Abstract: Provided is a bonding material which enables formation of a bonded article in nitrogen, and can exhibit bonding strength to withstand practical use while having reduced bonding fluctuations between samples without a heat treatment procedure under pressurized or high temperature conditions. The bonding material comprises: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic substance having 8 carbon atoms or less; a dispersion medium having a boiling point of 230° C. or higher; and a flux component including an organic matter having at least two carboxyl groups. Particularly, it is preferable to use the silver nanoparticles and submicron silver particles in combination.

Abstract: Disclosed is a multilayer film laminate comprising a layer consisting essentially of a fluorinated copolymer resin and a layer consisting essentially of an ethylene terpolymer. The ethylene terpolymer layer can be used as an encapsulant layer for solar cells and the multilayer laminate is useful as a component of photovoltaic modules. Methods for preparing photovoltaic modules are also included.

Abstract: The disclosure provides a multilayer composition containing fluoropolymer and method for fabricating the same, and a solar cell module. The multilayer composition includes: a fluoropolymer layer; a non-fluorinated polymer layer; and an adhesion promoter layer formed between the fluoropolymer layer and the non-fluorinated polymer layer, wherein the adhesion promoter layer includes aromatic diamines or aromatic polyamines.

Abstract: The invention relates to the production of a transparent, weather-resistant barrier film by lamination, extrusion lamination (adhesive lamination, melt lamination or hotmelt lamination) or extrusion coating. The film can also contain a scratch-resistant coating. For this purpose, two or more transparent film composites, which consist in each case of two externally disposed polyolefin or polyester layers which are in each case inorganically coated and glued to the inorganic layer on the inside, are connected to each other. Said composite is laminated with a weather-resistant, transparent film (e.g. PMMA or PMMA polyolefin coextrudate or PMMA polyester coextrudate). The inorganic oxide layers have the property of a high optical transparency while having at the same time a good barrier effect against water vapour and oxygen while the PMMA layer exhibits weather resistance stability.

Abstract: Provided are a bonded structure, a sealed structure, an electronic component including the same, a bonding method, and a sealing method, the bonded structure and sealed structure allow hermetic adhesion using an adhesive even when the materials of the bonding surfaces are different, or the bonding surfaces have low wettability for the adhesive. A sealed structure 21 used for an electronic component or the like includes a first bonding surface 17 on a first adherent 11 bonded to a second bonding surface 18 on a second adherent 16 via an adhesive layer 24, the first and/or second bonding surfaces 17 and 18 having films 22 and 23 of film-forming compounds, the film-forming compounds being bound to the surfaces 17 and 18 at one end of the molecule thereof, and bound to a molecule of the adhesive at the functional group at the other end of the molecule.

Abstract: The present invention provides hydrolytically resistant monomers prepared by the reaction of an epoxy compound and a reactive ester and methods for producing the monomers. Also provided are adhesive compositions containing the hydrolytically resistant monomers and methods for use thereof.

Abstract: The present invention provides a reusable masquerade formed of delicate or fragile material that can be retained to skin surface without straps/bands through a backing and adhesive. Suitable delicate materials may include lace, embroidery, brocade, crochet, netting, fishnet, mesh, tissue paper, sequins, beads, and filigree. The backing is applied to the delicate material by ironing, heating, or melting it on. Suitable backing materials may include vinyl, rubber, and plastic. The periphery of the masquerade comprising the delicate material together with attached backing is precisely cut to at least partially conform to a design on the delicate material and to conform to an anatomy of a target skin surface on which it is placed. The masquerade may be placed on the face with a hole for the eye in it. It can be worn again as the adhesive is easily removed from the backing and skin with conventional means.

Abstract: To provide a microchip for a nucleic acid amplification reaction which allows high-precision analysis by a simple method. There is provided a microchip A for a nucleic acid amplification reaction including an entrance through which a liquid enters from the outside, a plurality of wells configured to function as reaction sites of nucleic acid amplification reaction, and flow channels through which the liquid entered from the entrance is fed into each of the wells, in which a plurality of reagents needed for the reaction are laminated and anchored in a prescribed order in each well.

Abstract: The present invention relates to a method of bonding a gold surface to a second surface which comprises heating a hybrid organic-inorganic melting gel >50° C., applying the melting gel to either the gold surface or the second surface. The melting gel is heated to above 130° C. until the melting gel has cured sufficiently to bond the surfaces together. The invention also relates to a combination of a gold surface and a second surface that is bonded together with a hybrid organic-inorganic melting gel. In another aspect of the invention the hybrid organic-inorganic melting gel is heated to a workable viscosity and cast into a film, sheet, block or lens. The cast gel is cured or partially cured and then applied between the gold surface and the second surface. Additional uncured melting gel may be applied. The construct is heated to above 130° C. until the melting gel has cured sufficient to bond the surfaces together.

