Abstract: An integrated assembly includes a resistor and a heat spreader. The resistor includes a resistive element and terminals. The heat spreader is integrated with the resistor and includes a heat sink of thermally conducting and electrically insulating material and terminations of a thermally conducting material and situated at an edge of the heat sink. At least a portion of a top surface of the resistive element is in thermally conductive contact with the heat sink. Each resistor terminal is in thermally conductive contact with a corresponding termination of the heat sink. A method of fabricating an integrated assembly of a resistor and a heat spreader includes forming the heat spreader, forming the resistor, and joining the heat spreader to the resistor by bonding at least a portion of a top surface of the resistive element to the heat sink and bonding each electrically conducting terminal to a corresponding termination.

Abstract: [Object] A method for efficiently manufacturing chip resistors is provided. [Means] The method includes the steps of preparing at least three conductive elongated boards 711 made of an electrically conductive material and a resistive member 702 made of a resistive material, arranging the at least three conductive elongated boards 711 apart from each other along a width direction crossing a longitudinal direction in which one of the at least three conductive elongated boards 711 is elongated, forming a resistor aggregate 703 by bonding the resistive member 702 to the at least three conductive elongated boards 711, and collectively dividing the resistor aggregate 703 into a plurality of chip resistors by punching so that each of the chip resistors includes two electrodes and a resistor portion bonded to the two electrodes.

Abstract: A resistor includes a substantially cylindrical resistive element having a resistance of less than about 1 m?, a substantially cylindrical first termination electrically connected to the resistive element and a second termination electrically connected to the resistive element. The substantially cylindrical first termination is hollow to allow for accepting a connection such as from a battery cable. In addition there may be sense leads present on the resistor. A method of forming a substantially cylindrical resistor includes forming a hollow cylindrical resistor body by rolling a flat sheet comprising a resistive element and a first termination and a second termination joined on opposite ends of the resistive element.

Abstract: Provided is a shunt resistor, which controls an influence of skin effect by high frequency current. The shunt resistor has a rod-shaped resistance body (11), and a pair of main electrode (12), of another material from the resistance body, wherein end faces of the resistance body and the main electrode are bonded. The resistance body (11) has a hole (11a) going through in direction where main electrodes are disposed, or a high resistance part (11b) going through at its axis portion that is highly resistive than outer part, and low resistance part (11c) that is formed in outer of the high resistance part. It is preferable that outer circumference of the resistance body is circle-shaped. Since, current doesn't flow fundamentally in the through hole or the high resistance part, fluctuation band in the current pathway can be reduced. Therefore, change of resistance value by skin effect by high-frequency current can be reduced.

Abstract: A heating apparatus for electric blankets/carpets comprising: a heating element; an adhesive tape material integrally combined and wrapping the heating element; a metal conductor connected to two opposing ends of each of the heating element and the adhesive tape material in a series-parallel manner; and a lead connecting the metal conductor and a power source terminal, wherein a space is defined between the adjacent heating elements. The present invention provides a manufacturing method of a heating apparatus for electric blankets/carpets, comprising the steps of: (a) using a heating element; (b) causing an adhesive tape material to be integrally combined and to wrap the heating element therein; (c) causing a metal conductor to connect to two opposing ends of each of the heating element and the adhesive tape material in a series-parallel manner; and (d) causing a lead to connect the metal conductor and a power source terminal.

Abstract: A chip resistor device includes an insulating substrate, two indented patterns, and a resistor unit. The insulating substrate has opposite first and second surfaces. The first surface has two opposite edges and two electrode forming regions adjacent to the two opposite edges, respectively. The indented patterns are respectively formed in the electrode forming regions of the first surface and indented from the first surface. The resistor unit includes two contact electrodes respectively formed on the electrode forming regions of the first surface and filled into the indented patterns, and a resistor formed on the first surface between the two contact electrodes and electrically contacting the contact electrodes.

