Abstract: Certain embodiments herein relate to an apparatus used for remote plasma processing. In various embodiments, the apparatus includes a reaction chamber that is conditioned by forming a low recombination material coating on interior chamber surfaces. The low recombination material helps minimize the degree of radical recombination that occurs when the reaction chamber is used to process substrates. During processing on substrates, the low recombination material may become covered by relatively higher recombination material (e.g., as a byproduct of the substrate processing), which results in a decrease in the amount of radicals available to process the substrate over time. The low recombination material coating may be reconditioned through exposure to an oxidizing plasma, which acts to reform the low recombination material coating. The reconditioning process may occur periodically as additional processing occurs on substrates.

Abstract: A method of forming a semiconductor device includes forming a photoresist layer over a mask layer, patterning the photoresist layer, and forming an oxide layer on exposed surfaces of the patterned photoresist layer. The mask layer is patterned using the patterned photoresist layer as a mask. A target layer is patterned using the patterned mask layer as a mask.

Abstract: A substrate processing apparatus includes: a chamber; a substrate support disposed in the chamber; a plasma generator configured to form a plasma in the chamber; and a controller configured to perform a process including: placing a substrate on the substrate support, the substrate including a first film, a second film and a third film, the first film containing a silicon, the second film having a second aperture, the first film being disposed between the second film and the third film; cooling the substrate to ?30° C. or less; etching the first film through the second aperture with a plasma formed from a first process gas containing a fluorocarbon gas, to form a first aperture of a tapered shape in the first film such that a width of the first aperture gradually decreases toward a bottom of the first aperture; and etching the third film through the first aperture.

Abstract: A method of forming a magnetic core on a substrate having a stacked inductor coil includes etching a plurality of polymer layers to form at least one feature through the plurality of polymer layers, wherein the at least one feature is disposed within a central region of a stacked inductor coil formed on the substrate; and depositing a magnetic material within the at least one feature.

Abstract: In a pattern formation method, a first organic film is formed on a film to be etched and contains a metal. A second organic film is formed on the first organic film, and has a higher density than a density of the first organic film. The first and second organic films are patterned to form a mask, and the film to be etched is etched using the mask.

Abstract: In an embodiment, a method includes: receiving, within a processing chamber, a wafer with a photoresist mask above a metal layer, wherein the processing chamber is connected to a gas source; applying an etchant configured to etch the metal layer in accordance with the photoresist mask within the processing chamber; and applying gas from the gas source to perform plasma ashing in the processing chamber.

Abstract: A semiconductor structure includes a semiconductor substrate, a gate structure, an etch stop layer, a dielectric structure, and a conductive material. The gate structure is on the semiconductor substrate. The etch stop layer is over the gate structure. The dielectric structure is over the etch stop layer, in which the dielectric structure has a ratio of silicon to nitrogen varying from a middle layer of the dielectric structure to a bottom layer of the dielectric structure. The conductive material extends through the dielectric structure.

Abstract: A method of forming a semiconductor structure includes the following steps. A dielectric layer is formed over a conductive line. A photoresist layer is formed over the dielectric layer. The photoresist layer is patterned to form a mask feature and an opening is defined by the mask feature. The opening has a bottom portion and a top portion communicated to the bottom portion, and the top portion is wider than the bottom portion. The dielectric layer is etched to form a via hole in the dielectric layer using the mask feature as an etch mask, such that the via hole has a bottom portion and a tapered portion over the bottom portion. The conductive material is filled in the via hole to form a conductive via.

Abstract: A method of etching selectively etches a first region of a substrate with respect to a second region of the substrate formed of a different material from the first region. A deposition film is formed of a chemical species included in plasma generated from a first gas. A gaseous precursor is supplied to the substrate having the deposition film formed thereon to form an adsorption film on the substrate from the precursor. Ions from plasma generated from a second gas are supplied to the substrate having the deposition film and the adsorption film formed thereon so as to cause a reaction between the material of the first region and a chemical species included in the deposition film, so that the first region is etched. The adsorption film reduces the etching rate of the second region during the etching of the first region.

