Abstract: An article is provided that includes a plurality of layers. Each layer includes a sinterable mass having a sinter temperature that is less than about 1000 degrees Celsius, and an inner electrode proximate to the sinterable mass. The inner electrode includes a material having a melting point that is within a determined temperature range of about 10 degrees Celsius to about 200 degrees Celsius relative to the sintering temperature. A method to make the article is also provided.

Abstract: An ablating device is used to form a pattern into a sensing element pad of a soot sensor, with the pattern establishing two finger paths without electrical connection between them. The pattern can be formed through a protective layer on the sensing element pad before the sensing element pad is fired.

Abstract: The invention relates to a magnetoresistive device formed to sense an externally applied magnetic field, and a related method. The magnetoresistive device includes a magnetoresistive stripe formed over an underlying, metallic layer that is patterned to produce electrically isolated conductive regions over a substrate, such as a silicon substrate. An insulating layer separates the patterned metallic layer from the magnetoresistive stripe. A plurality of conductive vias is formed to couple the isolated regions of the metallic layer to the magnetoresistive stripe. The conductive vias form local short circuits between the magnetoresistive stripe and the isolated regions of the metallic layer to alter the uniformity of a current flow therein, thereby improving the position and angular sensing accuracy of the magnetoresistive device.

Abstract: An article of manufacture having an in-molded resistive and/or shielding element and method of making the same are shown and described. In one disclosed method, a resistive and/or shielding element is printed on a film. The film is formed to a desired shape and put in an injection mold. A molten plastic material is introduced into the injection mold to form a rigid structure that retains the film.

Abstract: A varistor including a varistor body with two parallel end faces made of a material that contains one or more metal oxides, and at least one electrode made of an electrically conductive electrode material arranged on any of the end faces of the varistor body. The electrode includes a layer of electrode material coated on the end face by means of an ion- or atom-transferring method, whereby the layer has a thickness within the interval of from 5 micrometers to 30 micro-meters.

Abstract: Disclosed herein is a manufacturing method of a planar resistance heating element and a planar resistance heating element made using the method. In the manufacturing method of a planar resistance heating element by etching an aluminum foil deposited on an insulating substrate in a desired pattern, printing carbon paste and connecting current input terminals in parallel, the aluminum foil is adapted to undergo a multiple step tempering process to thereby prevent heat deformation. The carbon paste acting as a resistor element is made of electrically conductive carbon, graphite, a resin, a solvent and a hardener which are mixed so as to optimize physical properties of the carbon paste. As a result, prevention of heat deformation of the insulating substrate, uniform heat conductivity, excellent heat-generation effect and easy manufacture may be achieved.

Abstract: Provided is a variable resistance element capable of performing a stable resistance switching operation and having a favorable resistance value retention characteristics, comprising a variable resistor 2 sandwiched between a upper electrode 1 and lower electrode 3 and formed of titanium oxide or titanium oxynitride having a crystal grain diameter of 30 nm or less. When the variable resistance 2 is formed under the substrate temperature of 150° C. to 500° C., an anatase-type crystal having a crystal grain diameter of 30 nm or less is formed. Since the crystalline state of the variable resistor changes by applying a voltage pulse and the resistance value changes, no forming process is required. Moreover, it is possible to perform a stable resistance switching operation and obtain an excellent effect that the resistance fluctuation is small even if the switching is repeated, or the variable resistance element is stored for a long time under a high temperature.

Abstract: Provided are a variable resistive element having a configuration that the area of an electrically contributing region in a variable resistor body is smaller than the area defined by an upper electrode or a lower electrode, and a method for manufacturing the variable resistive element. The cross section of a current path, in which an electric current flows through between the two electrodes via the variable resistor body at the time of applying the voltage pulse to between the two electrodes, is formed with a line width of narrower than that of any of the two electrodes and of smaller than a minimum work dimension regarding manufacturing processes, so that its area can be made smaller than that of the electrically contributing region in the variable resistive element of the prior art.

Abstract: An electrically heated, multi-layered article of apparel that is heated by a novel, silver-coated, flexible, battery-powered heating harness that is disposed between the layers of the article.