Abstract: There are provided a chip resistor and a method of manufacturing the same. The chip resistor includes a ceramic substrate; an adhesion portion formed on a surface of the ceramic substrate; and a resistor formed on the adhesion portion, wherein the adhesion portion includes at least one of copper (Cu), nickel (Ni), and copper-nickel (Cu—Ni).

Abstract: A simplified and less costly manufacture process of a print head can be effective in preventing the peeling-off between a substrate and a flow passage forming member. In the print head, a protective layer is formed between the flow passage forming member and a heat generating portion. The protective layer contains a noble metal. On a side of the flow passage forming member, the surface of the protective layer is made of an oxide of a noble metal, except in a portion corresponding to the heat generating portion, while in the portion corresponding to the heat generating portion on the flow passage forming member side, the surface thereof is made of the noble metal.

Abstract: A resistor for suppressing magnetizing inrush current includes a container made of an insulating material and at least one resistive element housed in the container, the resistive element being connected to two bushings provided at the container, the outer surface of the container being coated with a conductive paint, and the paint being connected to the ground, thereby being able to be located between a cable and a switch, and being able to fix the outer surface thereof to a ground voltage level so that human contact safety is not impaired.

Abstract: An electrostatic discharge (ESD) protector includes a first high heat-conductive substrate, a second high heat-conductive substrate, a varistor layer, and a plurality of via-hole electrodes. The first high heat-conductive substrate is provided with a plurality of first through-holes. The second high heat-conductive substrate is provided with a plurality of second through-holes. The varistor layer that is mainly composed of zinc oxide is disposed between the first high heat-conductive substrate and the second high heat-conductive substrate. The varistor layer includes internal electrodes. Each of via-hole electrodes penetrates the varistor layer and fills both one of the first through-holes and one of the second through-holes to couple both the ones to each other.

Abstract: An electrostatic lens includes a first electrode and a second electrode that are arranged oppositely relative to each other with a gap separating them from each other and the first and second electrodes have respective through-holes for allowing a charged particle beam to pass through the through-hole, wherein at least either the first electrode or the second electrode comprises two or more regions; and the through-hole of the electrode with the two or more regions is arranged at least in one of the regions; while the regions are electrically connected to each other by way of a resistor.

Abstract: An object of the disclosure is to provide a chip resistor without causing the disconnection in atmosphere of sulfidizing gas and without precipitating silver sulfide on its surface. The chip resistor of the present disclosure includes a resistor layer disposed on a top surface of a substrate; a first upper electrode layer disposed at both sides of the resistor layer and being electrically connected to the resistor layer; and a second upper electrode layer disposed on the first upper electrode layer and including between 75% by weight and 85% by weight (inclusive) of silver particles with an average particle diameter ranging from 0.3 ?m to 2 ?m, between 1% by weight and 10% by weight (inclusive) of carbon, and a resin.

Abstract: A fabrication method of an alloy resistor includes: providing an alloy sheet having a plurality of openings spacing apart from each other and going through the alloy sheet and a plurality of alloy resistor units located between any two adjacent openings, wherein each of the alloy resistor units has an insulating cover area and a plurality of electrode ends on both sides of the insulating cover area; forming an insulating layer on a surface of the insulating cover area of the alloy resistor units by an electrodeposition coating process; cutting the alloy along a connecting portion, so as to obtain separated alloy resistor units; and forming a conductive adhesion material on the electrode ends of the alloy resistor units. An alloy resistor having an insulating layer with a smooth surface can be obtained by performing an electrodeposition coating process.

Abstract: The object of the invention is to provide a method and an apparatus that allow production of metal plate chip resistors having a relatively low resistance with high accuracy and yield through simple process. The object is achieved by apparatus 10 for manufacturing metal plate chip resistors including cutting mold 21 for cutting intermediate product strip 14 transversely to obtain worked product chip 16a, ohm meter 22 for measuring the resistance of the worked product chip 16a, control device 23 having a calculating part for performing a calculation using the resistance measured by the ohm meter 22 to work out a width in which the strip 14 is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjusting means 26, 27 for making an adjustment so that the strip 14 is to be cut transversely in the width obtained from the calculating part.

