Abstract: An assembling jig for lens module comprises a crutch, a mobile carrier and a pressing mechanism. The crutch includes a level mounting base and an erect support wall joined to one side of the mounting base. A firm carrier is fixed on the mounting base. The mobile carrier fixed on the firm carrier comprises a carrier base, several positioning blocks disposed around the top surface of the carrier base, the positioning blocks surrounding a restraining groove in which a PCB with a lens socket is received. The pressing mechanism disposed on the support wall includes a pressing member can move up and down and a drive gear connected to one end of the pressing member. This kind of lens module component assembling jig features in assembling lens component steadily and can be applied to different kinds of lens component. Thus it abates the cost of assembling the lens component.

Abstract: Component placement apparatus (1, 21) comprising a storage device (2) for storing components, means (5, 25, 71, 81, 91) for transporting a component from the storage device (2) to a transfer device (6, 26) comprising at least one component pickup position (11), and a component pick and place device (7) for picking up a component from the pickup position and placing the component on a desired location on a substrate (8) positioned on a substrate support. The transfer device (6, 26) is movable between a position relatively close to the stationary storage device (2) and a variable desired position above the substrate support relatively close to the movable pick and place device whilst the means (5, 25, 71, 81, 91) for transporting a component from the storing device to the transfer device (6, 26) comprise guiding means for guiding a tape (4) comprising components from reel (3) located in the storage device (2) into the component pickup position (11) on the transfer device (6, 26).

Abstract: It is an object to provide an electronic component mounting system capable of concurrently, efficiently subjecting a plurality of substrates to component mounting operation and accomplishing both high productivity and a capability of addressing production of multiple products. An electronic component mounting system is configured by arranging, on an upstream side of a component loading unit having a plurality of substrate conveyance mechanisms, a screen printer M2 having a plurality of individual printing mechanisms and a coating and inspection machine M4 that applies a coat of a resin for use in boding an electronic component and that inspects a coated state. The coating and inspection machine M4 is equipped with a coating head 15 that performs operation for coating substrates conveyed by substrate conveyance mechanisms 12A and 12B from the screen printer M2 with the resin and an inspection head 16 that performs pre-coating inspection and post-coating inspection.

Abstract: A assembly apparatus for attaching decorative pieces to electronic devices includes a seat, a first cover, a second cover, and a transmitting member. The seat includes a disengaging portion and an attaching portion. The disengaging portion has a recess, a protrusion and at least one positioning column in the recess. The attaching portion defines a receiving room for receiving a shell. The first cover is detachable mounted on the disengaging portion and defines at least one first through hole. The second cover is detachable mounted on the attaching portion and defines a second through hole. The transmitting member includes a latching portion. The latching portion is inserted in the first through hole to attract a decorative piece, and is inserted in the second through hole to release the decorative piece on the shell.

Abstract: An object of the invention is to provide an electronic component mounting system and an electronic component mounting method which can execute component mounting work on a plurality of boards simultaneously, concurrently and efficiently so that high productivity and responsiveness to production of many items can be achieved consistently.

Abstract: The invention relates to a remote control device with a stowable key, in particular for an automobile, which comprises a remote control casing including two lower (1) and upper (2) shells, an insert (3) defining a key-bit pivotally mounted between an extended use position and a stowed position inside the casing, and an elastic return mechanism for returning the insert to the extended position, which comprises a push button (4) provided on the upper shell (2). According to the invention, the insert (3) rotates directly about said button (4) which is rotatingly connected with the upper shell (2), and includes rotational indexing means with said insert (3) that can be declutched by pushing said button (4).

Abstract: Embodiments of the invention relate to a method and system for magnetic self-assembly (MSA) of one or more parts to another part. Assembly occurs when the parts having magnet patterns bond to one another. Such bonding can result in energy minima The magnetic forces and torques—controlled by the size, shape, material, and magnetization direction of the magnetic patterns cause the components to rotate and align. Specific embodiments of MSA can offer self-assembly features such as angular orientation, where assembly is restricted to one physical orientation; inter-part bonding allowing assembly of free-floating components to one another; assembly of free-floating components to a substrate; and bonding specificity, where assembly is restricted to one type of component when multiple components may be present.

