Abstract: A method to fabricate a damped suspension assembly includes providing a suspension assembly including a mounting plate, a bend region, and a load beam. A first thinned area of the load beam is partially-etched. The bend region does not include the first thinned area. A constrained-layer damper is adhered to the first thinned area of the load beam without being adhered to the bend region.

Abstract: A method of fabricating a membrane having a tapered pore, a polymeric membrane having a tapered pore, and uses of such polymeric membrane are disclosed. The membrane includes apertures of increasing diameter which are aligned with each other to form the tapered pore.

Abstract: A method of producing a mold having an uneven structure and a mold for an optical element are provided. The method includes forming on a nickel substrate a mixed film using nickel and a material which phase separates from nickel simultaneously, the mixed film including a plurality of cylinders including nickel as a component thereof and a matrix region including the material which phase separates from nickel as a component thereof and surrounding the plurality of cylinders; and removing the matrix portion from the mixed film by etching to give a mold including nickel or a nickel alloy. The uneven structure is disposed in plurality on the substrate, and a pitch of the uneven structure is within a range of 30 nm or more and 500 nm or less and a depth of the uneven structure is within a range of 100 nm or more.

Abstract: A composition comprising a solution of potassium monopersulfate having an active oxygen content of from about 3.4% to about 6.8% and a process for its preparation including neutralization with an alkaline material is disclosed.

Abstract: A method is provided for selectively etching native oxides or other contaminants to metal nitrides and metal oxides during manufacture of a semiconductor device. The method utilizes a substantially non-aqueous etchant which includes a source of fluorine ions. In a preferred embodiment, the etchant comprises H2SO4 and HF. The etchant selectively etches native and doped oxides or other contaminants without excessively etching metal nitrides or metal oxides on the substrate or on adjacent exposed surfaces.

Abstract: Methods, materials, and systems for texturizing mold surfaces is disclosed. In one method and system of the invention, a first step involves generating a graphics file of a desired texture pattern. The graphics file is subsequently output to an ink jet printer, which is configured to print using an acid-etch resist ink. The acid-etch resist ink is formulated to provide optimal properties for ink-jet printing, while also providing excellent acid-etch resist and superior handling properties. The acid-etch resist ink is printed onto a sheet of a carrier substrate that allows the acid-etch resist to be transferred to a mold surface, after which the mold surface is etched with a strong acid.

Abstract: An etching process is employed to selectively pattern an exposed magnetic layer of a magnetic thin film structure. The etching process generally includes selectively patterning a magnetic film structure comprises providing a magnetic structure comprising at least one bottom magnetic layer, at least one top magnetic layer, wherein the at least one bottom magnetic layer is separated from the at least one top magnetic layer by a tunnel barrier layer; and selectively etching the top magnetic layer with an etching solution comprising at least one weakly absorbing acid, a surfactant inhibitor soluble in the at least one weakly absorbing acid, and at least one cation additive, wherein etching of the tunnel barrier layer is substantially prevented. In some embodiments, etching solution comprises at least one perfluoroalkane sulfonic acid, an alkylsulfonate salt soluble in the at least one perfluoroalkane sulfonic acid, and at least one cation additive.

Abstract: A semiconductor device and related method for fabricating the same include providing a stacked structure including an insulating base layer and lower and upper barrier layers with a conductive layer in between, etching the stacked structure to provide a plurality of conductive columns that each extend from the lower barrier layer, each of the conductive columns having an overlying upper barrier layer cap formed from the etched upper barrier layer, wherein the lower barrier layer is partially etched to provide a land region between each of the conductive lines, forming a liner layer over the etched stacked structure exposing the land region, and etching the liner layer and removing the exposed land region to form a plurality of conductive lines.

Abstract: Apparatus including: a substrate layer having a substantially planar top surface; an optically conductive peak located and elongated on, and spanning a first thickness measured in a direction generally away from, the top surface; the optically conductive peak having first and second lateral walls each including distal and proximal lateral wall portions, the proximal lateral wall portions intersecting the top surface; and first and second sidewall layers located on the distal lateral wall portions, the sidewall layers not intersecting the top surface and spanning a second thickness that is less than the first thickness measured in the same direction.

Abstract: Super-hydrophobic and self-cleaning articles produced by imprinting exposed surfaces with suitable fine-grained and/or amorphous metallic embossing dies to transfer a dual surface structure, including ultra-fine features less than or equal to 100 nm embedded in and overlaying a surface topography with macro-surface structures greater than or equal to 1 micron are disclosed.

