Abstract: An amplifier system has an amplifier for amplifying a plurality of input signals from a plurality of different channels, and a plurality of demodulators each operatively coupled with the amplifier for receiving amplified input signals from the amplifier. Each demodulator is configured to demodulate a single amplified input channel signal from a single channel of the plurality of different channels. The system thus also has a plurality of filters, coupled with each of the demodulators, for mitigating the noise.

Abstract: A MEMS/NEMS device having an adjustable frequency response comprises an array of electrostatically actuated resonators, an electrostatic actuation circuit, electrical detection means, and means adjusting the frequency response of the resonators. The device comprises resonators having a movable portion, electrically connected in series between a first biasing potential VB and a second biasing potential VB2, each resonator biased to a potential Vi between VB and VB2, depending on position in the series. The electrostatic actuation circuit comprises, for each resonator, an actuation electrode facing the movable portion, all electrodes being connected in parallel to a common control potential VIN, the actuation voltage of each resonator being equal to VIN?Vi. The detection means comprises a detection output common to all resonators, the output being connected to an output potential Vout.

Abstract: This invention provides a micromechanical resonator oscillator structure and a driving method thereof. As power handling ability of a resonator is proportional to its equivalent stiffness, a better power handling capability is obtained by driving a micromechanical resonator oscillator at its high equivalent stiffness area. One of the embodiments of this invention is demonstrated by using a beam resonator. A 9.7-MHZ beam resonator via the high-equivalent stiffness area driven method shows better power handling capability and having lower phase noise.

Abstract: An elastic wave device includes a first elastic wave element, a second elastic wave element, and a first substrate. The first elastic wave element includes a first piezoelectric substrate. The second elastic wave element includes a second piezoelectric substrate. The second piezoelectric substrate is stacked on the first piezoelectric substrate. A coefficient of linear expansion of the second piezoelectric substrate is greater than a coefficient of linear expansion of the first piezoelectric substrate. The first substrate is bonded to the second piezoelectric substrate. A coefficient of linear expansion of the first substrate is lower than the coefficient of linear expansion of the second piezoelectric substrate.

Abstract: An RF filter comprises a signal transmission path having an input and an output, a plurality of resonant elements disposed along the signal transmission path between the input and the output, and a plurality of non-resonant elements coupling the resonant elements together to form a stop band having a plurality of transmission zeroes corresponding to respective frequencies of the resonant elements, and at least one sub-band between the transmission zeroes. The non-resonant elements comprise at least one variable non-resonant element for selectively introducing at least one reflection zero within the stop band to create a pass band in a selected one of the sub-band(s). The RF filter further comprises an electrical controller configured for receiving an operating temperature, and adjusting the variable non-resonant element(s) based on the received operating temperature, thereby selectively moving the reflection zero(es) along the stop band to move the pass band within the selected sub-band.

Abstract: Tunable MEMS resonators having adjustable resonance frequency and capable of handling large signals are described. In one exemplary design, a tunable MEMS resonator includes (i) a first part having a cavity and a post and (ii) a second part mated to the first part and including a movable layer located under the post. Each part may be covered with a metal layer on the surface facing the other part. The movable plate may be mechanically moved by a DC voltage to vary the resonance frequency of the MEMS resonator. The cavity may have a rectangular or circular shape and may be empty or filled with a dielectric material. The post may be positioned in the middle of the cavity. The movable plate may be attached to the second part (i) via an anchor and operated as a cantilever or (ii) via two anchors and operated as a bridge.

Abstract: A resonator device (200) comprises a base (206) comprising an anchor (204) and a vibration unit (212) connected to the anchor (204). The vibration unit (212) is configured to have a first vibration mode (218) and a second vibration mode (216) different from the first vibration mode (218). According to an embodiment, the vibration unit (212) is configured such that the first vibration mode (218) and the second vibration mode (216) destructively interfere at the anchor (204).

Abstract: A micro-electro-mechanical transducer (such as a cMUT) having a non-flat surface is disclosed. The non-flat surface may include a variable curve or slope in an area where a spring layer contacts a support, thus making a variable spring model as the spring layer vibrates. The non-flat surface may be that of a non-flat electrode optimized to compensate the dynamic deformation of the other electrode during operation and thus enhance the uniformity of the dynamic electrode gap during operation. Methods for fabricating the micro-electro-mechanical transducer are also disclosed. The methods may be used in both conventional membrane-based cMUTs and cMUTs having embedded springs transporting a rigid top plate.

Abstract: Integrated Microelectromechanical System (“MEMS”) devices and methods for making the same. The MEMS devices comprise a substrate (200) and a MEMS filter device (100) mechanically suspended above a major surface of the substrate. A first gas gap (202) exists between the major surface of the substrate and the MEMS filter device. An isolation platform (500) is provided to absorb vibrations from an external environment prior to reaching the MEMS filter device. In this regard, the isolation platform comprises: a frame structure (510) framing a periphery of the MEMS filter device; and at least one resilient component (512-518) coupled between the frame structure and the MEMS filter device. The frame structure is mechanically connected to the substrate. Electronic circuitry is connected to the MEMS filter device via a resilient interconnection (204, 206) that is movable in at least one direction of the vibrations.

Abstract: Integrated Microelectromechanical System (“MEMS”) devices and methods for making the same. The integrated MEMS device comprises a substrate (200) with first electronic circuitry (206) formed thereon, as well as a MEMS filter device (100). The MEMS filter device has a transition portion (118) configured to (a) electrically connect the MEMS filter device to second electronic circuitry and (b) suspend the MEMS filter device over the substrate such that a gas gap exists between the substrate and the MEMS filter device. The transition portion comprises a three dimensional hollow ground structure (120) in which an elongate center conductor (122) is suspended. The RF MEMS filter device also comprises at least two adjacent electronic elements (102/110) which are electrically isolated from each other via a ground structure of the transition portion, and placed in close proximity to each other.

