Organic Containing Patents (Class 156/326)
  • Publication number: 20100206474
    Abstract: A bonding method includes: forming a liquid coating by supplying a polyester-modified silicone material-containing liquid material onto at least one of a first base material and a second base material prepared beforehand to be bonded to each other via a bonding film; drying and curing the liquid coating to obtain a bonding film on at least one of the first base material and the second base material; imparting energy to the bonding film to develop adhesion near a surface of the bonding film; and contacting the first base material and the second base material via the bonding film so as to obtain a bonded structure in which the first base material and the second base material are bonded to each other via the bonding film.
    Type: Application
    Filed: February 16, 2010
    Publication date: August 19, 2010
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Mitsuru SATO, Takatoshi YAMAMOTO, Nobuhiro NAITO, Minehiro IMAMURA
  • Patent number: 7771559
    Abstract: The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: August 10, 2010
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Isao Tsukagoshi, Yasushi Gotou, Masami Yusa, Yasuo Miyadera
  • Patent number: 7763146
    Abstract: An electrostatic chuck and a base member are separated from each other while heating up a substrate mounting member to a thermal decomposition temperature within a range from a thermal decomposition starting temperature to a thermal decomposition ending temperature and then softening and decomposing an organic adhesive layer.
    Type: Grant
    Filed: October 30, 2006
    Date of Patent: July 27, 2010
    Assignee: NGK Insulators, Ltd.
    Inventor: Masahito Eguchi
  • Publication number: 20100181090
    Abstract: Provided are a bonded structure, a sealed structure, an electronic component including the same, a bonding method, and a sealing method, the bonded structure and sealed structure allow hermetic adhesion using an adhesive even when the materials of the bonding surfaces are different, or the bonding surfaces have low wettability for the adhesive. A sealed structure 21 used for an electronic component or the like includes a first bonding surface 17 on a first adherent 11 bonded to a second bonding surface 18 on a second adherent 16 via an adhesive layer 24, the first and/or second bonding surfaces 17 and 18 having films 22 and 23 of film-forming compounds, the film-forming compounds being bound to the surfaces 17 and 18 at one end of the molecule thereof, and bound to a molecule of the adhesive at the functional group at the other end of the molecule.
    Type: Application
    Filed: June 20, 2008
    Publication date: July 22, 2010
    Inventor: Kazufumi Ogawa
  • Publication number: 20100170638
    Abstract: An adhesion promoting composition and a process for treating metal surfaces with the adhesion promoting composition is described. The adhesion promoting composition comprises an oxidizer, an acid, a corrosion inhibitor, a source of halide ions and a material selected from a mercapto propane sulfonate, mercapto propane sulfonic acid, and bis-sodium sulfopropyl disulfide. The adhesion promoting composition increases the adhesion of polymeric materials to the metal surfaces and also provides increased acid resistance.
    Type: Application
    Filed: January 8, 2009
    Publication date: July 8, 2010
    Inventors: John L. Cordani, JR., Kesheng Feng, Steven A. Castaldi, Colleen Mckirryher
  • Publication number: 20100163160
    Abstract: The invention relates to a method for producing a cladding element (10) with a base board (12) that is provided with a paper ply (14, 18) impregnated with resin on a surface (12a, 12b). According to the invention in a first step (BID, BIR) the resin is applied to the surface (12a, 12b) of the base board (12), in a second step (DS, RS) the paper ply (14, 18) is applied to the surface (12a, 12b) of the base board (12), and in a third step (HP) the base board (12) provided on the surface (12a, 12b) with resin and the paper ply (14, 18) are pressed to one another.
    Type: Application
    Filed: January 17, 2007
    Publication date: July 1, 2010
    Inventor: Herbert Ruhdorfer
  • Patent number: 7740733
    Abstract: Disclosed is an easy to use optical adhesive composition which has lower refractive index than the conventional optical adhesive compositions while having low viscosity, fast curability and excellent heat resistance. Also disclosed are a method for bonding an optical component using such an optical adhesive composition which enables to reduce transmission loss, and an optical device. Specifically disclosed are an optical adhesive composition characterized by comprising at least one acrylate compound represented by the general formula (I) and a photopolymerization initiator, a method for bonding an optical component using such an optical adhesive composition, and an optical device. Tf-(O)a—(CH2)b—(CF2)m—(CH2)b—(O)a-Tf (I) wherein a's are the same represent 0 or 1, b's are the same represent 0 or 1, m represents an integer of 4 to 12, and Tf's are the same and represent a glycidyl group or CH2?CH—C(O)—.