Abstract: The invention relates to a surge arrester having a cage design, and to a method for its production. According to the invention, during extrusion-coating or encapsulation of a module comprising two end fittings (3) and a plurality of varistor blocks (1) and at least one reinforcing element (9) in order to form the outer housing (5), first through-holes (11) for the reinforcing element (9) thereof are sealed with silicone. For this purpose, second through-holes (15) are provided in the end fittings (3), through which the silicone runs during casting or spraying, and enters the through-holes (11) from the outside, in order in this way to seal them against water and moisture.

Abstract: Example embodiments provide a micro-heater including, a substrate, at least one heating element unit provided on the substrate, the at least one heating element unit having a configuration to allow two or more heating element units to be repeatedly connected in series, and a support structure between the substrate and the at least one heating element unit to support the at least one heating element unit at a lower part of the at least one heating element unit.

Abstract: A chip resistor and method for fabricating the same are disclosed according to the present invention, wherein a thermo-conductive adhesive bonding layer is applied to bond together in face-to-face orientation a substrate with a fixed resistor, and a passivation layer is applied to partially cover the fixed resistor, such that it divides the surface of the fixed resistor into a central covered region and two uncovered regions to form two electrode zones, thereby eliminating unnecessary current transmission impedance as in prior art, as well as efficiently and stably reducing the temperature coefficient of resistance. The bonding design of the substrate and the fixed resistor of the present invention is capable of overcoming the drawback of the high cost of semiconductor processing as exists in the prior art, and provides a simple fabrication process that is capable of increasing process yield and decreasing production costs.

Abstract: An apertured fixed chip resistor and method for fabricating the same are disclosed according to the present invention, wherein a bonding layer is applied to accordingly bond together a substrate and a metallic sheet structure that has central aperture, and then a passivation layer is applied to partially cover the exposed surface of the metallic sheet structure and to divide the surface of the metallic sheet structure into a central covered region separating two uncovered regions, wherein the uncovered regions are provided to serve as electrode zones, thereby eliminating unnecessary current transmission impedance as in prior art as well as efficiently and stably reducing the temperature coefficient of resistance.

Abstract: The present invention provides a method of producing a resistance element incorporated in a printed circuit board at an accuracy of resistance value of ±1% or less, at low cost and with a good yield while the resistance element formed by a resistor paste is incorporated.

Abstract: A method of manufacturing a thermal print head includes a conductor layer formation step, a first measurement step, a conductor layer splitting step and a second measurement step. In the conductor layer formation step, a single conductor layer including first and second measurement points is formed on a substrate. In the first measurement step, the electrical resistance is measured in the conductor layer, between the first and the second measurement points. In the conductor layer splitting step, a predetermined portion of the conductor layer is removed, so that a first electrode including the first measurement point and a second electrode including the second measurement point are formed. In the second measurement step, the resistance between the first and the second electrodes is measured. If the conductor layer has a disconnected portion in the first measurement step, a repairing conductor is formed on the disconnected portion.

Abstract: A magnetic detection apparatus can be improved in its product yield. The magnetic detection apparatus includes a resin compact having a the magnet arranged in opposition to an object to be detected for generating a magnetic field, an IC chip with a magnetic detection part built therein for detecting a change in the magnetic field in accordance with movement of the object to be detected, and an IC package in which a lead frame having the IC chip installed thereon is sealed with a resin. A method for manufacturing such a magnetic detection apparatus includes a signal adjustment step for adjusting a signal generated from the magnetic detection part in a state in which the magnetic field is applied to the magnetic detection part to correct a deviation of the signal of the magnetic detection part generated in accordance with a relative displacement between the magnetic detection part and the magnet.

Abstract: A non-burnable varistor, comprises a base slice having two opposite surfaces, a first elicit pole electrically connected to one surface of the said base slice, a second elicit pole electrically connected to the other surface of the said base slice. Outside each of the said two opposite surfaces of the base slice a low-melting-point metal conductor layer is respectively situated, which is melted at the temperature of 155˜450° C., and the two layers are not electrically connected by any good conductor. When the non-burnable varistor base is struck and burned through to form an arc, the low-melting-point metal are melted and go into the arc in the form of gas or liquid, to depress the resistance of the arc nearly to a short estate. So the arc current can be cut off by the over-loading security mechanism as over-current protective fuses or breakers, before the coat of the non-burnable varistor caught on fire, to prevent the occurrence of fire accident.

