Abstract: A circuit is constituted by a plurality of n-channel-type transistors, the circuit including: among the plurality of transistors, a transistor including a drain terminal for receiving a voltage of VDD, a source terminal, and a gate terminal for receiving an input signal; among the plurality of transistors, a transistor including a drain terminal for receiving the voltage of VDD, a source terminal connected to an output terminal, and a gate terminal connected to the source terminal of the transistor; and a capacitor provided between a node and a clock terminal for receiving a clock signal. In at least one embodiment, the clock signal inputted into the clock terminal has a frequency higher than that of an output signal outputted from the output terminal.

Abstract: A power supply potential detecting circuit detects a power supply potential of a second circuit block when a first circuit block shifts from a power supply shutdown state to a power supply feeding state or shifts from the power supply feeding state to the power supply shutdown state. Then, an operation control circuit temporarily stops a function of the second circuit block when the first circuit block shifts from the power supply shutdown state to the power supply feeding state or shifts from the power supply feeding state to the power supply shutdown state and then recovers the function of the second circuit block based on a detection result outputted from the power supply potential detecting circuit.

Abstract: In an embodiment, a semiconductor device has a semiconductor body of a first semiconductor type, a first region of a second semiconductor type disposed in the semiconductor body, and a second region of the first semiconductor type disposed within the first region, where the second semiconductor type is opposite the first semiconductor type, and where an interface between the first region and the semiconductor body forms a first diode junction. The semiconductor device also has a comparator with a first input coupled to the semiconductor body and a second input coupled to the first region, and a switch having a first output node coupled to the first region, and a second output node coupled to the semiconductor body. The semiconductor body, the first region and the second region are configured to be coupled to a first supply voltage, a second supply voltage, and a third supply voltage, respectively.

Abstract: Systems and methods for providing one or more reference currents with respective negative temperature coefficients are provided. A first voltage is divided to provide a divided voltage, which is compared to a reference voltage (e.g., a bandgap reference voltage) to provide a control voltage. The first voltage and the one or more reference currents are based on the control voltage.

Abstract: A device for transferring charges photogenerated in a portion of a semiconductor layer delimited by at least two parallel trenches, each trench including, lengthwise, at least a first and a second conductive regions insulated from each other and from the semiconductor layer, including the repeating of a first step of biasing of the first conductive regions to a first voltage to form a volume accumulation of holes in the area of this portion located between the first regions, while the second conductive regions are biased to a second voltage greater than the first voltage, and of a second step of biasing of the first regions to the second voltage and of the second regions to the first voltage.

Abstract: Embodiments relate to a method including receiving a voltage potential at a gate of a first MOSFET based on a sensed chemical characteristic. The method includes receiving at a backgate of the first MOSFET an AC voltage signal and analyzing, with an analysis circuit connected to one of a first source and a first drain of the MOSFET, the sensed characteristic based on the receiving the voltage potential at the gate of the first MOSFET.

Abstract: A drive frequency source with two selectable output frequencies connected to two charge pump arrays. A first array of basic charge pump units is connected to the first output frequency and a second array of basic charge pump units is connected to the output frequency. One or more of the basic charge pump units making up the aforementioned first and second charge pump arrays has an enable input allowing its output current contribution to be added or subtracted from the total array output. The output of the first array is coupled to a P-type substrate and the output of the second array is coupled to an N-well residing in the P-type substrate. A controller may be coupled to the drive frequency source for selecting the output frequencies, and an output monitor may be coupled between the array outputs and the controller to provide feedback.

Abstract: A differential voltage controlled current source generating one or more output currents is based upon a single external resistor. The differential voltage controlled current source may generate an output current that is proportional to a received differential voltage and a bias current with the use of a single external resistor. The technique may be used to generate multiple accurate and process independent current sources. The current sources may be a zero temperature coefficient (ZTC) current, a proportional to absolute temperature (PTAT) current, or an inversely proportional to absolute temperature (NTAT) current. The output of the current sources may be inversely proportional to the resistance of the external resistor.

Abstract: A body control apparatus for an analog switch for minimizing leakage current and keeping PN junctions reverse-biased. The analog switch has first and second switch device clusters coupled between input and output nodes and controlled by a control input, each having a corresponding body junction. The body control apparatus includes body control devices each controlled by one of the input and output nodes for coupling a body junction to the opposite one of the input and output nodes. Each switch device cluster may include a main switch and body devices which keep the body junction of the main switch at a voltage level between the input and output nodes when the analog switch is on. When the analog switch is off, the body control apparatus activates when voltage across the input and output nodes rises to keep the body junctions at desired voltage levels.

