Abstract: Inside a single apparatus main body (100), a surface treatment apparatus includes: a treatment cell (11); a vertical rotation shaft (12); an attachment/detachment device; a receiving tank (15); a cover body (16); a plurality of tanks (21); a plurality of surface treatment liquid supply devices (22); a cleaning water supply device; a drain device (3); and a first cleaning device. Upon operation of the surface treatment liquid supply device while the treatment cell (11) containing small objects is rotated by the vertical rotation shaft (12), a surface treatment is carried out on the small objects, upon operation of the cleaning water supply device, the small objects inside the treatment cell (11) are cleaned, and upon operation of the first cleaning device, the inner face of the cover body and the outer face of the treatment cell are cleaned, thus providing circulation use of surface treatment liquids in the tanks.

Abstract: To provide a liquid processing apparatus capable of processing substrates with a high throughput with the lesser number of nozzles for chemical-liquid, when the substrates that are horizontally held in cup bodies are liquid-processed by supplying a chemical liquid to the substrates. Taking a developing process as an example of a liquid process, two-types of developing nozzles are prepared for two types of developing methods. The developing nozzle, which is used in the method in which the nozzle is engaged with the process for a longer period of time, is individually disposed on each of a first processing module 1 and a second processing module 2. On the other hand, the developing nozzle, which is used in the method in which the nozzle is engaged with the process for a shorter period of time, is used in common in the first liquid processing module 1 and the second liquid processing module 2. The common developing nozzle is configured to wait on an intermediate position between the modules 1 and 2.

Abstract: The present invention provides a substrate processing system in which a processing liquid is supplied to a substrate W from a processing nozzle 50a situated above the substrate W so as to process the substrate W, and which makes it possible to prevent unintended dripping of the processing liquid from the processing nozzle. A substrate processing system 20 comprises a processing nozzle 50a capable of supplying a processing liquid to a substrate to be processed, an arm 54 supporting the processing nozzle, and droplet removing nozzles 60, 62 capable of blowing a gas to the processing nozzle. The arm is movable between a processing position and a waiting position, the processing nozzle being above a substrate when the arm is in the waiting position and being outside a substrate when the arm is in the processing position. The droplet removing nozzles are so situated that they are in the vicinity of the processing nozzle when the arm is in the waiting position.

Abstract: A cleaning system which includes an enclosure and having a door with a transparent window. The door is opened and closed to load and unload products to be cleaned. An operator puck on the outside of the enclosure couples magnetically to another actuator puck on the inside of the enclosure. This coupling allows an operator to move and direct the inside puck to actuate spray or air blast functions, without opening the enclosure. The outside operator puck includes one or more switches which turn on the various electronic components such as the liquid pump, light, or air blast valve. The cleaning system enables a user to efficiently direct cleaning action to parts inside to minimize the cleaning time, and to prevent exposure of chemicals. The cleaning fluid is cycled out of the enclosure continuously, and into a “trap” box, through a pump and back into the cleaner box in a closed loop cycle.

Abstract: In one embodiment, a cleaning assembly may include a modular electrode sealing housing, an acid injection inlet, and a fluid injection inlet. The modular electrode sealing housing may include a high pressure closure member that contains a first cleaning volume and a low pressure closure member that contains a second cleaning volume. The acid injection inlet can be in fluid communication with the first cleaning volume of the high pressure closure member. The fluid injection inlet can be in fluid communication with the second cleaning volume of the low pressure closure member. During normal operation, a showerhead electrode can be sealed within the modular electrode sealing housing such that the first cleaning volume is located on a first side and the second cleaning volume is located on a second side of the showerhead electrode.

Abstract: The purpose of the present invention is to provide a container sterilization method, washing method, and system which retain food hygiene manufacturing standards and a required production line speed, as well as reducing the amount of treatment fluids used such as pharmaceutical fluid, hot water and aseptic water. The container sterilization method and washing method of the present invention is a method in which a container is sterilized/washed using a treatment fluid, and the sterilization step and/or washing step are divided into at least two parts. By storing and pumping upwards the treatment fluid supplied from one part of the divided sterilization or washing step after use, the treatment fluid can be supplied in series to the other part of the same divided sterilization or washing step.