Abstract: The invention describes a temperature sensor for a, resistance thermometer having an electric measuring resistor the resistance material of which consists either of a ceramic material or of a metallic resistance material in combination with a ceramic or a mineral carrier; having a protective tube comprising a closed tip and a rear end that provides an access to the inner space of the protective tube and that contains the measuring resistor; having at least one connection wire of the measuring resistor that is brought out through the rear end of the protective tube; and having an electrically insulating filler based on a ceramic or a mineral material that fills the space between the protective tube on the one side and the measuring resistor on the other side.

Abstract: A resistive random access memory (RRAM) device may include a first metal pattern on a substrate, a first insulating layer on the first metal pattern and on the substrate, an electrode, a second insulating layer on the first insulating layer, a resistive memory layer, and a second metal pattern. Portions of the first metal pattern may be between the substrate and the first insulating layer, and the first insulating layer may have a first opening therein exposing a portion of the first metal pattern. The electrode may be in the opening with the electrode being electrically coupled with the exposed portion of the first metal pattern. The first insulating layer may be between the second insulating layer and the substrate, and the second insulating layer may have a second opening therein exposing a portion of the electrode.

Abstract: The following abstract will replace all prior versions of the abstract in the application: A pressure sensor is provided with a cap on a measuring portion of a diaphragm to which a first end of a flexible board is connected while a second end of the flexible board is connected to a circuit board spaced apart from the diaphragm. The flexible board is provided with the first end, a belt portion that is bent at an angle of ninety degrees or more relative to the first end in a direction to be away from the circuit board and is curved along the outer circumference of the diaphragm, and the second end that is bent at an angle of ninety degrees or more relative to the belt portion to be connected to the circuit board.

Abstract: A contactless potentiometer is described wherein the conductive and resistive traces of the potentiometer are contained within a sealed channel formed of non-conductive material. The electrical gap between the conductive and resistive traces is bridged by a magnetically reactive contactless tap. A magnetic force is applied to the tap through the surface of the channel holding the conductive and resistive traces. This provides a drawing magnetic force to the tap which pulls the tap against the traces and allows for changing the resistance of the potentiometer by laterally moving the tap along the traces as the tap moves to follow the motion of the external force.

Abstract: The present invention provides an ink jet print head that enables an optimum resistance value to be set for a heating resistor that generates ink ejection energy to allow high-quality images to be printed, as well as a method for manufacturing the ink jet print head. Heating resistors with sheet resistance values differing from each other are formed on the same substrate by heating resistant layers.

Abstract: A varistor including a varistor body with two parallel end faces made of a material that contains one or more metal oxides, and at least one electrode made of an electrically conductive electrode material arranged on any of the end faces of the varistor body. The electrode includes a layer of electrode material coated on the end face by means of an ion- or atom-transferring method, whereby the layer has a thickness within the interval of from 5 micrometers to 30 micrometers.

Abstract: A method of making a chip resistor is provided. The method includes the following steps. First, a resistive element is provided on a substrate. Then, a resin layer is formed on the substrate to enclose the resistive element. Then, the substrate and the resin layer are cut in this order. To prevent the breakage of the substrate during the cutting, the resin layer has better machinability than the substrate.

Abstract: Provided are a semiconductor probe having a resistive tip and a method of fabricating the semiconductor probe. The semiconductor probe includes a resistive tip which is doped with a first impurity, and of which an apex portion is doped with a low concentration of a second impurity of opposite polarity to the first impurity, wherein first and second semiconductor electrode regions doped with a high concentration of the second impurity is formed on slopes of the resistive tip; a dielectric layer formed on the resistive tip; an electric field shield which is formed on the dielectric layer, and forms a plane together with the dielectric layer on the apex portion of the resistive tip; and a cantilever having an end on which the resistive tip is located.

Abstract: Methods of manufacturing a variety of circuit protection devices are provided as well as devices so manufactured. In an embodiment, a surface mount electrical device having a substrate and a pair of conductive electrodes connected to an electrical protection component for sensing current or voltage is provided. The method includes the steps of: (i) providing a substrate having a first surface and a second surface; creating a first and second aperture, plasma etching a through-hole, slot or bore through the substrate; (ii) depositing a conductive material on the substrate and through the apertures to form the electrodes, wherein the conductive material extends through the apertures and on the first and second surfaces of the substrate, respectively; and (iii) depositing the electrical protection component on the first surface of the substrate to electrically connect the electrodes.