Abstract: A method for temporarily fixing a member with a curable composition that includes (A) a polyfunctional (meth)acrylate, (B) phenol 2-mol ethylene oxide-modified acrylate, (C) a photopolymerization initiator, (D) a polar solvent, and (H) at least one granular material selected from the group consisting of polypropylene particles, crosslinked polymethyl methacrylate particles and crosslinked polystyrene particles.

Abstract: A method of increasing adhesion between a copper or copper alloy layer and a polymeric resin. The method includes the steps of a) applying a pre-dip composition to the copper layer; b) applying a nano-oxide composition to the treated copper layer, c) applying a post-dip composition to the nano-oxide treated surface, and d) bonding a resin to the treated copper surface. The nano-oxide composition comprises (i) a chlorite; (ii) a caustic; (iii) a phosphate salt; (iv) an organic nitro compound; and (v) a thio compound. The post-dip composition is an alkaline solution that comprises (i) a phosphate salt; (ii) a source of molybdenum ions; and (iii) a thiazole. The process of the invention is useful for improving the bond between copper and a resin, including high Tg resins, halogen-free resins, and high speed/lost resins.

Abstract: The invention generally relates to di-cinnamyl compounds useful in a variety of adhesive applications. More specifically, the invention provides chain-extended bismaleimides and methods for generating them by reaction with di-cinnamyl compounds, including particular di-cinnamyl compounds disclosed herein. Invention di-cinnamyl compounds can also be used as co-monomers in a Diels-Alder type cure, and can act as a co-monomer in a thermoset composition with a maleimide monomer.

Abstract: A particular method includes exposing a plurality of fibers of a composite skin of an aircraft component by providing an opening in a layer of a first resin overlaying the plurality of fibers at an interior surface of the composite skin. The method also includes bonding a conductive patch in electrical contact with the plurality of fibers of the composite skin at the opening using a second resin. The method further includes preparing the aircraft component to receive a connector in electrical contact with the conductive patch.

Abstract: The inventive method for placing and fixing (bonding) a first object, whose surface is functionalized by compounds of formula I Y (X), A? (I), on the surface of a second object whose surface is functionalized by compounds of formula II Y (X)n A (II), wherein A and A? are functional groups enabling to be bonded at least by a link in a covalent manner to an object surface X and X? are aliphatic, linear, branched or cyclic spacers which can comprise one or several hetero or aromatic, or heteroaromatic atoms or consist of several aromatic or heteroaromatic cycles and optionally of alternating aliphatic chains having aromatic or heteroaromatic groups, n and n?=0 or 1 and Y and Y are functions for generating one or several non-covalent bonds wherein said Y or Y? are selected such that they are complementary or can complex a metal atom or an identical metal compound.

Abstract: Methods are disclosed for creating extremely high permittivity dielectric materials for use in capacitors and energy storage devices. High permittivity materials suspended in an organic non-conductive media matrix with enhanced properties and methods for making the same are disclosed. A general method for the formation of thin films of some particular dielectric material is disclosed, wherein the use of organic polymers, shellac, silicone oil, and/or zein formulations are utilized to produce thin film low conductivity dielectric coatings. Additionally, methods whereby the formation of certain transition metal salts as salt or oxide matrices at low temperatures utilizing mild reducing agents are disclosed. Further, a method for the enhancement of dielectric permittivity formation in the dielectric material of the capacitor is taught.

Abstract: A method for connecting an electronic part, which contains: mixing a dispersing solvent, an adhesive resin which is dissolved in the dispersing solvent, conductive particles, and insulating particles which have smaller particle diameters than those of the conductive particles so as to prepare an anisotropic conductive adhesive; placing a terminal of a substrate and a terminal of an electronic part so as to face each other via the anisotropic conductive adhesive, and applying heat and pressure to the substrate and the electronic part so as to sandwich the conductive particles between the terminal of the substrate and the terminal of the electronic part to thereby deform the conductive particles, in which the pressure is smaller than pressure at which the conductive particles are destroyed, and smaller than pressure at which the particle diameters of the conductive particles become equal to the particle diameters of the insulating particles.

Abstract: Described is a pre-adhesive, curable composition comprising an acid-functional (meth)acrylate copolymer and a novel (meth)acryloyl-aziridine crosslinking agent, which when crosslinked provides a pressure-sensitive adhesive composition.