Abstract: Provided are an analog digital converting device and a reference voltage controlling method thereof. The analog digital converting device includes: a first reference voltage generating circuit generating a first reference voltage; a second reference voltage generating circuit generating a second reference voltage; a first sub analog digital converter receiving an analog input signal and converting the analog input signal into a first digital signal by using the first reference voltage; an amplifier converting the first digital signal into a voltage corresponding to the first digital signal by using the first reference voltage and amplifying a difference between a voltage level of the analog input signal and a voltage level corresponding to the first digital signal to output a residual signal; and a second sub analog digital converter receiving the residual signal and converting the residual signal into a second digital signal by using the second reference voltage.

Abstract: An electronic apparatus for providing supply voltage to a first external device with a predetermined pin assignment specification is provided. The electronic apparatus includes a connection interface and a voltage supplier. The connection interface includes a first pin and a second pin. The voltage supplier provides a detection voltage signal to the first pin and determines whether to provide the supply voltage according to whether the second pin is at a first level in response to the detection voltage signal. When the second pin is at the first level in response to the detection voltage signal, the voltage supplier provides the supply voltage to the first pin.

Abstract: Semiconductor devices are described, along with methods and systems that include them. One such device includes a diffusion region in a semiconductor material, a terminal coupled to the diffusion region, and a field plate coupled to the terminal and extending from the terminal over the diffusion region to shield the diffusion region. Additional embodiments are also described.

Abstract: Embodiments of a method, apparatus and circuit for voltage regulation are disclosed. One embodiment of a circuit includes a first field effect transistor (FET) having a gate, a drain and a source. A current source is connected to the drain of the FET. A second FET has a source connected to the source of the first FET by a node. The second FET also has a gate. A low-pass filter circuit has an input connected to the gate of the first FET and an output connected to the gate of the second FET.

Abstract: Apparatuses and methods for disabling well bias are disclosed. In one embodiment, an apparatus includes a complimentary metal oxide semiconductor (CMOS) switch having a gate, a drain, a source, and a well. The source and drain are formed in the well. The gate is formed adjacent the well between the source and drain, and the source is configured to receive a bias voltage from a power amplifier. The apparatus further includes a well bias control block for biasing the well voltage of the first switch and a disable circuit for disabling the well bias control block so as to prevent the well bias control block from biasing the well. The well bias control block can bias the well voltage of the first switch to at least two voltage levels.

Abstract: A capacitance structure comprises a plurality of metal oxide silicon (MOS) capacitors. A first end of each MOS capacitor of the plurality of MOS capacitors is coupled together at an effective node. A second end of each MOS capacitor of the plurality of MOS capacitors is configured to receive a respective different signal. Each first end of each MOS capacitor of the plurality of MOS capacitors thereby functions as an input end of a capacitor with a capacitance value determined based on the respective different signal. An effective capacitance value thereby results at the effective node.

Abstract: A RFID transponder includes an electronic circuit and an antenna, the electronic circuit being integrated in a p-type substrate and comprising a modulator formed by a PMOS transistor whose drain, electrically connected to a pad of the antenna, and source, connected to the ground of the electronic circuit, are arranged in an n-type well provided in the p-type substrate. The PMOS transistor has a gate driven by a driving circuit which is arranged for providing at least a negative voltage, this negative voltage being low enough for turning on this PMOS transistor in response to a control signal provided by a logical unit of the electronic circuit.

Abstract: A switch can be implemented by a switch circuit, which can include a pair of NMOS transistors connected in series as pass-through transistors to transmit an input signal at an input terminal to produce an output signal at output terminal in response to an active state of a switching signal, and a pair of PMOS transistors connected in series as pass-through transistors to transmit the input signal at the input terminal to produce the output signal at output terminal in response to the active state of the switching signal. The switch circuit can also include a switch network connecting, in response to the active state of the switching signal, sources to bodies of the pairs of NMOS and PMOS transistors, and connecting, in response to an inactive state of the switching signal, the bodies of the pair of NMOS transistors to a first reference voltage, the bodies of the pair of PMOS transistors to a second reference voltage, and the sources of the pairs of NMOS and PMOS transistors to a third reference voltage.

