Abstract: The invention relates to a frame plating method for forming a plating film using a mold formed by patterning a resist, and has an object to provide the frame plating method in which tilting of a resist frame having a high aspect ratio is easily and certainly prevented and a desired plating film can be formed. The constitution includes a developing/washing portion 100 for developing an exposed resist layer formed on a substrate 138 and for washing a developing solution by a washing solution, and a plating portion 50 for immersing a surface of the substrate 138 in a state where the washing solution is not dried after washing but is held, into a plating solution 62 to carry out plating.

Abstract: A method for plating a second metal directly to a first metal without utilizing a mask. A semiconductor substrate is provided including at least one metal feature and at least one insulating layer covering the metal feature and the substrate. At least one recess is formed in the at least one insulating layer thereby exposing at least a portion of the metal feature. At least one conductive barrier layer is formed over the insulating layer and the exposed portion of the metal feature. A plating seed layer of a first metal is formed over the at least one barrier layer. A photoresist layer is deposited over the plating seed layer. Portions of the photoresist layer and portions of the plating seed layer outside of the at least one recess are removed. Photoresist remaining in the at least one recess is removed. A second metal is electroplated to the plating seed layer in the recess, using the barrier layer to conduct electrical current.

Abstract: A method of fabricating an electrical component includes the steps of providing a three-dimensional metal electrical component having multiple sides. A coating material is applied simultaneously to a plurality of the sides of the multi-sided component over a predetermined first portion thereof. A highly conductive plating material is applied to a second portion of the component not covered by the coating material. The coating material then is removed from the plurality of sides of the first portion of the component.

Abstract: A method of coating a metal surface, particularly an inner surface of a gun barrel, with a chromium layer, includes the following steps: electrolytically precipitating on the metal surface a plurality of partial chromium layers in a superposed relationship by electric current pulses equaling the number of the partial chromium layers; and selecting the duration of each pulse such that a crystallite growth of individual partial chromium layers is stopped prior to a natural termination thereof for obtaining a globular polytropic structure of the entire chromium layer.

Abstract: The invention relates in general to a method of electroplating substrates where at least a portion of the substrate is coated with a solution containing a flhn forming amine and sufficient acid to produce a pH of less than 6.5. The acid helps to clean the surface of the substrate, and the film forming amine forms a film on the surface of the substrate. Electroplating proceeds with greatly improved speed and efficiency, especially in low current areas.

Abstract: A method to form a passivation layer over a MR Sensor so that the passivation layer defines the track width. The passivation layer is formed simultaneously with the development of the lift off structure in a novel developing/oxidizing solution that oxidizes the MR sensor and develops the photoresist. The passivation layer is an electrical insulator that prevents sensor current from shunting through the overspray of the leads and a heat conductor to allow MR heat to dissipate through the overspray. The method comprises: spinning-on and printing a lift-off photoresist structure over the MR sensor. Next, the lift-off photoresist structure is developed. The MR sensor is anodized in a developing/oxidizing solution to: (1) remove portions of the lower photoresist and (2) to form a (e.g., thin NiFeO) passivation layer on the MR layer at least partially under the upper photoresist layer. The passivation layer is etched to remove the passivation layer not covered by the lift-off structure.

Abstract: A metal plating apparatus is described which includes a compressible member having a conductive surface covering substantially all of the surface of the substrate to be plated. The plating current is thereby transmitted over a wide area of the substrate, rather than a few localized contact points. The compressible member is porous so as to absorb the plating solution and transmit the plating solution to the substrate. The wafer and compressible member may rotate with respect to each other. The compressible member may be at cathode potential or may be a passive circuit element.

Abstract: A method for electroplating a film onto a substrate. Electrical power is supplied to the plating surface through electrical contact made to contact pads on the underside of the substrate. Contact to the contact pads is made within a liquid-tight region. The contact pads are connected to the plating surface through the substrate. Because the contact scheme is provided within a liquid-tight region on the underside of the substrate, the contacts do not erode or become plated, nor do they consume an area of the plating surface.