Abstract: A pen sterilization device includes a main body having a first end, a second end and a plurality of opposing sides defining a watertight reservoir for containing a sterilization agent, and a pair of watertight valves for allowing ingress and egress of a pen.

Abstract: A pressure is maintained within a volume within which a semiconductor wafer resides at a pressure that is sufficient to maintain a liquid state of a precursor fluid to a non-Newtonian fluid. The precursor fluid is disposed proximate to a material to be removed from the semiconductor wafer while maintaining the precursor fluid in the liquid state. The pressure is reduced in the volume within which the semiconductor wafer resides such that the precursor fluid disposed on the wafer within the volume is transformed into the non-Newtonian fluid. An expansion of the precursor fluid and movement of the precursor fluid relative to the wafer during transformation into the non-Newtonian fluid causes the resulting non-Newtonian fluid to remove the material from the semiconductor wafer.

Abstract: A household appliance includes a container for receiving objects to be treated, an ozone generator having an intake air conduit, and an ozone eliminating device arranged in an exhaust air conduit. The exhaust air conduit is connected to the container and includes a fan for removing exhaust air from the container. The exhaust air conduit is connected to the intake air conduit of the ozone generator.

Abstract: A dishwashing machine is used for pre-rinse operation of soiled dishes. A cavity is configured and arranged to contain the soiled dishes. A nozzle is proximate the cavity and is in fluid communication with the cavity. An accumulator pan accumulates wash and rinse water including cleaning chemicals used in a previous cycle of the dishwashing machine. A fluid passageway interconnects the nozzle and the accumulator pan. A pump directs the accumulated wash and rinse water from the accumulator pan to the nozzle via the fluid passageway for pre-rinse operation of the soiled dishes in the cavity, and the nozzle directs the accumulated wash and rinse water into the cavity with the soiled dishes to assist in removing soil from the soiled dishes prior to a wash cycle of the dishwashing machine. The wash cycle utilizes fresh wash water.

Abstract: A substrate cleaning method for cleaning a substrate on which a film is formed with a pattern in a vacuum-state processing chamber includes a preprocessing step where the film formed on the substrate on which the pattern has been formed by an etching process is cleaned by using a cleaning gas; and a consecutive step including an oxidation step where residues attached on a surface of the pattern are oxidized by using an oxidizing gas and a reduction step where the oxidized residues are reduced by using a reducing gas, which are consecutively carried out posterior to the preprocessing step. The gases used in the preprocessing step and the consecutive step are clustered by ejecting the gases into the processing chamber from a gas nozzle whose internal pressure PS is maintained to be higher than an internal pressure PO of the processing chamber.

Abstract: A machine for cleaning a head-disk assembly (HDA) of a hard disk drive (HDD) includes a nest that seals the HDA between an upper and lower portion during cleaning. An inlet port receives a gas and an exhaust port exhausts the gas and entrained particles. A shock drive delivers mechanical shocks to the nest and the HDA while the gas is flowing through the HDA. A blower may circulate the gas from the exhaust port to the inlet port. A filter may be coupled to the inlet port. The HDA nest may be movable along an axis of the mechanical shocks delivered by the shock drive. A blow tube may deliver gas to a screw hole and a coaxial vacuum tube may rest against a surface around the screw hole to encapsulate the blow tube during cleaning and remove the gas and particles from the screw hole.

Abstract: A water-conducting domestic appliance including a line system, a detergent feed facility that supplies at least one detergent into the line system, wherein the detergent feed facility includes at least one reservoir configured to be filled with detergent, and a refill fitting having a connection to the at least one reservoir, the refill fitting being arranged on a door of the water-conducting domestic appliance.

