Particular Adhesive Patents (Class 156/325)
  • Patent number: 7687119
    Abstract: A radiation-curable desiccant-filled adhesive/sealant composition comprising a radiation-curable resin, one or more desiccant fillers, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.
    Type: Grant
    Filed: April 4, 2005
    Date of Patent: March 30, 2010
    Assignee: Henkel AG & Co. KGaA
    Inventors: Jie Cao, Donald E. Herr
  • Patent number: 7687551
    Abstract: Adhesive compositions useful for laminating cellulosic substrates are formulated using an aqueous emulsion of a vinyl ester polymer such as polyvinyl acetate, one or more monomers or oligomers functionalized with (meth)acrylate groups, and a photoinitiator. The adhesive is cured by drying and exposing the adhesive to UV or visible light and is particularly useful for attaching clear films to cellulosic substrates such as paper and boxboard (e.g., in the manufacture of envelopes or folding cartons having windows).
    Type: Grant
    Filed: September 6, 2006
    Date of Patent: March 30, 2010
    Assignee: Henkel Corporation
    Inventors: Alexander P. Mgaya, Balasubramaniam Ramalingam
  • Patent number: 7686904
    Abstract: This invention generally pertains to self propagating high temperature synthesis or combustion synthesis as a way of bonding materials. The present invention provides methods and an apparatus for bonding, preferably carbon-carbon composite materials, by combustion synthesis. Generally, the invention involves providing at least two carbon-carbon composite parts to be bonded and interspersing a combustion synthesis material in between the parts with each part in contact with the combustion synthesis material. The combustion synthesis material is then ignited, which initiates the combustion synthesis reaction. Typically, a ceramic material is formed which immediately freezes, bonding the parts together.
    Type: Grant
    Filed: October 20, 2006
    Date of Patent: March 30, 2010
    Assignee: Honeywell International Inc.
    Inventors: Slawomir T. Fryska, Mark C. James, Mark L. LaForest, Allen H. Simpson, Barry P. Soos
  • Patent number: 7682478
    Abstract: A vacuum infusion laminate adhesive that holds the laminate layers together as the catalyzed resin is sucked into a laminate structure. The adhesive includes properties that cross-link with polyester present in the laminate structure as it cures. Generally, the laminate layers include the assembly of polyester or vinyl ester resins that are reinforced with fiberglass.
    Type: Grant
    Filed: February 22, 2005
    Date of Patent: March 23, 2010
    Assignee: Westech Aerosol Corp.
    Inventors: Jim Manlove, David Carnahan
  • Publication number: 20100065203
    Abstract: A sealable water heater manifold door is formed by adhering a gasket to a manifold door base plate. The manifold door base plate is sized and shaped to cover an opening in a water heater combustion chamber. The gasket is formed from a sealing material that is cut into multiple partial gaskets. The arrangement of multiple partial gaskets on the sealing material reduces excess and unusable sealing material. Each partial gasket has opposed ends that engage opposed ends of another partial gasket to form the gasket. A pair of partial gaskets is applied to an assembly device for accurate and quick placement of the pair of partial gaskets with the manifold door base plate. Door guides on the assembly device are used to align the base plate with the gasket, and the base plate is adhered to the gasket by an acrylic material that is applied to the gasket.
    Type: Application
    Filed: September 18, 2008
    Publication date: March 18, 2010
    Inventors: EMADEDDIN Y. TANBOUR, Clifton A. Madden
  • Publication number: 20100065207
    Abstract: The invention relates to a repulpable adhesive comprising orthophosphoric acid, to adhesive tapes comprising at least one layer of such an adhesive, and to the use of adhesive tapes of this kind.
    Type: Application
    Filed: September 16, 2009
    Publication date: March 18, 2010
    Applicant: TESA SE
    Inventors: Kai ELLRINGMANN, Stefan Wulf, Kristin Kerber
  • Patent number: 7674348
    Abstract: When an air bag is prepared by laying a pair of silicone rubber-impregnated and/or coated base fabric pieces one on the other, with the coated surfaces of the pieces inside, and joining peripheral portions of the pieces together to form a bag, an addition curable silicone rubber composition which is loaded with aluminum hydroxide powder and cures into a silicone rubber having an elongation at break of at least 1000% is used as a sealer and applied to the peripheral portions of the base fabric pieces, thereby achieving improved adhesion therebetween.