    Type: Grant
    Filed: June 23, 2005
    Date of Patent: June 22, 2010
    Assignee: Nagase Chemtex Corporation
    Inventor: Iida Takafumi
  • Publication number: 20100147451
    Abstract: The use of silanes as adhesion promoters between two uncured or partially cured organic surfaces, especially such surfaces that do not adhere well to each other, and particular applications of such silanes, such as in the formation of boat hull laminates.
    Type: Application
    Filed: April 24, 2008
    Publication date: June 17, 2010
    Applicant: EVONIK DEGUSSA GmbH
    Inventor: Ramon Sanchez Morillo
  • Publication number: 20100143725
    Abstract: An aqueous gel-forming composition, e.g. a fire retardant coating composition, comprises an aluminosilicate, the aluminosilicate comprising alkali metal aluminate and an alkali metal silicate, and an organic liquid having a boiling point greater than 11O° C., e.g. silicone oil. The molar ratio of SiO2:X2O for the alkali metal silicate is from 3.6:1 to 10:1, where X represents the alkali metal of the alkali metal silicate, when the alkali metal aluminate has a molar ratio of Y2O:AI2O3 of 1.35:1, where Y represents the alkali metal of the alkali metal aluminate, this providing improved water resistance for films or coatings prepared from the compositions by drying and curing.
    Type: Application
    Filed: January 23, 2008
    Publication date: June 10, 2010
    Inventors: Abraham Araya, Eric Petrus Wilhelmus Elisabeth Smeets, Jan Noordegraaf, Petrus Frederikus Maria Rensen, Christianus Marcus Gijsbertus Maria Buijk, Wilhemus Petrus Theodorus Kamperman, Henricus Johanna De Swart, Peter Willem Marie Schouren, Moses Rathbun
  • Publication number: 20100119741
    Abstract: The invention provides the art with a starch based corrugating adhesive that may advantageously be used in the manufacture of water-resistant paperboard products, such as laminated board and corrugated board. The adhesive has the required tack, water resistance and viscosity that allows its use at commercial speeds in a cold corrugating process.
    Type: Application
    Filed: November 7, 2008
    Publication date: May 13, 2010
    Inventors: A. Levent Cimecioglu, Frank J. Swiezkowski, Craig H. Leake
  • Publication number: 20100097918
    Abstract: Provided is a highly reliable optical recording head which has a small fluctuation of a quantity of light applied on a recording medium due to temperature. The optical recording head is provided with a light guide section for guiding light applied from a light source, a slider relatively moving to the recording medium, and a light transmitting section, which is arranged on the slider, transmits the light outputted from the light guide section and outputs the light toward the recording medium. The optical recording head is further provided with an adhesive layer, which is sandwiched between the light transmitting section and the light guide section and fixes the positions of the light transmitting section and the light guide section, and an elastic cohesive layer, which is sandwiched between the portions other than the light transmitting section of the slider and the light guide section.
    Type: Application
    Filed: January 10, 2008
    Publication date: April 22, 2010
    Applicant: KONICA MINOLTA OPTO, INC.
    Inventor: Naoki Nishida
  • Publication number: 20100080995
    Abstract: A method for connecting an electronic part, which contains: mixing a dispersing solvent, an adhesive resin which is dissolved in the dispersing solvent, conductive particles, and insulating particles which have smaller particle diameters than those of the conductive particles so as to prepare an anisotropic conductive adhesive; placing a terminal of a substrate and a terminal of an electronic part so as to face each other via the anisotropic conductive adhesive, and applying heat and pressure to the substrate and the electronic part so as to sandwich the conductive particles between the terminal of the substrate and the terminal of the electronic part to thereby deform the conductive particles, in which the pressure is smaller than pressure at which the conductive particles are destroyed, and smaller than pressure at which the particle diameters of the conductive particles become equal to the particle diameters of the insulating particles.