Abstract: Inventive methods and systems of cleaning patterned integrated circuit (“IC”) substrates are described. The cleaning methods of the present invention include: (1) providing the patterned integrated circuit substrate having thereon poly silicon lines adjacent to each other; (2) charging a solution, which contains at least a solute selected to promote cleaning of the patterned integrated circuit substrate, to produce a charged solution, wherein at least a portion of the solute is present as clusters in the charged solution; and (3) conveying the charged solution for cleaning the patterned integrated circuit substrate.

Abstract: A surface treating jig of the present invention includes a treatment solution collecting section having (i) a ring-like groove formed on a surface (a) facing to a surface (a) to be treated of a semiconductor wafer and (ii) a through hole for collecting the treatment solution, the through hole formed so as to be continuous with the ring-like groove. With this arrangement, the present invention provides a surface treatment apparatus that prevents the treatment solution from spattering to a surface other than the surface (a) to be treated, and thereby, treatment with the treatment solution can be performed only with respect to the target surface.

Abstract: An endoscope cleaning/disinfecting apparatus according to the present invention includes a chemical bottle, an insertion portion, a chemical receiving portion, a blade portion, a first limit switch and a second limit switch. When the chemical bottle is moved to a first position, the first limit switch changes from off to on to detect the first position, when the chemical bottle is inserted to a second position at which an inner face of the chemical receiving portion and a spout portion are aligned to each other, the second limit switch changes from off to on to detect the second position, and when the chemical bottle is inserted to a third position at which a stopper portion is opened, the first limit switch is released by a stepped portion from pressing by the chemical bottle, and thereby changes from on to off to detect the third position.

Abstract: The invention relates to a method for cleaning a vacuum pump embedded in a technical system. Water is provided for the cleaning, and a rotational speed of the vacuum pump is adjusted to a value in a cleaning rotational speed range. A defined amount of cold water and/or warm water is supplied to the vacuum pump and the vacuum pump is rinsed with the water during a predetermined time period. After letting the water escape from the vacuum pump, the vacuum pump is dried by aeration with gas or a gas mixture. The invention also relates to a cleaning system for cleaning the vacuum pump.

Abstract: In one embodiment, a dual phase cleaning chamber may include a turbulent mixing chamber, a fluid diffuser, an isostatic pressure chamber and a rupture mitigating nozzle. The turbulent mixing chamber may be in fluid communication with a first fluid inlet and a second fluid inlet. The fluid diffuser may be in fluid communication with the turbulent mixing chamber. The rupture mitigating nozzle may include a first fluid collecting offset, a second fluid collecting offset, and a displacement damping projection. The displacement damping projection may be disposed between the first and second fluid collecting offset and may be offset away from each of the first fluid collecting offset and the second fluid collecting offset, and towards the fluid diffuser. A pressurized cleaning fluid introduced from the first fluid inlet, the second fluid inlet, or both flows through the outlet passage of the first and second fluid collecting offset.

Abstract: A substrate processing method includes a removing step of removing unwanted matter from a substrate and a vaporizing step performed in parallel to the removing step. In the removing step, an HF vapor that contains hydrogen fluoride and a solvent vapor that contains a solvent capable of dissolving water and having a lower boiling point than water is supplied onto the substrate to etch and remove the unwanted matter. In the vaporizing step, the solvent on the substrate is vaporized.

Abstract: A substrate liquid processing apparatus includes a substrate rotation unit configured to hold and rotate a substrate within a processing space; a processing solution supply unit configured to selectively supply multiple kinds of processing solutions; a collection cup configured to collect the processing solutions; liquid collection regions formed at the collection cup and configured to collect the processing solutions; a liquid drain opening formed at a bottom portion of the collection cup and configured to discharge the processing solutions; an exhaust opening formed above the liquid drain opening; a fixed cover configured to cover an upper portion of the exhaust opening with a space therebetween; an elevating cup provided above the fixed cover and configured to guide the processing solutions into the liquid collection regions; and a cup elevating unit configured to move up and down the elevating cup depending on the kinds of the processing solutions.