Abstract: Provided are a semiconductor device producing method with simple production steps while preventing contamination of a bonding pad and preventing warp generation in an adherend such as a substrate, a lead frame, or a semiconductor element, thereby improving yield; an adhesive sheet used in this method; and a semiconductor device obtained by this method. The invention includes a pre-setting step of pre-setting a semiconductor element 13 to an adherend 11 through an adhesive sheet 12, and a wire bonding step of wire bonding the element 13 in the bonding temperatures range of 80 to 250° C. without performing any heating step, wherein, as the adhesive sheet 12, a sheet having a storage elastic modulus of 1 MPa or more in the temperature range of 80 to 250° C. or a storage elastic modulus of 1 MPa or more at any temperature in the temperature range before curing the sheet 12 is used.

Abstract: A process for increasing the adhesion of a polymeric material to a metal surface, the process comprising contacting the metal surface with an adhesion promoting composition comprising: 1) an oxidizer; 2) an inorganic acid; 3) a corrosion inhibitor; and 4) an organic phosphonate; and thereafter b) bonding the polymeric material to the metal surface. The organic phosphonate aids in stabilizing the oxidizer and organic components present in the bath and prevents decomposition of the components, thereby increasing the working life of the bath, especially when used with copper alloys having a high iron content.

Abstract: The present invention generally relates to chemically bonded ceramic biomaterials, preferably a dental material or an implant material, comprising two binder systems. The main binder system forms a chemically bonded ceramic upon hydration thereof, and comprises powdered calcium aluminate and, optionally, minor amounts of calcium silicate. The second binder system is a cross-linking organic binder system which provides for initial crosslinking of the freshly mixed paste forming the biomaterial. The biomaterial also comprises inert filler particles.

Abstract: Adhesive tape having a carrier and a layer of adhesive applied on at least one side to the carrier, the carrier having at least one foam layer composed at least in part of a polyolefin-based polymer, wherein the polyolefin-based polymer contains an ethylene multi-block copolymer in a fraction of at least 40% (w/w), the ethylene multi-block copolymer being composed of hard segment blocks, containing at least 95% (w/w) of ethylene and a comonomer, and of soft segment blocks, containing ethylene and a comonomer, the fraction of comonomer in the soft segment blocks being between 10 and 20 mol %.

Abstract: Provided are a temporal fixation method in processing of optical members and a resin composition suitable therefor. The present invention provides a composition which is characterized by comprising (A1): a (meth)acrylate with a molecular weight of at least 500 having at least one (meth)acryloyl group at a terminal or in a side chain of a molecule, (B1): a polyfunctional (meth)acrylate, (C1): a (meth)acrylate other than (A1) and (B1), and (D1): a photopolymerization initiator. The invention also provides a method for temporarily fixing a member, characterized by comprising bonding a member to temporarily fix it with use of the composition, processing the temporarily fixed member, and immersing the processed member in warm water of at most 90° C., thereby removing a cured resin of the composition.

Abstract: A compound comprising at least one alkoxy silane moiety; and at least one moiety selected from a nitrosobenzene or a nitrosobenzene precursor and combinations thereof are provided and used in polymer to metal in particular rubber to metal bonding. The nitrosobenzene precursor may be at least one of a quinone dioxime or a quinone oxime.

Abstract: The invention relates to an adhesive system comprising starch and one or more polymers (P) containing acetoacetoxy groups. It further relates to a method of producing an adhesive composition comprising starch and one or more polymers (P) containing acetoacetoxy groups. The invention further relates to a method of producing a wood based product such as a laminated or veneered material, or a particle board.

Abstract: An optical device is formed by hot stamping a demetallized hologram to an optically variable foil or to a coating of optically variable ink. In another embodiment a hologram is hot stamped to a banknote or document printed with a color-shifting ink.

Abstract: Provided is an adhesive composition disclosed herein includes tannin, poly(ethylene glycol) and water. The adhesive composition has little toxicity, allows adhesion even in the absence of a thermosetting curing agent, and is hardly soluble in water to show moisture resistance, unlike known tannin adhesives. Therefore, the adhesive composition may be used as a medical adhesive, adhesive depot for sustained release of drug, anti-adhesion agent, cell/protein adsorption barrier and medical hemostatic applicable to various wet environments.