Abstract: An insertion tool for manipulating a cable termination device having an auxiliary handle section pivoted to a base handle section, the inner and outer bodies of a cable termination device nested together with multiple cable strands positioned between the two bodies, and the inner strand of the cable extending through an aperture in the inner body and being adapted to be bend 90 degrees by manipulation of the handle sections.

Abstract: An apparatus tool for filling vias in a product greensheet and/or repairing vias in a product greensheet. The apparatus tool utilizes a transfer greensheet having filled vias in a fixed array, which vias are punched into the product greensheet to either repair or fill the via of the product greensheet. The apparatus tool employs position determining means such as a camera, a punch head and a corresponding punch die and an activating means to activate the punch head to punch the transfer greensheet via to fill the product greensheet via. The transfer greensheet has a fixed array of filled vias and a transfer greensheet station employs a fixed plate having a plurality of vacuum ports positioned in the non-via areas of the transfer greensheet which secures the transfer greensheet during the repair or fill method. The product greensheet is held by a vacuum plate.

Abstract: The present application provides a method for the production of photovoltaic devices, preferably tandem solar cells. The method comprises the steps of: Providing at least one substrate comprising a front contact; and depositing at least a first semiconductor stack onto the substrate to produce a photo-voltaic device; and comprises at least two of the steps of: applying a back contact to the photovoltaic device; contacting of the photovoltaic device; removal of unnecessary material from the edge regions of the photovoltaic device; encapsulation; cross-contacting; and/or framing of the photovoltaic device, wherein the substrate is continuously or semi-continuously moved from one step of the method to the next step of the method. The present application furthermore provides a system to carry out the method of the invention.

Abstract: The present invention carries out the vacuum deposition by setting a deposition angle between a single mask set including a shadow mask having a plurality of slits and a deposition source to form a lower terminal layer, a dielectric layer, an inner electrode layer, and an upper terminal layer at once under a vacuum state generated once, or adjusts slit patterns by relatively moving upper and lower mask sets that respectively include shadow masks having a plurality of slits and face each other to form a lower terminal layer, a dielectric layer, an inner electrode layer, and an upper terminal layer at once under a vacuum state generated once.

Abstract: A circuit board assembly fixture is used in assembling a circuit board assembly. The fixture includes supporting surfaces each including a first side and an opposite second side, wherein each first side receives at least one of the fixed circuits to be coupled together using at least one flexible circuit. The fixture also includes at least one hinge to couple the supporting surfaces together, wherein the hinge enables the supporting surfaces to be folded into a desired alignment relative to each other and provides structural support for the assembly. Moreover, the fixture includes at least one fastening mechanism extending from the surface first side to retain the fixed circuits in position relative to the supporting surfaces. Further, the fixture includes at least one retainer coupled to at least one of the supporting surfaces to retain an alignment of each of the supporting surfaces relative to each other.

Abstract: A structure of wireless receiver includes a metallic casing, a positioning base, a receiving module, and a housing. The metallic casing has a circumferential wall defining an accommodating space therein, and two opposite ends thereof formed with an insertion hole and a through hole in communication with the accommodating space. The positioning base has a mounting trough, and is disposed in the accommodating space of the metallic casing. The positioning base has two side ends being fixed to the circumferential wall. The mounting trough is in communication with the accommodating space and the through hole. The receiving module is disposed in the mounting trough of the positioning base via the through hole of the metallic casing. The housing is assembled to the through hole of the metallic casing, and the through hole is sealed by the housing to block the receiving module.

Abstract: A method and apparatus for forming a protective coating on a photovoltaic device is provided. The photovoltaic device is formed by depositing photoelectric conversion units on a substrate, and by forming conductive layers and contacts on the photoelectric conversion units. The protective coating is formed by a deposition process, such as physical or chemical vapor deposition.

Abstract: A mechanical construction of an electrical module includes two or more electrical components (102-105). Each of the electrical components has a contact surface (106-109) that is capable of forming a galvanic contact with an external electrical conductor. The electrical module includes a holder element (101) that includes flexible material arranged to flexibly support the electrical components with respect to each other in such a way that the contact surfaces of the electrical components are capable of aligning with external surfaces independently of each other.

Abstract: The described embodiments relate to methods and systems of forming slots in a substrate. One exemplary embodiment forms a feature into a substrate having a first substrate surface and a second substrate surface, and moves a sand drill nozzle along the substrate to remove substrate material sufficient to form, in combination with said forming, a slot through the substrate.