Abstract: According to one embodiment, a substrate processing method is disclosed. The method can include treating a substrate with a first liquid. The substrate has a structural body formed on a major surface of the substrate. The method can include forming a support member supporting the structural body by bringing a second liquid into contact with the substrate wetted by the first liquid, and changing at least a portion of the second liquid into a solid by carrying out at least one of causing the second liquid to react, reducing a quantity of a solvent included in the second liquid, and causing at least a portion of a substance dissolved in the second liquid to be separated. The method can include removing the support member by changing at least a part of the support member from a solid phase to a gaseous phase, without passing through a liquid phase.

Abstract: Systems and methods for oscillating exposure of a semiconductor workpiece to multiple chemistries are disclosed. A method in accordance with one embodiment includes sequentially exposing a portion of a semiconductor workpiece surface to a first chemistry having a first chemical composition and a second chemistry having a second chemical composition different than the first. Prior to rinsing the portion of the workpiece surface, the portion is sequentially exposed to the first and second chemistries again. The first and second chemistries are removed from the portion, and, after sequentially exposing the portion to each of the first and second chemistries at least twice, and removing the first and second chemistries, the portion is rinsed and dried.

Abstract: The present invention provides a substrate cleaning method capable of removing particles from the entire surface of a substrate to be processed at a high removing efficiency. In the substrate cleaning method according to the present invention, a substrate to be processed W is immersed in a cleaning liquid in a cleaning tank 12. Then, ultrasonic waves are generated in the cleaning liquid contained in the cleaning tank 12, so that the substrate to be processed W is subjected to an ultrasonic cleaning process. While the substrate to be processed is being cleaned, a dissolved gas concentration of a gas dissolved in the cleaning liquid contained in the cleaning tank is changed.

Abstract: A method and apparatus for providing multiple spray zones to different subportions of a silverware basket within the wash chamber of a dishwasher.

Abstract: A removable non-integrated treating chemistry dispensing cartridge assembly may emit a signal in response to a predetermined amount of treating chemistry being detected and in response to a predetermined amount of illumination being detected.

Abstract: The invention relates to a tool for cleaning and/or drying a cavity in a workpiece, such as a hole, in particular a threaded bore. The workpiece has a workpiece adapter. The workpiece adapter includes a workpiece contact surface and has a connector for feeding cleaning medium and/or drying medium. There is an opening in the connection adapter for discharging cleaning medium and/or drying medium containing dirt particles. A nozzle having a nozzle chamber is formed in the workpiece adapter. The connector opens into the nozzle chamber such that a cyclonic flow of the fed cleaning medium and/or drying medium can form in the nozzle and exits the nozzle. The cyclonic flow transports dirt particles from the cavity in the workpiece to the opening for discharging dirt particles and cleaning medium and/or drying medium.

Abstract: The invention relates to a multi-dosing detergent delivery device. In embodiments of the present invention, the device comprises a housing (2) for receiving a cartridge (200). The cartridge (200) has a plurality X of chambers, each accommodating a detergent composition. The device has a lid (3,1100) for receiving water/wash liquor and directing it selectively into a chamber of the cartridge (200) to contact the detergent composition therein and an outlet to allow the detergent loaded wash liquor to exit the device. The device has automatic indexing means (100) for automatic movement of said cartridge (200) relative to said lid (3,1100) so as to cause a neighboring chamber to be in an exposed, ready to be used, position prior to a next washing cycle and features an end stop mechanism (A,B) for preventing actuation of said automatic indexing mechanism (100) subsequent to an Xth washing cycle.

Abstract: Methods and apparatus are provided for using various megasonic apparatus including megasonic tanks, scanning megasonic plates, megasonic jets, and megasonic sweeping beams etc., in combination with selective chemistries to remove sub-micron particulate contaminants from the surfaces of the processing equipment used in semiconductor, medical, or any other processing environments.