Abstract: An apparatus and a method for electroplating for forming a metal film by an electroplating method. The apparatus comprises a plating bath provided in a non-oxidative atmosphere, and in the method, an article to be plated is immersed in a plating bath through a non-oxidative atmosphere.

Abstract: A method for depositing a multi-layered protective and decorative coating on an article comprising first depositing at least one coating layer on the article by electroplating, removing the electroplated article from the electroplating bath and subjecting it to pulse blow drying to produce a spot-free surface on the electroplated article, and then depositing, by physical vapor deposition, at least one vapor deposited coating layer on the electroplated article.

Abstract: A process for producing anodized aluminum with enhanced electrical conductivity, comprising anodic oxidation of aluminum alloy substrate, electrolytic deposition of a small amount of metal into the pores of the anodized aluminum, and electrolytic anodic deposition of an electrically conductive oxide, including manganese dioxide, into the pores containing the metal deposit; and the product produced by the process.

Abstract: A transparent support having formed thereon a transparent conductive film and an organic or inorganic semiconductor thin film that generates an electromotive force by irradiation of light formed on the transparent conductive film, and an aqueous electrolytic solution containing a solvent, a coloring material and a polymer electrodeposition material, whose solubility in the solvent changes depending on the change of pH are prepared; the substrate and a counter electrode connected to the substrate are arranged in such a manner that an surface of the substrate, on which the semiconductor thin film is formed, and the counter electrode are immersed in the aqueous electrolytic solution; the transparent support is selectively irradiated with light; an electrodeposition film having the coloring material and the polymer electrodeposition material is deposited on a part of the support, on which an electromotive force is generated; and the deposited electrodeposition film is brought into contact with an aqueous liquid h

Abstract: An apparatus and associated method for deposition of metal ions contained in an electrolyte solution to form a metal film primarily on a seed layer formed on at least a first side of a substrate. The substrate has a second side that is opposed the first side and an edge joining the first side and the second side. The apparatus comprises a substrate holder system and an electric contact element. The electric contact element physically contacts one of the second side or the edge of the substrate. In one aspect, the substrate is rotated about its vertical axis when the seed layer of substrate is immersed in the electrolyte solution during the metal film deposition. In another aspect, the substrate is not rotated about its vertical axis when the seed layer on the substrate is immersed in the electrolyte solution during the metal film deposition.

Abstract: In order to form metallic conductor patterns having connection regions that can be soldered and/or bonded on electrically insulating substrates, firstly a metalization is applied to the substrate and is then removed again, at least in those regions adjoining the desired conductor pattern. There then follows the electrolytic deposition of a final surface which can be soldered and/or bonded to the connection regions. Clean-room conditions are not necessary.

Abstract: A method for depositing a multi-layered protective and decorative coating on an article comprising first depositing at least one coating layer on the article by electroplating, removing the electroplated article from the electroplating bath and subjecting it to pulse blow drying to produce a spot-free surface on the electroplated article, and then depositing, by chemical vapor deposition, at least one chemically vapor deposited coating layer on the electroplated article. The electroplated layers are selected from copper, nickel and chrome. The chemical vapor deposited layers are selected from non-precious refractory metals, non-precious refractory metal alloys, non-precious refractory metal compounds, and non-precious refractory metal alloy compounds.

Abstract: An electrodeposition apparatus for depositing material on a surface of a substrate. The electrodeposition apparatus includes at least one contact for laterally contacting the substrate and providing electrical connection to the substrate. The at least one contact does not obscure the surface of the substrate to be plated. A voltage source is connected to the at least one contact.

Abstract: A method for forming an ink jet nozzle plate with ink jet nozzles, including providing a first mold formed with spaced-apart recesses; providing inlay material in the spaced-apart recesses; attaching a base to the inlay material; separating the first mold from the inlay material and the base, thereby forming a final mold having a plurality of inlay material protrusions over the base, the protrusions and base defining the shape and the size of the ink jet nozzles; providing plate forming material between the protrusions and over the base in the final mold; and releasing the plate forming material to form an ink jet nozzle plate having a plurality of ink jet nozzles.