    Type: Grant
    Filed: April 22, 2004
    Date of Patent: March 9, 2010
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takashi Aketa, Hiroyasu Hara
  • Publication number: 20100032092
    Abstract: The present invention relates to a starch adhesive mixed with zeolite powder to provide suitable absorption function for corrugated cardboards, and a method for making the adhesive. The adhesive comprises: corn starch as main ingredient, zeolite powder suitably mixed with said corn starch, water, and additives like caustic soda and borax. The corn starch is mixed with zeolite powder in an amount of zeolite powder being 20˜33% of the total weight of corn starch and the zeolite powder, and said adhesive is prepared and adjusted to have a lower gelation temperature. The present invention solves the problem that the initial adhesive strength of adhesive would decrease because of addition of the zeolite powder to the adhesive and would make the drying time longer and then deteriorating the initial adhesive strength. The present invention will make it more efficient and predictable for the mass production of the zeolite starch corrugated cardboards.
    Type: Application
    Filed: April 27, 2009
    Publication date: February 11, 2010
    Inventors: Yi-Jia Chen, Jui-Min Wang, Yi-Chen Tsai
  • Patent number: 7658811
    Abstract: The invention provides a process to deliver an elastomeric composition to a substrate. The elastomeric composition is cooled. The cooling also results in substantially complete transfer of the elastomeric composition from the pattern roll to the substrate with a resulting reduction in elastomer degradation.
    Type: Grant
    Filed: March 23, 2005
    Date of Patent: February 9, 2010
    Assignee: The Procter & Gamble Company
    Inventors: Kenneth Stephen McGuire, Mary Lee Amirpour, Urmish Popatlal Dalal, Fred Naval Desai, Charles Bruce Lambert, David Richard Tucker
  • Patent number: 7652103
    Abstract: A pre-adhesive composition is described comprising an acid-functional (meth)acrylate copolymer and an aziridine crosslinking agent, which when crosslinked provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles.
    Type: Grant
    Filed: February 14, 2008
    Date of Patent: January 26, 2010
    Assignee: 3M Innovative Properties Company
    Inventors: Maureen A. Kavanagh, Kelly S. Anderson, Belma Erdogan, Larry R. Krepski, Sanat Mohanty, Timothy D. Filiatrault, Babu N. Gaddam
  • Patent number: 7648609
    Abstract: The invention relates to the use of a two-phase polymer combination which is dissoluble in aqueous alkali and comprises a. an alkali-soluble copolymer or terpolymer of an ?,?-unsaturated monocarboxylic acid which possesses carboxyl groups distributed essentially uniformly over the chain of the molecule, as a continuous phase, and b. a copolymer or terpolymer which is insoluble in aqueous alkali and contains epoxy groups along its polymer chain, as a discontinuous finely disperse phase, c. free epoxy groups on the surface of the polymer particles of the discontinuous phase being linked to one another by esterification with some of the carboxyl groups of the polymer of the continuous phase, and the remaining carboxyl groups being present in unchanged form, as an adhesive. The polymer combination, which is not tacky in the dry state, can be made tacky by supplying aqueous moisture to it.
    Type: Grant
    Filed: October 1, 2007
    Date of Patent: January 19, 2010
    Assignee: Belland Technology GmbH
    Inventors: Herbert Leder, Elvira Hammer-Wolf
  • Publication number: 20090305051
    Abstract: The invention relates to bonding agent composition containing at least one bonding agent and at least one carrier medium which is liquid at room temperature and has a boiling point higher than 250° C. The carrier medium part represents between 40 and 99 wt. % of the total weight of the composition.
    Type: Application
    Filed: August 31, 2007
    Publication date: December 10, 2009
    Applicant: SIKA TECHNOLOGY AG
    Inventor: Antonio Corsaro
  • Patent number: 7629432
    Abstract: The present invention relates to polycarbonate having repeat units derived from tert-butylhydroquinone (TBHQ). It has herein been found that polycarbonate having repeat units derived from TBHQ has superior properties as compared to polycarbonate having repeat units derived from other dihydroxy (hydroquinone-type) compounds. In one embodiment the present invention provides a polycarbonate having repeat units derived from tert-butylhydroquinone. The polycarbonate has a Mw (PC) of at least 9,000 g/mol.
