Abstract: An apparatus and associated method for deposition of metal ions contained in an electrolyte solution to form a metal film primarily on a seed layer formed on at least a first side of a substrate. The substrate has a second side that is opposed the first side and an edge joining the first side and the second side. The apparatus comprises a substrate holder system and an electric contact element. The electric contact element physically contacts one of the second side or the edge of the substrate. In one aspect, the substrate is rotated about its vertical axis when the seed layer of substrate is immersed in the electrolyte solution during the metal film deposition. In another aspect, the substrate is not rotated about its vertical axis when the seed layer on the substrate is immersed in the electrolyte solution during the metal film deposition.

Abstract: A memory element comprising nanomagnets having a rotational symmetry selected in order to provide high remanence and a suitable coercivity. There is also a sensor element comprising nanomagnets having a rotational symmetry selected such that they are superparamagnetic and exhibit substantially zero hysteresis so that a magnetisation of the nanomagnets depends only on the current value of applied field and not on the field history.

Abstract: A solution for use in connection with the deposition of one or more metals on electroplatable substrates. This solution includes water; a metal ion; and a complexing agent. The complexing agent is advantageously an organic compound having between 4 and 18 carbon atoms which includes at least two hydroxyl groups and a five or six membered ring that contains at least one oxygen atom. The compound is present in an amount sufficient to complex the metal in the solution and inhibit oxidation of the metal. If necessary, a suitable pH adjusting agent can be included in the solution to maintain the pH of the solution in the range of between 2 and 10 and preferably to a pH of about 3.5 to 5.5. At the preferred pH range, the solution is particularly useful for electroplating composite articles that have electroplatable portions and non-electroplatable portions without deleteriously affecting the non-electroplatable portions.

Abstract: A pattern of very fine features (18) can be produced by illuminating an inorganic negative tone resist layer (16), provided on an electroplating base layer (14), by a beam (EB), which is able to cure the resist to a cured pattern according to the pattern to be formed, removing the non-illuminated portions of the resist layer and electroplating a layer (20) between the cured portions (18) of the resist layer.

Abstract: The plating method comprises the steps of dividing a region, to be plated, into a group of mesh-like zones, measuring a plating area of each of the zones, comparing the measurement values of the plating areas and judging whether or not the plating area has any variance, and conducting a design change, on patterns contained in this zone, to eliminate the variance.

Abstract: MEMS structures are provided that compensate for ambient temperature changes, process variations, and the like, and can be employed in many applications. These structures include an active microactuator adapted for thermal actuation to move in response to the active alteration of its temperature. The active microactuator may be further adapted to move in response to ambient temperature changes. These structures also include a temperature compensation element, such as a temperature compensation microactuator or frame, adapted to move in response to ambient temperature changes. The active microactuator and the temperature compensation element move cooperatively in response to ambient temperature changes. Thus, a predefined spatial relationship is maintained between the active microactuator and the associated temperature compensation microactuator over a broad range of ambient temperatures absent active alteration of the temperature of the active microactuator.

Abstract: An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel.

Abstract: The present invention relates to a method and apparatus of fabricating electromagnetic coil vanes. The method involves placing a bonding composition on opposing surfaces of a substrate. First and second complementary coil patterns are formed, and are aligned and bonded to respective clamp plate fixtures. The first complementary coil pattern is bonded to one surface of the opposing surfaces of the substrate via the bonding composition, and the second complementary coil pattern is bonded to the other surface of the opposing surfaces of the substrate via the bonding composition. The bonding composition is cured, and the clamp plates are removed from the first and second complementary coil patterns.

Abstract: A technique for forming functionalized particles, where such particles are readily formed into periodic structures. A layer of particles is formed on a substrate, a first material is deposited over at least a portion of each of the particles, and then a functionalizing agent is attached to the first material. The functionalized particles are then capable of being formed into an ordered structure, by selection of appropriate complementary functionalizing agents on a substrate and/or on other particles and/or on other regions of the same particles.

Abstract: To electrically contact and electrolytically treat, more specifically to electroplate, very thin, electrically conductive layers, especially with a high electrolytic current, a device comprising contact carriers 4, 5, 10, 11, more specifically clamps, clips and the like, with contact elements 8 for supplying the current to the work 6 is utilized, at least the contact areas of the contact elements 8 that may be brought to contact the work 6 are made from an elastic, electrically conductive material.

