Abstract: A control circuit for controlling an output transistor for outputting power includes: a ramp terminal connected to a ramp resistance; a ramp waveform generation unit for generating a ramp waveform including a slope corresponding to a resistance value of the ramp resistance; an output control unit for controlling at least one of an ON time or an OFF time of the output transistor based on a comparison result between the ramp waveform and a comparison voltage; and a state detection unit for detecting a state of the ramp resistance connected to the ramp terminal, wherein the output control unit turns the output transistor to an OFF state regardless of the comparison result, when the state of the ramp resistance becomes a predetermined state.

Abstract: A method for dynamic immutable security personalization for enterprise products. Specifically, the disclosed method describes how a computer processor (e.g., baseboard management controller) of an enterprise product can personalize security requirements in trusted facilities, along the supply chain route of the enterprise product, so that trusted assumptions concerning the enterprise product can be made. Further, through dynamic immutable security personalization, these trusted assumptions are allowed to change over time (e.g., from being less restrictive to more restrictive) as changing enterprise product configuration states are captured while the enterprise product traverses the supply chain route.

Abstract: A text-to-database neural network architecture is provided. The architecture receives a natural language question and a database schema and generates a serialized question-schema representation that includes a question and at least one table and at least one field from the database schema. The serialized question-schema representation is appended with at least one value that matches a word in the natural language question and at least one field in a database picklist. An encoder in the architecture generates question and schema encodings from the appended question-schema representation. Schema encodings are associated with metadata that indicates a data type of the fields and whether fields are associated with primary or foreign keys. A decoder in the architecture generates an executable query from the question encodings and schema encodings.

Abstract: A memory device includes a terminal calibration circuit having at least one of a pull-down circuit or a pull-up circuit used in calibrating an impedance of a data bus termination. The memory device also includes a reference calibration circuit configured to generate a calibration current. The terminal calibration circuit can be configured to program an impedance of the least one of a pull-down circuit or a pull-up circuit based on the calibration current.

Abstract: Techniques in electronic systems, such as in systems including a processing chip and one or more external memory chips, provide improvements in one or more of system security, performance, cost, and efficiency. In some embodiments, the processing chip includes immutable hardware that is enabled, without a use of any CPUs, to determine and/or confirm an expected configuration of one or more external memory chips (such as with a Serial Presence Detect operation), and/or to enable communication with the one or more external memory chips. The immutable hardware is further enabled to copy executable code from a non-volatile one of the one or more external memory chips to another of the one or more external memory chips so that a CPU of the processing chip is able to securely boot by fetching initial instructions from the copy of the executable code.

Abstract: In an embodiment, an apparatus includes a source device including a first current limiter and a second current limiter in parallel with each other and a first transformer and a second transformer; a load device includes a third transformer and a fourth transformer in parallel with each other; and an Ethernet cable is electrically coupled between the source device and the load device, the Ethernet cable including first twisted pair lines and second twisted pair lines. A direct current (DC) voltage is provided to the first current limiter and the second current limiter, the first transformer is electrically coupled to an output of the first current limiter, and the second transformer is electrically coupled to an output of the second current limiter. The DC voltage is transmitted to the third transformer and the fourth transformer in parallel with each other via the first twisted pair lines and the second twisted pair lines.

Abstract: A power distribution circuit can include a comparator circuit that is formed of an inverter. The inverter can be configured with a trip voltage value (Vtrip) different than half a supply voltage value (VDD/2) for further energy efficiencies in discharging a charge storage device used in the power distribution circuit to gain security.

Abstract: In some examples, a system comprises a bi-directional gallium nitride (GaN) device including first and second switches and a substrate, the first switch including a first gate and a first source, the second switch including a second gate and a second source, and the substrate shared between the first and second switches. The system include a third switch coupled to the first source and the substrate. The system includes a fourth switch coupled to the second source and the substrate and a comparator having inputs coupled to the first and second sources and outputs coupled to the third and fourth switches.

Abstract: A semiconductor device includes an operation control circuit and a mode register activation signal generation circuit. The operation control circuit generates a chip identification storage control signal, a selection identification storage control signal, and a mode register set signal in response to an external set signal and a command. The mode register activation signal generation circuit generates a chip identification and a selection identification in response to the chip identification storage control signal and the selection identification storage control signal. The mode register activation signal generation circuit also generates a mode register activation signal for controlling a mode register set operation in response to the mode register set signal when the chip identification is identical to the selection identification.