    Type: Grant
    Filed: October 19, 2007
    Date of Patent: December 8, 2009
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Jan Henk Kamps, Edward Kung, Brian Mullen
  • Patent number: 7629056
    Abstract: A circuit terminal connected structure and a circuit terminal connecting method are provided. Both the structure and the method feature a circuit connecting material formulated with the following components: a curing agent capable of generating free radicals upon heating; an acrylate or methacrylate radical polymerizable substance; and either an acrylic rubber or a maleimide radical polymerizable substance having at least two maleimide groups per molecule. In some embodiments, the curing agent features a 10-hour half life temperature of 40° C. or above and a 1-minute half-life temperature of 180° C. or below. In other embodiments, the circuit connecting material includes conductive particles. In additional embodiments, the circuit connecting material includes a hydroxyl-group-containing resin having a weight average molecular weight of 10,000 or more.
    Type: Grant
    Filed: June 4, 2004
    Date of Patent: December 8, 2009
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atsushi Kuwano
  • Publication number: 20090294055
    Abstract: A method for making a polymeric microfluidic structure in which two or more components (layers) of the microfluidic structure are fixedly bonded or laminated with a weak solvent bonding agent, particularly acetonitrile or a mixture of acetonitrile and alcohol. In an aspect, acetonitrile can be used as a weak solvent bonding agent to enclose a microstructure fabricated in or on a non-elastomeric polymer such as polystyrene, polycarbonate, acrylic or other linear polymer to form a three-dimensional microfluidic network. The method involves the steps of wetting at least one of the opposing surfaces of the polymeric substrate components with the weak solvent bonding agent in a given, lower temperature range, adjacently contacting the opposing surfaces, and thermally activating the bonding agent at a higher temperature than the lower temperature range for a given period of time. The contacted polymeric substrates may also be aligned prior to thermal activation and compressed during thermal activation.
    Type: Application
    Filed: August 12, 2009
    Publication date: December 3, 2009
    Applicant: RHEONIX, INC.
    Inventors: Peng Zhou, Lincoln C. Young
  • Publication number: 20090288852
    Abstract: An electronic device of the present invention has a substrate; an electro-conductive pattern (electrodes) provided over the substrate; a semiconductor chip mounted over the substrate, and electrically connected with the electrodes; a resin cap provided over the substrate and composed of two or more resin layers to hollow-sealing the semiconductor chip; and an adhesive layer (metal-resin adhesion maintenance layer) bonding the resin cap with the electrode.
    Type: Application
    Filed: April 27, 2009
    Publication date: November 26, 2009
    Applicant: NEC Electronics Corporation
    Inventors: Tomoaki Hirokawa, Makoto Matsunoshita, Yuji Kakuta, Naoki Sakura
  • Patent number: 7618713
    Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: November 17, 2009
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atushi Kuwano
  • Publication number: 20090277580
    Abstract: A laminated assembly (10) comprising a substrate (100) with an image (103) thereon, has a first film (20) with a brush stroke texture embossed therein (21), a second film (40) with a canvas texture embossed therein (41) to create a final product having the appearance of a piece of fine art.
    Type: Application
    Filed: May 6, 2009
    Publication date: November 12, 2009
    Inventor: Karl Singer
  • Publication number: 20090277578
    Abstract: A method of laminating a surface of a flexible material to a surface of a rigid, curved material. The method includes pressing an area of the surface of the flexible material into the surface of the rigid, curved material with a holder to create a contact area while the flexible material is conformed to the holder, which has a curvature greater than a curvature of the rigid, curved material surface; and changing the contact area between the surface of the flexible material and the surface of the rigid, curved material while maintaining pressure on the contact area until the surface of the flexible material and the surface of the rigid curved material are laminated.