Abstract: One or more fractal antennas are produced in an electroforming circuit. A stainless steel on glass mandrel is covered with a dielectric in an inverse image of a fractal antenna to be formed. The portion of the stainless steel uncovered by the dielectric is chemically washed so that a fractal antenna formed thereon can be more efficiently removed. The mandrel is made a cathode in an electroforming circuit, which results in a fractal antenna being formed on the mandrel. The fractal antenna is separated from the mandrel and mounted on a rigid or semi-rigid substrate.

Abstract: A process for cleaning an electrically conducting surface (3) by arranging for the surface to form the cathode of an electrolytic cell in which the anode (1) is maintained at a DC voltage in excess of 30V and an electrical arc discharge (electro-plasma) is established at the surface of the workpiece by suitable adjustment of the operating parameters, characterized in that the working gap between the anode and the cathode is filled with an electrically conductive medium consisting of a foam (9) comprising a gas/vapor phase and a liquid phase. The process can be adapted for simultaneously coating the metal surface by including ions of the species required to form the coating in the electrically conductive medium.

Abstract: An object of the present invention is to provide a substrate plating apparatus capable of performing continuous plating operations within one apparatus without the wafers becoming contaminated after the post-plating process by chemicals used in the plating process and the like. Further object is to provide a substrate plating apparatus capable of forming a plating film of uniform thickness on the plating surface of the wafer, while encouraging bubbles to escape from fine holes or grooves in the substrate surface and deterring particles from depositing on the plated surface.

Abstract: An electrochemical deposition apparatus and method for depositing a material onto a surface of a workpiece and for polishing the material are disclosed. The apparatus includes a platen and a polishing surface, including a conductive material and conductors embedded therein, disposed proximate the platen. During material deposition, a bias is applied across the conductor and the platen to cause deposition of material onto the workpiece surface.

Abstract: A method of fabricating a recording head is disclosed in which a needle-type control electrode is formed integrally with the substrate. The method includes steps of forming on a substrate a first member layer having a pattern such that the substrate is partially exposed. Forming a second member layer spanning a portion of the exposed substrate and a portion of the first member layer. Then, a needle-type member is formed from the second member layer. Finally, the basic portion of the recording head is completed just by joining the substrate and an overhead plate. Thus, there is no need to join the needle-like control electrode with the substrate. There is no need to position members having critical dimensions with each other.

Abstract: The various embodiments of coaxial capacitors are self-aligned and formed in a via, including blind vias, buried vias and plated through holes. The coaxial capacitors are adapted to utilize the plating of a plated via as a first electrode. The dielectric layer is formed to overlie the first electrode while leaving a portion of the via unfilled. A second electrode is formed in the portion of the via left unfilled by the dielectric layer. Such coaxial capacitors are suited for use in decoupling and power dampening applications to reduce signal and power noise and/or reduce power overshoot and droop in electronic devices. For such applications, it is generally expected that a plurality of coaxial capacitors, often numbering in the thousands, will be coupled in parallel in order to achieve the desired level of capacitance.

Abstract: According to the invention, silicon nanoparticles are applied to a substrate using an electrochemical plating processes, analogous to metal plating. An electrolysis tank of an aqueous or non-aqueous solution, such as alcohol, ether, or other solvents in which the particles are dissolved operates at a current flow between the electrodes. In applying silicon nanoparticles to a silicon, metal, or non-conducting substrate, a selective area plating may be accomplished by defining areas of different conductivity on the substrate. Silicon nanoparticle composite platings and stacked alternating material platings are also possible. The addition of metal ions into the silicon nanoparticle solution produces a composite material plating. Either composite silicon nanoparticle platings or pure silicon nanoparticle platings may be stacked with each other or with convention metal platings.

Abstract: The present invention is to provide a method of selective electroplating comprises a substrate. The substrate may include printed circuir board or other plating metal article on printed circuit board surface specified region. Then, a wet film formed on the substrate by screen-printing, wherein the wet film is photo-sensitivty. Next, it is hardening the wet film, and then exposing the wet film. Next, it is developing the wet film to expose some region for forming metal on the substrate. A metal layer formed on the substrate. Finally, it is stripping the wet film.

