution from a processing unit thereby reducing the amount of deionized water for the processing and the cost. The substrate processing apparatus includes, inter alia, a first and second discharge solution lines each connected to a downstream side of a discharge unit, and the discharged solution from each of the first and second discharge solution lines is independently delivered to the processing solution supply unit as a recovered solution. Also, the substrate processing apparatus includes a converting unit that converts flow of the discharged solution from the discharge unit either to the first discharge solution line or to the second discharge solution line. The processing solution supply unit selectively delivers the recovered solution from the first and second discharge solution lines to the processing unit.

Abstract: In an example embodiment, a linear wet system includes a carrier and a proximity head in a chamber. The proximity head includes three sections in a linear arrangement. The first section suctions liquid from the upper surface of a semiconductor wafer as the wafer is transported by the carrier under the proximity head. The second section is configured to cause a film (or meniscus) of cleaning foam which is a non-Newtonian fluid to flow onto the upper surface of the wafer. The third section is configured to cause a film of rinsing fluid to flow onto the upper surface of the wafer as the wafer is carried under the proximity head. The third section is defined partially around the second section and up to the first section, so that the third section and the first section create a confinement of the cleaning foam with respect to the chamber.

Abstract: A process for treating the surface of a substrate in the manufacture of a semiconductor device. The process comprises providing a concentrated acid or base, a peroxide and water, and delivering the acid or base, the peroxide and the water to the surface of the substrate. The acid or base and the water are delivered separately to the surface of the substrate and allowed to mix on the surface, and the water is delivered in pulses. The present invention also provides an apparatus adapted to carry out this process.

Abstract: A substrate cleaning system has a first processing apparatus including a first holding device for holding a substrate, and a treatment solution supply device for supplying onto the entire portion of the front surface of the substrate a treatment solution which includes a volatile component and solidifies or is cured to form a treatment film, and a second processing apparatus including a second holding device for holding the substrate, and a removal-solution supply device for supplying onto the substrate a removal solution which removes the treatment film formed on the front surface of the substrate after the treatment solution supplied by the treatment solution supply device solidifies or is cured.

Abstract: The device is suitable in particular for treating medical endoscopes. At least one treatment fluid is fed through a conduit system (3) to a channel attachment (4), to which a channel of the instrument to be treated can be attached. The conduit system has a fluid attachment (39), which can be connected to a source of treatment fluid. With the aid of a measuring device, the flow of the treatment fluid in the conduit system, and thus the permeability of the attached channel, can be measured. The measurement is effected with the aid of a measurement section (6) in which a flow sensor (7, 7?) is arranged. All the treatment steps are carried out via the conduit system and in particular also via the measurement section. In this way, the conduit system is subjected to the same process as the instrument to be treated, and a flow measurement can be carried out in each individual treatment step.

Abstract: Embodiments of the present invention generally relate to a method and apparatus for ex-situ cleaning of a chamber component part. In one embodiment, a system for cleaning component parts in a cleaning chemistry is provided. The system comprises a wet bench set-up comprising a cleaning vessel assembly for holding one or more component parts to be cleaned during a cleaning process and a detachable cleaning cart detachably coupled with the cleaning vessel assembly for supplying one or more cleaning chemistries to the cleaning vessel assembly during the cleaning process.

Abstract: A rinsing liquid (DIW) is discharged from a rinsing liquid discharge port formed in a blocking member to perform rinsing processing to a substrate surface while a nitrogen gas is supplied into a clearance space, and a liquid mixture (IPA+DIW) is discharged from a liquid mixture discharge port formed in the blocking member to replace the rinsing liquid adhering to the substrate surface with the liquid mixture while the nitrogen gas is supplied into the clearance space. Thus, an increase of the dissolved oxygen concentration of the liquid mixture can be suppressed upon replacing the rinsing liquid adhering to the substrate surface with the liquid mixture, which makes it possible to securely prevent from forming an oxide film or generating watermarks on the substrate surface.