Abstract: An encapsulated heat pipe is made by placing a removable elongated solid partially within a mold, filling the mold with a solid dielectric material, and removing the elongated solid from the dielectric material defining an elongated cavity that extends within the solid dielectric material. Next, a wick material is inserted into the periphery of the elongated cavity, then a coolant liquid is inserted into the elongated cavity and the open end of the elongated cavity is sealed.

Abstract: A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices. The assembly is made by providing first and second laminates, each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface of the stack, and making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.

Abstract: In a method of resistance adjustment, a resistance adjusting element and a resistance adjusting device, in order to readily recognize a terminal end of a cut-off part for connecting cut-off parts when a resistance film is cut off at several times and to prevent a resistance value from changing due to cracking of the resistance film, the resistance adjustment having preliminary resistance adjustment carried out before an electronic circuit board is incorporated in the associated equipment, and final resistance adjustment which is carried out after the electronic circuit board is incorporated in the associated equipment, the preliminary resistance adjustment forming a first cut-off part in the resistance film and forming a second cut-off part serving as a marker in the resistance film, so as to be connected to the first cut-off part substantially at a position of one end of the first cut-off part, and the final resistance adjustment recognizing the position of the second cut-off part, and forming the third cut-

Abstract: A method for making an integrated circuit substrate having embedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer of the substrate is embossed or laser-ablated to generate apertures for insertion of a paste forming the body of the passive component. A resistive paste is used to form resistors and a dielectric paste is used for forming capacitors. A capacitor plate may be deposited at a bottom of the aperture by using a doped substrate material and activating only the bottom wall of the aperture, enabling plating of the bottom wall without depositing conductive material on the side walls of the aperture. Vias may be formed to the bottom plate by using a disjoint structure and conductive paste technology. Connection to the passive components may be made by conductive paste-filled channels forming conductive patterns on the substrate.

Abstract: The acceleration sensor according to the present invention includes a circuit chip having a prescribed circuit built into a front surface thereof; a sensor chip bonded to the front surface of the circuit chip; and a resin package for sealing the circuit chip and the sensor chip, while the sensor chip includes: a membrane arranged to oppose to the front surface of the circuit chip and having a plurality of openings; a piezoresistor formed on a surface of the membrane opposed to the circuit chip; a support section provided on a side opposite to the circuit chip with respect to the membrane and supporting a peripheral edge portion of the membrane; and a weight section provided on the side opposite to the circuit chip with respect to the membrane and integrally held on a central portion of the membrane.

Abstract: A chip resistor includes a metal resistor element having a flat lower surface. The lower surface is formed with two electrodes spaced from each other, and an insulating resin film is formed between these electrodes. Each of the electrodes partially overlaps the insulating film so that a portion of the insulating film is inserted between each of the electrodes and the lower surface of the resistor element.

Abstract: The manufacturing method for an electroceramic component (1), for example a varistor (1), comprises a laser irradiation of a part (5; 6) of the surface of an electroceramic body (2) before a metallization (3; 4) is applied to the part (5; 6) of the surface. By means of the laser irradiation it is possible to produce a micro-roughness and/or a chemical modification of the surface which permits good adhesion of the metallization, and it is possible to reduce or eliminate areas of unevenness or waviness of that part (5; 6) of the surface of the electroceramic body (2) which is to be metallized. In addition, improved transverse conductivity can be produced, by virtue of which a low contact resistance and a very homogeneous current distribution is achieved, in particular near to the metallization (3; 4). In addition it is possible to remove residues which originate in particular from a sinter support or from the application of a passivation layer.

Abstract: In manufacturing a chip resistor by dividing a chip resistance substrate which includes an insulator, resistance film formed on a surface of the insulator, and a plurality of conductive strips disposed on the resistance film at fixed intervals, grooves are formed by removing a predetermined width of the resistance film including at least second prescribed severing lines. After forming the grooves, the chip resistance substrate is severed in longitudinal and lateral directions along first prescribed severing lines for dividing the conductive strips into two parts and the second prescribed severing lines perpendicular to the first prescribed severing lines so as to produce discrete chip resistors.