Abstract: A series connected light string using LEDs connected to an AC power source is disclosed. In order to make some or all of the lights color change, twinkle, and/or flash, controllers are provided in series with all or some of the LEDs. Because the supply source AC, but the active elements are essentially rectifiers, the circuit becomes a half wave DC circuit. Half wave DC will cause unpredictable behavior in DC circuit components. This will cause the controller to shut down during the zero voltage portion of the pulsating DC cycle. To prevent this a current supplying element is placed in parallel with the controller.

Abstract: A mounting apparatus for mounting electronic parts includes, a part conveying device in which a plurality of part holding portions are integrally provided, along a peripheral direction at a predetermined interval, wherein the plurality of part holding portions are intermittently driven in a peripheral direction; a part supply portion for supplying an electronic part to each part holding portion of the part conveying device intermittently driven; and an inspection device for inspecting whether or not dust is attached to the electronic parts supplied and held by the part holding portion at a position where the part holding portion stops due to the intermittent driving of the part conveying device.

Abstract: A jig for holding and conveyance includes a plate having a weak-adherence adhesive pattern on a surface and a printed circuit board having a conductive portion and a non-conductive portion on the surface of an insulating substrate. The weak-adherence adhesive pattern is formed at a position corresponding to the non-conductive portion. Alternatively, the weak-adherence adhesive pattern subjected to surface roughening is formed on a surface of the weak-adhesive layer at a position corresponding to the conductive portion.

Abstract: An installation system and a method for mounting a rotor blade to a hub on a wind turbine are disclosed. The method includes coupling a rotor and a stator together, the rotor rotatably connected to the hub. The method further includes rotating the stator in a first direction, wherein rotation of the stator causes the rotor and the hub to rotate in the first direction. The method further includes securing the hub to prevent rotation of the hub. The installation system includes a coupling device configured to releasably couple a stator and a rotor together and a securing device configured to releasably secure the hub. The installation system further includes at least one stator drive device operably connected to the stator, the stator drive device configured to rotate the stator between a first position and a second position.

Abstract: A magnetic handling assembly for thin-film processing of a substrate, a system and method for assembling and disassembling a shadow mask to cover a top of a workpiece for exposure to a processing condition. The assembly may include a magnetic handling carrier and a shadow mask disposed over, and magnetically coupled to, the magnetic handling carrier to cover a top of a workpiece that is to be disposed between the shadow mask and the magnetic handling carrier when exposed to a processing condition. A system includes a first chamber with a first support to hold the shadow mask, a second support to hold a handling carrier, and an alignment system to align the shadow mask a workpiece to be disposed between the carrier and shadow mask. The first and second supports are moveable relative to each other.

Abstract: A method of connecting electrical components and an electronic device formed using this method are disclosed. This method includes stretching a first substrate with a plurality of conductive traces to form a stretched substrate where at least one increased pitch (a spacing between two conductive traces plus a width of one conductive trace) is not greater than 40 microns; and electrically connecting the conductive traces on the first substrate to conductive traces on a second substrate. A device by which this method can be implemented is also disclosed, which includes a base, and platforms and stretchers mounted to the base that are configured to pull opposite ends of the first substrate to align the conductive traces thereon with the conductive traces on the second substrate.

Abstract: A light source manufacturing apparatus, which manufactures a light source device by adhering a laser device and a wavelength converting device that converts the laser light emitted by the laser device to laser light of a different wavelength, includes a first stage that holds the wavelength converting device, a second stage that holds the laser device, a power meter that measures the amount of laser light emitted by the wavelength converting device, a light receiving device that detects the drive waveform of the laser light, and a controlling unit that changes relative positions of the first stage and the second stage in such a manner that the amount of laser light measured by the power meter is a predetermined value or greater and the drive waveform detected by the light receiving device falls within a reference range.

Abstract: An assembly-target-object-and-assembly-component carrier pallet carries thereon a target object (semi-finished product) 2 and a plurality of assembly components arranged, as viewed in plane, on a straight line which passes through a predetermined attachment position on the target object where the predetermined assembly component is to be attached. This allows a minimum of moving parts in the attaching device which attaches the assembly components to the assembly target object. Therefore, the structure of an assembling apparatus is simplified and mechanical errors and assembly time are reduced, thereby improving assembling accuracy.