    Type: Application
    Filed: December 4, 2009
    Publication date: April 1, 2010
    Applicant: Sony Chemical & Information Device Corporation
    Inventors: Tomoyuki Ishimatsu, Daisuke Sato, Hiroki Ozeki
  • Patent number: 7687119
    Abstract: A radiation-curable desiccant-filled adhesive/sealant composition comprising a radiation-curable resin, one or more desiccant fillers, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.
    Type: Grant
    Filed: April 4, 2005
    Date of Patent: March 30, 2010
    Assignee: Henkel AG & Co. KGaA
    Inventors: Jie Cao, Donald E. Herr
  • Patent number: 7687551
    Abstract: Adhesive compositions useful for laminating cellulosic substrates are formulated using an aqueous emulsion of a vinyl ester polymer such as polyvinyl acetate, one or more monomers or oligomers functionalized with (meth)acrylate groups, and a photoinitiator. The adhesive is cured by drying and exposing the adhesive to UV or visible light and is particularly useful for attaching clear films to cellulosic substrates such as paper and boxboard (e.g., in the manufacture of envelopes or folding cartons having windows).
    Type: Grant
    Filed: September 6, 2006
    Date of Patent: March 30, 2010
    Assignee: Henkel Corporation
    Inventors: Alexander P. Mgaya, Balasubramaniam Ramalingam
  • Publication number: 20100071327
    Abstract: A filter assembly includes a filter pad comprising flame resistant viscose. The filter assembly also includes a bonding emulsion. The bonding emulsion may comprise casein resin. The bonding emulsion may additionally comprise acrylic resin. The filter assembly also includes a structural support. In particular embodiments, at least a portion of the fibers are treated with a solution that is fire resistant or fire retardant.
    Type: Application
    Filed: September 23, 2009
    Publication date: March 25, 2010
    Inventors: Glenn David Alexander, Joseph Anthony Salpietra, JR.
  • Publication number: 20100066206
    Abstract: A method and apparatus for bonding on a silicon substrate are disclosed. An apparatus includes a membrane having a membrane surface, a groove in the membrane surface, a transducer having a transducer surface substantially parallel to the membrane surface, and an adhesive connecting the membrane surface to the transducer surface. The groove can be configured to permit flow of adhesive into and through the groove while minimizing voids or air gaps that could result from incomplete filling of the groove. Multiple grooves can be formed in the membrane surface and can be of uniform depth.
    Type: Application
    Filed: September 18, 2009
    Publication date: March 18, 2010
    Applicant: FUJIFILM DIMATIX, INC.
    Inventors: Christoph Menzel, Gregory DeBrabander, Corina Nistorica
  • Publication number: 20100065311
    Abstract: The conductive particle of the invention each comprises a conductive nucleus particle and an insulating coating containing an organic high molecular compound on the surface of the nucleus particle, and the coverage factor as defined by the following formula (1) is in the range of 20-40%.
    Type: Application
    Filed: April 10, 2007
    Publication date: March 18, 2010
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Masaru Tanaka, Jun Taketatsu
  • Publication number: 20100065209
    Abstract: Microcapsules wherein the capsule wall is formed from an organic polymer (capsule wall polymer for short) and the core of the microcapsules comprises compounds containing carbodiimide groups (carbodiimide compound for short).
    Type: Application
    Filed: December 11, 2007
    Publication date: March 18, 2010
    Applicant: BASF SE
    Inventors: Andre Burghardt, Maria Teresa Hechavarria Fonseca, Karl Haeberle, Oliver Hartz, Marc Rudolf Jung, Karl-Heinz Schumacher, Denise von Preysing, Hans-Peter Hentze
  • Patent number: 7674348
    Abstract: When an air bag is prepared by laying a pair of silicone rubber-impregnated and/or coated base fabric pieces one on the other, with the coated surfaces of the pieces inside, and joining peripheral portions of the pieces together to form a bag, an addition curable silicone rubber composition which is loaded with aluminum hydroxide powder and cures into a silicone rubber having an elongation at break of at least 1000% is used as a sealer and applied to the peripheral portions of the base fabric pieces, thereby achieving improved adhesion therebetween.
    Type: Grant
    Filed: April 22, 2004
    Date of Patent: March 9, 2010
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takashi Aketa, Hiroyasu Hara
  • Publication number: 20100043970
    Abstract: The present invention relates to a method of producing a wood based product comprising applying a water-based adhesive composition comprising non-gelatinised starch, the composition further comprises from 0.1 to 50 weight % of one or more polymers (P) containing an amine group or an amide group, onto one or more pieces of a wood-based material and joining the one or more pieces with one or more further pieces of a wood based material.