Abstract: A semiconductor integrated circuit includes a cascode circuit having a transistor, a detector circuit and a bias generator circuit. A bias is applied to a substrate of the transistor. The detector circuit generates a signal related to a threshold voltage of the transistor. The bias generator circuit generates the bias based on the signal generated by the detector circuit.

Abstract: Embodiments of a dynamic leakage control circuit for use with graphics processor circuitry are described. The dynamic leakage control circuit selectively enables back biasing of the transistors comprising the graphics processor circuits during particular modes of operation. The back biasing levels are controlled by two separate power rails. A first power rail is coupled to an existing power supply and the second power rail is coupled to a separate adjustable voltage regulator. A separate voltage regulator may also be provided for the first power rail. A hardware-based state machine or software process is programmed to detect the occurrence of one or more modes of operation and adjust the voltage regulators for the first and second power rails to either enable or disable the back biasing state of the circuit, or alter the threshold voltage of the circuit within a specified voltage range.

Abstract: A semiconductor integrated circuit includes a main circuit including a transistor, a pseudo-power supply line connected to a first power supply terminal of the main circuit, a first power supply line connected to the pseudo-power supply line via a first switch, a second power supply line connected to a second power supply terminal of the main circuit, a diode having a first end connected to the pseudo-power supply line and a second end connected to the first power supply line so that a potential difference between the pseudo-power supply line and the second power supply line is reduced in a conductive state, and a second switch having a first end connected to the pseudo-power supply line and a second end connected to the second power supply line.

Abstract: Disclosed is a semiconductor device including a mode control circuit that, when a standby control signal is in an activated state, based on a timer output signal from a timer circuit, generates a MODE control output signal that changes a logic state of a functional circuit part at every prescribed time interval, and an output control circuit that receives an output signal of the functional circuit part and controls output of the output signal; based on a delay output signal generated by delaying a MODE control output signal by a delay circuit. While the functional circuit part is changing the logic state by the MODE control output signal, the output control circuit does not transfer the functional circuit part output signal to output, but holds and outputs a functional circuit part output signal immediately before the functional circuit part changes the logic state by the MODE control output signal.

Abstract: A design structure embodied in a machine readable medium used in a design process includes a current mirror circuit that includes a reference current source that generates a reference current, a reference transistor, a mirror transistor and a ratioed body bias feedback unit. The reference transistor has a first node that is coupled to the output of the reference current source, a gate that is coupled to the first node and a second node coupled to a common voltage. The mirror transistor has a gate coupled to the first node. The ratioed body bias feedback unit generates a body bias voltage coupled to the body of the reference transistor and the body of the mirror transistor. The ratioed body bias feedback unit is configured to adjust the body bias voltage in relationship to the common voltage so that the reference transistor and the mirror transistor each have a threshold voltage within a predefined range.

Abstract: A pair of power nodes of a logic circuit that needs to output a high level at the time of standby is connected to third and fifth dummy power lines and a pair of power nodes of a logic circuit that needs to output a low level at the time of standby are connected to second and sixth dummy power lines. Fourth, third, sixth, and fifth potentials of the second, third, fifth, and sixth dummy power lines satisfy fourth potential<third potential<first potential, and sixth potential>fifth potential>second potential. With this configuration, a leakage current flowing between a substrate and a gate of a transistor that becomes on at the time of standby, and a leakage current flowing between the substrate and a drain of a transistor that becomes off at the time of standby can be reduced.

Abstract: A layout for a semiconductor integrated circuit device can maintain a sufficient capacitance of a capacity cell even when a height of the cell is lowered. In this layout, power supply wiring extending along a first direction supplies a first supply voltage, power supply wiring and power supply wiring extending in parallel with the power-supply wiring supply a second and a third supply voltages respectively. Capacitive element is formed of a transistor that receives the first supply voltage at its source and drain, and receives the second or the third supply voltages at its gate. Capacitive element is disposed under power supply wiring such that it strides over a portion at power supply wiring side and a portion at power supply wiring side.