Abstract: Disclosed is a liquid processing apparatus and a liquid processing method, which can process an entire wafer at a sufficiently high temperature and can sufficiently suppress adhesion of particles on a surface of the wafer, when the peripheral portion of the wafer is processed. The liquid processing apparatus includes a holding part to hold the substrate, a rotation driving part to rotate the holding part, and a shield unit. The shield unit includes an opposed plate opposed to the substrate held by the holding part, a heating part to heat the substrate through the opposed plate, and a heated gas supplying part to supply heated gas to a surface of the substrate held by the holding part.

Abstract: An apparatus for cleaning and conditioning the surface of a semiconductor substrate such as wafer includes a rotatable chuck, a chamber, a rotatable tray for collecting cleaning solution with one or more drain outlets, multiple receptors for collecting multiple cleaning solutions, a first motor to drive chuck, and a second motor to drive the tray. The drain outlet in the tray can be positioned directly above its designated receptor located under the drain outlet. The cleaning solution collected by the tray can be guided into designated receptor. One characteristic of the apparatus is having a robust and precisely controlled cleaning solution recycle with minimum cross contamination.

Abstract: A part washing device includes an air inlet; a first valve to regulate air coming into the washing device through the air inlet; a liquid inlet; a second valve to regulate liquid entering the washing device through the liquid inlet; a connector to receive air and liquid from the first valve and the second valve; and a tube to receive the liquid and/or air from the connector and direct the air and/or liquid towards a portion of the part.

Abstract: A substrate processing apparatus includes a chamber configured to dispose a substrate to be processed with a substrate holder, a spin chuck to rotate the substrate, a gas discharging head configured to discharge a dehumidified gas to the substrate, a processing liquid supply nozzle, an IPA supply nozzle, and a driving device configured to move the gas discharging head between a retreat position of an upper part of the chamber and an approach position near the substrate. In particular, the gas discharging head is positioned at the approach position when the IPA is supplied to the substrate so that the dehumidified gas is supplied from the gas discharging head to the substrate when the IPA is supplied to the substrate.

Abstract: A substrate processing apparatus which holds and rotates a substrate substantially horizontally; having a control unit which controls a rinsing liquid supply mechanism for supplying a rinsing liquid onto the substrate; a gas knife mechanism that sprays gas onto the substrate to form a gas spraying zone and scans the entire substrate without rotating the substrate; a rinsing liquid mechanism for supplying a rinsing liquid onto the substrate at its area downstream from the gas spraying zone; and a drying unit for drying the substrate by rotating the substrate.

Abstract: A control system for multiple sterilization chambers for the sterilization of medical and other instruments interact with a common vacuum pump, steam generator and ozone generator via a common controller. Instead of placing all instruments of one type in one large chamber and running one generic sterilization program followed by another such program, instruments may be grouped by the type of sterilization program needed and the sterilization programs may be run using a single pump and a single ozone generator fed into multiple sterilization chambers controlled by the controller. One smaller and less expensive vacuum pump and ozone generator may be sufficient to sterilize large amounts of medical equipment present in the total assembly of chambers. The controller may run sterilization programs in parallel fully or overlapping partially in time. Control valves governing flow passage of air, steam and ozone in and out of the chambers are also controlled by the controller.

Abstract: Embodiments of this device or method repeatedly apply droplets of two or more liquids by means of nozzles of fixed relative direction in an alternate or sequential manner to a target location on a surface for removing material from the surface, adding material to the surface, or using the surface to biphasically catalyze a reaction of components of the liquids. The droplets have essentially no contact with one another before reaching the surface (FIG. 12A thru 13H). The effect of the droplets on the target surface can be modified by a continuous or interrupted flow of air or other gas to the target surface (FIG. 27A thru 29H), or by application of radiations such as sonic or ultrasonic radiation, or various frequencies of electromagnetic radiation, to the target surface, or some combination of these. Means may be included for adjusting the temperature of the liquids and gasses.