Abstract: An electronic device and method utilizes an external sensor group to facilitate miniaturization the device and repair/replacement of external sensors. An interface connected to an external sensor package including at least one sensor. A processor that when the external sensor package is connected through the interface, determines from which group the external sensor package is included in among pre-configured groups and controls the performance of a function corresponding to the determined group.

Abstract: The present invention relates to a capacitance multiplier topology suitable for both positive and negative capacitance multiplication having a minimum configuration consisting of a current feedback amplifier (CFOA), two resistors and a reference capacitor, with each C-multiplier having a respective capacitance amplification constant k which is externally adjustable. Such a capacitance multiplier has less parasitic components, occupies a smaller chip area with higher simulated capacitance value.

Abstract: A pixel circuit and driving method thereof, and a display device are provided. The pixel circuit comprises a light-emitting element, a first, second, third, and fourth transistors, and a capacitor element. The first transistor is configured to time-sharingly receive a data voltage and a power supply voltage under control of a first voltage signal. The second transistor is configured to detect and compensate a threshold voltage deviation of the first transistor under control of a first scanning signal. The third transistor is configured to provide a driving current generated by the first transistor to the light-emitting element under control of a light-emitting signal. The fourth transistor is configured to transmit a reset signal to an anode of the light-emitting element under control of a second scanning signal. The capacitor element is configured to store the data voltage transmitted to the first transistor. The light-emitting element is configured to emit light.

Abstract: Integrated circuits and coupled inductors with isotropic magnetic cores, and methods for fabricating integrated circuits and coupled inductors with isotropic magnetic cores are provided. In an embodiment, a method for fabricating an integrated circuit is provided. The method includes providing a semiconductor substrate and forming an isotropic magnetic core bottom yoke over the semiconductor substrate. Further, the method includes forming an inductor coil over the isotropic magnetic core bottom yoke. Also, the method includes forming isotropic magnetic core sidewalls over the isotropic magnetic core bottom yoke and around the inductor coil. The method includes forming an isotropic magnetic core top yoke over the isotropic magnetic core sidewalls and over the inductor coil.

Abstract: The semiconductor device according to an exemplary embodiment includes: a driver configured to output first and second signals complementary to each other through first and second nodes, respectively; and a receiver detector configured to detect whether a reception circuit of an active state is connected to the first node and the second node according to a voltage of the first node and a voltage of the second node. The receiver detector is configured to compare the voltage of the first node with a first reference voltage, compare the voltage of the second node with a second reference voltage, and detect whether the reception circuit of the active state is connected according to a comparison result of the voltage of the first node and a comparison result of the voltage of the second node.

Abstract: A flat panel display includes a signal generator to generate data signals to respective data lines via an output terminal or to generate a control signal for controlling switches. The signal generator includes a first voltage supply unit to supply, to the output terminal, a voltage of a first voltage sources, a voltage stabilizing unit to raise or drop the voltage supplied to the output terminal, and a second voltage supply unit to supply, to the output terminal, a voltage from a second voltage source, after the voltage of the output terminal is raised or dropped.

Abstract: A first aspect provides in a supply voltage control module, a method of providing instructions for setting a supply voltage comprising obtaining information on a supply voltage need of a load and based on that information, determining a supply voltage that is to be provided to the load. Subsequently, an instruction is sent to a power supply module to supply the determined supply voltage to the load. A need for a supply voltage of a load, like an integrated circuit, may not only depend on design of the load, but also on parameters of the manufacturing process and the level of activity of the load. By obtaining information on a supply voltage need of the load and using that information to determine a supply voltage to be provided to the load, a feedback loop is created by instructing a point of load power supply to provide the supply voltage determined.

Abstract: An audio plug detection structure is disclosed, which is adapted for an audio jack corresponding to an audio plug and includes a first and second connection points, a time-varying signal generation circuit, and a comparison circuit. The time-varying signal generation and comparison circuits are connected to the first connection point. When the audio plug is inserted into the audio jack, the first connection point is connected to a first pole of the audio plug and the second connection point is connected to a second pole different from the first pole of the audio plug. Therefore, the time-varying signal generation circuit, the first connection point, an inner impedance circuit of the audio plug and the second connection plug form a loop. The comparison circuit outputs a determination signal indicating the audio plug is inserted by detecting a change of a time-varying signal generated by the time-varying signal generation circuit.