    Type: Application
    Filed: December 7, 2007
    Publication date: February 25, 2010
    Applicant: AKZO NOBEL COATING INTERNATIONAL B.V.
    Inventors: Farideh Khabbaz, Per Anders Eriksson, Joanna Fare, Anna Kristina Furberg
  • Patent number: 7662447
    Abstract: An adhesive of the invention for polarizing plates used for forming an adhesive layer in a polarizing plate in which a polarizer and a transparent protective film is are adhering with each other via the adhesive layer, wherein the adhesive for polarizing plates is an aqueous solution containing a polyvinyl alcohol-based resin having an acetoacetyl group and a crosslinking agent, and the aqueous solution has a pH of 4.3 or less. The adhesive of the invention for polarizing plates is good in durability and long in pot life.
    Type: Grant
    Filed: December 15, 2004
    Date of Patent: February 16, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Naoki Tomoguchi, Tadayuki Kameyama, Morimasa Wada, Hiroaki Mizushima
  • Patent number: 7648609
    Abstract: The invention relates to the use of a two-phase polymer combination which is dissoluble in aqueous alkali and comprises a. an alkali-soluble copolymer or terpolymer of an ?,?-unsaturated monocarboxylic acid which possesses carboxyl groups distributed essentially uniformly over the chain of the molecule, as a continuous phase, and b. a copolymer or terpolymer which is insoluble in aqueous alkali and contains epoxy groups along its polymer chain, as a discontinuous finely disperse phase, c. free epoxy groups on the surface of the polymer particles of the discontinuous phase being linked to one another by esterification with some of the carboxyl groups of the polymer of the continuous phase, and the remaining carboxyl groups being present in unchanged form, as an adhesive. The polymer combination, which is not tacky in the dry state, can be made tacky by supplying aqueous moisture to it.
    Type: Grant
    Filed: October 1, 2007
    Date of Patent: January 19, 2010
    Assignee: Belland Technology GmbH
    Inventors: Herbert Leder, Elvira Hammer-Wolf
  • Publication number: 20100000679
    Abstract: The present invention provides a method for bonding a membrane electrode assembly (MEA) and a gas diffusion layer (GDL) of a fuel cell stack, which facilitates stacking of an electrode catalyst layer of the MEA and the GDL and, at the same time, facilitates the keeping of the stacked layers for mass production of the fuel cell stack. For this purpose, the present invention provides a method for bonding a membrane electrode assembly and a gas diffusion layer of a fuel cell stack, the method including: coating a catalyst layer on a surface of a polymer electrolyte membrane; attaching a sub-gasket on the circumference of the polymer electrolyte membrane; and stacking a gas diffusion layer onto an outer surface of the catalyst layer by bonding all or a portion of an outer surface of the sub-gasket and the circumference of the gas diffusion layer with a bonding means.
    Type: Application
    Filed: January 13, 2009
    Publication date: January 7, 2010
    Applicant: HYUNDAI MOTOR COMPANY
    Inventors: Kook Il Han, Keun Je Lee, Sae Hoon Kim, Bo Ki Hong, Byung Ki Ahn
  • Publication number: 20090309459
    Abstract: The present invention is a metal paste for sealing comprising a metal powder and an organic solvent characterized in that the metal powder is one or more kinds of metal powders selected from a gold powder, a silver powder, a platinum powder and a palladium powder which has a purity of 99.9% by weight or more and an average particle size of 0.1 ?m to 1.0 ?m and that the metal powder is contained in a ratio of 85 to 93% by weight and the organic solvent is contained in a ratio of 5 to 15% by weight. This metal paste preferably contains an additive such as a surfactant in accordance with the application method. As a sealing method using this metal paste, there is a method of applying and drying a metal paste, sintering it at 80 to 300° C. to form a metal powder sintered body and after that pressurizing the base member and the cap member while heating the metal powder sintered body.