Abstract: Provided is a method and system for stripping an ion implanted resist or performing a post-ash clean using a single substrate tool. Cleaning objectives and cleaning operating variables are selected for optimization. The first step immerses the substrate in a first treatment chemical, while concurrently irradiating the substrate with UV light, the process completed in a first process time, a first flow rate, and a first rotation speed of the substrate. The second step dispenses onto the substrate a second treatment chemical at a second temperature and a second composition, the second treatment chemical dispensed at a dispense temperature, and completed in a second process time and a second rotation speed. The two or more selected cleaning operating variables comprise UV wavelength, UV power, first concentration, first rotation speed, first flow rate, second process time, second rotation speed, percentage of residue removal, and dispense temperature.

Abstract: A liquid processing apparatus including: a second housing; a first housing capable of being brought into contact with the second housing; a holding part configured to hold an object to be processed; a rotation driving part configured to rotate the object to be processed held by the holding part; front-side process-liquid supply nozzle configured to supply a process liquid onto a peripheral portion of a front surface of the object to be processed held by the holding part; and a storage part disposed on a side of a rear surface of the object to be processed held by the holding part, the storage part being configured to store the process liquid having been passed through the object to be processed. The respective first housing and the second housing can be moved in one direction, so that the first housing and the second housing can be brought into contact and separated from each other.

Abstract: Apparatuses are provided for cleaning a processing component using megasonic energy including megasonic tanks, scanning megasonic plates, megasonic jets, and megasonic sweeping beams etc., in combination with selective chemistries to remove sub-micron particulate contaminants from the surfaces of the processing component that is used in cleaning semiconductor, medical, or any other processing substrates. The apparatus includes a processing chamber having a carrier element that is configured to support the processing component. The carrier element includes a mechanism to flip the processing component within the processing chamber during cleaning. A fluid supply assembly supplies a fluid to a surface of the processing component and a beam assembly equipped with a megasonic transducer is used to provide high frequency megasonic acoustic energy to the fluid during cleaning.

Abstract: A liquid treatment method including: retaining a substrate with a treatment target surface being set as a lower surface, and rotating the substrate; supplying DIW (deionized water) to the lower surface of the substrate, thereby performing a rinsing process to the substrate; and thereafter supplying a mist containing IPA (isopropyl alcohol) and N2 gas, thereby substituting the IPA for the DIW. The supplying of the mist is performed using a nozzle positioned below the substrate, the nozzle comprising a plurality of ejection ports which are arrayed between a position opposing a central portion of the substrate and a position opposing a peripheral portion of the substrate.

Abstract: Methods, systems and apparatus for cleaning turbines, such as power generation turbines, are disclosed. Supplemental piping is connected to existing compressor air extraction and turbine nozzle cooling air piping, to supply water and/or cleaning agents into areas of a turbine not ordinarily accessible by injection of water and/or cleaning agents into the bellmouth of the turbine alone. Pressure and flow sensors, pumps, valving, and a control system to regulate the operation of the pumps and valving are provided to control the introduction of water and/or cleaning agents into the turbine.

Abstract: A cleaning apparatus for cleaning articles is proposed. The cleaning apparatus comprises at least one cleaning chamber for receiving the articles. The cleaning apparatus comprises, in the cleaning chamber, at least one fluid source for subjecting the articles to the action of at least one cleaning fluid. The cleaning apparatus furthermore comprises at least one plasma source, which is designed to ignite at least one plasma in at least one gas and to generate at least one reactive gas. The cleaning apparatus is designed to bring the reactive gas into contact with the articles, at least in part.

Abstract: An ultrasonic cleaning method for cleaning an object in a liquid in which a gas is dissolved includes preparing the liquid in which the gas is dissolved and cleaning the object while irradiating the liquid with ultrasonic waves so that a region, where a spatial rate of change of a refractive index of the liquid in which the gas is dissolved is large relative to a case where ultrasonic waves are not applied, appears along a direction in which the ultrasonic waves travel.

Abstract: An ultrasonic cleaning method for cleaning an object in a liquid in which a first gas is dissolved includes preparing the liquid in which the first gas is dissolved and introducing a second gas into the liquid while irradiating the liquid with ultrasonic waves so as to realize a state where bubbles containing the first gas dissolved in the liquid continue to be generated. The object is cleaned in the state where the bubbles containing the first gas continue to be generated.