Abstract: A surface-mount type over-current protection element includes two single-layer composite chips, wherein one chip is made of a first core material and a first and a second metallic foil layer attached on the two surfaces of the first core material, the other chip is made of a second core material and a third and a fourth metallic foil layer attached to the two surfaces of the second core material. The protection element also has an insulating layer arranged between the two chips to electrically insulate and bond to the second and third metallic layers to form a bi-layer composite chip. Part of the first metallic foil layer and the corresponding part of the fourth metallic foil layer are etched to expose part of the first core material and correspond part of the second core material. One or more through-holes are made on the bi-layer composite chip for mounting.

Abstract: The present disclosure relates to a thin film resistor that is formed on a substrate along with other semiconductor devices to form all or part of an electronic circuit. The thin film resistor includes a resistor segment that is formed over the substrate and a protective cap that is formed over the resistor segment. The protective cap is provided to keep at least a portion of the resistor segment from oxidizing during fabrication of the thin film resistor and other components that are provided on the semiconductor substrate. As such, no oxide layer is formed between the resistor segment and the protective cap. Contacts for the thin film resistor may be provided at various locations on the protective cap, and as such, are not provided solely over a portion of the resistor segment that is covered with an oxide layer.

Abstract: A resistance component includes a stack of ceramic layers and inner electrodes. Inner electrodes of a first type are electrically conductively connected to a first external contact and inner electrodes of a second type are electrically conductively connected to a second external contact. The inner electrodes of the first type are arranged such that there is no overlap with the inner electrodes of the second type. An inner electrode of a third type, which is electrically conductively connected neither to the first external contact nor to the second external contact, at least partially overlaps the inner electrodes of the first type and the inner electrodes of the second type.

Abstract: A method of manufacturing a chip resistor includes forming a resistor assembly in which a conductive member including portions separated from each other in a first direction is provided in a resistance body member; and dividing the resistor assembly into chip resistors, each including a chip-shaped resistance body formed by a part of the resistance body member, a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction, and a pair of sub-electrodes formed by a part of the conductive member, separated from each other in the first direction, and adjacent to the main electrodes in a second direction perpendicular to the first direction with concave portions recessed in the first direction interposed therebetween, by punching.

Abstract: There is provided a method of producing a printed circuit board incorporating a resistance element capable of adjusting resistance after the resistance element has been formed and assuring a high accurate resistance. A method of producing a printed circuit board incorporating a resistance element using carbon paste includes the steps of: forming through holes 5, 6, 25 and 26 or a bottomed hole in a double-sided copper clad laminate; applying noble metal plating into the through hole or the bottomed hole; filling the through hole or the bottomed hole with carbon paste; subjecting the carbon paste with which the thorough hole or the bottomed hole is filled to noble metal plating, conducting treatment and plating to form a conductive layer; forming an opening 18 in the conductive layer on the end of the through hole filled with the carbon paste; and performing trimming through the opening to adjust the resistance of the resistor formed by the carbon paste.

Abstract: A varistor is provided with a varistor element body, a plurality of internal electrodes arranged in the varistor element body so as to sandwich a partial region of the varistor element body between them, and a plurality of external electrodes arranged on the surface of the varistor element body and connected to the corresponding internal electrodes. The external electrode has a sintered electrode layer formed by attaching an electroconductive paste containing an alkali metal to the surface of the varistor element body and sintering it. The varistor element body has a high-resistance region formed by diffusing the alkali metal in the electroconductive paste into the varistor element body from an interface between the surface of the varistor element body and the sintered electrode layer.

Abstract: Provided is a shunt resistor which has an excellent accuracy of current detection and a small temperature drift as well as a compact structure, and improves the operability. The shunt resistor is provided with a resistance body (11), a pair of main electrodes (12, 12) separated from the resistance body, and a pair of voltage detection electrodes (13, 13) separated from the main electrodes. The voltage detection electrodes (13) are provided and fixed between the resistance body (11) and the main electrodes (12). The voltage detection electrode (13) is provided with a detection terminal (13a) to be connected to a terminal of a voltage detection circuit. The resistance body (11) has a columnar shape. The voltage detection electrode (13) and main electrode (12) are fixed to both end faces of the resistance body (11) in the length direction, so that they are opposing each other. The components are bonded by diffusion boding, friction bonding, wax bonding, etc., after abutting the bonding surfaces with each other.