Abstract: A semiconductor element 100 including an MISFET according to the present invention is characterized by having diode characteristics in a reverse direction through an epitaxial channel layer 50. The semiconductor element 100 includes a semiconductor layer 20 of a first conductivity type, a body region 30 of a second conductivity type, source and drain regions 40 and 75 of the first conductivity type, an epitaxial channel layer 50 in contact with the body region, source and drain electrodes 45 and 70, a gate insulating film 60, and a gate electrode 65. If the voltage applied to the gate electrode of the MISFET is smaller than a threshold voltage, the semiconductor element 100 functions as a diode in which current flows from the source electrode 45 to the drain electrode 70 through the epitaxial channel layer 50. The absolute value of the turn-on voltage of this diode is smaller than that of the turn-on voltage of a body diode that is formed of the body region and the first silicon carbide semiconductor layer.

Abstract: An analog switch including at least one first MOS transistor capable of transferring a signal from a first terminal to a second terminal; a connection circuit for bringing a substrate terminal of the first transistor to a voltage which is a function of the voltages of the first and second terminals; and a circuit for controlling a control voltage of the first transistor with the signal.

Abstract: A semiconductor device includes: first and second circuit cell arrays extending in first direction; first and second power supply lines each extending in first direction and arranged over first circuit cell array, first power supply line being supplied with first power source voltage; third power supply line extending in first direction separately from second power supply line, arranged over second circuit cell array, and supplied with second power source voltage; first transistor coupled between second and third power supply lines; and first circuit arranged on first circuit cell array and operating on first and second power source voltages supplied from first and second power supply lines, respectively.

Abstract: A high-speed semiconductor integrated circuit device is achieved by adjusting an offset voltage. For example, dummy NMOS transistors MND1 (MND1a and MND1b) and MND2 (MND2a and MND2b) are connected to drain outputs of NMOS transistors MN1 and MN2 operated according to differential input signals Din_p and Din_n, respectively. The MND1 is arranged adjacent to the MN1, and a source of the MND1a and a drain of the MN1 share a diffusion layer. The MND2 is arranged adjacent to the MN2, and a source of the MND2a and a drain of the MN2 share a diffusion layer. The MND1 and the MND2 function as dummy transistors for suppressing variations in process of the MN1 and the MN2 and, and besides, they also function as means for adjusting the offset voltage by appropriately applying an offset-amount setting signal OFST to each gate to provide a capacitor to either the MN1 or the MN2.

Abstract: Provided are a switching circuit and a small-size high-efficiency direct current-to-direct current (DC-DC) converter for portable devices including the same. Using dynamic threshold-complementary metal oxide semiconductor (DT-CMOS) transistors having dynamic threshold voltages as a switching device, the switching circuit maintains a low threshold voltage in a normal mode to improve current drivability while reducing conduction loss, and maintains a high threshold voltage in a standby mode to minimize power consumption. When the switching circuit is employed in a DC-DC converter, power conversion efficiency can be improved by reducing conduction loss in the normal mode, and power consumption can be minimized in the standby mode. Consequently, the DC-DC converter can maximize a use time of a battery of a portable device and can be useful in power supplies of portable devices that are gradually being miniaturized.

Abstract: Disclosed are a spin transistor and a method of operating the spin transistor. The disclosed spin transistor includes a channel formed of a magnetic material selectively passing a spin-polarized electron having a specific direction, a source formed of a magnetic material, a drain, and a gate electrode. When a predetermined voltage is applied to the gate electrode, the channel selectively passes a spin-polarized electron having a specific direction and thus, the spin transistor is selectively turned on.

Abstract: While an IC chip is in idle mode with no power being supplied to the IC chip, the IC chip may be operable to detect a signal pulse received by the IC chip using energy associated with the signal pulse. The IC chip may be operable to control a control signal for a power switch using the energy associated with the signal pulse. The power switch may allow power to be provided to the IC chip based on the control signal. The IC chip may comprise a pulse detector, a latch circuit and an ON/OFF logic circuit within the IC chip. While the IC chip is fully powered and communication with a partner chip is finished, the IC chip may be operable to control the control signal to turn off the power switch for powering down the IC chip based on a turn-off signal.

Abstract: A charge pump in a low dropout (LDO) regulator includes a first capacitor coupled to an output of an amplifier and to a gate of a pass transistor. A first plurality of switches is operable to couple a second capacitor between an output of the LDO regulator and to a ground in a first clock phase, such that the second capacitor charges to an output voltage. A second plurality of switches is operable to couple the second capacitor in parallel to the first capacitor in a second clock phase such that the second capacitor charges the first capacitor.