Abstract: A method of manufacturing a polymer transistor having a controllable gap is provided in an embodiment. In the embodiment, a conducting tip is positioned proximate to a conducting surface so as to form a gap, an electrochemical medium is introduced in contact with the conducting tip and the conducting surface, and an electrical potential is applied across the electrochemical medium so as to deposit a conductive polymer that electrically bridges the formed gap. In another embodiment, a counter electrode is provided in the electrochemical solution, facilitating processing in which the electrochemical potential at the conducting tip and at the conducting surface are the same and there is a return path for electrical current through the counter electrode. Repositioning of the tip during and after polymer deposition provides, in a further embodiment, adds additional capability with respect to gap control and polymer properties.

Abstract: A bio-molecule analyzer includes an array of addressable light sources, a photoconductive layer of material having a layer of electrically conductive material on a surface thereof mounted on the array of addressable light sources, and a plurality of test sites on an opposing surface of the photoconductive layer of material defined by the plurality of light sources. A solution containing a plurality of bio-molecules is positioned in electrical contact with the plurality of test sites. An electrical potential is connected between the solution and the layer of electrically conductive material, whereby the array of addressable light sources emit beams of light through a plurality of portions of the photoconductive layer of material to define the test sites and complete electrical circuits between the layer of electrically conductive material and the solution.

Abstract: The performance of many macroscopic structures (those whose dimensions are on the order of centimeters, meters, or even larger) can be greatly improved by covering their surfaces with microstructures. There are several applications in which “large,” microstructure-covered sheets are useful. An apparatus and method are disclosed for forming high aspect ratio microstructures (“HARMs”) on planar and non-planar surfaces, using a modification of the LIGA microfabrication process. A free-standing polymer sheet is lithographically patterned with through-holes. The polymer sheet is then pressed against, clamped to, or otherwise attached to a conductive substrate in such a way that the patterned holes in the sheet are not blocked. Subsequent electroplating produces well-defined HARM structures on the planar or non-planar surface, in shapes that are complementary to the lithographically patterned through-holes in the polymer. The polymer may then be removed (e.g.

Abstract: A method for plating gold to a plurality of bond leads on a substrate is disclosed. The method first extends a plating line from a plating loop on the edge of the substrate to a bond area in the center portion of the substrate to electrically connect the plurality of bond leads in series. The plating line further extends to connect to the plating loop after connecting the plurality of bond leads together. Then, electricity is applied to the plurality of bond leads via the plating loop and the plating line thereby plates gold to the plurality of bond leads. Finally, a bonding tool is used to cut off and remove the plating line when the bonding tool is provided to bond the plurality of bond leads to a die that is attached to the substrate, whereby the residual plating line remaining on the substrate does not affect the performance of the semiconductor chip.

Abstract: An electrochemical deposition and testing system consisting of individually addressable electrode arrays, a fully automated deposition head, and a parallel screening apparatus is described. The system is capable of synthesizing and screening millions of new compositions at an unprecedented rate.

Abstract: Novel arrays of nanowires made of semi-metallic Bismuth (Bi) is disclosed made by unique electrodeposition techniques. Because of the unusual electronic properties of the semi-metallic Bi and the nanowire geometry, strong finite size effects in transport properties are achieved. In addition, very large positive magnetoresistance, 300% at low temperatures and 70% at room temperature, with quasilinear field dependence have been attained.

Abstract: An apparatus for depositing an electrical conductive layer on the surface of a wafer includes a virtual anode located between the actual anode and the wafer. The virtual anode modifies the electric current flux and plating solution flow between the actual anode and the wafer to thereby modify the thickness profile of the deposited electrically conductive layer on the wafer. The virtual anode can have openings through which the electrical current flux passes. By selectively varying the radius, length, or both, of the openings, any desired thickness profile of the deposited electrically conductive layer on the wafer can be readily obtained.