Abstract: There is provided a chip resistor including a ceramic substrate; a first resistance layer formed on the ceramic substrate and including a first conductive metal and a first glass; and a second resistance layer formed on the first resistance layer, including a second conductive metal and a second glass, and having a smaller content of glass than the first resistance layer, thereby obtaining relatively low resistance and a relatively small temperature coefficient of resistance (TCR).

Abstract: A method of manufacturing a heat-generating panel 100 having a configuration in which an electrically-conductive thin layer 120 is provided on at least one surface of a translucent plate 110 and the electrically-conductive thin layer 120 is caused to generate heat by supplying electric power to the same.

Abstract: Apparatus and methods of trimming resistors are disclosed. In one embodiment, a method of controlling the PCR of a thin film resistor is provided. The method includes applying a first current to a resistor so as to alter a property of the resistor, and measuring the property of the resistor. Applying the first current and measuring the property of the resistor can be repeated until the PCR of the resistor is within an acceptable tolerance of a desired value for the property of the resistor.

Abstract: A method of manufacturing a chip resistor includes the following steps. A resistor layer is formed on an obverse surface of a material substrate. A plurality of substrate sections are defined in the material substrate by forming, in the obverse surface of the material substrate, a plurality of first grooves each of which is elongated in a first direction. A conductor layer is formed in each of the first grooves. The substrate sections are cut along lines extending in a second direction different from the first direction.

Abstract: To provide manufacturing method for resistor that uses metal plate as resistance body, which can obtain desired accurate resistance value without trimming resistance body even if product becomes small. The method comprises; in method for manufacturing an unit resistor that has a pair of electrodes separated by insulation film, from resistor material that is provided with a metal plate consisting of resistance material, an insulation film pattern formed on the metal plate, and an electrode region formed besides area where insulation film pattern has been formed, by piercing predetermined piercing area, wherein length E of insulation film pattern is longer than width w of piercing area, wherein width L of insulation film pattern extends or narrows along direction of length E of insulation film pattern, and wherein position X of piercing area is adjusted in extent and in direction of length E of insulation film pattern.

Abstract: An embodiment of a resistor formed by at least one first portion and one second portion, electrically coupled to one another and with different crystalline phases. The first portion has a positive temperature coefficient, and the second portion has a negative temperature coefficient. The first portion has a first resistivity, and the second portion has a second resistivity, and the portions are coupled so that the resistor has an overall temperature coefficient that is approximately zero.

Abstract: An over-current protection device includes a conductive composite having a first crystalline fluorinated polymer, a plurality of particulates, a conductive filler, and a non-conductive filler, wherein the plurality of particulates include a second crystalline fluorinated polymer. The first crystalline fluorinated polymer has a crystalline melting temperature of between 150 and 190 degrees Celsius. The plurality of particulates including the second crystalline fluorinated polymer are disposed in the conductive composite, having a crystalline melting temperature of between 320 and 390 degrees Celsius and having a particulate diameter of from 1 to 50 micrometers. The conductive filler and the non-conductive filler are dispersed in the conductive composite.

Abstract: A method for manufacturing terminals for electric resistors consists in preparing a piece of substantially pure copper; reducing the thickness, by cold pressing, of the piece so as to obtain from it at least one thick part and one thin part designed to form the tip of an electrical terminal to be obtained; obtaining, by rolling, a groove which is central to the thick part; and tapering, by rolling, the thin portion.