Abstract: A method is disclosed that includes the operations outlined below. A first criteria is determined to be met when directions of a first current and a second current around a first end and a second end of a metal segment respectively are opposite, in which the metal segment is a part of a power rail in at least one design file of a semiconductor device and is enclosed by only two terminal via arrays. A second criteria is determined to be met when a length of the metal segment is not larger than a electromigration critical length. The metal segment is included in the semiconductor device with a first current density limit depending on the length of the metal segment when the first and the second criteria are met.

Abstract: A novel and useful millimeter-wave digitally controlled oscillator (DCO) that achieve a tuning range greater than 10% and fine frequency resolution less than 1 MHz. Switched metal capacitors are distributed across a passive resonator for tuning the oscillation frequency. To obtain sub-MHz frequency resolution, tuning step attenuation techniques are used that exploit an inductor and a transformer. A 60-GHz fine-resolution inductor-based DCO (L-DCO) and a 60 GHz transformer-coupled DCO (T-DCO), both fabricated in 90 nm CMOS, are disclosed. The phase noise of both DCOs is lower than ?90.5 dBc/Hz at 1 MHz offset across 56 to 62 GHz frequency range. The T-DCO achieves a fine frequency tuning step of 2.5 MHz, whereas the L-DCO tuning step is over one order of magnitude finer at 160 kHz.

Abstract: A general-purpose peripheral interface according to an exemplary embodiment of the present invention includes a pair of complementary connectors including at least one input terminal, at least one output terminal, and at least one power supply terminal and ground terminal, wherein when a connector of a peripheral device is combined to a connector of a control device, an identification voltage in a voltage range varying according to a type of the peripheral device is shown in the input terminal. Here, the voltage ranges may be set not to overlap each other when the types of the peripheral devices are different. The type of the peripheral device may be one of an input type, an input-output mixed type, and an output type.

Abstract: An integrated circuit (IC) includes a first power supply node that is arranged to receive a first power supply signal. The IC also includes process detection circuits. Each process detection circuit provides a process detection output signal such that a value associated with the process detection output signal is a function of process variation at a location of the process detection circuit outputting the process detection signal. The IC also includes a processing unit that executes processor-executable instructions to provide at least one voltage control signal, based, at least in part, on the process detection signals. The voltage control signal(s) include a first voltage control signal is associated with a target voltage for the first power supply signal.

Abstract: According to an aspect of the present invention, in a semiconductor device, a plurality of commands for specifying a circuit configuration of an analog front-end unit are transmitted from a processing unit to the analog front-end unit, an analysis is performed on the plurality of commands received by the analog front-end unit, and when a circuit configuration of the analog front-end unit which is to be updated and is determined according to the plurality of commands includes a forbidden condition that has been previously set, updating processing of the circuit configuration according to the plurality of commands is stopped.

Abstract: A coulomb counter is provided. In the coulomb counter, a current generated on charge or discharge of a secondary battery is converted into a voltage by a resistor, and the voltage is amplified by an amplifier circuit. The voltage amplified by the amplifier circuit is converted into a current by a voltage-current converter circuit, and the current is input to a cumulative addition circuit. The cumulative addition circuit charges a capacitor with the current input from the voltage-current converter circuit and generates a signal corresponding to a voltage generated across the capacitor. One terminal of the capacitor is connected to an output of the voltage-current converter circuit through a switch, and the other terminal of the capacitor is supplied with a constant potential. By on/off of the switch, supply of electric charge to the capacitor and storage of the electric charge can be controlled.

Abstract: An electronic circuit includes a plurality of circuit blocks, a plurality of bias circuits, a switching circuit, and plurality of transistors. The plurality of circuit blocks each includes a high power terminal and a low power terminal. The switching circuit includes a plurality of switches for selectively coupling a bias circuit of the plurality of bias circuits to the low power terminal of a circuit block of the plurality of circuit blocks. Each bias circuit of the plurality of bias circuits is selectively couplable to the low power terminal of each of the plurality of circuit blocks. Each transistor of the plurality of transistors has a first current terminal coupled to a circuit ground terminal, and each transistor of the plurality of transistors has a control terminal for controlling the conductivity of the plurality of the transistors by a bias circuit of the plurality of bias circuits.