Abstract: Articles containing fine-grained and/or amorphous metallic coatings/layers on at least part of their exposed surfaces are imprinted with surface structures to raise the contact angle for water in the imprinted areas at room temperature by equal to or greater than 10°, when compared to the flat and smooth metallic material surface of the same composition.

Abstract: An interbody spinal implant including a body, the body comprising: a top surface; a bottom surface; opposing lateral sides; and opposing anterior and posterior portions; the top surface, bottom surface, opposing lateral sides, internal wall surface, and opposing anterior and posterior portions defining a substantially hollow center having a single vertical aperture defining an internal wall surface, the single vertical aperture (a) extending from the top surface to the bottom surface, (b) having a size and shape predetermined to maximize the surface area of the top surface and the bottom surface available proximate the anterior and posterior portions while maximizing both radiographic visualization and access to the substantially hollow center, and (c) defining a transverse rim, wherein at least a portion of the internal wall surface has a roughened surface topography.

Abstract: The present invention concerns a method and device for oxidative erosion or for decontamination of a metallic surface, comprising a step consisting of intermittently polarising the metallic surface to be eroded or decontaminated, placed in contact with a solution containing manganese VII, at a more anodic electric potential than the corrosion potential of said surface.

Abstract: A process for selectively stripping a coating from a component of a turbomachine, and particularly a coating having a ceramic matrix that contains metallic particles dispersed therein that render the coating more difficult to remove from the component after the component has been subjected to elevated temperatures during operation of the turbomachine. The process generally includes immersing the component in an aqueous solution containing ferric chloride, nitric acid, and phosphoric acid, for a duration sufficient to attack the metallic particles in the coating. The component is then removed from the aqueous solution and its surface rinsed of the aqueous solution. The immersing and removing steps are then sequentially repeated a sufficient number of times to sufficiently attack the metallic particles to enable the coating to be mechanically removed from the component.

Abstract: An inkjet head includes a plurality of nozzles through which ink is dischargeable out of the inkjet head, a pressure chamber plate that is made of metal, a plurality of pressure chambers that are groove portions formed in the pressure chamber plate for applying to the ink a pressure that is necessary in order to discharge the ink from the plurality of nozzles, an actuator that faces a first face of the pressure chamber plate and that includes a plurality of pressure generating portions, and a pressure chamber support member that supports the pressure chamber plate from a second face of the pressure chamber plate, the second face being an opposite face to the first face, and that is made from a material that has a Young's modulus that is greater than a Young's modulus of a material from which the pressure chamber plate is made.

Abstract: A chemical etchant containing hydrogen peroxide and phosphate ions at a controlled pH is provided for selectively etching metals in the presence of one or more metals not to be etched. The etchant is useful in the fabrication of semiconductor components particularly for forming capture pads where TiW is used as a barrier layer for a copper, copper/nickel pad, or copper/nickel alloy pad. A commercial hydrogen peroxide solution is preferred to which has been added phosphoric acid as a source of phosphate ions and KOH as the pH adjuster.

Abstract: An inkjet ink includes a polymer which contains a functional group capable of forming an interaction with a plating catalyst or its precursor and a polymerizable functional group; and at least one solvent in which the polymer is dissolved or dispersed. The inkjet ink is capable of forming in a desired pattern a polymer layer having excellent adhesion to a metal film (plated film) and exhibits high stability in continuous discharge.

Abstract: According to one embodiment, a method of treating catalyst for nanocarbon production comprises, bringing a surface of a catalytic material into contact with a chemical, the catalytic material containing a metallic material and being used to produce nanocarbon, corroding the surface of the catalytic material, and drying the surface of the catalytic material.

Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.

Abstract: Imprint lithography substrates may include alignment marks formed of high contrast material. Exemplary methods for forming alignment marks having high contrast material are described.

Abstract: Methods are provided for manufacturing optical display devices which remove an etch resist and residual post-etch metal in a single step. These methods are particularly useful in the manufacture of LCDs.

Abstract: A method for manufacturing a semiconductor device includes the step of conducting a cleaning process for a wafer formed with copper wiring lines to remove contaminations produced on a back surface of the wafer. The cleaning process is conducted by injecting onto the back surface of the wafer an etchant for removing contaminations and simultaneously injecting onto a front surface of the wafer a reductant containing hydrogen.