Abstract: Methods and apparatuses for detecting radial flows of conductive fluid are provided. In an embodiment of the present invention, shields are used to prevent or reduce circulating electrical currents from causing a voltage difference that would adversely affect the measured voltage difference between two adjacent electrodes. The shields may be a conduit through which conductive fluid may flow. Groups of sensors, e.g., two or more, may be placed within the shield. The shields may have any cross-section shape. Generally, once the circulating electrical current flow between the electrode pairs is substantially reduced or eliminated, only the voltage difference from the localized induced electric field remains. This way, a true induced voltage may be measured, and thus an accurate value for the fluid velocity may be determined.

Abstract: There are provided a resistor and a method of fabricating the same. The resistor includes: a substrate; a lower resistant material layer formed on the upper portion of the substrate; an insulating layer to be stacked on the upper portion of the lower resistant material layer; an upper resistant material layer to be stacked on the upper portion of the insulating layer; and two penetration parts vertically penetrating through the insulating layer, wherein the penetration part is filled with a resistant material having the same component as that of the lower resistant material layer and the upper resistant material layer to electrically connect the upper resistant material layer to the lower resistant material layer.

Abstract: The present invention relates to a polysilicon resistor, a reference voltage circuit including the same, and a method for manufacturing the polysilicon resistor. The polysilicon resistor according includes a first polysilicon resistor and at least one of second polysilicon resistors, coupled to the first polysilicon resistor in series. The first polysilicon resistor and the at least one of the second polysilicon resistors are P-type polysilicon, and a doping concentration of the first polysilicon resistor is different from a doping concentration of the at least one of the second polysilicon resistors. The polysilicon resistor formed by serially coupling the first polysilicon resistor and the at least one of the second polysilicon resistors is applied with a constant current such that a reference voltage or a constant voltage is generated.

Abstract: A positive temperature coefficient (PTC) superimposed impedance polymeric (SIP) compound including an electrically insulating matrix essentially consisting of a siloxane polymer in addition to first and second electrically conductive particles having different properties with respect to surface energies and electrical conductivities. A multi-layered, ZPZ, foil including a PTC SIP compound of the invention present between two metal foils, thereby forming a conductive composite body. A multi-layered device, including an essentially flat composite body made up from a PTC SIP compound according to the invention, two electrode layers adhering to the surfaces of the composite body, the electrode layers being metal foils prepared to connect to electrodes.

Abstract: A surface-mount type over-current protection element includes two single-layer composite chips, wherein one chip is made of a first core material and a first and a second metallic foil layer attached on the two surfaces of the first core material, the other chip is made of a second core material and a third and a fourth metallic foil layer attached to the two surfaces of the second core material. The protection element also has an insulating layer arranged between the two chips to electrically insulate and bond to the second and third metallic layers to form a bi-layer composite chip. Part of the first metallic foil layer and the corresponding part of the fourth metallic foil layer are etched to expose part of the first core material and correspond part of the second core material. One or more through-holes are made on the bi-layer composite chip for mounting.

Abstract: A polymer film 102 is formed on a substrate 101, a thermistor resistor 106 is formed on the polymer film 102, and a light reflecting film 104 is formed between the thermistor resistor 106 and the substrate 101. For this reason, if infrared rays or terahertz waves are incident from above, a part is absorbed by the thermistor resistor 106, and most transmits the polymer film 102 and is reflected by the light reflecting film 104. When the distance between the thermistor resistor 106 and the light reflecting film 104 is d, a light component having a wavelength expressed by d=l/4 and equal to or smaller than l resonates and changes to heat, and the temperature of the thermistor resistor 106 rises. A change in resistance with a rise in the temperature of the thermistor resistor 106 is detected, thereby detecting the intensity of an infrared ray or a terahertz wave.

Abstract: A dielectric component with electrical connection is provided for a laminated heater mat (3) for an ice protection system for an aircraft (1). The dielectric component with electrical connection comprises at least one dielectric layer (50, 55) comprising thermoplastic material, and the dielectric layer (50) or a stack of the dielectric layers (50, 55) has first and second main surfaces and a hole (505) extending between the first and second main surfaces. A first sprayed metal coating (501) comprises a first portion (503) deposited on the first main surface (502) adjacent to the hole (505) and a second portion (5014) which projects into the hole. A second sprayed metal coating (5013, 5513) comprises a third portion deposited on the second main surface (506, 552) adjacent to the hole (505) and a fourth portion (5015) which projects into the hole (505). The second portion (5014) overlaps the fourth portion (5015) to form a continuous conductive path between the first main surface and the second main surface.