Abstract: Pressure-sensitive adhesive for single- or double-sidedly tacky pressure-sensitive adhesive strips redetachable without residue or destruction both by extensive stretching substantially in the bond plane and by peeling, the pressure-sensitive adhesive being composed at least of (1) a vinylaromatic block copolymer, (2) a solid tackifying resin having a softening temperature by the ring-and-ball method of more than 30° C. and (3) a resin which is liquid at room temperature (23° C.), the fraction of liquid resin accounting for at least 40% by weight, based on the total amount of resin. Strips formed from the adhesive and the use of the strips to form redetachable bonds are also disclosed.

Abstract: The reaction of diner acids, C10-C20 dicarboxylic acids, and alkylene diamines having from 2 to 8 carbon atoms provides polyamides having good oil and solvent resistance, high heat resistance, flexibility, and relatively low melt viscosities.

Abstract: Process for the production of wood-based materials containing wood parts, comprising the steps a) bringing wood parts into contact with a1) alkaline binder and a2) thiacloprid and b) pressing a bed of wood parts, containing wood parts treated according to step a), under pressure at a temperature of the press contact surfaces of 126° C. to 240° C.

Abstract: Compositions comprising at least one copper salt, and an aromatic nitroso compound precursor are provided. The copper salt may oxidise the aromatic nitroso compound precursor to provide an aromatic nitroso compound. The compositions may find utility in polymer to metal, in particular, rubber to metal bonding. The aromatic nitroso compound precursor may be a nitrosobenzene/dinitrosobenzene precursor. The nitrosobenzene or dinitrosobenzene precursor may be at least one of a quinone oxime or a quinone dioxime.

Abstract: An adhesion promoting composition and a process for treating metal surfaces with the adhesion promoting composition is described. The adhesion promoting composition comprises an oxidizer, an acid, a corrosion inhibitor, a source of halide ions and a material selected from a mercapto propane sulfonate, mercapto propane sulfonic acid, and bis-sodium sulfopropyl disulfide. The adhesion promoting composition increases the adhesion of polymeric materials to the metal surfaces and also provides increased acid resistance.

Abstract: The present disclosure is generally directed to electrically conductive adhesives. More particularly, the disclosure is directed to electrically conductive adhesives comprising an organic polymer resin and an electrically conductive polymer. Advantageously, the electrically conductive adhesives have low RF loss, and are thus suitable for use in a space radar antenna and in other antenna applications where antenna components are in the RF field of view.

Abstract: The present invention relates to a patch for treating constipation, which contains rhubarb ingredients selected from among crude drugs (medical herbs). More particularly, the present invention relates to a patch for treating constipation in which powder obtained by boiling, filtering, and free-drying rhubarb selected from among pure crude drugs is applied to the patch, and the patch is attached to the recesses (arched parts) below the wrists of both hands of a patient, to thereby increase the metabolism of internal organs of the patient and exhibit the effects of treating or preventing constipation. The patch of the present invention can be simply attached to the skin of the patient instead of directly administering agents for treating constipation to the patient.

Abstract: A pre-adhesive composition is described comprising an acid-functional (meth)acrylate copolymer and an acylaziridine crosslinking agent, which when crosslinked provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles.

Abstract: The invention relates to a method of producing a wood based product, comprising applying an adhesive system onto one or more pieces of a wood-based material, and joining the one or more pieces with one or more further pieces of a material, the adhesive system comprises one component comprising starch and another component comprising one or more polymers (P) containing an amine group or an amide group. The present invention also relates to an adhesive system comprising one component comprising starch and another component comprising one or more polymers (P) containing an amine group or an amide group, the two components being present as unmixed separate components. The invention further relates to a wood based product.

Abstract: There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.

Abstract: Microcapsules wherein the capsule wall is formed from an organic polymer (capsule wall polymer for short) and the core of the microcapsules comprises compounds containing carbodiimide groups (carbodiimide compound for short).

Abstract: The present invention has its object to provide a curable composition which allows slight bleedout of a liquid compound to occur to the cured product and shows good curability and adhesiveness using a non-organotin catalyst, an amine compound, as a silanol condensation catalyst. The present invention relates to a non-organotin-based curable composition which comprises: (A) an organic polymer having a silicon-containing group capable of crosslinking by siloxane bond formation, and (B) a specific amidine compound and/or a guanidine compound having a melting point of not lower than 23° C., as a silanol condensation catalyst.

Abstract: The present invention has its object to provide, by using a non-organotin curing catalyst, a curable composition having a practical level of curability. Furthermore, the present invention has its object to provide a curable composition excellent in adhesiveness while it secures a practical level of curability. The present invention relates to a curable composition which comprises: (A) an organic polymer containing a silicon-containing group capable of crosslinking by siloxane bond formation and (B) a silanol condensation catalyst: and that the silanol condensation catalyst is an amine compound and that an aqueous solution prepared by adding 5 millimoles of the amine compound to 100 g of a mixed solvent composed of isopropyl alcohol and water in a weight ratio of 10:3 has a pH value of not lower than 13.4 as measured at 23° C. according to JIS Z 8802.