    Type: Application
    Filed: September 24, 2008
    Publication date: November 12, 2009
    Inventors: Kuo Sung, Troy Edwards, Casey Feinstein, John Zhong, Steve Porter Hotelling, Andrew David Lauder
  • Patent number: 7604868
    Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: October 20, 2009
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atushi Kuwano
  • Publication number: 20090255573
    Abstract: Disclosed herein is the fusing of photovoltaic modules or cells to a heat-weldable thermoplastic roofing membrane, and related methods of manufacturing of the same. The resulting membrane may be used as the back sheet for sealing the back surface of photovoltaic cells/modules. In one embodiment, such a photovoltaic roofing structure may comprise a photovoltaic module with an active layer and electrodes, a transparent superstrate, and a thermoplastic olefin membrane. The transparent superstrate may be positioned on top of the photovoltaic module. Also included may be an underlying membrane comprising heat-weldable thermoplastic material positioned beneath the photovoltaic module. In addition, a frame comprised of the same heat-weldable thermoplastic material as the underlying membrane may be located on a perimeter of the superstrate and the photovoltaic module. The frame is then heat-welded to the underlying membrane around the perimeter of the photovoltaic module.
    Type: Application
    Filed: April 10, 2009
    Publication date: October 15, 2009
    Applicant: BUILDING MATERIALS INVESTMENT CORPORATION
    Inventor: Thomas J. Taylor
  • Patent number: 7601239
    Abstract: A low-expanding adhesive composition comprising: a diisocyanate, a surfactant and an activator is provided. The provided adhesive composition cures upon exposure to water. The adhesive composition can be used to bond wood, metal, glass, ceramic, leather, acrylic, PVC and combinations thereof.
    Type: Grant
    Filed: April 4, 2007
    Date of Patent: October 13, 2009
    Assignee: Comptek Structural Composites of Colorado, Inc.
    Inventors: Lawrence D. Cercone, James D. Lockwood
  • Patent number: 7600398
    Abstract: A method for making artificial tooth bridges including a ceramic densely sintered high strength individual core veneered with porcelain using powder metallurgical methods. The individual densely sintered bridge parts are joined together to a bridge core by a particle reinforced glass. Since only the glass material wets the surface of the densely sintered parts, the glass is the binding material that holds the core together and the particles function to only increase the strength of the bulk glass material.
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: October 13, 2009
    Assignee: Nobel Biocare AB
    Inventors: Jonas Salomonson, Joseph Yanez
  • Publication number: 20090242121
    Abstract: In some embodiments, a low stress, low-temperature metal-metal composite flip chip interconnect is presented. In this regard, a method is introduced consisting of combining a powder of substantially pure tin with a powder of tin alloy having a lower melting point than pure tin and depositing the combination of metals between an integrated circuit device and a package substrate. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: March 31, 2008
    Publication date: October 1, 2009
    Inventor: Daewoong Suh
  • Publication number: 20090239030
    Abstract: A ceramic honeycomb structure comprised of at least two separate smaller ceramic honeycombs that have been adhered together by a cement comprised of inorganic fibers and a binding phase wherein the smaller honeycombs and fibers are bonded together by the binding phase which is comprised of an amorphous silicate, aluminate or alumino-silicate glass and the cement has at most about 5% by volume of other inorganic particles. The cement may be made in the absence of other inorganic and organic additives while achieving a shear thinning cement, for example, by mixing oppositely charged inorganic binders in water together so as to make a useful cement for applying to the smaller honeycombs to be cemented.
    Type: Application
    Filed: March 19, 2009
    Publication date: September 24, 2009
    Applicant: Dow Global Technologies Inc.
    Inventors: Jun Cai, Aleksander Jozef Pyzik, Kwanho Yang
  • Publication number: 20090231661
    Abstract: An electro-optic display comprises a backplane; a layer of electro-optic material disposed adjacent the backplane; a protective layer; and a sealing layer of a metal or a ceramic extending between the backplane and the protective layer, and thus sealing the layer of electro-optic material from the outside environment.
    Type: Application
    Filed: May 26, 2009
    Publication date: September 17, 2009
    Applicant: E Ink Corporation
    Inventors: Shamus Ford Patry, Richard J. Paolini, JR., Thomas H. Whitesides, Robert W. Zehner, Johnathan D. Albert, Harit Doshi
  • Publication number: 20090220735
    Abstract: A sealing material for a honeycomb structure includes inorganic fibers, oxide sol, and inorganic particles. The inorganic fibers include at least one of an alkali metal compound, an alkaline earth metal compound and a boron compound. The sealing material has a pH of at least about 4 and at most about 6.