Abstract: A substrate drying apparatus for drying a width of a surface of a substrate in a liquid. The substrate drying apparatus has a liquid tank containing the liquid. An injection nozzle is coupled to the liquid tank, the injection nozzle having a continuous knife edge injection surface across the width of the surface of the substrate. A drain is coupled to the injection nozzle, the drain having a continuous drain surface substantially parallel to the continuous knife edge injection surface and across the width of the surface of the substrate. The liquid forms a meniscus between the continuous drain surface and the width of the surface of the substrate. The injection nozzle directs a vapor at the meniscus.

Abstract: A cleaning and drying apparatus includes a support frame, a washing and drying cabinet, a blower module, and a water tank. The support frame includes a first frame, a second frame, a number of pillars connected to the first frame and the second frame. The washing and drying cabinet is mounted on the second frame. The blower module is mounted on the first frame, the water tank is mounted on the first frame, and the blower module and the water tank are connected to the washing and drying cabinet.

Abstract: Provided are a liquid processing apparatus and a liquid processing method that can optimize the state of air flow at an upper side of a substrate according to each liquid process performed during a substrate liquid processing. A liquid processing apparatus for performing a substrate liquid processing includes a support member configured to horizontally supporting the substrate; a gap forming member configured to form an annular gap between the gap forming member and an outer circumferential part of the support member; an upper liquid supplying member configured to supply a processing liquid to the substrate from an upper side; a cup configured to surround the annular gap and receive the processing liquid swept away from the rotating substrate through the annular gap; and an elevating mechanism configured to elevate the gap forming member.

Abstract: A device for disinfecting, sterilizing and/or maintaining medical, especially dental, instruments comprises a maintenance and leaning chamber for accommodating instruments to be conditioned and means for supplying different cleaning or maintenance media for cleaning, disinfecting or sterilizing and/or maintaining the instruments in subsequent steps. The start times of the conditioning cycles for the different instruments are staggered.

Abstract: A device to provide improved anti-smudging, better gripping and longer shelf-life to products and surfaces includes an electric superheated steam generator and an electric low-ion plasma generator to provide superheated steam and low-ion plasma to the surfaces of products including plastics. One embodiment envisions the superheated steam generator and the low-ion plasma generator being contained in a housing while another embodiment anticipates a conveyor means positioned in front of the superheated steam generator and the low-ion plasma generator. A method for the improving of anti-smudging, gripping and shelf-life for properties includes the application of superheated steam and low-ion plasma by means of a superheated steam generator and a low-ion plasma generator to products for specific periods of time and at specific distances to attain desired surface and bulk properties. The superheated steam and low-ion plasma may be applied individually, simultaneously or sequentially.

Abstract: A dishwasher is provided that allows oxygenating gases, especially ozone, to be effectively used at least for cleaning and disinfecting. An oxygenating gas is added to the rinsing liquor or the crude water and/or the washing container for use in a partial program cycle having a cleaning effect, e.g. the “cleaning” cycle, in order to be able to use the gas at least for cleaning and disinfecting.

Abstract: An apparatus for treating objects with a treatment gas comprises a treatment chamber, a chamber input through which objects enter the treatment chamber, and a chamber output (which may be the same as the chamber input) through which the objects leave the treatment chamber. The treatment chamber encloses the treatment gas, which can be steam. The chamber output and/or the chamber input include an intermediate medium, such as a liquid, through which the objects pass. The intermediate medium prevents escape of the treatment gas from the treatment chamber and the ingress of external gases into the treatment chamber, while facilitating input of the objects to the chamber, and output of the objects from the chamber.

Abstract: Apparatus and method for removing an ink image from a plastic substrate, particularly a plastic container such as a cup, are provided. A solvent capable of solvating the ink image is utilized in order to de-ink articles so that they can be recycled and re-imprinted thereby reducing waste associated with printing line start up. As the articles may be intended for use with food and beverage products, a safe and non-toxic solvent may be selected. However, to ensure that the article is not contaminated with foreign materials prior to human use, the de-inked article may undergo a rinse and drying operation to remove solvent residues and UV light treatment to eliminate any harmful microorganisms that may be present on the article's surfaces.