Abstract: The device according to the invention is used to clean medical instruments having at least one instrument cavity and at least two openings, wherein the device has a first fastening module for detachably fastening the medical instrument and a second fastening module for detachably fastening a first container for receiving liquid (insert in drawing) and/or air (insert in drawing), wherein the device comprises a cleaning device cavity which is designed such that when the medical instrument and container are fastened, the liquid and/or air can be flushed from the interior of the container through the cleaning device cavity into the instrument cavity.

Abstract: A liquid processing apparatus processes a lower surface and a side surface of an object to be processed W. The liquid processing apparatus includes: a process-liquid supply mechanism configured to supply a process liquid to the object to be processed; a drain mechanism configured to drain the process liquid having processed the object to be processed W; a rotational cup disposed circumferentially outward the object to be processed W, the rotational cup being configured to guide the process liquid having processed the object to be processed W to the drain mechanism; and a driving part configured to rotate the rotational cup. The rotational cup is provided with a support part that projects circumferentially inward so as to support a circumferential part of the object to be processed W.

Abstract: A washing treatment apparatus and a washing treatment method are provided. A washing treatment apparatus washes in a washing container an object to be washed including a tubular portion, and a main body portion to which one end portion of the tubular portion is connected. The washing treatment apparatus includes a washing solution supply unit which pressurizes and supplies a washing solution to the washing container, a penetration hole portion which is provided on the washing container and includes a penetration hole into which the tubular portion can be inserted, an outlet hole portion which is provided on the washing container and includes an outlet hole through which the washing solution supplied into the washing container flows out to adjust pressure of the washing solution in the washing container to predetermined pressure.

Abstract: A substrate processing system which enables a minute piece of foreign matter attached to a substrate surface to be detected and are suitable for mass production of substrates. The substrate processing system has a substrate processing apparatus that carries out predetermined processing on a substrate. The substrate processing system comprises a substrate surface processing apparatus having a fluid supply unit that supplies onto a surface of the substrate a fluid containing an altering substance that alters a substance exposed at the surface of the substrate, and a substrate surface inspecting apparatus that inspects the surface of the substrate onto which the fluid has been supplied.

Abstract: An apparatus for cleaning and conditioning the surface of a semiconductor substrate such as wafer includes a rotatable chuck, a chamber, a rotatable tray for collecting cleaning solution with one or more drain outlets, multiple receptors for collecting multiple cleaning solutions, a first motor to drive chuck, and a second motor to drive the tray. The drain outlet in the tray can be positioned directly above its designated receptor located under the drain outlet. The cleaning solution collected by the tray can be guided into designated receptor. One characteristic of the apparatus is having a robust and precisely controlled cleaning solution recycle with minimum cross contamination.

Abstract: A cleaning apparatus for a semiconductor wafer includes: a gas jet device including a gas nozzle which jets a first gas onto the surface of a semiconductor wafer to thin the thickness of a stagnant layer on the surface of the semiconductor wafer; and a two-fluid jet device including a two-fluid nozzle which jets droplet mist onto a region where thickness of the stagnant layer of the semiconductor wafer is thinned, the droplet mist being mixed two-fluid of a liquid and a second gas.

Abstract: A package for delivering a cleaning solution to a surface to be cleaned comprises a housing, a pocket in the housing having at least one piercing projection extending into the pocket and a passageway between the pocket and the surface to be cleaned beneath the housing. A sealed packet containing a cleaning solution can be configured to fit into the pocket and can have at least a portion of an outer surface thereof adapted to be pierced by the at least one piercing projection when the packet is placed in the pocket. The cleaning solution can be discharged from the packet when the packet is positioned in the pocket and the packet is pierced by the at least one piercing projection. The cleaning solution can then be dispensed through the passageway onto a surface to be cleaned.