Abstract: A metal strip resistor is provided. The metal strip resistor includes a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating on each of the first and second opposite terminations. There is also an insulating material overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided. The method includes coating an insulative material to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the conductive pattern, and adjusting resistance of the metal strip.

Abstract: The present invention provides a low-resistance carbon grounding module and a method for manufacturing the same, which can increase strength for durability against external environmental changes by varying the type and mixing ratio of raw materials for a carbon resistor without using any heat source. The low-resistance carbon grounding module comprises a carbon resistor extending in the longitudinal direction thereof and a conductive core bar installed in the center of the transverse section of the carbon resistor, wherein the carbon resistor comprises graphite, cement, and feldspar. Thus, it is possible to prevent the durability from being deteriorated due to external environmental changes, water, or electrical resistance, thus improving the quality and reliability of the product while minimizing the production of CO2.

Abstract: A current sense resistor and a method of manufacturing a current sensing resistor with temperature coefficient of resistance (TCR) compensation are disclosed. The resistor has a resistive strip disposed between two conductive strips. A pair of main terminals and a pair of voltage sense terminals are formed in the conductive strips. A pair of rough TCR calibration slots is located between the main terminals and the voltage sense terminals, each of the rough TCR calibration slots have a depth selected to obtain a negative starting TCR value observed at the voltage sense terminals. A fine TCR calibration slot is formed between the pair of voltage sense terminals.

Abstract: A resistive heating element 30 has a higher molybdenum carbide content in a central portion 35 than in a peripheral portion 34. Since molybdenum carbides have a low temperature coefficient of resistance compared to molybdenum, the amount of heat generated in the central portion 35 of the resistive heating element 30 does not increase as much as in the peripheral portion 34 even when the temperature is increased, and the increase in difference in temperature between the peripheral portion 34 and the central portion 35 can be suppressed. In other words, generation of hot spots near the center can be suppressed and a good uniform heating property in a wide range of operation temperatures can be obtained.

Abstract: There are provided a process for manufacturing a PTC device as well as a PTC device manufactured by such process wherein a resin coating for preventing the oxidation can be easily formed. The PTC device includes (A) a polymer PTC component (14) comprising: (a1) an electrically conductive filler, and (a2) a polymer material wherein the polymer PTC component is defined by opposite main surfaces and a side surface connecting outer peripheries of these main surfaces, and (B) layered metal electrodes (12, 22) placed on the main surfaces on both sides of the polymer PTC component. The PTC device has a support member (20) extending outward from a periphery of at least one of the main surfaces, and the side surface of the polymer PTC component is sealed from an ambient environment around the PTC device by a cured curable resin (24) disposed and supported on the support member.

Abstract: A higher precision resistive element suppresses variation of the resistance value due to variation of film thickness. A resistive element includes a first portion having a first film thickness and a first width, and a second portion having the first film thickness and a second width determined by the first width. The sum of the first and second widths is constant. The first portion has an upper surface at a position at which a height from the bottom surface of the resistive element first portion is a first height. The resistive element second portion has an upper surface of the resistive element second portion at a position at which a height from a surface including the bottom surface of the resistive element first portion is the first height. The resistive element first portion and the resistive element second portion are coupled to each other via a coupling portion.

Abstract: A method of forming a buried resistor within a cavity for use in electronic packages using two glass impregnated dielectric layers, one with a clearance hole, the second with a resistor core, the clearance hole being placed over the resistor core and the assembly fusion bonded. The space remaining around the resistor core is filled with a soldermask material and the assembly is coated with metal. Thru-holes are drilled, cleaned, and plated and then the metal coating is etched and partially removed. The soldermask is then removed and a layer of gold plating is applied to the exposed metal surfaces. The use of glass impregnated dielectric layers and fusion bonding eliminates the fluorinated ethylene propylene resin (FEP) bleed problem associated with previous buried resistor cavity assemblies.