Abstract: Provided are a trimming circuit which does not need a dedicated terminal to which a current for cutting a fuse is input, and also a semiconductor device including the trimming circuit. The trimming circuit includes: an input terminal connected to a pad which is an external terminal of an internal circuit; a fuse provided between a power supply terminal and an output terminal; and a diode provided between the input terminal and the output terminal. The trimming circuit performs trimming by applying, to the pad, such a voltage that the diode is biased in the forward direction.

Abstract: Systems, methods, and apparatus for controlling power semiconductor devices are described. According to one embodiment of the disclosure, there is disclosed a system. The system may include at least one power source for selectively providing power to one or more power semiconductor devices controlled by a gate driver. The gate driver may include at least one controller coupled to at least one power semiconductor device interface via a first channel and a second channel configured to provide galvanic isolation of information communicated between the controller and the at least one power semiconductor device interface.

Abstract: A method and circuit for implementing a chip to chip calibration in a chip stack, for example, with through silicon vias (TSV) stack, and a design structure on which the subject circuit resides are provided. A first chip and a second chip are included within a semiconductor chip stack. The semiconductor chip stack includes a vertical stack optionally provided with Though Silicon Via (TSV) stacking of the chips. At least one of the first chip and the second chip includes a calibration control circuit and a performance indicator circuit coupled to the calibration control circuit to train and calibrate at least one of the first chip and the second chip to provide enhanced performance and reliability for the semiconductor chip stack.

Abstract: A communication system according to one aspect of the present invention, comprises one or more integrated circuits. The one or more integrated circuits comprise at least one of a local integrated circuit and a remote integrated circuit. At least one sending application hardware module located on the local integrated circuit has a sending logic that controls the sending of messages from the sending application hardware module. At least one receiving application hardware module is located on at least one of the local integrated circuit or remote integrated circuit. A sending application hardware module sends messages to a receiving application hardware module without its sending logic having been constructed with a priori knowledge of the address of or the path to said receiving application hardware module. A dispatch logic located on the local integrated circuit that routes at least one or more.

Abstract: A microcontroller includes first and second modules. The first module can operate in a mode that causes interference with operation of the second module. A control circuit on the first module and a control circuit on the second module coordinate operation of the first and second modules to prevent the interference from causing the second module to function incorrectly.

Abstract: A hardware trie structure includes a tree of internal node circuits and leaf node circuits. Each internal node is configured by a corresponding multi-bit node control value (NCV). Each leaf node can output a corresponding result value (RV). An input value (IV) supplied onto input leads of the trie causes signals to propagate through the trie such that one of the leaf nodes outputs one of the RVs onto output leads of the trie. In a transactional memory, a memory stores a set of NCVs and RVs. In response to a lookup command, the NCVs and RVs are read out of memory and are used to configure the trie. The IV of the lookup is supplied to the input leads, and the trie looks up an RV. A non-final RV initiates another lookup in a recursive fashion, whereas a final RV is returned as the result of the lookup command.

Abstract: Semiconductor device packages comprise a first semiconductor device comprising a heat-generating region located on at least one end thereof. A second semiconductor device is attached to the first semiconductor device. At least a portion of the heat-generating region extends laterally beyond at least one corresponding end of the second semiconductor device. A thermally insulating material at least partially covers the end of the second semiconductor device. Methods of forming a semiconductor device packages comprise attaching a second semiconductor device to a first semiconductor device. The first semiconductor device comprises a heat-generating region at an end thereof. At least a portion of the heat-generating region extends laterally beyond an end of the second semiconductor device. The end of the second semiconductor device is at least partially covered with a thermally insulating material.

Abstract: An integrated circuit has a circuit part and a trimmable resistor, the resistance whereof may be modified by Joule effect. The trimmable resistor has first and second connection terminals coupled to the circuit part, and an intermediate terminal that divides the trimmable resistor into two portions. The first and the second connection terminals and the intermediate terminal are coupled to respective pads configured to receive electrical quantities designed to cause, in use, a respective trimming current flow in each portion. In this way, a substantially zero voltage drop is maintained between the first and second connection terminals while current is flowing in the resistor to change an electrical characteristic of the resistor, such as resistance or thermal coefficient.