Abstract: An apparatus capable of cleaning a material includes pipes arranged in a first barrel; and through holes defined in a second barrel. The second barrel is received in the first barrel. The apparatus further includes a driver comprising a drive shaft, the drive shaft extending through the first barrel and being connected to the second barrel. A fluid container is included store fluid, an air controller is provided air-dry the material. Before washing the material, the second barrel is driven by the driver to cause each of the through holes to disengage from a corresponding pipe. After washing the material, the second barrel is driven by the driver to cause each of the through holes to engage with the corresponding pipe.

Abstract: A hand sanitizer (2) comprises: (a) a first part (14) comprising a chlorite solution and contained in a first dispenser (4) whereby it will be dispensed as a spray or jet of liquid; and (b) a second part (16) comprising an acid solution and contained in a second dispenser (6) whereby it will be dispensed as a second spray or jet of liquid; wherein the chlorite and the acid will react to provide chlorine dioxide when the first part is mixed with the second part; and wherein a mixture (18) of equal quantities of the first part and the second part contains at least 15% alcohol by weight; and wherein at least a part of the alcohol comprises 3-methoxy-3-methylbutan-1-ol (MMB).

Abstract: A washing machine includes a valve with a housing base and a rotor, the housing base defining a central liquid line, nozzles in the housing base and in a circle that is concentric to an axis of the rotor, the nozzles being connectable to the central liquid line by a connection line in the rotor and having a seal that seals a connection with the connection line, a motor for driving the rotor, a storage container connected to each of the nozzles, a liquid line connected to the central liquid line, a pump connecting the liquid line to a dispensing device for a laundry treatment room, and a water feed without a seal in a transition to the connection line. The rotor axially presses the seals toward the housing base until contact areas of the rotor and the housing base oppose each other and are close to each other.

Abstract: A method of manufacturing a semiconductor device in which an insulating film is filled between patterns etched into a workpiece structure is disclosed. The method includes cleaning etch residues residing between the etched patterns by a first chemical liquid; rinsing the workpiece structure cleaned by the first chemical liquid by a rinse liquid; and coating the workpiece structure rinsed by the rinse liquid with a coating liquid for formation of the insulating film. The cleaning to the coating are carried out within the same processing chamber such that a liquid constantly exists between the patterns of the workpiece structure.

Abstract: Apparatuses, and related methods, for processing a workpiece that include a particular barrier structure that can overlie and cover a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular movable member that can be positioned over and moved relative to a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular ceiling structure that can overlie a processing chamber. Nozzle devices, and related methods, that include a particular annular body. Nozzle devices, and related methods, that include a particular first, second, and third nozzle structure.

Abstract: A substrate treating apparatus for treating substrates by immersing the substrates in a treating solution includes the following elements. A treating tank for storing the treating solution; a lifter capable of supporting a plurality of substrates, and vertically movable between an upper withdrawn position above the treating tank and a treating position inside the treating tank; a treating solution supply device for supplying the treating solution to the treating tank; a dripping device for dripping a surfactant to a surface of the treating solution stored in the treating tank; and a control device for causing the treating solution supply device to supply the treating solution to the treating tank, causing the lifter to place the substrates in the treating position, and causing the dripping device to drip the surfactant when raising the lifter to the upper withdrawn position after treatment of the substrates with the treating solution.

Abstract: Provided is a liquid processing apparatus that selectively supplies processing liquids with a switching operation to the surface of a substrate to perform a liquid processing. The liquid processing apparatus includes a first processing liquid supply unit including a first nozzle block that selectively supplies an acidic chemical liquid and a rinse liquid, and a second processing liquid supply unit including a second nozzle block that selectively supplies an alkaline chemical liquid and a rinse liquid. When a chemical liquid is supplied to the substrate from one of the first and second nozzle blocks, the other of the first and second nozzle blocks is retreated to a retreat position. When the rinse liquid is supplied to the substrate from one of the first and second nozzle blocks, the other of the first and second nozzle blocks is moved to a processing position.