Abstract: Micromechanical component and a method for its production having vertically arranged layers made of metallic materials, with the layers adhering firmly to one another at least in part. The layers of the micromechanical component are attached to each other via intermediate layers, with the intermediate layers being at least one sputtered layer which can be applied in the form of a metallic start plating to the underlying layer, which includes metallic and nonmetallic areas, and to which an upper metallic electroplated layer can be applied. Upon their completion, the layers yield the micromechanical component with layers that adhere to one another or layers which can be partially detached from one another.

Abstract: A method of applying a conductive carbon coating to a non-conductive surface, conductive carbon compositions for that purpose, and a printed wiring board having through holes or other nonconductive surfaces treated with such carbon compositions are disclosed. A liquid dispersion of electrically conductive carbon (for example, graphite) having a mean particle size no greater than about 50 microns is coated on the non-conductive surface to form an electrically conductive carbon coating. The conductive carbon coating is then fixed on the (formerly) nonconductive surface. Fixing may be accomplished in a variety of different ways. For example, the fixing step can be carried out by applying a fixing liquid to the carbon-coated surface. One example of a suitable fixing liquid is a dilute aqueous acid. Fixing may also be carried out by removing the excess carbon dispersion with an air knife or other source of compressed air.

Abstract: A method is provided for selectively electrochemically depositing copper. The method includes forming a layer of dielectric material above a structure layer, forming a conductive layer above the layer of dielectric material and forming an opening in the conductive layer and the layer of dielectric material. The method also includes selectively forming at least one barrier metal layer and a copper seed layer only in the opening, the at least one barrier metal layer and the copper seed layer being conductively coupled to the conductive layer. The method further includes forming an insulating layer above the conductive layer, and selectively electrochemically depositing copper only in the opening.

Abstract: A shield is applied to a permeable core in a predetermined pattern, where the predetermined pattern covers less than the entire surface area of the permeable core.

Abstract: Method for producing a press-form (a stamper) for shaping an information-carrying optical storage medium, wherein in a first step, tracks are burned into the covering layer-coated (5) surface (3) of a blank (1) by a laser beam (6) according to the information to be stored before the tracks (7) are filled with metal in an electroplating process in a further step of said method, wherein the blank (1) is made from a cut or stamped metal disc (2) whose surface (3) is ground and polished.

Abstract: A method for fabricating a capillary element for electrokinetic transport of materials. The method comprises providing a first capillary element which has a first capillary channel disposed through its length. The capillary channel comprises first and second ends and an outer surface. A continuous layer of an electrically conductive material is applied along a length of the outer surface such that the continuous layer of electrically conductive material extends along the outer surface to a point proximal to, but not up to at least one of the first and second ends. The capillary element is then segmented into at least first and second separate capillary element portions at an intermediate point of the capillary element and the continuous layer.

Abstract: An electromigration-resistant copper film structure and the process for forming the structure. The film structure contains a high impurity content, is resistant to grain growth, and possesses superior metallurgical, thermo-mechanical, and electrical properties. The process comprises the steps of: (a) providing a seed layer at least indirectly on a substrate, the seed layer having an exposed surface; (b) immersing the substrate in a plating solution; (c) electrodepositing a copper-containing film on the exposed surface of the seed layer, the copper-containing film having a first surface; (d) maintaining the substrate in an immersed state within the plating solution; (e) electrodepositing a further copper-containing film from the plating solution onto the first surface; (f) removing the substrate from the plating solution; and (g) drying the substrate.

Abstract: Erosion of high density metallization areas associated with conventional damascene-CMP processing is avoided and greater planarity achieved by selectively increasing the metal overburden layer thickness at high density metallization regions. Embodiments include initially filling recesses formed in the substrate surface with a metal forming a blanket or overburden layer of the metal thereon. Regions of the blanket or overburden layer overlying regions of high density metallization are selectively electroplated to a greater thickness. The surface is then planarized by CMP, with the selectively increased thickness areas of the overburden layer compensating for greater erosion rates thereat during CMP, thereby resulting in greater planarity of the polished surface.

Abstract: A process for producing a terminal metal pad structure electrically interconnecting a package and other components. More particularly, the invention encompasses a process for producing a plurality of corrosion-resistant terminal metal pads. Each pad includes a base pad containing copper which is encapsulated within a series of successively electroplated metal encapsulating films to produce a corrosion-resistant terminal metal pad.