Abstract: Methods are provided for producing large volumes of small antenna arrays. In one embodiment, the method comprises the steps of creating an antenna array pattern as a computer file, printing the created pattern onto the surface of a suitable transfer paper, placing the printed image surface in contact with the surface of a material to be etched, and transferring the printed image to the surface of the material to be etched. The transfer can be effected by any combination of chemicals, heat, and/or pressure. After transfer of the printed image, the transfer paper is removed. The step of removing the transfer paper optionally includes wetting the transfer paper in a manner that dissolves the transfer paper leaving the printed antenna pattern on the surface of the material to be etched.

Abstract: A thin film device, such as an intravascular stent, is disclosed. The device is formed of a seamless expanse of thin-film (i) formed of a sputtered nitinol shape memory alloy, defining, in an austenitic state, an open, interior volume, having a thickness between 0 5-50 microns, having an austenite finish temperature Af below 37° C.; and demonstrating a stress/strain recovery greater than 3% at 37° C. The expanse can be deformed into a substantially compacted configuration in a martensitic state, and assumes, in its austenitic state, a shape defining such open, interior volume. Also disclosed is a sputtering method for forming the device.

Abstract: An etching process for selectively etching exposed metal surfaces of a substrate and forming a conductive capping layer over the metal surfaces is described. In some embodiments, the etching process involves oxidation of the exposed metal to form a metal oxide that is subsequently removed from the surface of the substrate. The exposed metal may be oxidized by using solutions containing oxidizing agents such as peroxides or by using oxidizing gases such as those containing oxygen or ozone. The metal oxide produced is then removed using suitable metal oxide etching agents such as glycine. The oxidation and etching may occur in the same solution. In other embodiments, the exposed metal is directly etched without forming a metal oxide. Suitable direct metal etching agents include any number of acidic solutions. The process allows for controlled oxidation and/or etching with reduced pitting.

Abstract: The present invention relates to a door skin comprising an exterior surface having outer portions lying on a first plane, spaced grooves recessed from the plane of the outer portions, and tonal portions having a planar area and a plurality of spaced depressions recessed from the plane of said planar area. The present invention is also directed to a method of etching a plate, for use with a molded die set, for embossing a wood grain pattern in the door skin, and the etched plate formed therefrom.

Abstract: When forming an opening conforming to a groove of a quartz resonator in a metal film serving as a mask of the quartz resonator by conducting etching, the outer periphery of the metal film is wavingly etched. Therefore, when the groove is formed on the quartz resonator, the quartz resonator is formed according to the above-described metal film, which results in appearance defects or dimension defects. In order to solve the problems, the outer shape of the metal film is formed smaller than the outer shape of the quartz resonator before forming the opening conforming to the groove of the quartz resonator in the metal film, then etching of the metal film and etching of the quartz resonator are performed.

Abstract: A method for manufacturing a thin film magnetic head includes a step for forming an MR layered body; a step for forming a first sacrificial layer made of material removable by wet etching, and subsequently, forming a cap layer on the upper surface of the first sacrificial layer; further, a step for patterning the MR layered body and the cap layer and then filling part of the removed areas of the MR layered body and the cap layer with a bias magnetic layer and the remaining with insulating layers; a step for removing the cap layer by dry etching and, subsequently, removing the first sacrificial layer by wet etching; and a step for forming a second shield layer above the MR layered body and the bias magnetic layer.

Abstract: A method of forming a petterned substracte is provided. The method includes providing a substrate (300) having a structured surface region comprising one or more recessed features (310). The method includes disposing a first liquid (325) onto at least a portion of the structured surface region. The method includes contacting the first liquid with a second liquid (330). The method includes 300 displacing the first liquid with the second liquid from at least a portion (315) of the structured surface region. The first liquid is selectively located in at least a portion of the one or more recessed features.

Abstract: A method of fabricating a liquid crystal display array substrate includes forming a gate wiring line having a gate pad electrode, forming a data wiring line having a data pad electrode, forming a protection layer over the gate pad electrode and the data pad electrode, and positioning etching tapes on the protection layer over the gate pad electrode and the data pad electrode.

Abstract: Processes for the purification of silicon carbide structures, including silicon carbide coated silicon carbide structures, are disclosed. The processes described can reduce the amount of iron contamination in a silicon carbide structure by 100 to 1000 times. After purification, the silicon carbide structures are suitable for use in high temperature silicon wafer processing.

Abstract: A superhydrophobic polymer fabrication is provided. According to one method for preparing a superhydrophobic polymer fabrication, the superhydrophobic polymer fabrication can be fabricated quickly and easily, and the superhydrophobic surface can be repeatedly imprinted using a template, so that mass production of the superhydrophobic polymer fabrication over a large area can be economically implemented.