Abstract: In a method of frame plating, an electrode film for plating is formed on a base layer of a plating layer to be formed. Next, a resist layer is formed on the electrode layer. The resist layer is exposed to beams for exposure through the use of a mask. Next, the resist layer exposed is developed and the portion exposed is removed to form a resist frame, such that the angle &thgr; between an inner wall of the resist frame and the bottom surface thereof exceeds 90 degrees. Next, heat treatment is performed on the resist frame, such that the angle &thgr; becomes 90 degrees or smaller. Next, plating is performed with the electrode film as the seed layer through the use of the resist frame having gone through the heat treatment. The plating layer is thereby formed.

Abstract: In an electrochemical reactor used for electrochemical treatment of a substrate, for example, for electroplating or electropolishing the substrate, one or more of the surface area of a field-shaping shield, the shield's distance between the anode and cathode, and the shield's angular orientation is varied during electrochemical treatment to screen the applied field and to compensate for potential drop along the radius of a wafer. The shield establishes an inverse potential drop in the electrolytic fluid to overcome the resistance of a thin film of conductive metal on the wafer.

Abstract: A method for controlling plating with two independent power sources, wherein the high voltage power source is used for controlling the electrical swimming speed of the metal positive ions while the other is low-voltage power source for being used to control rate of plating rate. Positively charged metal ions of the strong electric field in the plating solution can reach to the negatively charged and unevenly distributed surface of the extraction negative pole more quickly, which is in turn connected to the negative of the low voltage power source. The ions aggregate at the recess of the extraction negative pole surface and waiting incoming electrons so as to perform electric extraction and produce uniform plating. The present invention also provides the apparatus for carrying out the mentioned method and therefore achieves better plating quality.

Abstract: The interior of cavities and through-holes in electrically conductive substrates having high-aspect ratios of 8:1 or greater can be electroplated with a uniform layer of metal on their interior surfaces by using a pulse reverse voltage waveform having a pulse train of long cathodic pulses followed by short anodic pulses even in the absence of conventional additives such as levelers and brighteners.

Abstract: An improved plating method in which non-plated vias or through holes are temporarily metalized for use as busses during selective noble metal plating and subsequently de-metalized to prevent shorting together of the nobly plated features.

Abstract: A semispherical microstructure includes a substrate, an insulating mask layer, and an electrodeposition layer. The substrate has an electrically-conductive portion. The mask layer is formed on the electrode layer or electrically-conductive portion of the substrate and includes an opening formed in the mask layer to expose the electrically-conductive portion at the opening. The electrodeposition layer is formed of organic compound electrodeposited in the opening and on the mask layer around the opening.

Abstract: The method of the present invention is a method of producing a thin film of zinc oxide, which comprises immersing a counter electrode and a conductive substrate as a negative electrode in an aqueous solution containing nitrate ions and 0.05 mol/liter or more of zinc ions, and passing a current between the counter electrode and the conductive substrate to electrochemically deposit zinc oxide on the conductive substrate from the aqueous solution, thereby forming a thin film of zinc oxide, wherein a film forming rate of the thin film is varied at least one time midway during an electrolytic deposition reaction for forming the thin film.

Abstract: For use in a fuel cell, constituted by plural cells, a separator that can reduce fluctuations in electromotive force across respective cells. A method for producing a separator in which a recessed gas path is formed. Depth fluctuations of the gas path can be reduced. It is formed easily even if the separator is formed of a hard material. The gas path having plural depths or gradation can be formed easily. An electrically conductive member 3, as a separator, and a processing electrode 16, having patterned electrode projections 20, are immersed in an electrolytic solution facing each other. Current is fed between member 3 and electrode 16 for electrolytic processing to dissolve the portion of the member 3 facing projections 20, thus forming a gas path 30 having a surface roughness Rz on this bottom surface 30e not larger than 1 &mgr;m.