Abstract: A sheet bonding device includes a detection unit that detects first position data of first marks in a first sheet provided with a first electrode, and second position data of second marks in a second sheet provided with a second electrode, a generation unit that generates third shape data from the first shape data based on a result of comparison of the first position data and the third position data, and generates fourth shape data from the second shape data based on a result of comparison of the second position data and the fourth position data, and a decision unit that changes relative positions of the third shape data and the fourth shape data, and determines a first relative position of the first electrode against the second electrode at which an area of overlapping in plan view of the third shape data and the fourth shape data is maximized.

Abstract: In order to increase the clamping effect in an electrical screw connector used in industrial applications to fix or hold an electrical conductor, the support and contact surfaces for the electrical conductor are textured. According to the invention, the texturing of the support and contact surfaces for the electrical conductor is carried out by various production methods using embossing or stamping tools.

Abstract: The invention relates to a method for producing a contact for solar cells (30) arranged in a laminated solar panel (1), wherein the solar cells (30) are coated on both sides of the main surfaces thereof with at least one layer and before a lamination step the solar cells (30) are connected with electrically-conducting connectors (31, 33), the electrically conducting connectors (31, 33) being arranged in the solar panel for laminating such as to be completely laminated within the solar panel (1) after the lamination step. After the lamination step a contact region (35) of the electrically-conducting connector (33) is exposed, wherein at least one of the layers covering the solar cells is completely punched through in the corresponding region, in particular by stripping. The contact region (35) of the electrically-conducting connector (33) can then be contacted by means of an externally-accessible contact element.

Abstract: A geometric end effector system for use on a robot. The system includes a platform and a frame secured to the platform. At least one base is arranged at a predetermined position on the frame. The system also has an anchor mount secured to the base and a component connected to an end of the anchor mount by a collar assembly. A key is arranged between the component and the anchor mount.

Abstract: A structure for attaching a heat sink to an integrated circuit chip includes a servo control system and at least one voice coil motor for actuating the heat sink.

Abstract: Provided is a manufacturing apparatus that manufactures an integrated circuit package by packaging an integrated circuit chip, the manufacturing apparatus comprising a flattening section that flattens the integrated circuit chip; a holding section that holds a base substrate; a transporting section that transports the flattened integrated circuit chip to load the integrated circuit chip on the base substrate held by the holding section; and a packaging section that packages the integrated circuit chip and the base substrate as the integrated circuit package.

Abstract: A method of manufacturing a magnetoresistive element includes a tunnel barrier forming step. The tunnel barrier forming step comprises a metal layer forming step of forming a metal layer to have a first thickness, a plasma processing step of performing a plasma treatment which exposes the metal layer to a plasma of an inert gas to etch the metal layer to have a second thickness smaller than the first thickness, and an oxidation step of oxidizing the metal layer having undergone the plasma treatment to form a metal oxide which forms a tunnel barrier.

Abstract: Systems and methods of retrofitting a commercial passenger aircraft with a mounting system that secures and protects a line replaceable unit (LRU) are disclosed. An exemplary embodiment is a mounting system for a regulatory compliant passenger power outlet system.

Abstract: A method for manufacturing a hard-disk drive (HDD). The method for manufacturing a HDD includes writing servo tracks, and writing servo tracks into the HDD using a calculated control target value of a calculated servo pattern overlap amount. Writing servo tracks includes a first, second, third and fourth operation. The first operation includes: producing a first control equation for obtaining a servo pattern overlap amount; and, converting a root-mean-square error (RMSE) into a probability distribution. The second operation includes calculating a second control target value that results in an increased product yield, from the RMSE probability distribution. The third operation includes producing a second control equation for obtaining a calculated servo pattern overlap amount, by assigning the second control target value into the first control equation.

Abstract: A circuit board assembly fixture is used in assembling a circuit board assembly. The fixture includes supporting surfaces each including a first side and an opposite second side, wherein each first side receives at least one of the fixed circuits to be coupled together using at least one flexible circuit. The fixture also includes at least one hinge to couple the supporting surfaces together, wherein the hinge enables the supporting surfaces to be folded into a desired alignment relative to each other and provides structural support for the assembly. Moreover, the fixture includes at least one fastening mechanism extending from the surface first side to retain the fixed circuits in position relative to the supporting surfaces. Further, the fixture includes at least one retainer coupled to at least one of the supporting surfaces to retain an alignment of each of the supporting surfaces relative to each other.