Abstract: A method of forming a semiconductor device is provided. Metallic interconnects are formed in a dielectric layer of the semiconductor device. A hard mask is used to avoid usual problems faced by manufacturers, such as possibility of bridging different conductive elements and via patterning problems when there are overlays between vias and trenches. The hard mask is etched multiple times to extend via landing windows, while keeping distance between the conductive elements to avoid the bridging problem.

Abstract: An object is to provide a ruthenium removal composition capable of dissolving Ru while suppressing dissolution of CoFeB, and a method of producing a magnetoresistive random access memory (MRAM) using the same. A ruthenium removal composition of the present invention contains orthoperiodic acid and water, and the pH is 11 or more. It is preferable that the content of orthoperiodic acid in the ruthenium removal composition is 0.01% to 5% by mass with respect to the total mass of the composition.

Abstract: Methods of forming a circuit-protection device include forming a dielectric having a first thickness and a second thickness greater than the first thickness over a semiconductor, forming a conductor over the dielectric, and patterning the conductor to retain a portion of the conductor over a portion of the dielectric having the second thickness, and to retain substantially no portion of the conductor over a portion of the dielectric having the first thickness, wherein the retained portion of the conductor defines a control gate of a field-effect transistor of the circuit-protection device.

Abstract: Methods are described herein for etching metal films which are difficult to volatize. The methods include exposing a metal film to a chlorine-containing precursor (e.g. Cl2). Chlorine is then removed from the substrate processing region. A carbon-and-nitrogen-containing precursor (e.g. TMEDA) is delivered to the substrate processing region to form volatile metal complexes which desorb from the surface of the metal film. The methods presented remove metal while very slowly removing the other exposed materials. A thin metal oxide layer may be present on the surface of the metal layer, in which case a local plasma from hydrogen may be used to remove the oxygen or amorphize the near surface region, which has been found to increase the overall etch rate.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a first gate structure and a second gate structure on a substrate and an interlayer dielectric (ILD) layer around the first gate structure and the second gate structure; transforming the first gate structure into a first metal gate and the second gate structure into a second metal gate; removing part of the ILD layer between the first metal gate and the second metal gate to form a recess; forming a first spacer and a second spacer in the a recess; performing a first etching process to form a first contact hole; and performing a second etching process to extend the first contact hole into a second contact hole.

Abstract: Selective gas etching for self-aligned pattern transfer uses a first block and a separate second block formed in a sacrificial layer to transfer critical dimensions to a desired final layer using a selective gas etching process. The first block is a first hardmask material that can be plasma etched using a first gas, and the second block is a second hardmask material that can be plasma etched using a second gas separate from the first gas. The first hardmask material is not plasma etched using the second gas, and the second hardmask material is not plasma etched using the first gas.

Abstract: A variable resistance memory device includes a plurality of first conductive layer pattern, a plurality of second conductive layer patterns over the first conductive layer patterns, and a plurality of lower cell structures including a switching element and a variable resistance element, the lower cell structures being formed at intersections at which the first conductive layer patterns and the second conductive layer patterns overlap each other. The first conductive layer patterns, the second conductive layer patterns and the lower cell structures serves as one of a memory cell, a first dummy pattern structure and a second dummy pattern structure.

Abstract: Techniques herein include methods for controllable lateral etching of dielectrics in polymerizing fluorocarbon plasmas. Methods can include dielectric stack etching that uses a mask trimming step as part of a silicon etching process. Using a fluorocarbon mixture for dielectric mask trimming provides several advantages, such as being straightforward to apply and providing additional flexibility to the process flow. Thus, techniques herein provide a method to correct or tune CDs on a hardmask. In general, this technique can include using a fluorine-based and a fluorocarbon-based, or fluorohydrocarbon-based, chemistry for creating a plasma, and controlling a ratio of the two chemistries. Without the hardmask trim method disclosed herein, if a hardmask CD is not on target, then a wafer is scrapped. With hard-mask trim capability in silicon etch as disclosed herein, a given CD can be re-targeted to eliminate wafer-scraps.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate. The semiconductor device structure includes a first conductive structure over the substrate. The semiconductor device structure includes a first dielectric layer over the substrate. The first dielectric layer has a first opening exposing the first conductive structure. The semiconductor device structure includes a seal layer covering an inner wall of the first opening and in direct contact with the first dielectric layer. The seal layer includes a dielectric material including an oxygen compound. The semiconductor device structure includes a second conductive structure filled in the first opening and surrounded by the seal layer. The second conductive structure is electrically connected to the first conductive structure.