Abstract: A cylinder barrel inside surface treatment apparatus for providing a uniform treatment finish is disclosed. The treatment apparatus includes a pallet on which a cylinder block is placed with a gasket surface faced upward. A top opening of a cylinder barrel of the cylinder block is covered by a cover member having a concave portion communicating with the top opening. A nozzle having treatment solution spray holes is attached to the cover member. The treatment solution is sprayed toward a wall of the concave portion from the treatment solution spray holes and flows along the wall from a top end to a bottom end of the cylinder barrel inside surface.

Abstract: A device-incorporated substrate and a method of manufacturing a device-incorporated substrate, as well as a printed circuit board and a method of manufacturing a printed circuit board in which a fine-pitch conductor pattern can be formed on an insulating layer with high precision while securing the dimensional stability of the conductor pattern, are provided. A transfer sheet (61) has a structure that includes two layers, a metal base material (62) and a dissolvee metal layer (64), and a conductor pattern (55) is formed on the dissolvee metal layer (64) through electroplating. Then, after the transfer sheet (61) on which the conductor pattern (55) is formed is adhered onto an insulating base material (51), the transfer sheet (61) is removed through a step of separating the metal base material (62) from the dissolvee metal layer (64), and a step of selectively dissolving and removing the dissolvee metal layer (64) with respect to the conductor pattern (55).

Abstract: The invention is a technique for strongly integrating a galvanized steel sheet and a resin molded article. A hot-dip galvanized steel sheet “Z18” is immersed in an aqueous solution for aluminum degreasing at 75° C. for 7 minutes, to form roughness having an RSm of 0.8 to 2.3 ?m and an Rz of 0.3 to 1.0 ?m on the surface. The surface is covered with convex protrusions having a diameter of about 100 nm, and a chromate treatment layer appears in the surface. In other words, three conditions suitable for bonding are satisfied thereby. A resin composition comprising 70 to 97 wt % of polyphenylene sulfide and 3 to 30 wt % of a polyolefin resin is injected onto the surface. The resin composition penetrates into ultra-fine irregularities and is cured in that state, whereby a composite in which the galvanized steel sheet and the resin molded article are strongly integrated is obtained. The shear rupture strength of the composite is extremely high, in excess of 20 MPa.

Abstract: A method for removing an undesirable material from an electronic or electrical component and introducing a desirable material in place of the undesirable material. The method can include the replacement of a leaded material found on the component with a no-lead material to meet governmental directives including those of the European Union.

Abstract: The invention relates to a ceramic substrate material having a first layer having a cavity structure formed therein, and at least one sealing layer situated on at least a part of the cavity structure. The first layer comprises at least one first component made of a crystalline ceramic material and/or a glass material as a matrix, the first layer containing a second component made of a further crystalline ceramic material, with selected mantle areas of the crystals and/or crystal agglomerates of the second component being etched out in such a way that the cavity structure is provided (preferably in the form of a pore and/or tube structure). The sealing layer seals the surface of the first layer in the areas on which it is situated (e.g., above the cavity structure), allowing application of thin-film structures to the cavity structure.

Abstract: An indium cap layer is formed by blanket depositing indium onto a surface of metallic interconnects separated by interlayer dielectric, and then selectively chemically etching the indium located on the interlayer dielectric leaving an indium cap layer. Etchants containing a strong acid are provided for selectively removing the indium.

Abstract: By forming a protection layer on the back side of a substrate prior to any process sequences, which may deposit material or material residues on the back side, the respective back side uniformity may be significantly enhanced, thereby also increasing process efficiency of subsequent back side critical processes, such as lithography, back end of line processes and the like. In one illustrative embodiment, silicon carbide may be used as a material for forming a respective protection layer.

Abstract: The present invention relates to a method and an arrangement for restoring strength and wear resistant of a metallic matrix ceramic (1) comprising a metallic binder (2) and ceramic filler (3) particles, which metallic matrix ceramic (1) has been exposed for long term high temperature and pressure cycling, for example in a gas exhaust nozzle (6), whereby micro cracks (4) are developed in the outer layer (5) of the metallic binder (2) According to the invention this is achieved by virtue of the fact that the outer layer (5) of the metallic binder (2), partly or fully, is removed from the MMC part (1) by a chemical operation, where after the outer layer (5) is compressed by a compression operation for achieving a dense outer layer (5), in which filler (3) particles are close to each other.