Abstract: A method of increasing adhesion between a copper or copper alloy layer and a polymeric resin. The method includes the steps of a) applying a pre-dip composition to the copper layer; b) applying a nano-oxide composition to the treated copper layer, c) applying a post-dip composition to the nano-oxide treated surface, and d) bonding a resin to the treated copper surface. The nano-oxide composition comprises (i) a chlorite; (ii) a caustic; (iii) a phosphate salt; (iv) an organic nitro compound; and (v) a thio compound. The post-dip composition is an alkaline solution that comprises (i) a phosphate salt; (ii) a source of molybdenum ions; and (iii) a thiazole. The process of the invention is useful for improving the bond between copper and a resin, including high Tg resins, halogen-free resins, and high speed/lost resins.

Abstract: A connection between a power bus and a conducting layer of a suspended particle device in accordance with an embodiment of the present application includes an adhesive combined with metallic particles to impart both good adhesion and electrical conductivity. The adhesive is applied to a surface of the conducting layer. A conducting copper foil or conducting fabric is adhered to the adhesive and forms at least a portion of the power bus.

Abstract: Non-ceramic floor coverings are bonded to a substrate by an aqueous adhesive that comprises a synthetic polymer as a binder and hydrolyzable silane groups.

Abstract: The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which a pressure-sensitive adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.

Abstract: Composite materials comprising propylene-based copolymer coating or tie layers disposed on one or more substrates are set forth herein. In one or more embodiments, the coating compositions comprise propylene and from about 3 to about 25 wt % units derived from ethylene and/or a C4-C8 alpha-olefin, and have a melting temperature less than about 105° C. and a heat of fusion less than about 75 J/g. Processes for forming such composite materials, such as by monoextrusion or coextrusion, are also provided.

Abstract: A method for making a device housing comprises: providing a metal substrate; providing a transparent or translucent film, the film being formed with a pattern coating on one surface thereof; forming a bonding coating on the metal substrate; and heat pressing the film and the metal substrate into a whole with the pattern coating bonding with the bonding coating. A device housing manufactured by the method is also described there.

Abstract: This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.

Abstract: The invention relates to compositions comprising or consisting of a reaction product obtained from a reaction mixture of aminosilane of formula (I), a mecaptosilane of formula (II) and an epoxysilane of formula (III). Said compositions are suitable as bonding agents, especially in the form of primers. The compositions are highly adhesive and especially suitable for low-temperature applications and especially for sticking glass together.

Abstract: A patch for external use which has a laminate structure comprising a substrate and a pressure-sensitive adhesive layer which contains a styrene/isoprene/styrene block copolymer as the base and further contains a tackifier resin consisting of a rosin resin and at least one other tackifier resin, a softening agent consisting of polybutene and liquid paraffin, a fatty acid ester, and fentanyl, characterized in that the weight ratio of the rosin resin to fentanyl is 1 to 5, the weight ratio of the rosin resin to the whole tackifier resin is 0.1 to 0.6, and the tackifier resin accounts for 30 to 60wt % of the whole pressure-sensitive adhesive layer. The patch is excellent in the permeation of fentanyl through the skin and in storage stability, and is weak in irritation to skin.

Abstract: A fuel cell separator plate assembly (20) includes a separator plate layer (22) and flow field layers (24, 26). In one disclosed example, the separator plate layer (22) comprises graphite and a hydrophobic resin. The hydrophobic resin of the separator plate layer (22) serves to secure the separator plate layer to flow field layers on opposite sides of the separator plate layer. In one example, at least one of the flow field layers (24, 26) comprises graphite and a hydrophobic resin such that the flow field layer is hydrophobic and nonporous. In another example, two graphite and hydrophobic resin flow field layers are used on opposite sides of a separator plate layer. One disclosed example includes all three layers comprising graphite and a hydrophobic resin.

Abstract: An adhesion bond between a metallic surface layer and a second surface is formed by treating the layers with a material comprising sulphur-containing molecules. The sulphur-containing molecules are applied as a surface treatment of the surfaces, so that the sulphur-containing molecules act as a coupling agent to bond chemically to both substrates form nanometer-sized structures on the surfaces. The nanometer-sized structures are incorporated into a self-assembly interlayer in between the surfaces, with the interlayer forming a bond to both surfaces.