Abstract: A method and apparatus for fluid sealing the underside of a workpiece, such as a semiconductor wafer and the like, during wet-processing such as electrodeposition and the like, employing an elastomeric encased ring of flexible fingers against which the periphery of the workpiece underside is forced to deflect the fingers downwardly and engage a peripheral sealing bead against the underside periphery of the workpiece; and where electrical contact with the workpiece is desired, resiliently engaging electrical contact tips protruding through peripheral openings in the elastomeric covering within the sealing ring, with the underside periphery of the workpiece.

Abstract: The present invention relates to a plating apparatus and method which smoothly perform contact of a plating liquid with a surface of the substrate and which can prevent air bubbles from remaining on the surface to be plated. The plating apparatus comprises a plating bath containing a plating liquid in which an anode is immersed, a head portion for holding a substrate detachably and bringing a lower surface, to be plated, of the substrate into contact with an overflow surface of the plating liquid held in the plating bath, a drive mechanism for rotating the head portion, and a tilt mechanism for tilting the head portion so that the substrate held by the head portion is inclined relative to a horizontal plane.

Abstract: The present invention relates to methods and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on the top portion of the workpiece more than at least one additive disposed on a cavity portion, thereby allowing plating of the conductive material take place before the additive fully re-adsorbs onto the top portion and causing greater plating of the cavity portion relative to the top portion.

Abstract: A method for providing preferential coloring to a portion of an electrochromic window assembly, includes the steps of providing an electrochromic window assembly comprising first and second spaced apart transparent substrates defining a chamber therebetween, the first transparent substrate having a first conductive coating and the second transparent substrate having a second conductive coating, the chamber containing an electrochromic medium capable of coloring upon application of electrical potential thereto to provide reduced luminous transmittance; electrically connecting a plurality of first spaced facilities to the first conductive coating for providing the electrical potential to the first conductive coating; electrically connecting a plurality of second spaced facilities to the second conductive coating for providing the electrical potential to the second conductive coating; and applying an electrical current to selected ones of the plurality of first spaced facilities and to selected ones of the plura

Abstract: A method and system for electrolytically processing a microelectronic workpiece. In one embodiment, the method includes contacting the workpiece with an electrolytic fluid, positioning one or more electrodes in electrical communication with the workpiece, directing an electrical current through the electrolytic fluid from the electrodes to the workpiece or vice versa, and actively changing a distribution of the current at the workpiece during the process. For example, the current can be changed such that a current ratio of at least one electrical current to the sum of the electrical currents shifts from a first current ratio value to a second current ratio value. Accordingly, the current applied to the workpiece can be adjusted to achieve a target shape for a conductive layer on the workpiece, or to account for temporally and/or spatially varying characteristics of the electrolytic process.

Abstract: An electroplating apparatus, in accordance with the present invention, includes a plurality of chambers. A first chamber includes an anode therein. The first chamber has an opening for delivering an electrolytic solution containing metal ions onto a surface to be electroplated. The surface to be electroplated is preferably a cathode. A second chamber is formed adjacent to the first chamber and has a second opening in proximity of the first opening for removing electrolytic solution containing metal ions from the surface to be electroplated. The plurality of chambers are adapted for movement in a first direction along the surface to be electroplated.

Abstract: The present invention relates to a method for forming a planar conductive surface on a wafer. In one aspect, the present invention uses a no-contact process with electrochemical deposition, followed by a contact process with electrochemical mechanical deposition.

Abstract: This invention is a method of, providing conductive tracks on a printed circuit including coating a substrate carrying printed tracks with an electro-plating solution with a tool which provides a first electrode of an electro-plating circuit and a second electrode provided by the tracks which are to be electroplated, the tool including an absorptive member in which plating solution can be carried; a first electrode of an electro-plating circuit adapted to make electrical contact with plating solution carried by the absorptive member; and at least one tool second electrode electrically insulated from the first electrode and spaced from the absorptive member, the tool second electrode being so positioned that as the absorptive member is wiped across a surface of a substrate, the second electrode contactor can be wiped across the surface of the substrate to contact electrically conductive regions of the substrate to form a second electrode of the electro-plating circuit therewith.