    Type: Application
    Filed: March 18, 2008
    Publication date: December 17, 2009
    Inventors: Toshinori Ogashiwa, Masayuki Miyairi, Yoji Nagano
  • Patent number: 7629056
    Abstract: A circuit terminal connected structure and a circuit terminal connecting method are provided. Both the structure and the method feature a circuit connecting material formulated with the following components: a curing agent capable of generating free radicals upon heating; an acrylate or methacrylate radical polymerizable substance; and either an acrylic rubber or a maleimide radical polymerizable substance having at least two maleimide groups per molecule. In some embodiments, the curing agent features a 10-hour half life temperature of 40° C. or above and a 1-minute half-life temperature of 180° C. or below. In other embodiments, the circuit connecting material includes conductive particles. In additional embodiments, the circuit connecting material includes a hydroxyl-group-containing resin having a weight average molecular weight of 10,000 or more.
    Type: Grant
    Filed: June 4, 2004
    Date of Patent: December 8, 2009
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atsushi Kuwano
  • Publication number: 20090288768
    Abstract: The invention generally relates to di-cinnamyl compounds useful in a variety of adhesive applications. More specifically, the invention provides chain-extended bismaleimides and methods for generating them by reaction with di-cinnamyl compounds, including particular di-cinnamyl compounds disclosed herein. Invention di-cinnamyl compounds can also be used as co-monomers in a Diels-Alder type cure, and can act as a co-monomer in a thermoset composition with a maleimide monomer.
    Type: Application
    Filed: April 9, 2009
    Publication date: November 26, 2009
    Inventor: Stephen M. Dershem
  • Publication number: 20090286308
    Abstract: The present invention relates to a process for assembling at least one zone of a first surface with at least one zone of a second surface or with a molecule of interest, comprising a step that consists in placing the said zone of the said first surface in contact with the said zone of the said second surface or with the said molecule of interest, the said zone of the said first surface bearing at least one radical and/or ionic species. The present invention also relates to a solid support whose surface bears at least one zone with at least one radical and/or ionic species, with at least one adhesion primer, or with at least one adhesion primer precursor, and to its various uses.
    Type: Application
    Filed: April 2, 2009
    Publication date: November 19, 2009
    Inventors: Thomas Berthelot, Guy Deniau, Vincent Huc, Xuan Tuan Le, Fabien Nekelson, Sébastien Roussell, Pascal Viel
  • Patent number: 7618713
    Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: November 17, 2009
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atushi Kuwano
  • Publication number: 20090268483
    Abstract: An illuminable marking device includes a light guide panel overlaid with an illuminable pressure-sensitive film. Light is injected into the light guide panel at an angle of incidence sufficient to establish total internal reflection of the light between the surfaces of the light guide panel. When pressure is applied at selected points on the illuminable pressure-sensitive film, contact points on the film then interface with the light guide panel. The total internal reflection of light at that contact point is frustrated, allowing light to be extracted from the light guide panel and transmitted into the illuminable pressure-sensitive film. The viewer then sees illumination at the selected points. The illuminable marking device can be toy where children can create illuminated markings and drawings.
    Type: Application
    Filed: April 9, 2009
    Publication date: October 29, 2009
    Applicant: DONAHUE INVENTIONS LLC
    Inventor: Kevin G. Donahue
  • Patent number: 7604868
    Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: October 20, 2009
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atushi Kuwano
  • Patent number: 7588659
    Abstract: It is a joining auxiliary agent for a polyamide resin with which a predetermined joining face of a polyamide resin molded article is coated to ensure the joining strength between the predetermined joining face and another polyamide resin when they are joined together, and has a composition containing a compound (1), which cleaves a hydrogen bond in the polyamide resin molded article while assisting the dissolution of the polyamide resin, in an organic solvent capable of dissolving the polyamide resin.
    Type: Grant
    Filed: December 18, 2003
    Date of Patent: September 15, 2009
    Assignee: Kabushiki Kaisha Katazen
    Inventors: Akihiro Yoshino, Kumeo Kondo, Koji Tomoda
  • Publication number: 20090223631
    Abstract: The use of curable mixtures comprising (A) at least one phosphonic diester and/or at least one diphosphonic diester and (B) at least one compound containing at least two condensable silane groups, as coupling agents, particularly as coupling agents in laminates comprising at least one substrate, at least one coating, at least one adhesive layer, and at least one sheet, and also a new process for producing such laminates using the coupling agents, the laminates which are producible using the coupling agents, and thermally curable mixtures comprising the coupling agents and at least one thermally curable polyester (C).