    Type: Application
    Filed: December 12, 2008
    Publication date: September 3, 2009
    Applicant: IBIDEN CO., LTD.
    Inventors: Hideaki MIZUNO, Akikazu Miyata, Yosuke Fuchi
  • Publication number: 20090186254
    Abstract: The invention provides a polymer comprising an acid cured solvented resole wherein the solvented resole is substantially free from water; a shaped article formed from the polymer and use of the polymer as an electrode, as an electromagnetic shielding material, to suppress electromagnetic interference, or to prevent electrostatic discharge at a location; which polymer is conductive.
    Type: Application
    Filed: June 28, 2007
    Publication date: July 23, 2009
    Applicant: BAC2 Ltd.
    Inventor: Graham Simpson Murray
  • Patent number: 7560507
    Abstract: A method is disclosed. The method comprises combining at least a polymer adhesive material, a thickener, and water to form adhesive compositions having a pH of 4 to 10, and identifying the adhesive compositions having a stringing length of 9 cm or less and one or more of the following properties: a set time of 180 seconds or less, a phase lag of 45 degrees or less, a viscosity of 3,000 to 50,000 cP, a complex shear modulus of 50 to 1000 Pa, and a sag distance of 10 mm or less.
    Type: Grant
    Filed: January 29, 2007
    Date of Patent: July 14, 2009
    Assignee: 3M Innovative Properties Company
    Inventors: Kurt C. Melancon, Mark E. Fagan, Scott D. Pearson, William J. Hunt
  • Publication number: 20090173385
    Abstract: The apparatus and methods of the present disclosure, in a broad aspect, provide novel ways for bonding or sealing pieces of glass of photovoltaic cell modules. These include providing the first piece of glass having a planar surface, providing the second piece of glass having a second planar surface, providing a photovoltaic cell between the first piece of glass and second piece of glass, providing an amount of solder to at least one solder contact area disposed on at least one of the first or second pieces of glass, bringing the first and second pieces of glass into contact at the at least one solder contact area, and heating the solder to about the melting point or working point of the solder to provide the first and second pieces of glass with a bond or seal at the at least one solder contact area.
    Type: Application
    Filed: December 10, 2008
    Publication date: July 9, 2009
    Inventors: Alan Kost, Charles Qian, Katherine Liu
  • Patent number: 7531244
    Abstract: The invention relates to plywood, comprising at least two wood veneer layers and at least one adhesive layer, whereby the adhesive layer comprises a resin composition comprising a triazine compound (T), formaldehyde (F) and optionally urea, wherein the molar F/(NH2)2 ratio of the adhesive layer lies between 0.70 and 1.10 and the molar F/T ratio of the adhesive layer lies between 1.0 and 3.5. The invention further relates to a process for the preparation of plywood.
    Type: Grant
    Filed: December 9, 2004
    Date of Patent: May 12, 2009
    Assignee: DSM IP Assets B.V.
    Inventors: Lars Evers, Jozef Maria Johannes Mattheij
  • Publication number: 20090115291
    Abstract: In an ultrasonic transducer array, a plurality of vibrators arranged in an array is bonded to a base plate by bond material. The bond material bonds the bottom of the each vibrator to the base plate in a manner to surround lower part of the side face of the vibrator. A filling material is filled in between the vibrators. The filling material has a multi-layer structure of different rigidity. In a double layer structure of the filling material, it is preferable that thickness ratio of layer of filling material at the base plate side (lower side) to the other layer of the filling material is 1:1 to 1:3. Preferably, a beam is provided for connecting the side faces of the adjacent vibrators.