Abstract: A photovoltaic panel (10) comprising a back plate (12), a front sheet (20) and a photovoltaic cell (30) disposed between the back plate (12) and the front sheet (20), wherein the photovoltaic panel (10) comprises a protective element (22, 24) which extends along an edge of the front sheet (20) without extending beyond an uppermost surface of the front sheet (20).

Abstract: An apparatus and method are described for use in the manufacture of non-planar circuit modules. The apparatus includes a holder for holding a non-planar circuit module, an activation source for activating one or more localised regions of a non-planar circuit module held by the holder, and positioning apparatus for providing relative movement between the activation source and a non-planar circuit module held by the holder. The relative movement between the activation source and a non-planar circuit module held by the holder includes translational movement along at least one axis and rotational movement about at least one axis. A parallel positioning machine may provide such relative movement.

Abstract: A cable assembly apparatus for coupling a connector to a cable having a base supporting an interface pedestal dimensioned to receive the connector; an inductor coil coupled to an inductor coil actuator operable to move the inductor coil between a load position and an operation position proximate the interface pedestal; a grip clamp operable by a clamp actuator to move between an open position and a closed position above the interface pedestal; and a temperature sensor configured to read a temperature proximate the interface pedestal. A method for using the apparatus retains the pre-assembled connector and cable in an aligned orientation for controlled heating by the induction heater to heat a solder preform to solder the connector to an outer conductor of the cable.

Abstract: A manufacturing system including an apparatus in which a plurality differently configured workpieces requiring manufacturing operations are processed. The apparatus includes a work surface configured to receive apparatus components and a plurality of differently configured workpieces, a tool table adjacent the work surface providing support for tooling and apparatus components required to process various manufacturing operations on the workpieces, and a robotic manipulator positioned adjacent to the work surface and the tool table and having a gripping device configured to grip at least one of the apparatus components. Also, an automated feed system optionally included in the system for supplying component parts to the manufacturing operation. Also, a method of assembling first and second differently configured workpieces.

Abstract: An element mounting apparatus includes a movable arm, an electromagnet, a first controller and a glue dispenser. The glue dispenser includes a plate body and a second controller. The plate body includes an inner space containing glue, a through hole defined therein, and a plurality of spaced glue outlets formed in the first surface and communicating with the inner space. The second end of the electromagnet engages the through hole to attract the magnetic element on the first surface of the plate body with the glue outlets surrounding, and repelling the magnetic element to the retainer. The second controller ejects glue out of the inner space of the plate body via the glue outlets, thereby adhesively mounting the magnetic element to the retainer.

Abstract: Methods for manufacturing a smart card inlay. In a first embodiment, the method includes initially connecting a first end (106) of a wire antenna (108) to a chip module (104) mounted in an aperture (102) on a substrate (100), thereafter fixing the wire antenna (108) onto the substrate (100) and thereafter connecting a second end (112) of the wire antenna (108) to the chip module (104). In a second embodiment, the method includes providing a wire antenna having a first end (200) and a second end (202), wherein the first end (200) and the second end (202) are connected to a chip module (206) and do not extend past the chip module (206) and fixing the wire antenna (204) to a substrate (208).

Abstract: An optical scanning or positioning mechanism has a head on which optical components are mounted and an actuator coupled to the head to cause the head to move when the actuator is actuated. There are one or more sets of flexure bearings mounted in the mechanism. The flexure bearings have a restoring torque when moved from a rest position. The bearings are coupled to the head to allow the head to move when actuated by the actuator. One or more magnets are mounted in the mechanism in a location other than in the actuator to compensate for the flexure bearings restoring torque.

Abstract: A lead wire implanting apparatus is provided that can fabricate high-quality brushes that are without variations in implanting height and implanting strength and free from cracks and, moreover, that can make the reproducibility of set values better and improve the workability in setup changing. The lead wire implanting apparatus has a tamping member (6) and a storing cup (14) for storing conductive metal powder, for implanting and fixing a lead wire (4) to a brush main body (8) by performing a tamping action of the tamping member (6) a predetermined number of times.