Abstract: Creating relatively pure and consistent crystals of high performance minerals, such as diamond, has long been pursued. Unfortunately, synthesizing crystals that exhibit deep bonding generally requires high temperatures and high pressures for the formation of large crystals. Alternatively, high pressure and explosive shock waves can also be utilized, as demonstrated by closed-bomb diamond synthesis. Diamond crystal formation at lower temperatures and pressures have been demonstrated, but the formations have been thin and inconsistent. A method of forming diamond and the synthesis of other high performance crystals that are consistent, and can be grown to larger sizes has not existed, nor has a means of providing uniform and consistent thin layers of diamond and other such crystals been demonstrated.

Abstract: A method for manufacturing color filters, in which color layers for transmitting light within a specific wavelength range are formed on light-transmissive electrodes formed on a light-transmissive substrate. The light-transmissive electrodes are brought into contact with a deposition solution having an electrolytic solution and a pigment material dispersed therein. A voltage is applied through the contacting portions between the light-transmissive electrodes and the deposition solution. The deposition solution is then electrolyzed between the light-transmissive electrodes and a submerged electrode. Color layers are formed on the light-transmissive electrodes. Examples of possible methods to bring the light-transmissive electrodes into contact with the deposition solution include immersing the light-transmissive electrodes in the deposition solution, engaging the light-transmissive electrodes into contact with the surface of the deposition solution, and other methods.

Abstract: The invention relates to a method of forming a metal line. A photoresist layer is formed on a substrate and patterned so that a metal part on the substrate is exposed. A metal seed layer is then deposited over the photoresist layer utilizing a directional deposition technique. A portion of the metal seed layer is then removed. A metal plating is then formed on the metal seed layer utilizing a technique selected from the group consisting of electroplating and electroless plating. The photoresist layer is then removed.

Abstract: A method and device for the electrolytic formation of a deposit on a group of electrodes of an electrolysis support. The support has a plurality of electrodes. Electric charges are selectively deposited on chosen electrodes. The support is placed in the presence of an electrolyte to produce the deposit on the chosen electrodes by electrolysis. The electric charges deposited on the electrodes provide an electrolysis current for each chosen electrode. The formed device may be used as a biological sensor.

Abstract: A method for fabricating metal micropatterns. Trenches are introduced into a polymer layer. These trenches are filled with the metal micropatterns using an electroplating process. Before the deposition of the metal micropatterns, the side walls of the trenches are covered with insulating layers which adhere to the metal micropatterns after the polymer layer is removed.

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract: An apparatus and method for customizing electrode contact placement on a semiconductor wafer while depositing and/or removing a material on a semiconductor wafer. The present invention is a adapter having at least one opening through which at least one electrode contacts the semiconductor wafer. The adapter may be designed to have multiple openings at specified locations on the adapter, thus allowing multiple electrode contacts with the semiconductor wafer at pre-specified locations. A conductive sheet may couple with the adapter to carry an electrical current from an electrical conductor to the electrode contacts placed within the openings of the adapter.

Abstract: The invention relates to a process for the production of an electro-chemical deposit (8-1, . . . , 8-4) with the aid of a substrate (2) having connection pieces (4-1, . . . , 4-5), said pieces being used as electrodes, the deposit taking place on the surface of a removable support (6) and which can be subsequently separated from the substrate on areas of said surface in electrical contact with the pieces of the substrate.

Abstract: A magnetically shape-anisotropic material is made by providing a matrix with a plurality of elongated holes, and depositing first and second magnetic materials in each hole so as to form elongated particles including the first material adjacent one end and the second material adjacent the opposite end. One of the materials is a magnetically soft material having relatively low coercivity whereas the other material is a magnetically hard material having relatively high coercivity. The particles have dimensions transverse to their axes of elongation smaller than the magnetic domain size of the magnetically soft material.