Abstract: Methods of forming conductive structures and the conductive structures are disclosed. A method includes forming an opening in a dielectric layer over a substrate, performing a cleaning process on the dielectric layer with the opening, forming a nucleation layer in the opening, etching the nucleation layer in the opening, and forming a conductive material in the opening and on the nucleation layer after the etching. An upper portion of the opening is distal from the substrate, and a lower portion of the opening is proximate the substrate. After the etching, a thickness of an upper portion of the nucleation layer in the upper portion of the opening is less than a thickness of a lower portion of the nucleation layer in the lower portion of the opening.

Abstract: There is provided a process for forming a contained second layer over a first layer, including the steps: forming the first layer having a first surface energy; treating the first layer with a priming layer; exposing the priming layer patternwise with radiation resulting in exposed areas and unexposed areas; developing the priming layer to effectively remove the priming layer from either the exposed areas or the unexposed areas resulting in a first layer having a pattern of priming layer, wherein the pattern of priming layer has a second surface energy that is higher than the first surface energy; and forming the second layer by liquid depositions on the pattern of priming layer on the first layer. There is also provided an organic electronic device made by the process.

Abstract: Capacitor designs for substrates, such as interposers, and methods of manufacture thereof are disclosed. In an embodiment, a capacitor is formed between a through via and a lower level metallization layer. The capacitor may be, for example, a planar capacitor formed on the substrate or on a dielectric layer formed over the substrate.

Abstract: A method of manufacturing a semiconductor device comprises placing a semiconductor substrate in an ashing chamber, the semiconductor substrate having a gate, a silicon nitride gate sidewall offset spacer or a silicon nitride gate sidewall pacer formed thereon, and a photo resist residue remaining on the semiconductor substrate, introducing a gas mixture including D2 or T2 into the ashing chamber, and ashing the photo resist residue using a plasma that is formed from the gas mixture. The gas mixture can include a deuterium gas or a tritium gas having a volume ratio ranging between about 1% and about 20%. Embodiments can reduce Si recess and the loss of silicon nitride thin film during ashing.

Abstract: A method for forming a dual damascene opening includes the following steps. Firstly, a first hard mask layer with a trench pattern is formed over a material layer. Then, a dielectric layer is formed over the first hard mask layer and filled into an opening of the trench pattern. Then, a second hard mask layer with a via opening pattern is formed over the first hard mask layer and the dielectric layer. Then, a first etching process is performed, so that a via opening is at least formed in the dielectric layer. After the second hard mask layer is removed, a second etching process is performed. Consequently, a trench opening is formed in the material layer and the via opening is further extended into the material layer, wherein the via opening is located within the trench opening.

Abstract: A sample with at least a first structure and a second structure is measured and a first model and a second model of the sample are generated. The first model models the first structure as an independent variable and models the second structure. The second model of the sample models the second structure as an independent variable. The measurement, the first model and the second model together to determine at least one desired parameter of the sample. For example, the first structure may be on a first layer and the second structure may be on a second layer that is under the first layer, and the processing of the sample may at least partially remove the first layer, wherein the second model models the first layer as having a thickness of zero.

Abstract: A method of forming a nitrogen-doped amorphous carbon layer on a substrate in a processing chamber is provided. The method generally includes depositing a predetermined thickness of a sacrificial dielectric layer over a substrate, forming patterned features on the substrate by removing portions of the sacrificial dielectric layer to expose an upper surface of the substrate, depositing conformally a predetermined thickness of a nitrogen-doped amorphous carbon layer on the patterned features and the exposed upper surface of the substrate, selectively removing the nitrogen-doped amorphous carbon layer from an upper surface of the patterned features and the upper surface of the substrate using an anisotropic etching process to provide the patterned features filled within sidewall spacers formed from the nitrogen-doped amorphous carbon layer, and removing the patterned features from the substrate.

Abstract: A method for forming device features with reduced line end shortening (LES) includes trimming the device feature to achieve the desired sub-ground rule critical dimension during the etch to form the device feature.