Abstract: In an A/D conversion circuit and an imaging device, an upper counter acquires a first upper count value by performing counting using one output signal, which constitutes a first lower phase signal output from a delay circuit, as a count clock. After values of bits constituting the first upper count value are inverted, the upper counter acquires a second upper count value by performing counting using one output signal, which constitutes a second lower phase signal output from the delay circuit, as a count clock, and further performing counting based on an upper count clock output from a lower counter. A modification unit modifies a logic state of a count clock to a predetermined state when the count clock of the upper counter is switched.

Abstract: A multi-chip package includes first and second semiconductor chips each configured to perform first and second operations having different current consumptions. The first and second semiconductor chips perform the first operation in response to an enable control signal transmitted from one of the first and second semiconductor chips to the other and transmitted from the other back to the one.

Abstract: An integrated circuit comprises a circuit module, a first function circuit, and a second function circuit. The first function circuit is configured to he operational in response to a first type logic signal at a first pin and the second function circuit is configured to be operational in response to a second type logic signal at the first pin. The type of logic signal at the first pin is determined by the circuit module. Based on the determined type of logic signal, the circuit module is configured to activate the appropriate function circuit and provide function related signaling for operation at a second pin. The circuit module allows the pins of the integrated circuit to be shared between the first and second function circuits, thus minimizing the number of pins required for multi-functional circuits on the integrated circuit.

Abstract: Disclosed are a terminal device and a method for realizing an analogue circuit in the terminal device. The terminal device includes control device and programmable analogue circuit device. The control device includes: acquisition module, configured to acquire the configuration data information corresponding to the function index and the parameter index of a target analogue circuit, wherein the configuration data information is configured to indicate the on/off state of an interconnection switch between CABs; downloading module, configured to download the configuration data information to the programmable analogue circuit device; and restart module, configured to restart the programmable analogue circuit device. The programmable analogue circuit device includes: a configurable analogue array module, configured to configure the parameters and/or the connection relationship of the CABs by using the configuration data information.

Abstract: Disclosed is a driver circuit structure integrated in a display panel. The driver circuit structure includes a plurality of transistors and a backup transistor. After completing the driver circuit structure, the disclosure inspects it to find an inactive transistor. The inspection process first, isolates the electrical connection between the inactive transistor and the first electrode line and/or the electrical connection between the inactive transistor and the second electrode line. Next, the source electrode of the backup transistor and the first electrode line and/or electrically connecting the drain electrode of the backup transistor and the second electrode line are electrical connected.

Abstract: A class-D amplifier includes a quantized amplifier, having no quantization error feedback circuit, coupled to receive a digital input signal, according to which an output signal is generated to be switched between power rails. The digital input signal is pre-compensated to correct an error. A low-pass filter is configured to operate on the output signal to generate a filtered output signal.

Abstract: A device and a method of thermal management. In one embodiment, the device includes an integrated circuit, including: (1) a conductive region configured to be connected to a voltage source, (2) a transistor having a semiconductor channel with a controllable conductivity and (3) first and second conducting leads connecting to respective first and second ends of said channel, wherein a charge in the conductive region is configured to substantially raise an electrical potential energy of conduction charge carriers in the semiconductor channel and portions of said leads are located where an electric field produced by said charge is substantially weaker than near the semiconductor channel.

Abstract: A fuse circuit includes an electric fuse coupled to a first voltage source; a low resistance unit coupled to the electric fuse and having a junction which is capable of breaking down; and a switching unit coupled between the low resistance unit and a second voltage source.

Abstract: The present invention relates to a method and an apparatus for determining an external connection device connected to a portable terminal. A multi-connector, and a charging cable and a data cable having the same are disclosed. According to the method, a logic level of the external connection device is determined when the external connection device is connected to the portable terminal. The external connection device is distinguished according to the logic level and performing control corresponding to the external connection device.