    Type: Application
    Filed: January 26, 2007
    Publication date: September 10, 2009
    Applicant: BASF COATINGS AG
    Inventors: Andreas Poppe, Guido Schulze-Finkenbrink
  • Publication number: 20090202772
    Abstract: Disclosed is a release material applied to a sheet material that provides for temporary repositioning of an adhesive over the release material. Over time the adhesion between the release material and the applied adhesive builds such that the adhesive cannot be removed from the release material without damaging the underlying sheet material. The release material includes an free nitrogen containing basic group. The release material is dispersed on a flexible substrate and the release material allows for repositioning when contacted with a pressure sensitive adhesive, which includes a free carboxylic acid group, for at least 1 minute and not more than 10 minutes.
    Type: Application
    Filed: February 7, 2008
    Publication date: August 13, 2009
    Inventors: JOHN W. VANDERZANDEN, Scott D. Pearson
  • Publication number: 20090130487
    Abstract: The inventive method for placing and fixing (bonding) a first object, whose surface is functionalized by compounds of formula I Y (X), A? (I), on the surface of a second object whose surface is functionalized by compounds of formula II Y (X)n A (II), wherein A and A? are functional groups enabling to be bonded at least by a link in a covalent manner to an object surface X and X? are aliphatic, linear, branched or cyclic spacers which can comprise one or several hetero, or aromatic, or heteroaromatic atoms or consist of several aromatic or heteroaromatic cycles and optionally of alternating aliphatic chains having aromatic or heteroaromatic groups, n and n?=0 or 1 and Y and Y are functions for generating one or several non-covalent bonds wherein said Y or Y? are selected such that they are complementary or can complex a metal atom or an identical metal compound.
    Type: Application
    Filed: June 12, 2006
    Publication date: May 21, 2009
    Applicant: Commissariat A L'Energie Atomique
    Inventors: Renaud Demadrille, Stephane Guillerez
  • Publication number: 20090118218
    Abstract: A biocompatible macromer composition is provided which includes a first polymer possessing a first nucleoside, and a second polymer possessing a second nucleoside that is complementary to the first nucleoside and capable of undergoing base pairing with the first nucleoside. The biocompatible macromer composition can be used as an adhesive or sealant in human and/or animal medical applications.
    Type: Application
    Filed: July 11, 2007
    Publication date: May 7, 2009
    Inventor: Joshua Stopek
  • Publication number: 20090090454
    Abstract: A method to join pipe is disclosed using a curable one or two part adhesive composition comprising an effective amount of a boron containing initiator compound such as an organoborate, a stabilized organoborane complex, or combinations thereof; one or more monomers, oligomers, polymers or mixtures thereof having olefinic unsaturation which is capable of polymerization by free radical polymerization; and optionally a decomplexing agent. An especially preferred organoborane is one where a tertiary or quaternary nitrogen atom is bonded to the organoborane to prepare an amido-borate. In those embodiments where the nitrogen is quaternary, the quaternary nitrogen portion of the amido-borate is the cationic counter ion for the borate anion portion of the compound to which the quaternary nitrogen atom is bonded.
    Type: Application
    Filed: August 22, 2008
    Publication date: April 9, 2009
    Inventors: William G. Lutz, Shaoguang Feng, Brian C. Nickless, Wesley J. Spaulding, Gary L. Jialanella
  • Patent number: 7507461
    Abstract: Core-skin bonding is improved between honeycomb and composite face sheets by applying a nylon-based (polyamide) adhesive to the edge of the honeycomb prior to bonding. Edge coating of honeycomb with polyamide adhesives is useful in further increasing the bond strength between honeycomb and prepreg face sheets, especially when the matrix resin of the prepreg is designed to adhere the prepreg to the honeycomb.