Abstract: When a substrate is etched by using a processing gas including a first gas containing halogen and carbon and having a carbon number of two or less per molecule, while supplying the processing gas toward the substrate independently from a central and a peripheral portion of a gas supply unit, which face the central and the periphery part of the substrate respectively, the processing gas is supplied such that a gas flow rate is greater in the central portion than in the peripheral portion. When the substrate is etched by using a processing gas including a second gas containing halogen and carbon and having a carbon number of three or more per molecule, the processing gas is supplied such that a gas flow rate is greater in the peripheral portion than in the central portion.

Abstract: Provided are an actinic-ray- or radiation-sensitive resin composition that excels in the sensitivity, roughness characteristics and exposure latitude, and a method of forming a pattern using the same. The composition includes (A) a resin that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer, and (B) a compound that when exposed to actinic rays or radiation, is decomposed to thereby generate an acid, the compound being any of compounds of general formula (1-1) below.

Abstract: There are provided an etching method and an etching apparatus suitable for etching an antireflection coating layer by using a resist film as a mask. The etching method includes forming the antireflection coating layer (Si-ARC layer) on an etching target layer; forming a patterned resist film (ArF resist film) on the antireflection coating layer; and forming a desired pattern on the antireflection coating layer by introducing an etching gas including a CF4 gas, a COS gas and an O2 gas into a processing chamber and etching the antireflection coating layer by the etching gas while using the resist film as a mask.

Abstract: Provided by the present invention is a method including: (1) forming a resist underlayer film on the upper face side of a substrate to be processed using a composition for forming a resist underlayer film, the composition containing (A) a compound having a group represented by the following formula (1); (2) forming a resist coating film by applying a resist composition on the resist underlayer film; (3) exposing the resist coating film by selectively irradiating the resist coating film with a radiation; (4) forming a resist pattern by developing the exposed resist coating film; and (5) forming a predetermined pattern on the substrate to be processed by sequentially dry etching the resist underlayer film and the substrate using the resist pattern as a mask.

Abstract: A conductive film is formed to extend from a bottom and a sidewall of a recess formed in an interlayer insulating film onto a top surface of the interlayer insulating film. Dry etching of the conductive film is performed such that a portion of the conductive film remains on the bottom and sidewall of the recess. The dry etching is also performed such that a deposition film is formed on a top portion of the recess.

Abstract: A method for making a three-dimensional nano-structure array includes following steps. First, a substrate is provided. Next, a mask is formed on the substrate. The mask is a monolayer nanosphere array or a film defining a number of holes arranged in an array. The mask is then tailored and simultaneously the substrate is etched by the mask. Lastly, the mask is removed.

Abstract: A method and system for forming dual damascene structures in a semiconductor package. In one embodiment, the method includes forming an intermediate dielectric layer on a bottom stop layer; forming an ashing removable dielectric layer on the intermediate dielectric layer; forming a patterned photoresist layer above the ashing removable dielectric layer in the semiconductor structure; and defining an in-situ hard mask in the ashing removable dielectric layer having an opening with a profile selected from the group consisting of a via, a trench, or a combination thereof. The profile of the in-situ mask preferably is capable of being transferred to the intermediate dielectric layer by etching.

Abstract: A method of producing a semiconductor element includes the steps of forming a wiring portion layer on a substrate; forming an interlayer insulation layer over the substrate and the wiring portion layer, in which a third insulation film, a second insulation film, and a first insulation film are laminated in this order from the substrate; forming a mask pattern on the first insulation film; removing a contact hole forming area of the first insulation film through a wet etching process; removing a contact hole forming area of the second insulation film through an etching process; removing a contact hole forming area of the third insulation film through an etching process; and a contact hole forming step of forming a contact hole in the interlayer insulation layer so that a surface of the wiring portion layer is exposed.

Abstract: A manufacturing method of a thin film transistor includes forming a pair of source/drain electrodes on a substrate, such that the source/drain electrodes define a gap therebetween; forming low resistance conductive thin films, which define a gap therebetween, on the source/drain electrodes; and forming an oxide semiconductor thin film layer on upper surface of the low resistance conductive thin films and in the gap defined between the low resistance conductive thin films so that the oxide semiconductor thin film layer functions as a channel. The low resistance conductive thin films and the oxide semiconductor thin film layer are etched so that side surfaces of the resistance conductive thin films and corresponding side surfaces of the oxide semiconductor thin film layer coincide with each other in a channel width direction of the channel. A gate electrode is mounted over the oxide semiconductor thin film layer.