Abstract: A method and circuit for implementing a chip to chip calibration in a chip stack, for example, with through silicon vias (TSV) stack, and a design structure on which the subject circuit resides are provided. A first chip and a second chip are included within a semiconductor chip stack. The semiconductor chip stack includes a vertical stack optionally provided with Though Silicon Via (TSV) stacking of the chips. At least one of the first chip and the second chip includes a calibration control circuit and a performance indicator circuit coupled to the calibration control circuit to train and calibrate at least one of the first chip and the second chip to provide enhanced performance and reliability for the semiconductor chip stack.

Abstract: A semiconductor apparatus includes first and second chips sharing first and second data channels. The first and second chips output normal data of the respective chips through the first and second data channels in a normal operation, and the first chip outputs test data of the first chip through the first data channel, and the second chip outputs test data of the second chip through the second data channel in a test operation.

Abstract: Architecture for supporting ZIF or LIF/IF systems includes 4N pins, 2N ADCs, a determination unit and a processing unit, N being a positive integer. The 2N ADCs include a y-th ADC for converting a differential analog signal received by a (2y?1)-th pin and a 2y-th pin into a y-th digital signal, y being positive integers ranging from 1 to 2N. The determination unit determines whether the digital signals are ZIF signals, LIF signals or IF signals. The processing unit performs an ZIF system processing on the ZIF signals, performs a LIF system processing on the LIF signals, and performs an IF system processing on the IF signals.

Abstract: A compensation circuit for controlling a variation in output impedance of at least one buffer circuit includes a monitor circuit and a control circuit coupled with the monitor circuit. The monitor circuit includes a pull-up portion including at least one PMOS transistor and a pull-down portion comprising at least one NMOS transistor. The monitor circuit is configured to track an operation of an output stage of the buffer circuit and is operative to generate at least a first control signal indicative of a status of at least one characteristic of corresponding pull-up and pull-down portions in the output stage of the buffer circuit over variations in PVT conditions to which the buffer circuit may be subjected. The control circuit is operative to generate a set of digital control bits as a function of the first control signal. The set of digital control bits is operative to compensate the pull-up and pull-down portions in the output stage of the buffer circuit over prescribed variations in PVT conditions.

Abstract: A test circuit tests a nonvolatile circuit element having multiple intermediate states. The test circuit includes a waveform generator configured to apply a waveform to the circuit element connected to the test circuit. The waveform includes stress pulses applied to the circuit element over time. A detector detects a parameter of the circuit element as the waveform is applied to the circuit element.

Abstract: Methods and apparatus to minimize saturation in a ground fault detection device are disclosed. An example method includes connecting a capacitor simulator to a node of the ground fault detector device to prevent saturation, and monitoring power-line conductors for ground fault conditions with the ground fault detector device. An example apparatus to simulate a saturation capacitance in a ground fault device includes a sense coil induced by power-line conductors, and at least one of an amplifier or a current detector including an input connected to the sense coil and an output connected to a ground fault detector. The example apparatus also includes a saturation capacitor simulator connected to a node of at least one of the amplifier or the current detector to prevent saturation.

Abstract: There are numerous types of dividers that have been employed at various frequency ranges. For many very high frequency ranges (i.e., above 30 GHz), dividers in CMOS have been developed. However, many of these designs use multiple stages. Here, however, a single stage divider has been provided that is adapted to operate at very high frequencies (i.e., 120 GHz). To accomplish this, it uses parasitic capacitances in conjunction with inductor(s) to form an LC tanks so as to take advantages of parasitics that normal degrade performance.

Abstract: A data input/output device includes a buffer that accumulates data, and a data receiver that receives data input in synchronization with a first clock in accordance with a second clock whose generation source is different from a generation source of the first clock. The data input/output device further includes a data input part that accumulates data received by the data receiver in the buffer, and a data output part that sequentially outputs data accumulated in the buffer at an output interval depending on the amount of data accumulated in the buffer in such a manner that a predetermined data amount is the unit of the output.

Abstract: This document discusses, among other things, a multiple accessory detection apparatus and methods for identifying accessories coupled to a multi-pin connector of an electronic device. The apparatus can include a first reference generator, a second reference generator, a plurality of switches to couple an output of the second generator to an accessory device and a comparator. The comparator can generate identifying information about the accessory device using the reference information received from the first reference generator and test information received using the second reference generator.