Abstract: As provided herein, in some embodiments, power consumption and/or chip area is reduced by bias circuits configured to provide bias conditions for more than one active circuit, thereby reducing the number of bias circuits in a design. Shared bias circuits may reduce the aggregate amount of on-chip area utilized by bias circuitry and may also reduce the total power consumption of a chip. Additionally and/or alternatively, bias circuits disclosed herein are configured to provide outputs that are less susceptible to changes in the voltage supply level. In particular, in some embodiments, bias circuits are configured to provide relatively constant bias conditions despite changes in the voltage supply level. A bias circuit arrangement with an output substantially decoupled from changes in the voltage supply level may provide a more stable operating point in an active circuit.

Abstract: According to one embodiment, a semiconductor device includes a semiconductor circuit and an electric-power supply. The semiconductor circuit includes a main element including a switching element and an antiparallel diode, a reverse voltage application circuit including a high-speed free wheeling diode, a capacitor and an auxiliary element, a main element drive circuit, and an auxiliary element drive circuit. The electric-power supply is configured to supply electric-power to the capacitor, the main element drive circuit and the auxiliary element drive circuit, and has a voltage lower than the withstand voltage of the main element.

Abstract: Dynamic biasing methods and circuits are described. The described methods generate bias voltages that are continuously varied so as to control stress voltages across transistors used within a cascode stack.

Abstract: A reference-voltage generating circuit of an embodiment includes a first FET; a second FET; a first resistor in which one end is connected to a power supply while the other end is connected to a drain of the first FET; and a second resistor that is connected between the drain and a gate of the first FET, wherein a gate and a source of the second FET are connected, a drain of the second FET is connected to the gate of the first FET, the drain of the first FET outputs a reference voltage, and the source of the first FET and the source of the second FET are connected to a ground or another circuit.

Abstract: A replica biased voltage regulator circuit and method of load regulation are provided herein. According to one embodiment, the replica biased voltage regulator circuit includes an operational amplifier and a comparator, wherein outputs of the operational amplifier and comparator are respectively and simultaneously supplied to a front gate and a back gate of an output stage transistor included for regulating an output voltage generated by the replica biased voltage regulator circuit.

Abstract: A semiconductor device includes a first conductive type first transistor, a first conductive type second transistor, a first power supply pad arranged between the first transistor and the second transistor and supplying a first potential, a second conductive type third transistor, a second conductive type fourth transistor, a second power supply pad arranged between the third transistor and the fourth transistor and supplying a second potential, a first output pad arranged between the first transistor and the third transistor, and a second output pad arranged between the second transistor and the fourth transistor, in which a direction in which a line connecting the first power supply pad with the second power supply pad extends is perpendicular to a direction in which a line connecting the first output pad with the second output pad extends.

Abstract: Aspects of the invention may include receiving a first input signal and a second input signal via respective first and second input transistors. A biasing signal, generated by a cascode bias generator, tracks the first input signal, where the biasing signal has a fixed offset with respect to the first input signal. The biasing signal may be applied to the first and second cascode transistors that may be cascoded to the first and second input transistors, respectively.

Abstract: Aspects of the invention provide, inter alia, techniques for shifting auto-zero voltage in analog comparators. An embodiment of the invention may include at least one diode configured transistor to increase a drain voltage of at least one NMOS load transistor. A first switch and a second switch may be implemented to increase a voltage at a gate of a first PMOS input transistor and a voltage at a gate of a second PMOS input transistor when the first switch and the second switch are closed.

Abstract: Data is written in the following manner: potentials of first and second control gates of a transistor are set at a potential for making a storage gate of the transistor a conductor, a potential of data to be stored is supplied to the storage gate, and at least one of the potentials of the first and second control gates is set at a potential for making the storage gate an insulator. Data is read in the following manner: the potential of the second control gate is set at a potential for making the storage gate an insulator; a potential is supplied to a wiring connected to one of a source and a drain of the transistor; then, a potential for reading is supplied to the first control gate to detect a change in the potential of a bit line connected to the other of the source and the drain.

Abstract: A biasing circuit of an integrated circuit includes a well of the integrated circuit and a plurality of transistors disposed in the well. The transistors couple the well to three signals providing corresponding voltages. The transistors bias the well to an extreme one of the corresponding voltages for the three signals.