Abstract: An object is to provide a process for producing a glass substrate provided with transparent electrodes, whereby in the case of producing a glass substrate provided with transparent electrodes by a laser patterning method, no scratches are formed on the surface of the glass substrate, the resistance value of the formed transparent electrodes is not increased, and the surface roughness is not increased.

Abstract: A process for etching a metal or alloy surface which comprises applying an etch-resist ink by ink jet printing to selected areas of the metal or alloy, solidifying the etch-resist ink without the use of actinic light and/or particle beam radiation and then removing the exposed metal or alloy by a chemical etching process wherein the etch-resist ink comprises the components: A) 60 to 100 parts carrier vehicle comprising one or more components which contain at least one metal chelating group; D) 0 to 40 parts colorant; and E) 0 to 5 parts surfactant; wherein the ink has a viscosity of not greater than 30 cPs (mPa·s) at the firing temperature, all parts are by weight and the total number of parts A)+B)+C)=100.

Abstract: A highly selective metal wet etchant with an active ingredient comprising one or more types of molecules having two or more oxygen atoms is described. In one embodiment, the wet etchant is utilized to pattern a metal layer in a semiconductor structure. In another embodiment, a highly selective metal wet etchant with an active ingredient comprising one or more types of molecules having two or more oxygen atoms is used to pattern a metal gate electrode in a replacement gate processing scheme.

Abstract: In one aspect, there is provided a process for manufacturing a lower mold for receiving a falling molten glass droplet, in which without narrowing the option for material for a lower mold, any occurrence of air retention can be favorably prevented and a lower mold excelling in durability can be obtained. The process comprises the film forming step of forming a coating layer on a base material and the surface roughening step of roughening the surface of the coating layer. Preferably, the coating layer contains at least one element selected from among chromium, aluminum and titanium.

Abstract: This invention provides a manufacturing method of a molded glass object in which generation of defects such as dents and wrinkles due to catching of ambient gas between a molten glass drop and an upper mold is restrained in the case of manufacturing a molded glass object by press-molding of a dropped molten glass drop, and a manufacturing method of an upper mold for the manufacturing method of a molded grass object. A molten glass drop is press-molded by use of an upper mold having been subjected to a roughening treatment to roughen the surface on the molding surface to compress the molten glass drop.

Abstract: An optical element manufacturing method includes: disposing a light-shielding layer (14) that includes at least an Si layer as an uppermost layer, on a substrate (12) used as a base member, forming an optical aperture (14a) at the light-shielding layer (14) and forming a fine recession/projection structure (MR) at a surface of the uppermost layer through dry etching.

Abstract: A method for plating tin or a tin alloy on a substrate such that whiskers are prevented form forming or the number of whickers is reduced in number as well as size.

Abstract: A composition for removing a conductive material and a manufacturing method of an array substrate using the composition, wherein the composition may include a nitric acid of about 3 to 15 wt %, a phosphoric acid of about 40 to 70 wt %, an acetic acid of about 5 to 35 wt %. The composition may further include a chlorine compound of about 0.05 to 5 wt %, a chlorine stabilizer of about 0.01 to 5 wt %, a pH stabilizer of about 0.01 to 5 wt %, and water of residual quantity.

Abstract: A polishing composition comprising an abrasive and water, wherein the polishing composition has an index of degree of sedimentation of 80 or more and 100 or less; a process for producing a substrate comprising polishing a substrate to be polished using the above-mentioned composition; a process for preventing clogging of a polishing pad comprising applying the above-mentioned composition; a process for preventing clogging of a polishing pad comprising applying the above-mentioned composition to polishing with a polishing pad for a nickel-containing object to be polished; and a process for preventing clogging of a polishing pad comprising applying a composition comprising a hydrophilic polymer having two or more hydrophilic groups in its molecule and a molecular weight of 300 or more, or a compound capable of dissolving nickel hydroxide at a pH of 8.0, and water to polishing with a polishing pad for a nickel-containing object to be polished.

Abstract: There is provided a method for removing molten and scattered Cu and overhang that are generated around a via opening during laser machining in a direct laser via forming method of directly machining an outer-layer copper foil. In a manufacturing method of a printed wiring board of machining the via by laser directly through the copper foil of a copper-clad laminate in which the copper foil is clad on a base material resin, a process for machining the via is carried out in a sequence of (a) a copper foil surface treatment step of forming an oxide film on the surface of said copper foil, (b) a laser via machining step, (c) an alkali treatment step and (d) a molten and scattered Cu etching step. It is desirable to carry out (e) a de-smearing treatment after the molten and scattered Cu etching.