    Type: Application
    Filed: November 21, 2008
    Publication date: May 7, 2009
    Applicant: Fujifilm Corporation
    Inventor: Atsushi OSAWA
  • Patent number: 7495035
    Abstract: It is an object of the present invention to provide a photo-curable resin composition which provides a sealing agent for a flat panel display with good moisture permeation resistance and excellent adhesion. The present inventors have conducted extensive studies to solve the above-described problems, and as a result, they have found a photo-curable resin composition which comprises a cationic photopolymerization initiator (A), a cationically polymerizable compound (B), a cyclic polyether compound (C) and another organic compound (D), wherein the amount of (B) is 1.0 to 99.9% by mass and the amount of (C) is 0.0 to 10.0% by mass, both based on the sum of (B), (C) and (D), and the sum (F) of the fluorine atoms in a fluorine-containing organic compound is 0.0 to 40.0% by mass, based on the sum of (B), (C) and (D), and wherein at least 1/1000 mass ratio of the (B) component is a compound containing an oxetanyl group, and both of the contents of (C) and (F) are not 0.0% by mass at the same time.
    Type: Grant
    Filed: August 10, 2004
    Date of Patent: February 24, 2009
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Yugo Yamamoto, Yasushi Mizuta, Yuichi Ito
  • Patent number: 7485371
    Abstract: Polymer bonding compositions having greater than about 1 milliequivalent primary amine/100 grams of the polymer, more preferably greater than about 3 milliequivalent non-tertiary amine/100 grams of the polymer. Preferably the polymer is not significantly crosslinked. These bonding compositions may be especially useful for bonding fluoropolymers. Processes for making the novel polymers and the resulting multilayer bonded articles are described. The polymers include polymer-bonded ZNHLSi(OP)a(X)3?a?b(Y)b units. The bonding composition may be used for making multi-layer polymer laminates such as tubes and films and containers.
    Type: Grant
    Filed: July 30, 2004
    Date of Patent: February 3, 2009
    Assignee: 3M Innovative Properties Company
    Inventors: Naiyong Jing, George Van Dyke Tiers, Mark W. Muggli, Kathryn M. Spurgeon
  • Publication number: 20090029105
    Abstract: Disclosed is a honeycomb structure which is bonded with a bonding material containing 0.1 to 10 mass % of a layered clay mineral. Also disclosed are a honeycomb structure which is bonded with a bonding material containing 0.1 to 10 mass % of an organic binder, and a honeycomb structure which is bonded with a bonding material having a Casson yield value of 6 Pa or more. Further disclosed is a method for producing such a honeycomb structure.
    Type: Application
    Filed: September 22, 2008
    Publication date: January 29, 2009
    Applicant: NGK INSULATORS, LTD.
    Inventors: Naoshi MASUKAWA, Atsushi WATANABE, Shuichi ICHIKAWA
  • Publication number: 20090026076
    Abstract: A NOx sensor and a method of manufacturing a NOx sensor array. The NOx sensor includes a base substrate, a plurality of potentiometric sensors, and a plurality of connectors. The plurality of potentiometric sensors are coupled to the base substrate. Each potentiometric sensor generates a potential difference in response to the presence of NOX in a gas specimen. The plurality of connectors are coupled to the plurality of potentiometric sensors. The plurality of connectors connect the plurality of potentiometric sensors to combine the potential differences of the plurality of potentiometric sensors to produce a combined potential difference indicative of a level of NOx within an ambient gas specimen. Use of a filter and appropriate temperature control of filter and sensor minimizes interference from contaminants.
    Type: Application
    Filed: February 15, 2008
    Publication date: January 29, 2009
    Inventor: Jiun-Chan Yang
  • Publication number: 20090025967
    Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.
    Type: Application
    Filed: July 17, 2008
    Publication date: January 29, 2009
    Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
  • Patent number: 7482064
    Abstract: Disclosed is a composite wood component having upper and lower surface layers and a core layer; a first glueline layer; a second glueline layer; and an overlay layer.
    Type: Grant
    Filed: August 8, 2005
    Date of Patent: January 27, 2009
    Assignee: Huber Engineered Woods LLC
    Inventor: Brian Christopher Gerello
  • Publication number: 20090014122
    Abstract: Provided are a heat resistant laminated conveyor belt and manufacturing method thereof by which a belt surface pressure when a liner and corrugated core paper are pressed and bonded together can be increased to thereby enhance a bonding performance. The heat resistant laminated conveyor belt comprises a belt core layer 11 made by a heat resistant non-metallic fiber substrate being impregnated with a fluororesin dispersion and then dried and sintered and a surface layer 13 (plain weave wire, etc., for example) formed on the belt core layer 11 via an adhesive layer 12 made by a fluororesin film, the surface layer having a fabric structure using an element wire or wires made of a ferrous metal or having a structure in which the element wire or wires are arranged together.