Abstract: An apparatus for cleaning a substrate is disclosed. The apparatus having a first head unit and a second head unit. The first head unit is positioned proximate to the surface of the substrate and has a first row of channels defined within configured to supply a foam to the surface of the substrate. The second head unit is positioned substantially adjacent to the first head unit and proximate to the surface of the substrate. A second and a third row of channels are defined within the second head unit. The second row of channels is configured to supply a fluid to the surface of the substrate. The third row of channels is configured to apply a vacuum to the surface of the substrate.

Abstract: The present application describes a produce wash system for dispersing carbon dioxide into a liquid medium which includes a container containing carbon dioxide gas which is connected to another container or pipe capable of containing a liquid medium so that the gas from the first container is capable of being dispersed into the liquid medium of the second container or pipe.

Abstract: A washing/drying machine according to the present invention is capable of efficiently performing a drying operation to reduce a drying period. The washing/drying machine includes a tank (11) for storing used water, and the water is circulated from the tank (11) for dehumidification of air circulated through a drying air duct (20). Since the water is circulated from the tank (11), a great amount of water can be supplied as dehumidification water for higher dehumidification efficiency. The amount of the circulated water (the amount of cooling water (dehumidification water)) is reduced in a first half of a drying process, and increased in a second half of the drying process. As a result, the drying efficiency is improved during the drying operation, thereby reducing the drying period.

Abstract: A cleaning and drying-preventing method including: positioning a nozzle in a container such that a funnel-like inner circumferential surface of the container is located around a periphery of a distal end of the nozzle; sucking a liquid in the nozzle to retract a level of the liquid to a side of a supply passage; supplying a solvent into the container to form a swirl flow of the solvent turning around the distal end of the nozzle, and cleaning the nozzle by the swirl flow; supplying a solvent into the container to form a liquid pool of the solvent; and further retracting the level of the liquid in the nozzle to the side of the supply passage. A liquid layer, an air layer, and a solvent layer are formed in the nozzle in this order from the side of the supply passage, to prevent drying of the liquid in the nozzle.

Abstract: A cleaning apparatus in which a cleaning process is simplified, a time required for the cleaning process is reduced and which has an excellent cleaning effect, and a high pressure cleaner for use therein are provided.

Abstract: A device for treating a disc-like article with a fluid, includes elements for dispensing a fluid onto the article and a chuck for holding and rotating the article around an axis perpendicular thereto. The chuck includes a base body, a drive ring, and gripping members for contacting the article at its edge. The gripping members are eccentrically movable with respect to the center of the article and driven by a drive ring rotatably mounted to the base body, so that the drive ring is rotatable against the base body around the axis. The relative rotational movement of the drive ring against the base body is carried out by either holding the base body and rotating the drive ring or by holding the drive ring and rotating the base body, whereby the to-be-held-part (drive ring or base body) is held without touching the respective to-be-held-part by magnetic force.

Abstract: A liquid processing apparatus includes: a processing part 80 configured to process an object to be processed by a process liquid; a supply path 1 connected to the processing part 80, the supply path 1 being configured to guide the process liquid to the processing part 80; a solvent supply part 7 configured to supply a solvent to the supply path 1; and a chemical-liquid supply part 5 configured to supply a chemical liquid to the supply path 1 through a chemical-liquid supply path so as to generate a chemical liquid diluted with the solvent. A measuring part 10, which is configured to measure a conductivity of the chemical liquid diluted with the solvent, is disposed in the supply path at a position downstream from a connection points 25a, 35a, 45a, to which the chemical-liquid supply path 6 is connected.

Abstract: A soiled surface cleaning system is described for pre spraying soiled surface areas, and for rinsing and extracting the pre sprayed soiled surface areas, wherein the pre spraying of the soiled surface areas does not have to be stopped in order to perform the rinsing and extracting of the pre sprayed soiled surface areas. The system includes a prespray unit having a proportional pump driven by water from a water service line. The pump mixes the water with prespray and feeds the diluted prespray to a spray gun. The system also includes a rinse unit having a triplex pump that receives water from the water service line, increases the water's pressure, and feeds the pressurized water to an injector. The injector mixes the water with a rinse agent and feeds the diluted rinse agent to a nozzle arrangement on an extraction wand. In use, areas of the soiled surface are first pre sprayed with the diluted prespray. The diluted prespray is allowed to dwell on the pre sprayed areas.