    Type: Grant
    Filed: September 1, 2004
    Date of Patent: March 24, 2009
    Assignee: Hexcel Corporation
    Inventors: Yen-Seine Wang, Robert Morrison, Clark Smith
  • Patent number: 7495035
    Abstract: It is an object of the present invention to provide a photo-curable resin composition which provides a sealing agent for a flat panel display with good moisture permeation resistance and excellent adhesion. The present inventors have conducted extensive studies to solve the above-described problems, and as a result, they have found a photo-curable resin composition which comprises a cationic photopolymerization initiator (A), a cationically polymerizable compound (B), a cyclic polyether compound (C) and another organic compound (D), wherein the amount of (B) is 1.0 to 99.9% by mass and the amount of (C) is 0.0 to 10.0% by mass, both based on the sum of (B), (C) and (D), and the sum (F) of the fluorine atoms in a fluorine-containing organic compound is 0.0 to 40.0% by mass, based on the sum of (B), (C) and (D), and wherein at least 1/1000 mass ratio of the (B) component is a compound containing an oxetanyl group, and both of the contents of (C) and (F) are not 0.0% by mass at the same time.
    Type: Grant
    Filed: August 10, 2004
    Date of Patent: February 24, 2009
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Yugo Yamamoto, Yasushi Mizuta, Yuichi Ito
  • Publication number: 20090035512
    Abstract: The present invention provides: a honeycomb structure produced by bonding with a bonding material containing 0.1 mass % or more of a heat-gelling organic binder having a thickening-initiating temperature of 75° C. or lower, or a honeycomb structure produced by bonding with a thermosetting resin; and a process for producing a honeycomb structure, which comprises a bonding step of coating a bonding material containing 0.1 mass % or more of a heat-gelling organic binder having a thickening-initiating temperature of 75° C. or lower, on the porous outer wall provided at the periphery of each cell structure, drying the coated bonding material at a temperature of 100° C. or higher to form a bonding layer, and bonding the outer walls to each other via the bonding layer.
    Type: Application
    Filed: September 18, 2008
    Publication date: February 5, 2009
    Applicant: NGK INSULATORS, LTD.
    Inventors: Naoshi MASUKAWA, Atsushi WATANABE, Shuichi ICHIKAWA
  • Publication number: 20090029105
    Abstract: Disclosed is a honeycomb structure which is bonded with a bonding material containing 0.1 to 10 mass % of a layered clay mineral. Also disclosed are a honeycomb structure which is bonded with a bonding material containing 0.1 to 10 mass % of an organic binder, and a honeycomb structure which is bonded with a bonding material having a Casson yield value of 6 Pa or more. Further disclosed is a method for producing such a honeycomb structure.
    Type: Application
    Filed: September 22, 2008
    Publication date: January 29, 2009
    Applicant: NGK INSULATORS, LTD.
    Inventors: Naoshi MASUKAWA, Atsushi WATANABE, Shuichi ICHIKAWA
  • Publication number: 20090022909
    Abstract: An adhesion composition is disclosed. In one embodiment, the composition includes a gel material and an adhesion resin, a weight ratio of the gel material and the adhesion resin ranging from about 1:10 to about 1:100.
    Type: Application
    Filed: May 28, 2008
    Publication date: January 22, 2009
    Inventors: Sang-il Kim, Jae-hoon Kim
  • Publication number: 20090000518
    Abstract: An aqueous gel-forming composition, e.g. a fire retardant coating composition, comprises an aluminosilicate and an organic liquid having a boiling point greater than 110° C., e.g. silicone oil, which enhances the integrity of films formed by application of the composition as a coating to a surface then followed by drying.
    Type: Application
    Filed: July 24, 2006
    Publication date: January 1, 2009
    Applicant: INEOS SILICAS LIMITED
    Inventors: Abraham Araya, Eric Petrus Smeets, Jan Noordegraaf, Petrus Frederikus Maria Rensen, Christianus Marcus Buijk, Wilhelmus Petrus Theodorus Kemperman, Henricus Johanna De Swart
  • Publication number: 20080314518
    Abstract: The present invention relates to aqueous two-component adhesion promoter compositions and also to their use in methods of adhesive bonding or sealing. Additionally it relates to packaging consisting of the two-component composition and also a pack having two chambers. The two-component adhesion promoter composition is composed of a first component K1 comprising at least one organoalkoxysilane S and at least one anhydrous surfactant T; and of a second component K2 comprising at least water and at least one acid, the acid being present in an amount such that, after components K1 and K2 have been mixed, the resulting mixture is acidic.