Abstract: A device, method, system, operating method, component and composition are disclosed for preventing deposits of a disposal agent, e.g., where a multi-component paint having two or more components such as a paint component and a hardener component, is employed, for example in a coating installation. Exemplary illustrations include a receiving device for disposal agent, e.g., for disposal agent from cleaning and/or rinsing processes of an application apparatus, comprising at least one inlet opening for introducing the disposal agent, and an outlet opening for removing the disposal agent. Furthermore, at least one loading means may be provided in order to load the receiving device with a loading agent, which may at least delay a deposition of disposal agent on or in the receiving device.

Abstract: In an example embodiment, a top proximity head for depositing fluids on a semiconductor wafer includes a delivery bore which receives fluid. The top proximity head includes a plenum that is connected to the delivery bore by numerous input channels into which fluid flows from the delivery bore. Each input channel has an inverted V-shaped opening which urges the upward flow of any air bubbles. From the plenum, the fluid flows through output channels out of the top proximity head to form a meniscus. The fluid is suctioned from the meniscus back into the top proximity head through return channels that lead to a return bore. A passage connects the delivery bore with the return bore, allowing air bubbles to escape from the delivery bore into the return bore. The passage allows a negligible amount of fluid to flow directly between the two bores rather than through the plenum.

Abstract: An first example method and apparatus for etching and cleaning a substrate comprises device with a first manifold and a second manifold. The first manifold has a plurality of nozzles for dispensing chemicals onto the substrate. The second manifold is attached to a vacuum source and/or a dry air/gas source. A second example embodiment is a wafer cleaning device and method that uses a manifold with capillary jet nozzles and a liquid capillary jet stream to clean substrates.

Abstract: Embodiments of the current invention describe a substrate processing tool. The substrate processing tool includes a housing defining a chamber, a substrate support, a container, and an impelling mechanism. The substrate support is coupled to the housing and configured to support a substrate within the chamber. The container is coupled to the housing within the chamber and configured to hold a liquid. The container is below and spaced apart from the substrate. The impelling mechanism is coupled to the housing and configured to apply a force to the liquid within the container such that an impelled portion of the liquid contacts a lower surface of the substrate.

Abstract: A method of cleaning a vehicle exhaust system filter (1), the filter (1) having a first end (11) and a second end (10) and comprising a plurality of elongate channels (6) containing debris (19) to be removed, comprises the steps of: (i) providing a chamber (14) having an outlet in fluid communication with the first end (11) of the filter (1); (ii) covering the second end (10) of the filter (1) to hinder fluid flow out of the second end of the filter; (iii) introducing a flow of liquid into the chamber (14); (iv) stopping the flow of liquid into the chamber (14) when the chamber and channels (6) of the filter are substantially filled with liquid; (v) introducing a pulse of compressed gas into the chamber (14), and (vi) uncovering the second end (11) of the filter (1) to allow the gas to force said debris (19) and liquid (17) out of the second end (10) of the filter (1). The invention also provides apparatus for use in the method.

Abstract: There is provided a liquid processing apparatus including a rotation unit configured to hold the target substrate and rotate the target substrate around a vertical axis; a processing solution supply nozzle configured to supply the processing solution to the surface of the target substrate being rotated; a first gas supply unit configured to form a downward flow of a first gas that flows over the entire surface of the target substrate and is introduced into a cup in order to form a processing atmosphere suitable for a liquid process to be performed; and a second gas supply unit configured to form a downward flow of a second gas different from the first gas in a region outside the downward flow of the first gas. The first gas supply unit and the second gas supply unit are provided at a ceiling portion of the housing serving as the processing space.

Abstract: A device for wet treatment of wafers includes a first plate and a second plate substantially parallel to the first plate, and a wafer is held between the first and the second plate substantially parallel. A first dispenser introduces fluid into a first gap between the first plate and the wafer when being treated, and a second dispenser introduces fluid into a second gap between the second plate and the wafer when being treated. At least one vibrating element is acoustically coupled to at least the second plate, and a holder and the second plate are rotated relative to each other about an axis substantially perpendicular to the second plate.