Abstract: Embodiments of the present invention generally relate to a method and apparatus for ex-situ cleaning of a chamber component part. In one embodiment, a system for cleaning component parts in a cleaning chemistry is provided. The system comprises a wet bench set-up comprising a cleaning vessel assembly for holding one or more component parts to be cleaned during a cleaning process and a detachable cleaning cart detachably coupled with the cleaning vessel assembly for supplying one or more cleaning chemistries to the cleaning vessel assembly during the cleaning process.

Abstract: The object of the present invention is a device for depolluting a non-sealed, confined environment (1) having a natural leakage (6) and including an interior space (9) bounded by a wall (7), comprising a depollution enclosure (11, 30) means (32, 42) for pumping gas and means (33, 43) for introducing gas. The depollution enclosure (11, 30) has at least two chambers (12, 13; 31, 41) separated by a sealing wall (14, 49). A first chamber (12, 31) is constituted by the part of the enclosure that is situated is contact with the wall (7) of the non-sealed, confined environment (1) and cooperates with first means for pumping (42) and first means for introducing gas (43), and a second chamber (13, 41) is constituted by the part of the enclosure which is situated in contact wife the natural leakage (6) from the non-sealed, confined environment (1) and cooperates with second means for pumping (42) and second means for introducing gas (43).

Abstract: Provided is a substrate processing apparatus including a substrate holding unit configured to hold a wafer W horizontally, a rotation driving unit configured to rotate the substrate holding unit, a first chemical liquid nozzle configured to discharge a first chemical liquid to a first chemical liquid supplying position on the peripheral portion of the wafer W, and a second chemical liquid nozzle configured to discharge a second chemical liquid to a second chemical liquid supplying position on the peripheral portion of the wafer W. The rotation driving unit rotates the substrate holding unit in a first rotation direction when the first chemical liquid nozzle discharges the first chemical liquid, and rotates the substrate holding unit in a second rotation direction when the second chemical liquid nozzle discharges the second chemical liquid.

Abstract: Systems, apparatus and methods are provided for efficiently reclaiming solvents used to clean surfaces of semiconductor wafers, etc. More particularly, embodiments of the present invention provide a reclaim approach that prevents the evaporation of chemical solvents used to process wafers using proximity heads, by confining hot liquid solvents used to form fluid menisci on the wafer surface with cold liquid solvents of the same chemical composition.

Abstract: Disclosed are methods and apparatus for cleaning heat exchangers and similar vessels by introducing chemical cleaning solutions and/or solvents while maintaining a target temperature range by direct steam injection into the cleaning solution. The steam may be injected directly into the heat exchanger or into a temporary side stream loop for recirculating the cleaning solution or admixed with fluids being injected to the heat exchanger. The disclosed methods are suitable for removing metallic oxides from a heat exchanger under chemically reducing conditions or metallic species such as copper under chemically oxidizing conditions. In order to further enhance the heat transfer efficiency of heating cleaning solvents by direct steam injection, mixing on the secondary side of the heat exchanger can be enhanced by gas sparging or by transferring liquid between heat exchangers when more than one heat exchanger is being cleaned at the same time.

Abstract: Processing and drying of a sample, such as a semiconductor or MEMS device, is achieved using a single pressure chamber. The pressure chamber holds the sample in a sealed interior volume throughout various process steps, such as, but not limited to, photoresist removal, sacrificial layer etching, flushing or rinsing, dehydration, and critical point drying. The pressure chamber is constructed of a chemically-resistant and pressure-resistant material to withstand the various chemicals and pressures that are encountered in the various process and drying steps. For example, the pressure chamber is constructed from a nickel-copper alloy. Automated release etching and critical point drying of a MEMS or semiconductor device is provided without removing the device from the sealed pressure chamber.