    Type: Application
    Filed: May 16, 2005
    Publication date: January 15, 2009
    Inventors: Hiroshi Ishibuchi, Takashi Nitta, Hideo Imazato, Takafumi Arakawa
  • Publication number: 20090004459
    Abstract: A utility material can include microparticles, an organic binder and an inorganic binder. The microparticles can be present in an amount from about 25 wt % to about 60 wt %, based on wet formulation. The inorganic binder can optionally include sodium silicate. The organic binder can optionally include a vinyl acetate. The utility material can be formed into a variety of different products or building materials, such as wallboard, shear panels. In addition, the building material may be particularly used to attenuate sound.
    Type: Application
    Filed: March 21, 2008
    Publication date: January 1, 2009
    Inventors: Michael D. Kipp, Dilworth L. Pugh, Michael D. Ridges, William T. McCarvill
  • Publication number: 20080318053
    Abstract: In one embodiment, a multilayer structure comprises: an initial terpolymer layer, a second layer comprising plastic and/or glass, a polycarbonate layer, and an adhesive layer. The initial terpolymer layer comprises a polycarbonate terpolymer comprising structures derived from a dihydroxy compound having Structure (I) wherein Rf is a hydrogen or CH3; a second dihydroxy compound of Structure (A) which is derived from Structure (I) and is different from Structure (I); and a third dihydroxy compound of Structure (B) which is not derived from Structure (I), wherein a sum of mole percent of all of Structures (I) and Structure (A) is greater than or equal to 45% relative to a sum of mole percent of all of Structure (I), Structure (A), and Structure (B) in the polycarbonate terpolymer.
    Type: Application
    Filed: June 19, 2007
    Publication date: December 25, 2008
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Geert Boven, Johannes Martinus Dina Goossens, Josef Gerardus Berndsen, Cornelis Johannes Gerardus Maria van Peer
  • Patent number: 7462651
    Abstract: A radiation-curable desiccant-filled adhesive/sealant composition comprising a radiation-curable resin, one or more desiccant fillers, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: December 9, 2008
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Jie Cao, Donald E. Herr
  • Publication number: 20080295959
    Abstract: A thermally conductive adhesive composition contains a polymerizable (meth)acrylic compound (A) comprising at least one of a (meth)acrylic monomer and a (meth)acrylic oligomer, an organic peroxide (B), a thermally conductive filler (C) and a vanadium compound (D). The volume ratio ? of the polymerizable (meth)acrylic compound (A) to the thermally conductive filler (C) determined by the following formula (1) is 0.40 to 0.65. 40 to 100% by mass of the thermally conductive filler (C) is subjected to hydrophobic surface treatment.
    Type: Application
    Filed: May 16, 2008
    Publication date: December 4, 2008
    Applicant: POLYMATECH CO., LTD.
    Inventors: Tsukasa Ishigaki, Yutaka Nakanishi, Hisashi Aoki
  • Patent number: 7452489
    Abstract: A conductive material comprising a V2O5—P2O5 glass and a second phase dispersed in the V2O5—P2O5 glass, wherein the second phase contains a crystalline V and O compound and a crystalline metal phosphate compound. The crystalline V and O compound is at least one of V2O5, V4O9, V2O4, and V2O3. The metal phosphate compound is a phosphate compound of transition metal or alkaline-earth metal. In a visual display device, glass spacers are bonded to glass panels with the conductive material.
    Type: Grant
    Filed: May 31, 2007
    Date of Patent: November 18, 2008
    Assignee: Hitachi Displays, Ltd.