Abstract: Electronic devices prepared from nanoscale powders are described. Methods for utilizing nanoscale powders and related nanotechnology to prepare capacitors, inductors, resistors, thermistors, varistors, filters, arrays, interconnects, optical components, batteries, fuel cells, sensors and other products are discussed.

Abstract: The raw material for a ZnO—Pr-based varistor is mixed with cobalt and potassium to prepare a ceramic raw material powder. Potassium, which is an alkali metal, is added in the form of KClO4, KHC4H4O6, PtCl6, or K3[Co(NO2)6]. The ceramic raw material powder is pulverized by a wet process while 0.1 to 5.0 wt % of polycarboxylate dispersant is added to the powder. Such a method can produce a reliable, high-quality varistor having excellent varistor characteristics, such as varistor voltage V1mA and insulation resistance IR, and less variation in these characteristics.

Abstract: A resistive element in the form of a bent metal plate is placed in a box-shaped case and has electrodes exposed out of the box-shaped case. A heat radiator in the form of a bent metal plate is also placed in the box-shaped case and has heat radiating electrodes exposed out of the box-shaped case. The resistive element and the heat radiator are held out of contact with each other and disposed in criss-cross relation to each other. The box-shaped case is filled with a cement material in surrounding relation to the resistive element and the heat radiator.

Abstract: A magnetic head including a media heating device. Following the fabrication of the heating device, a sacrificial layer of material is deposited to protect the heating device during subsequent process steps. Thereafter, write head components, such as write head induction coils and/or a P1 pole pedestal are fabricated above the heating device, and the sacrificial layer is substantially consumed in protecting the heating device during the aggressive etching and milling steps used to create those components. Further components, including a second magnetic pole are thereafter fabricated to complete the fabrication of the write head portion of the magnetic head. The sacrificial layer may be comprised of alumina, or a material such as NiFe that can act as a seed layer for a subsequent head components such as the P1 pole pedestal.

Abstract: Disclosed is a method of producing a printed circuit board (PCB) with an embedded resistor, in which a resistor with a desired shape and volume is precisely formed using a resistor paste so that resistance values according to a position of the PCB are uniform, thereby a laser trimming process is omitted or minimally utilized. The method has advantages in that a production time of the PCB is shortened and productivity is improved because an operation condition is rapidly set without being greatly affected by the position precision of a printing device. Other advantages of the method are that the resistor paste with a relatively uniform thickness is secured through a screen printing process, thereby easily forming the resistor and improving resistance tolerance.

Abstract: A method of manufacturing a composite structural member with an integrated electrical circuit is provided. The structural member includes a plurality of layers of structural reinforcement material, and two or more electrical devices are disposed at least partially between the layers with an intermediate layer of the structural reinforcement material disposed between the electrical devices. At least one electrical bus is disposed in the structural member, and each electrical device is connected to the bus by a conductive electrode. Thus, the electrodes can extend through the intermediate layer of the structural reinforcement material to connect each of the electrical devices to one or more of the buses.

Abstract: A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to create an exposed central portion of the resistive material therebetween. According to the method the resistive strip is attached to a single co extensive strip of conductive material and a central portion of the conductive material is removed to create the exposed central portion of the resistive strip.

Abstract: A high precision power resistor having the improved property of reduced resistance change due to power is disclosed. The resistor includes a substrate having first and second flat surfaces and having a shape and a composition; a resistive foil having a low TCR of about 0.1 to about 1 ppm/° C. and a thickness of about 0.03 mils to about 0.7 mils cemented to one of the flat surfaces with a cement, the resistive foil having a pattern to produce a desired resistance value, the substrate having a modulus of elasticity of about 10×106 psi to about 100×106 psi and a thickness of about 0.5 mils to about 200 mils, the resistive foil, pattern, type and thickness of cement, and substrate being selected to provide a cumulative effect of reduction of resistance change due to power. The present invention also provides for a method of producing a high precision power resistor.

Abstract: A resistor and a structure for changing an electrical resistance of a resistor. Initially, the resistor is provided, wherein the resistor has a length L and an electrical resistance R1. A portion of the resistor is exposed to a laser radiation, wherein the portion includes a fraction F of the length L of the resistor. After the resistor has been exposed to the laser radiation, the resistor has an electrical resistance R2, wherein R2 is unequal to R1.