Abstract: In a method for fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electro- or electroless-plating, or electrodeposition. At least a surface of the first plated or electrodeposited layer is made electrically conductive. After that, the insulating mask layer is removed, and a second plated layer is formed on the first plated or electrodeposited layer and on the electrically-conductive portion by electroplating to firmly fix the first plated or electrodeposited layer to the substrate.

Abstract: This invention is a method of providing conductive tracks on a printed circuit including coating a substrate carrying printed tracks with an electro-plating solution with a tool which provides a first electrode of an electro-plating circuit and a second electrode provided by the tracks which are to be electroplated, and a tool suitable for use in electro-plating electrically conductive regions of a substrate, the tool including an absorptive member in which plating solution can be carried; a first electrode of an electro-plating circuit adapted to make electrical contact with plating solution carried by the absorptive member; and at least one tool second electrode electrically insulated from the first electrode and spaced from the absorptive member, the tool second electrode being so positioned that as the absorptive member is wiped across a surface of a substrate, the second electrode contactor can be wiped across the surface of the substrate to contact electrically conductive regions of the substrate to for

Abstract: The invention encompasses a method of forming a container-shaped physical vapor deposition target. A conductive material is provided in a container-shape. The container-shape comprises an interior region and an exterior region, and the conductive material comprises an interior surface along the interior region as well as an exterior surface along the exterior region. A sputtering material is electrolytically deposited on at least one of the interior and exterior surfaces of the container-shaped conductive material. The invention also encompasses a container-shaped physical vapor deposition target. The target includes a first conductive material in a container-shape, with the container-shape comprising an interior region and an exterior region. The first conductive material comprises an interior surface along the interior region of the container-shape and an exterior surface along the exterior region of the container shape.

Abstract: In a device, rod-shaped objects 10 (rods of various length and diameter) are electrochemically partially processed in dip plants (galvanized, pickled). Stationary tubular electrodes 30, into which the rods 10 are centrically entered, are provided in the plating tank of the plant. The surfaces to be plated are each axially limited by an adjustable membrane carrier 26, in which elastic shielding membranes 9 for delimiting the field lines are arranged. The membranes 9 are held by membrane holders 5. The membrane holders 5 are arranged in a cage where they are free to move radially and are provided with inner centering springs 7 and with outer centering springs 19 so that the membrane holder 5 and the membranes 9 are held in such a way as to be self-centering.

Abstract: A method of depositing a metal coating (28) on the interconnect (26) of a tubular, hollow fuel cell (10) contains the steps of providing the fuel cell (10) having an exposed interconnect surface (26); contacting the inside of the fuel cell (10) with a cathode (45) without use of any liquid materials; passing electrical current through a contacting applicator (46) which contains a metal electrolyte solution; passing the current from the applicator (46) to the cathode (45) and contacting the interconnect (26) with the applicator (46) and coating all of the exposed interconnect surface.

Abstract: A continuous layer of a metal is electrodeposited onto a substrate having both hydrodynamically inaccessible recesses and hydrodynamically accessible recesses on its surface by a two-step process in which the hydrodynamically inaccessible recesses are plated using a pulsed reversing current with cathodic pulses having a duty cycle of less than about 50% and anodic pulses having a duty cycle of greater than about 50% and the hydrodynamically accessible recesses are then plated using a pulsed reversing current with cathodic pulses having a duty cycle of greater than about 50% and anodic pulses having a duty cycle of less than about 50%.

Abstract: In a method for fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electro- or electroless-plating, or electrodeposition. At least a surface of the first plated or electrodeposited layer is made electrically conductive. After that, the insulating mask layer is removed, and a second plated layer is formed on the first plated or electrodeposited layer and on the electrically-conductive portion by electroplating to firmly fix the first plated or electrodeposited layer to the substrate.

Abstract: A method of coating an internal surface of a weapon barrel includes the steps of applying an intermediate layer to the internal barrel surface by explosion plating and applying a cover layer at least indirectly to the intermediate layer by electroplating. The intermediate layer has a heat conductivity which is greater than that of the weapon barrel and a ductility which is greater than that of the cover layer.