    Inventors: Yuichi Sawai, Osamu Shiono, Takashi Namekawa, Takashi Naitou, Mitsuo Hayashibara, Hiroshi Ito, Akira Hatori, Nobuhiko Hosotani
  • Patent number: 7452595
    Abstract: A heat-sensitive adhesive material contains a substrate and a heat-sensitive adhesive layer that contains a thermoplastic resin and a solid plasticizer, and the heat-sensitive adhesive material is so configured as to be heated and applied to an adherend, wherein the heat-sensitive adhesive material exhibits such an adhesive strength to the adherend as to increase with time from immediately after applying the heat-sensitive adhesive material to the adherend.
    Type: Grant
    Filed: May 21, 2004
    Date of Patent: November 18, 2008
    Inventors: Mitsunobu Morita, Tomoyuki Kugo, Hiroshi Goto, Norihiko Inaba
  • Publication number: 20080264956
    Abstract: A chassis comprising two or more chassis parts, said parts comprising sets of interconnection means; a closed space formed between said parts; and sealing means for sealingly connecting said parts, where said sealing means comprises light receiving window formed in said chassis, a light-sensitive glue; and a light guide formed within said chassis adapted for passing light from said light receiving window to said light-sensitive glue, said lightsensitive glue being provided between said parts, or between at least one of said parts and said light guide.
    Type: Application
    Filed: December 15, 2005
    Publication date: October 30, 2008
    Inventor: Peter Estlander
  • Publication number: 20080248282
    Abstract: A method is provided for fixing a silicone gel component, including a step of contacting the gel component with a sheet made of microporous material, such that the silicone gel is attracted upon contact with the sheet, thereby forming an assembly in which the component is fixed to the sheet without glue or adhesive. The method is applicable to the production of modules for protecting a human body part, in particular the foot.
    Type: Application
    Filed: April 9, 2008
    Publication date: October 9, 2008
    Applicant: MILLET INNOVATION
    Inventors: Jean-Luc MARTIN, Jean-Claude MILLET
  • Publication number: 20080233405
    Abstract: The invention provides a method for fastening a polymeric label to a glass, plastic or metal container or surface by means of a water based composition containing at least 30% by dry weight of animal glue that is activated into an adhesive by the following steps: (a) applying a layer of a hydrophilic solid material based on at least 30% by weight on protein from animal renderings to a polymeric label to form a hydrophilic layer that acts as an adhesive layer when activated with an aqueous medium; (b) applying a low deposition of water, a water based adhesive, water containing a cross-linking agent or an adhesive containing a cross-linking agent to the activatable hydrophilic layer sufficient enough to activate it into an adhesive and form a fastenable polymeric label; (c) fastening the fastenable polymeric label to a glass, plastic or metal container or surface; and (d) allowing said the polymeric label to dry on the glass, plastic or metal container or surface.
    Type: Application
    Filed: January 24, 2005
    Publication date: September 25, 2008
    Inventor: Peter J. Dronzek Jr.
  • Publication number: 20080202694
    Abstract: A fluid flow path, a microfluidic device including the fluid flow path, and methods of forming the same are described. The fluid flow path can include an inlet and at least one outlet, and is defined by a first substrate and a second substrate, each having one or more fluid via extending therethrough, and an adhesive sealant between the first substrate and the second substrate, wherein the adhesive sealant surrounds at least one via of each substrate such that fluid flows through the vias and an area bounded by the adhesive sealant between the substrates. The adhesive sealant can be a bismaleimide-containing compound.
    Type: Application
    Filed: February 26, 2007
    Publication date: August 28, 2008
    Inventors: Jeffrey P. Serbicki, Mario J. Ciminelli, Randy J. Kennard
  • Publication number: 20080199781
    Abstract: A method of producing an electrode assembly comprises positioning a first adhesive between a first surface of a first electrode layer having a width We1, and a first surface of a microporous separator layer having a width Wm at an edge of the first electrode layer and an edge of the microporous separator layer, to form a first separator/electrode pre-assembly, wherein the first adhesive has a width Wa1 less than ½(Weel); and adhering the first surface of the first electrode layer to the first surface of the microporous separator layer via the adhesive to form a first separator/electrode assembly. The adhesive can be a thermoplastic polymer, and can be a film and/or powder.
    Type: Application
    Filed: February 14, 2008
    Publication date: August 21, 2008
    Inventors: Michael Lunt, Murali Sethumadhavan, Gretchen Kolek