Abstract: Disclosed is a nickel electroplating bath or a nickel alloy electroplating bath used for electroplating a conductor partially masked with an organic high-molecular resist layer, wherein the nickel electroplating bath contains a water-soluble nickel salt, and the nickel alloy electroplating bath contains both a water-soluble nickel salt and a water-soluble salt of a metal capable of being alloyed with nickel. The above electroplating bath is incorporated with an electrical conductive salt containing at least one cation selected from the group consisting of an ammonium ion, magnesium ion, calcium ion, aluminum ion, and barium ion. Further, the electrical conductive salt substantially does not contain a sodium ion and a potassium ion as cations. Such an electroplating bath is capable of electroplating a conductor partially masked with an organic high-molecular resist layer without floating of the resist layer.

Abstract: Methods of treating wafers for analyzing defects present therein comprise providing wafers having front side surfaces comprising defective portions and a back side surfaces opposite thereto; and decorating the defective portion of the front side of the wafer with copper.

Abstract: A multipart seal is provided for electrically isolating from an electrolyte medium a projection secured at a projection base with a body surface, the projection and body surface having different electrochemical activities. A first seal part is a hollow cap sized and shaped to receive and cover the projection and to conform with the projection base. A second seal part is a cured, pliable sealant disposed on a cap wall about a cap opening and cap rim portion, and bonded with and covering the projection base and the body surface surrounding and immediately adjacent to the projection base. Both the first and second seal parts substantially will not react with or allow passage there through of the electrolyte medium. In an electrolytic method to coat the body surface, the projection is electrically isolated with the multipart seal prior to application of the electrolytic coating.

Abstract: The invention relates to a method for producing low cost hermetic Integrated Module Assembly (IMA) packaging, where an aluminum coating (24) is deposited on a poly-tetrafluoral-ethaline substrate (20), the aluminum coating (24) is selectively etched to form a waveguide window (26) and the substrate (20) is selectively treated over the waveguide window (26) to produce a non-conductive hermetic seal. The substrate (20) is then joined to a metal carrier (28) containing the waveguide (30). As a result of using selectively treated low cost substrates to produce hermetic seals, more expensive substrates are not required to form hermetic seals over substrate to waveguide interconnections.

Abstract: A method of performing electrochemistry processes on features and connectors of a substrate includes the application of a shorting layer across the connectors which are in electrical contact with the features, thereby shorting the features and creating an assemblage for which electricity is applied.

Abstract: In a method of manufacturing foils of plastic material which are electrically conductive in a transverse direction, but not in the plane of the foil wherein micropassages are formed in the foil by etching nucleus traces which are generated by exposure to a heavy ion beam, conductive layers are deposited on one side of the foil and the micropassages are filled by electrolytic metal ion depositions from the other side until caps are formed on the passages. After dissolving the two conductive layers, the steps are repeated to form caps also on the passages at the other side of the foil so as to provide for good contacting capabilities at both sides of the foil.

Abstract: An extremely small aperture is formed using a sharp conductive tip. The aperture may be in the form of a transparent window or an open aperture. In a first embodiment, the conductive tip is positioned adjacent a layer of titanium and a voltage is applied to the tip. The intense electric field near the tip anodizes the titanium and creates a small transparent window of titanium dioxide. In a second embodiment, a titanium layer is covered with a layer of silicon, a small region of the silicon is oxidized using a conductive tip, and the silicon and then the titanium are etched. In a third embodiment, an electric field from a conductive tip creates a pit in a surface titanium oxide layer. The titanium is then etched, using the oxide layer as a mask, to form an open aperture. The conductive tip is preferably the tip of an atomic force microscope.

Abstract: A method for depositing a multi-layered protective and decorative coating on the article comprising first depositing at least one coating layer on the article by electroplating, removing the electroplated article from the electroplating bath and subjecting it to pulse blow drying to produce a spot-free surface on the electroplated article, and then depositing, by physical vapor deposition, at least one vapor deposited coating layer on the electroplated article. The electroplated layers are selected from copper, nickel and chrome. The physical vapor deposited layers are selected from non-precious refractory metals, non-precious refractory metal alloys, non-precious refractory metal compounds, and non-precious refractory metal alloy compounds.