Abstract: A shallow trench isolation (STI) structure and method for forming the same is provided that reduces defects in a nitride film used as a field oxide mask and variations in pad oxide thickness. Generally, the method involves depositing a nitride over pad oxide on a substrate using plasma enhanced chemical vapor deposition (PECVD), and patterning the PECVD nitride to form a field oxide mask. In certain embodiments, patterning the PECVD nitride involves: (i) forming a patterned resist layer on the PECVD nitride; (ii) etching in a process chamber at least one opening through at least the PECVD nitride; and (iii) stripping the patterned resist layer in-situ in the same process chamber in which the at least one opening was etched through the PECVD nitride using a fluorine based plasma. Other embodiments are also disclosed.

Abstract: Methods for etching a dielectric barrier layer with high selectivity to a dielectric bulk insulating layer are provided. In one embodiment, the method includes providing a substrate having a portion of a dielectric barrier layer exposed through a dielectric bulk insulating layer in a reactor, flowing a gas mixture containing H2 gas, fluorine containing gas, at least an insert gas into the reactor, and etching the exposed portion of the dielectric barrier layer selectively to the dielectric bulk insulating layer.

Abstract: A method of plasma immersion ion implantation of a workpiece having a photoresist mask on its top surface prevents photoresist failure from carbonization of the photoresist. The method includes performing successive ion implantation sub-steps, each of the ion implantation sub-steps having a time duration over which only a fractional top portion of the photoresist layer is damaged by ion implantation. After each one of the successive ion implantation sub-steps, the fractional top portion of the photoresist is removed while leaving the remaining portion of the photoresist layer in place by performing an ashing sub-step. The number of the successive ion implantation sub-steps is sufficient to reach a predetermined ion implantation dose in the workpiece.

Abstract: The invention relates to a method for routing a chamfered substrate, having applications in the field of electronics, optics, or optoelectronics, which involves depositing a layer of a protective material on a peripheral annular zone of the substrate preferably with the aid of a plasma, partially etching the protective material with the aid of a plasma, so as to preserve a protective ring of the deposited material on the front face of the substrate, this ring located at a distance from the edge of the substrate, so as to delimit an accessible peripheral annular zone, etching a thickness of the material constituting the substrate to be routed, preferably with the aid of a plasma that is level with the accessible peripheral annular zone of the substrate, and removing the ring of protective material preferably with the aid of a plasma.

Abstract: Methods are provided for processing a substrate comprising a bilayer barrier film thereon. In one aspect, a method comprises depositing a first barrier layer, depositing a second barrier layer on the first barrier layer, depositing a dielectric layer on the bilayer barrier film formed by the first barrier layer and the second barrier layer, and ultraviolet curing the dielectric layer. In another aspect, a method comprises depositing a first barrier layer, depositing a second barrier layer on the first barrier layer, depositing a dielectric layer on the bilayer barrier film formed by the first barrier layer and the second barrier layer, and curing the dielectric layer with an electron beam treatment.

Abstract: When an interconnect structure is built on porous ultra low k (ULK) material, the bottom of the trench and/or via is usually damaged by a following metallization process which may be suitable for dense higher dielectric materials. Embodiment of the present invention may provide a method of forming an interconnect structure on an inter-layer dielectric (ILD) material. The method includes steps of treating an exposed area of said ILD material to create a densified area, and metallizing said densified area.

Abstract: Provision of a process capable of preferably etching particularly PtMn used for a pin layer of an MRAM is an object: a dry etching method for performing dry etching on a layer including platinum and/or manganese by using pulse plasma and a production method of an MRAM, wherein the dry etching method is applied to processing of the pin layer. The MRAM is configured to have a memory portion comprising a magnetic memory element composed of tunnel magnetoresistive effect element formed by stacking a magnetic fixed layer having a fixed magnetization direction, a tunnel barrier layer and a magnetic layer capable of changing the magnetization direction.