Abstract: A method for adjusting the equivalent series resistance (ESR) of a multi-layer component includes providing at least first and second layers separated by an insulating layer, providing a resistive layer between the inslulating layer and one of the first or second electrode layers, and adjusting the ESR of the component by varying the effective resistance of the resistive layer. The effective resistance may be varied by adjusting the composition or thickness of the resistive layer. Alternatively, the effective resistance may be varied by forming a plurality of through-holes perforating one of the electrode layers and by then adjusting the respective diameters of selected of the through-holes to vary the extent of coverage on the resistive layer. An additionally disclosed feature of the present subject matter is to incorporate dielectric layers of varied thicknesses to broaden the resonancy curve associated with a particular mutli-layer component configuration.

Abstract: There is provided a method and circuit for trimming a functional resistor on a thermally isolated micro-platform such that a second functional resistor on the same micro-platform remains substantially untrimmed; a method and circuit for providing and trimming a circuit such that at least two circuit elements of the circuit are subjected to a same operating environment and the operating environment is compensated for by distributing heat generated during operation of the circuit among the two circuit elements; a method and circuit for trimming a functional resistor on a thermally-isolated micro-platform such that a constant temperature distribution is obtained across the functional resistor; and a method and circuit for calculating a temperature coefficient of resistance of a functional resistor.

Abstract: A multiple chip resistor is manufactured in the following method. First electrode layers are formed on a first surface of a substrate. Resistor elements electrically connected to the first electrode layers, respectively, are formed on the first surface of the substrate. Slits are formed in the substrate for separating the first electrode layers. Edge electrodes connected to the first electrode layers at the edges of the slits, respectively, are formed on respective edges at the slits of the substrate. The substrate is divided at the slits into strip substrates. Portions of the edge electrodes are removed for electrically isolating the resistor elements from each other. The method provides the edge electrodes on each strip substrate with an improved dimensional accuracy, hence allowing the edge electrodes to be isolated electrically from each other. Consequently, the multiple chip resistor is prevented from being mounted defectively when the resistor is surface-mounted.

Abstract: A resistor, including a resistive element made of a metal plate, has a low resistance resulting from connection terminal electrodes formed on both ends of the lower surface of the resistive element. The object thereof is to achieve weight reduction and lower costs by reducing the height of the resistor. To achieve the above object, the ends of the lower surface of the resistive element are provided with recesses for accommodating the connection terminal electrodes, while at least the intermediate area of the lower surface of the resistive element between the connection terminal electrodes is covered with an insulator. Alternatively, a recess may be formed in the middle of the lower surface of the resistive element for using the ends of the lower surface as a pair of connection terminal electrodes, the recess being internally covered with an insulator.

Abstract: A method for fabricating the embedded thin film resistors of a printed circuit board is provided. The embedded thin film resistors are formed using a resistor layer built in the printed circuit board. Compared with conventional discrete resistors, embedded thin film resistors contribute to a smaller printed circuit board as the space for installing conventional resistors is saved, and better signal transmission speed and quality as the capacitive reactance effect caused by two connectors of the conventional resistors is avoided. The method for fabricating the embedded thin film resistors provided by the invention can be conducted using the process and equipment for conventional printed circuit boards and thereby saving the investment on new types of equipment. The method can be applied in the mass production of printed circuit boards and thereby reduce the manufacturing cost significantly.

Abstract: The substrate (2) containing the via-hole (3) is inserted into an electrophoretic cell (1) and an electrode (6) (the “first electrode”) is placed on top of a first orifice of the via-hole(s) (3), to be implemented with electrical component(s), so that the electrode (6) totally covers the first orifice. Electrically charged either conductive and/or non-conductive particles are provided by immersing the volume of the via-hole(s) (3) in a conductive medium (17) consisting of the electrically charged particles. An electric field is created between the first electrode (6) and a second electrode (4) through the via-hole(s) (3) and the conductive medium (17) and the electrically charged particles are precipitated on the inner surface of the first electrode (6) that is directed to the second orifice of the via-hole(s) (3), until a desired portion of the volume of the via-hole(s) (3) is filled with a first layer of the charged particles having a desired thickness.

Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.