    Type: Application
    Filed: August 22, 2008
    Publication date: December 25, 2008
    Inventors: Jolanda Sutter, Wolf-Rudiger Huck
  • Patent number: 7462651
    Abstract: A radiation-curable desiccant-filled adhesive/sealant composition comprising a radiation-curable resin, one or more desiccant fillers, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: December 9, 2008
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Jie Cao, Donald E. Herr
  • Publication number: 20080246490
    Abstract: A precipitation static sensor includes a bottom flexible dielectric layer (e.g., a layer of urethane tape) configured to be attached to a wing or other external surface of an aircraft, a flexible conductive layer (e.g., a layer of aluminum tape) formed over a portion of the first flexible dielectric layer, and a conductor (such as a twisted-pair wire) coupled to the flexible conductive layer. A top flexible dielectric layer is formed over a portion of the bottom dielectric layer and a portion of the flexible conductive layer, thus forming an exposed detector region. In accordance with a further embodiment, multiple such precipitation static sensors are used and coupled to a meter device (e.g., a picoammeter), which may also be coupled to a data acquisition and display for providing a visual indication of the charge accumulated by the precipitation static sensors.
    Type: Application
    Filed: May 15, 2008
    Publication date: October 9, 2008
    Inventors: Arlene M. Brown, Grant J. Erickson, Joe Heeter, David W. Kwolek, Robert Steinle, Kari L. Stromsland
  • Publication number: 20080223518
    Abstract: The invention provides a method for the production of composite elements composed of at least one outer layer a) and a thermal insulation material b), where between the outer layer a) and the thermal insulation material b) an adhesive c) has been applied, the outer layer a) being moved continuously, the thermal insulation material b) being applied to the outer layer a) and, if appropriate, a further outer layer a) being applied to the thermal insulation material b), and the adhesive c) being applied to the thermal insulation material b) or to the outer layer a), which comprises applying the adhesive c) by means of a rotating flat body which is mounted horizontally or with a slight deviation from the horizontal, of up to 15°, preferably parallel to the outer layer a) or to the thermal insulation material b).
    Type: Application
    Filed: May 11, 2006
    Publication date: September 18, 2008
    Applicant: BASF Aktiengesellschaft
    Inventors: Erhard Gleinig, Erwin Calgua, Michael Thater
  • Patent number: 7404848
    Abstract: A humidifier and a method for producing it can reduce gas leakage through inside the surfaces of humidifying membranes or through interfaces between the humidifying membranes and separators. The humidifier includes water permeable humidifying membranes and gas separators each having one or two channels opened at least one side in a direction of lamination, through which at least one of a dry gas and a wet gas is caused to flow. A humidifying membrane, a gas separator, a humidifying membrane and a gas separator are repeatedly laminated one over another in this order, or a gas separator, a humidifying membrane and a gas separator are repeatedly laminated one over another in this order. Each gas separator has a frame-shaped portion surrounding the one or two channels, and that portion of each humidifying membrane which, when laminated, faces the frame-shaped portion of a corresponding gas separator is filled with a resin.
    Type: Grant
    Filed: May 20, 2005
    Date of Patent: July 29, 2008
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Tatsunori Okada, Hajimu Yoshiyasu, Tatsuya Hayashi, Hideo Ichimura
  • Publication number: 20080173398
    Abstract: A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 ?m, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.
    Type: Application
    Filed: December 27, 2007
    Publication date: July 24, 2008
    Inventors: Yusuke Yasuda, Toshiaki Morita, Eiichi Ide, Hiroshi Hozoji, Toshiaki Ishii
  • Publication number: 20080142158
    Abstract: The present invention provides hydrolytically resistant monomers prepared by the reaction of an epoxy compound and a reactive ester and methods for producing the monomers. Also provided are adhesive compositions containing the hydrolytically resistant monomers and methods for use thereof.
    Type: Application
    Filed: December 19, 2007
    Publication date: June 19, 2008
    Inventor: Stephen M. Dershem
  • Publication number: 20080115890
    Abstract: Various embodiments of the present invention are directed to molecular-film adhesives and methods and systems for using molecular-film adhesives. In one embodiment of the present invention, an amphipathic, biological-substrate-compatible adhesive is applied as a molecular-film. The amphipathic adhesive includes a first functional group, capable of bonding to a first substrate, and a second functional group, capable of bonding to a second, chemically dissimilar substrate.
    Type: Application
    Filed: September 11, 2006
    Publication date: May 22, 2008
    Inventors: Sean X. Zhang, Patricia A. Beck