Abstract: The invention provides for a system and method for locating concealed locations such as wiring, plumbing, or void locations with respect to a covering material like a wall. The system comprises a position indicating portion that is concealed on one side of a covering material and a position locating portion positioned on the opposite side and adjacent to the covering material. The position indicating portion is coupled to any structural member using a mounting mechanism, thereby establishing the location of a site by creating a magnetic field extending through said covering material at that location. The position locating portion comprises a position locating magnet while the position indicating portion comprises a position indicating magnet. The position locating magnet cooperates repulsively and attractively through the covering material with a position indicating magnet in order to locate the concealed site by substantially aligning the position indicating portion and the position locating portion.

Abstract: The invention relates to a master device which can be used in a method for producing a recording medium, a substantially spirally or concentrically running main track structure and at least one substantially spirally or concentrically running secondary track structure being formed on the master device, the secondary track structure being arranged on at least one side of the main track structure, the secondary track structure having discontinuities varying an optically detectable surface texture of the recording medium in such a way that at least first auxiliary information is represented on the recording medium.

Abstract: An apparatus for manufacturing electronic parts is provided. The apparatus includes a head unit installed on a main body and configured to move up and down, a nozzle unit installed on the head unit and configured to move up and down, and a positioning unit sequentially displacing the head unit and the nozzle unit to a position where the electronic parts are on standby to suction the electronic parts using the nozzle unit. Thus, when the head unit is used to suction the electronic parts on standby at a standby position of the electronic parts, the head unit and the nozzle unit installed on the head unit are sequentially lowered, so that it is possible to relieve an impact occurring when the electronic parts are suctioned to the ends of nozzles.

Abstract: It is an object to provide an electronic component mounting apparatus suitable for diverting a single unit to a unit for different operation and a viscous material trial coater that is used in the electronic component mounting apparatus and that enables replacement of a working unit with a working unit of a different type with superior operability. In an electronic component mounting apparatus that is used in an electronic component mounting line for producing a mounted substrate by mounting electronic components on a substrate and that subjects the substrate to predetermined operation, a working unit attachment section 30 is provided within a range of movement of a working head, such as a loading head and a paste coating head, wherein a nozzle stocker 9 and a paste trial coating unit 10 can be removably attached as a working unit for performing specific additional operation appropriate for working function of the working head.

Abstract: The objective of this invention is to provide a transfer mask that is able to accurately pass micro-balls onto terminal areas on a substrate. A thin plate transfer mask 200 is arranged facing a substrate 100, and possesses a plurality of through-holes 242 for the purpose of passing micro-balls (solder balls) onto a plurality of terminal areas 108 formed on one surface of a substrate 100. Slits 230, 232, 234, 236 formed in the surface of the transfer mask 200 extending in the length direction and the width direction of the transfer mask 200, inside the substrate edge P1 and outside the area in which the plurality of through-holes 242 is formed when it is facing the substrate 100.

Abstract: During mounting to an inlay substrate, at least one end portion (including end) of an antenna wire is positioned directly over a terminal of the chip module for subsequent connecting thereto. A sonotrode is disclosed with a cutter above the capillary for nicking the wire. The antenna may comprise two separate stubs, each having an end portion (including end) positioned over a terminal of the chip module. Additional techniques for mounting the antenna wire are disclosed.

Abstract: Embodiments of the present invention include a roller for an input device, where the roller's absolute angular position is measured by a magnetic encoder. A magnet is attached to the roller, possibly inside the roller so as to make the embodiment more compact. In one embodiment, the magnetization is simple and low cost. Further, tight tolerances are not required, and such a system is easy to manufacture. In one embodiment, the sensor is covered by any non-ferromagnetic material, to protect it from foreign particles, and to reduce ESD. In one embodiment, the wheel consumes much less power than conventional wheels in input devices. In one embodiment, the tilting of the wheel is measured using the same sensor that is used for measuring the rotation of the wheel. In one embodiment, a ratcheting feel provided to the user when rotating the wheel is synchronized with the rotation signal.

Abstract: An all-in-one electrical device includes a front enclosure module, a rear enclosure module, a touch screen, and a middle module. The front enclosure module includes a frame. An opening is defined in the frame. A number of restricting members extend backwards from the frame. The rear enclosure module includes a cover detachably fixed to the frame. The touch screen is received in the frame and exposed through the opening. A forward freedom of motion (FOM) of the touch screen is restricted by the frame. Leftward, rightward, upward and downward FOMs of the touch screen are restricted by the number of restricting members. The middle module is detachably fixed to the frame and received between the frame and the cover. The middle module restricts a backward FOM of the touch screen.