Abstract: An apparatus for simultaneously rinsing and drying front and back surfaces of a workpiece comprises a chuck adapted to spin the workpiece, a plurality of posts coupled to the chuck and adapted to support the workpiece, and first and second mechanical arms. The first mechanical arm is adapted to be positioned between the chuck and the workpiece, and to sweep along at least part of the workpiece back surface. The first mechanical arm comprises at least a first rinsing liquid nozzle, and a first tensioactive vapor nozzle. The second mechanical arm is adapted to be positioned adjacent to the workpiece front surface, and to sweep along at least part of the workpiece front surface. The second mechanical arm comprises at least a second rinsing liquid nozzle, and a second tensioactive vapor nozzle.

Abstract: The present invention relates to a cost saving liquid-treatment unit (100). According to the invention, a control unit (152), which is connected to an input port of a control valve (118, 120, 122), is adapted to set, in dependence on the evaporation rate of a treatment liquid on the substrate at the given or desired temperature of the substrate and/or at the given or desired pressure of a gaseous ambient atmosphere at the substrate, a number of dispense pulses to be applied to the substrate for the liquid treatment, a respective pulse duration of individual dispense pulses, and respective dispense-interruption time spans between the individual dispense pulses. This way, the use of treatment liquid is reduced to a minimum amount, thus reducing costs for providing and cleaning treatment liquid.

Abstract: A wafer is substantially discharged in a load lock upon removal from a processing system and prior to storing in a storage compartment. The discharge helps to separate some electrostatically charge particles from the wafers. The particles may be also by creating turbulence inside the load lock during venting and/or purging cycles. These particle removal operations can be performed without significant impact to the overall process throughput.

Abstract: A method measures a property of a germicidal solution in an endoscope processor spectroscopically by placing a quantity of the solution into a cuvette and passing a light therethrough. A reservoir receives a quantity of the solution and bubbles are filtered out via a cross-flow filter prior to putting a sample therefrom into the cuvette for measuring.

Abstract: A method of cleaning an outer surface of a fluid ejector includes dispensing a cleaning fluid onto the outer surface of the fluid ejector, drying a region of the outer surface of the fluid ejector, and moving the region in a path across the outer surface of the fluid ejector to cause evaporation of the cleaning fluid along a front that moves across the outer surface of the fluid ejector A method of cleaning a surface of a fluid ejector includes dispensing a cleaning fluid onto the outer surface of the fluid ejector, the cleaning fluid including a solvent and carrier liquid that is more wettable to residue of fluid ejected from nozzles of the fluid ejector than the solvent and having a higher vapor pressure than the solvent, and evaporating the carrier liquid such that a concentration of solvent on the surface of the fluid ejector increases.

Abstract: A cleaning and drying-preventing method including: positioning a nozzle in a container such that a funnel-like inner circumferential surface of the container is located around a periphery of a distal end of the nozzle; sucking a liquid in the nozzle to retract a level of the liquid to a side of a supply passage; supplying a solvent into the container to form a swirl flow of the solvent turning around the distal end of the nozzle, and cleaning the nozzle by the swirl flow; supplying a solvent into the container to form a liquid pool of the solvent; and further retracting the level of the liquid in the nozzle to the side of the supply passage. A liquid layer, an air layer, and a solvent layer are formed in the nozzle in this order from the side of the supply passage, to prevent drying of the liquid in the nozzle.

Abstract: Methods of cleaning backing plates of electrode assemblies, or electrode assemblies including a backing plate and an electrode plate are provided. The methods can be used to clean backing plates and electrode plates made of various materials, such as silicon electrode plates and graphite and aluminum backing plates. The backing plates and electrode assemblies can be new, used or refurbished. A flushing fixture that can be used in the cleaning methods is also provided, the flushing fixture comprising a base plate comprising a recessed inner portion including and an upper surface configured to support the backing plate or the electrode assembly, and a cover plate configured to cover the base plate, the cover plate including at least one liquid passage through which a flushing liquid is introduced into an interior of the flushing fixture defined by the base plate and cover plate.