Abstract: A chip resistor device includes: a dielectric substrate that has top and bottom surfaces and two opposite edge faces interconnecting the top and bottom surfaces; two electrodes that are formed on two opposite sides of the dielectric substrate and that cover the edge faces and parts of the top and bottom surfaces; a resistor layer that is formed on one of the top and bottom surfaces of the dielectric substrate between the electrodes and that is brought into contact with the electrodes; and a heat conductive layer that is disposed on the resistor layer oppositely of the dielectric substrate and between the electrodes, that contacts the resistor layer and the two electrodes, and that has a higher resistance than that of the resistor layer. A method for making the chip resistor device is also disclosed.

Abstract: Provided is a shunt resistor which has an excellent accuracy of current detection and a small temperature drift as well as a compact structure, and improves the operability. The shunt resistor is provided with a resistance body (11), a pair of main electrodes (12, 12) separated from the resistance body, and a pair of voltage detection electrodes (13, 13) separated from the main electrodes. The voltage detection electrodes (13) are provided and fixed between the resistance body (11) and the main electrodes (12). The voltage detection electrode (13) is provided with a detection terminal (13a) to be connected to a terminal of a voltage detection circuit. The resistance body (11) has a columnar shape. The voltage detection electrode (13) and main electrode (12) are fixed to both end faces of the resistance body (11) in the length direction, so that they are opposing each other. The components are bonded by diffusion boding, friction bonding, wax bonding, etc., after abutting the bonding surfaces with each other.

Abstract: To provide manufacturing method for resistor that uses metal plate as resistance body, which can obtain desired accurate resistance value without trimming resistance body even if product becomes small. The method comprises; in method for manufacturing an unit resistor that has a pair of electrodes separated by insulation film, from resistor material that is provided with a metal plate consisting of resistance material, an insulation film pattern formed on the metal plate, and an electrode region formed besides area where insulation film pattern has been formed, by piercing predetermined piercing area, wherein length E of insulation film pattern is longer than width w of piercing area, wherein width L of insulation film pattern extends or narrows along direction of length E of insulation film pattern, and wherein position X of piercing area is adjusted in extent and in direction of length E of insulation film pattern.

Abstract: The method and system of high-resistance, multiple-conductor flat cables which contain integral tunable resistance sections suitable for fine tuning the resistance of a conductor to match the resistance of the conductors to one another within a specified target value. The method involves the design and creation of the high-resistance, multiple-conductor flat cables and the tuning of the resistance of the conductor.

Abstract: A high-temperature sensor element includes at least one thermistor element having at least two contact areas and one contacting element including an isolating ceramic base body and at least two conductor lines. The contact areas of the thermistor element are connected to the conductor lines of the contacting element by an electro conductive bridge. A process for assembling a sensor element is also described in which an thermistor element is connected by a temperature resistant junction to a contacting element, and in which the thermistor element and part of the contacting element adjacent to the thermistor element are sealed by a encapsulation compound.

Abstract: An article is provided that includes a plurality of layers. Each layer includes a sinterable mass having a sinter temperature that is less than about 1000 degrees Celsius, and an inner electrode proximate to the sinterable mass. The inner electrode includes a material having a melting point that is within a determined temperature range of about 10 degrees Celsius to about 200 degrees Celsius relative to the sintering temperature. A method to make the article is also provided.

Abstract: A chip varistor is provided with a varistor section, a plurality of electroconductive sections, and a plurality of terminal electrodes. The varistor section is comprised of a sintered body containing ZnO as a major component and exhibits the nonlinear voltage-current characteristics. The plurality of electroconductive sections are arranged on both sides of the varistor section and each electroconductive section has a first principal surface connected to the varistor section and a second principal surface opposed to the first principal surface. The terminal electrodes are connected to the respective second principal surfaces of the electroconductive sections.