Abstract: Method for manufacturing a semiconductor device including a semiconductor substrate, an element formed on the substrate, and an insulating film formed on the element, includes: (a) forming a first conductive layer (b) forming a first insulating film on the upper portion of the first conductive layer; (c) forming a second insulating film with a porous structure on the first insulating film; (d) forming a third insulating film different from the second insulating film on the second insulating film; (e) forming a via hole in the second and third insulating film by dry etching of the third insulating films; (f) removing a part of the first insulating film such that the surface of the first conductive layer is exposed at the bottom of the via hole and (g) forming a second conductive material film layer so as to fill the via hole.

Abstract: A method that includes forming a gate of a semiconductor device on a substrate, and etching sidewall spacers on sides of the gate to provide a proximity value, where the proximity value is defined as a distance between the gate and an edge of a performance-enhancing region. The sidewall spacers are used to define the edge of the region during formation of the region in the substrate. The method also includes pre-cleaning the gate and the substrate in preparation for formation of the region, where the etching and the pre-cleaning are performed in a continuous vacuum.

Abstract: A method of manufacturing a solid state imaging device having photoelectric conversion devices, the method including: 1) forming a plurality of color filters differing in color from each other, 2) forming a transparent resin layer on the color filters, 3) forming an etching control layer on the transparent resin layer, the etching control layer being enabled to be etched at a different etching rate from the etching rate of the transparent resin layer, 4) forming a lens master on the etching control layer by using a heat-flowable resin material, 5) transferring a pattern of the lens master to the etching control layer by dry etching to form an intermediate micro lens, and 6) transferring a pattern of the intermediate micro lens to the transparent resin layer by dry etching to form the transfer lenses.

Abstract: A method of forming an intermediate semiconductor device is disclosed that comprises providing a semiconductor substrate, forming a photoresist layer on the semiconductor substrate, implanting a dopant into the semiconductor substrate, and removing a dopant-containing layer from the photoresist layer. The dopant-containing layer includes dopant residuals and a carbon-rich crust and may be formed during implantation. The dopant-containing layer may be removed from the photoresist layer by exposing the dopant-containing layer to a water rinse, a chlorinated plasma or to a fluorinated plasma. The water rinse may include deionized water that is maintained at a temperature that ranges from approximately 25° C. to approximately 80° C. The fluorinated plasma may be formed from a gaseous precursor selected from the group consisting of nitrogen trifluoride, carbon tetrafluoride, trifluoromethane, hexafluoroethane, sulfur hexafluoride, and mixtures thereof.

Abstract: In a process for the manufacture of a semiconductor integrated circuit device having an inlaid interconnect structure by embedding a conductor film in a recess, such as a trench or hole, formed in an organic insulating film which constitutes an interlevel dielectric film and includes an organosiloxane as a main component, the recess, such as a trench or hole, is formed by subjecting the organic insulating film to plasma dry etching in a CF-based gas/N2/Ar gas in order to suppress the formation of an abnormal shape on the bottom of the recess, upon formation of a photoresist film over the organic insulating film, followed by formation of the recess therein with the photoresist film as an etching mask.

Abstract: A method for forming a pattern, comprises: forming a bank film on a substrate; performing a lyophobic treatment on a surface of the bank film; patterning the bank film on which the lyophobic treatment has been performed to form a bank; performing a surface modification treatment in which a hydroxyl group on a surface of a pattern forming region partitioned by the bank is alkylated; disposing a functional liquid in the pattern forming region; and firing the functional liquid to form a pattern.

Abstract: Methods for removing photoresist from semiconductor structures are provided. In an exemplary embodiment, a method for removing photoresist from a semiconductor structure having a high-k dielectric material layer overlying a substrate comprises depositing a photoresist overlying the high-k dielectric material layer and patterning the photoresist. The temperature of the substrate is adjusted to a temperature of no less than about 400° C. and hydrogen gas is excited to form a hydrogen plasma of excited H and H2 species. The photoresist is subjected to the excited H and H2 species from the hydrogen plasma.

Abstract: An optical critical dimension measuring method, applicable in measuring a pattern, that includes a plurality of polysilicon layers, of a device, is provided. The method includes obtaining a real curve corresponding to the to-be-measured device. Then, determining whether an ion implantation process has been performed on the polysilicon layers, a different module is selected. A correlation process is performed according to the selected module to generate a theoretical curve that correlates with the real curve to obtain a plurality of parameters corresponding to the theoretical curve.