Abstract: A process of selectively plating a metal pattern on the surface of a plastic component allows intricate and/or fine patterns of metal to be precisely electroplated onto either a two-dimensional or three-dimensional contoured surface of a plastic article or substrate. The selective metal plating may be either a decorative pattern or a functional pattern, such as for an electrical circuit. The process generally comprises electrolessly depositing a metal coating on the surface of a plastic component, depositing a photoresist coating over the electrolessly deposited metal, imaging and developing the photoresist coating to form a desired patterned photoresist, electroplating a metal on the electrolessly deposited metal that is exposed through the developed photoresist pattern, and stripping the cured photoresist coating and electrolessly deposited metal underneath the cured photoresist coating without damaging the decorative or functional electroplating.

Abstract: A method, system and structure for a pin grid or pad grid array structure includes a plurality of pins connected to an electronic structure, a power plane within the electronic structure electrically connected to power pins, a ground plane within the electronic structure, and fuse portions electrically connecting the ground plane to ground pins and signal pins. The power plane and the ground plane create a charge in the pins during electroplating of the pins. The fuse portions disconnecting the signal pins from the ground plane after the electroplating.

Abstract: Embodiments of the present invention provide methods for enhancing void-free metallic filling of narrow openings by electrochemical deposition (ECD). The methods provide enhanced replenishment of plating inhibitor at the field, while depleting the inhibitor inside narrow openings. The resulting inhibitor gradients facilitate void-free ECD filling of narrow openings with large aspect ratios. The inventive methods utilize vigorous electrolyte agitation at the field and top comers of the openings, while maintaining a relatively stagnant electrolyte inside the openings. Vigorous agitation is produced, for example, by high pressure jets flow and/or by mechanical means, such as brush (or pad, or wiper blade) wiping, or by a combination of jets and wiping brushes.

Abstract: A continuous electrocoat apparatus is provided for applying a coating onto a substantially flat substrate, e.g., an electroconductive substrate in coil or blank form. In one embodiment, the apparatus includes a first electrocoat tank having a coating region and a non-conductive conveyor extending at least partially into the first electrocoat tank and defining a conveyor path. A plurality of electrically conductive supports are carried on the conveyor. A connecting system is configured to selectively place at least a portion of the supports in electrical contact with an electrical power source when the selected supports are in the coating region of the first electrocoat tank.

Abstract: A method of anodizing an aluminum substrate comprising heating the substrate to a first temperature of 200° C. to about 380° C.; suspending the substrate into a first electrolyte and applying a first anodizing current to the first electrolyte; rinsing the substrate; heating the substrate to a second temperature of 200° C. to about 380° C.; and suspending the substrate into a second electrolyte and applying a second anodizing current to the second electrolyte, wherein the first electrolyte and second electrolyte each comprise an aqueous solution of at least one salt of alpha-hydroxy acid.

Abstract: An electroplating method includes forming a layer, the forming of the layer includes: a) contacting a substrate with a first article, the first article includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal from a source of metal ions onto the substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the substrate. The method may further involve one or more of (1) selectively depositing or non-selectively depositing one or more additional materials to complete formation of the layer, (2) planarizing deposited material after each deposition or after all depositions for a layer, and/or (3) forming layers adjacent previously formed layers to build up a structure from a plurality of adhered layers. Electroplating articles and electroplating apparatus are also disclosed.

Abstract: A common electrode line for plating for collectively forming conductive patterns of a plurality of circuit substrates on a main substrate, and for plating the conductive patterns of the plurality of circuit substrates at the same time by the common electrode lines for plating, wherein the common electrode lines for plating 22 respectively connected to pads 14 of the plurality of circuit substrates 20A are formed on both front and back surfaces of the main substrate and connected via through holes 11, the common electrode lines for plating are wired from the circuit substrate across a cut line which divides a substrate into the plurality of circuit substrates on any of the front and back surfaces.

Abstract: The object of the invention is to provide a process for electroplating a work piece (1) which is coated with an electrically conducting or modified polymer, wherein, independently of the work piece to be electroplated, it is possible to simultaneously reduce the current density and shorten the electroplating time. The invention includes, as a first step, that the work piece is connected to a current source (8) by multiple adjoining contact elements (5) and covered with a thin metallic coat, except at the points covered by the contact elements and that subsequently, in a second step, the contact elements are removed and an unbroken metal coat (10) is formed.