Abstract: A method and system for power supply management in an integrated chip selectively manages the power supplied to the various circuits within the integrated circuit. The integrated circuit includes a combinational logic block, a memory block, a power supply block, and a control block. The power supply block includes multiple power regulators for generating power supply potentials of various magnitudes. The control block receives a power down signal, a clock disable signal, and a temperature threshold signal, and generates control signals for controlling the magnitude of the potential of the power supplied to the combinational logic block and the memory block by the power supply block.

Abstract: A semiconductor device prevents the OFF current of a complementary field effect transistor from varying with changes in ambient temperature. The semiconductor device includes: a substrate voltage generating circuit that generates the substrate voltage of an n-channel MOS transistor forming a CMOS; a replica transistor that is a replica of the n-channel MOS transistor, and is diode-connected; and a voltage applier that applies a voltage of a predetermined voltage value between the anode and cathode of the replica transistor. In this semiconductor device, the substrate voltage of the replica transistor is the substrate voltage generated by the substrate voltage generating circuit. The substrate voltage generating circuit controls the substrate voltage to be generated so that the current value of the current flowing into the replica transistor becomes equal to a given target value.

Abstract: A first power supply voltage input section can input a first power supply voltage, a second power supply voltage input section can input a second power supply voltage, a regulator circuit generates a back bias voltage on the basis of the second power supply voltage, and an output section can output the back bias voltage generated by the regulator circuit as an output voltage. A substrate bias can be generated with low power consumption, and the circuit scale can be reduced.

Abstract: The present invention is directed to an MIS type semiconductor device, including a channel layer between a semiconductor body region and a gate insulating film, the channel layer having an opposite semiconductor polarity to that of the semiconductor body region. Since Vfb of the semiconductor device is equivalent to or less than a gate rated voltage Vgcc? of the semiconductor device with respect to an OFF-polarity, density of carrier charge that is induced near the surface of the semiconductor body region is kept at a predetermined amount or less with a guaranteed range of operation of the semiconductor device.

Abstract: A method of actuating a semiconductor device includes providing a transistor. The transistor includes a substrate. A first electrically conductive material layer is positioned on the substrate. A second electrically conductive material layer is in contact with and positioned on the first electrically conductive material layer. A third electrically conductive material layer is in contact with and positioned on the second electrically conductive material layer. The third electrically conductive material layer overhangs the second electrically conductive material layer. An electrically insulating material layer is conformally positioned over the third electrically conductive material layer, the second electrically conductive material layer, the first electrically conductive material layer, and at least a portion of the substrate. A semiconductor material layer conforms to and is in contact with the electrically insulating material layer.

Abstract: A method of actuating a semiconductor device includes providing a transistor. The transistor includes a substrate. A first electrically conductive material layer is positioned on the substrate. A second electrically conductive material layer is in contact with and positioned on the first electrically conductive material layer. The second electrically conductive material layer includes a reentrant profile. The second electrically conductive material layer also overhangs the first electrically conductive material layer. An electrically insulating material layer is conformally positioned over the second electrically conductive material layer, the first electrically conductive material layer, and at least a portion of the substrate. A semiconductor material layer conforms to and is in contact with the electrically insulating material layer. A third electrically conductive material layer is nonconformally positioned over and in contact with a first portion of the semiconductor material layer.

Abstract: An analog T switch is disclosed which has high isolation in the off state. The analog T switch can include series-connected NMOS transistors having separate gate control. The gates of the NMOS transistors can be isolated from one another to improve off state isolation of the analog T switch. The analog switch can include series-connected PMOS transistors having separate gate control. The gates of the PMOS transistors can be isolated from one another to improve off state isolation of the analog T switch. The analog T switch can include a substrate voltage control circuit that controls the voltage of the substrate regions in which the PMOS transistors are formed. The substrate voltage control circuit can isolate the substrate regions of the PMOS transistors from one another in the off state to improve off state isolation of the analog T switch.

Abstract: A method and apparatus is taught for reducing drain-source leakage in MOS circuits. In an exemplary CMOS inverter, a first transistor causes the body of an affected transistor to be at a first body potential. A second transistor brings the body potential of the affected transistor to a second body potential by providing an accurate body voltage from a body voltage source. Exemplary body bias voltage sources are further described that can drive one or more gate transistors of different gate circuits.