Abstract: An electromechanical resonator produced on a substrate, and a method of producing thereof, including: a suspended structure produced at least partly from the substrate, configured to have a vibration imparted to it such that it resonates at least one natural resonance frequency of the suspended structure; an anchor structure to anchor the suspended structure, by at least one area of its periphery, to the remainder of the substrate, and dimensioned to resonate at the resonance frequency; a mechanism to excite the suspended structure, to cause it to vibrate at the resonance frequency; and a mechanism to detect the vibration frequency of the suspended structure.

Abstract: On aspect relates to an electrical bushing for use in a housing of an implantable medical device. The bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element is set up to establish, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The at least one conducting element comprises at least one cermet such that the conducting element is hermetically sealed with respect to the base body. The bushing includes an electrical filter structure. The at least one conducting element provides at least a one conducting section of the filter structure and the base body provides at least one dielectric section of the filter.

Abstract: A resonator comprising a resonator body and actuation electrodes for driving the resonator into a resonant mode, in which the resonator body vibrates parallel to a first axis. The resonator comprises means to apply a voltage to the resonator in a direction perpendicular to the first axis direction. This serves to shift the frequency of resonant modes other than the principal resonant mode, and this allows increased amplitude of output signal from the resonator.

Abstract: A micromechanical device includes a substrate, a micromechanical structure supported by the substrate and configured for overtone resonant vibration relative to the substrate, and a plurality of electrodes supported by the substrate and spaced from the micromechanical structure by respective gaps. The plurality of electrodes include multiple drive electrodes configured relative to the micromechanical structure to excite the overtone resonant vibration with a differential excitation signal, or multiple sense electrodes configured relative to the micromechanical structure to generate a differential output from the overtone resonant vibration.

Abstract: An acoustic microwave filter comprises an input and an output, and a plurality of acoustic resonators coupled between the input and the output. The difference between the lowest resonant frequency and the highest resonant frequency of a plurality of resonators in the filter is at least 1.25 times the frequency separation of the resonator with the highest resonant frequency in the plurality of resonators.

Abstract: [Subject] An object of the present invention is to provide a resonator readily achieving a high resonance frequency without extreme downsizing and allowing for a high Q factor. [Solving means] A resonator includes: a substrate serving as a base; a first beam having opposite ends fixed to the substrate via fixed connection portions, and having a vibration receiving location for providing linear reciprocating motion in a direction perpendicular to the longitudinal direction thereof; and second beams, branching toward one side from a plurality of branching locations different from the vibration receiving location in the first beam, for generating torsional vibration in accordance with the linear reciprocating motion. The resonator further includes a plurality of third beam, extending from the plurality of branching locations to a side opposite to the plurality of second beams, for generating torsional vibration.

Abstract: A method of fabricating a multi-band filter module is provided. The method includes forming a Film Bulk Acoustic Resonator (FBAR) on a piezoelectric substrate by forming a resonant part on the piezoelectric substrate and then an air gap recessed on a surface of the piezoelectric substrate and positioned under the resonant part; and forming a Surface Acoustic Wave (SAW) device on the piezoelectric substrate in which the steps of forming the FBAR and the SAW are concurrently performed.

Abstract: A capacitively-driven Micro-Electro-Mechanical System (MEMS) resonator is provided, in which a piezoresistively differential measurement is used to enable the MEMS resonator to transfer a signal. The MEMS resonator uses a Complementary Metal-Oxide-Semiconductor (CMOS) manufacturing process to make its oscillator and piezoresistor to achieve electrical insulation, thereby lowering the level of feedthrough signal.

Abstract: A resonator in which in addition to the normal anchor at a nodal point, a second anchor arrangement is provided and an associated connecting arm between the resonator body and the second anchor arrangement. The connecting arm connects to the resonator body at a non-nodal point so that it is not connected to a normal position where fixed connections are made. The connecting arm is used to suppress transverse modes of vibration.

Abstract: A MEMS vibrator according to the invention includes: a first electrode fixed to a surface of a substrate; and a second electrode having a beam portion including a second face facing a first face of the first electrode, and a supporting portion supporting the beam portion and fixed to the surface of the substrate. The beam portion has a first portion whose length in a normal direction of the first face of the beam portion monotonically decreases toward a tip of the beam portion.

Abstract: An apparatus includes a microelectromechanical system (MEMS) device. The MEMS device includes a resonator suspended from a substrate, an anchor disposed at a center of the resonator, a plurality of suspended beams radiating between the anchor and the resonator, a plurality of first electrodes disposed about the anchor, and a plurality of second electrodes disposed about the anchor. The plurality of first electrodes and the resonator form a first electrostatic transducer. The plurality of second electrodes and the resonator form a second electrostatic transducer. The first electrostatic transducer and the second electrostatic transducer are configured to sustain rotational vibrations of the resonator at a predetermined frequency about an axis through the center of the resonator and orthogonal to a plane of the substrate in response to a signal on the first electrode.

Abstract: An acoustic microwave filter comprises an input and an output, and a plurality of acoustic resonators coupled between the input and the output. The difference between the lowest resonant frequency and the highest resonant frequency of a plurality of resonators in the filter is at least 1.25 times the frequency separation of the resonator with the highest resonant frequency in the plurality of resonators. Another acoustic microwave filter comprises an input and an output, and a plurality of acoustic resonators coupled between the input and the output to form a passband. The frequency difference between a local minimum or a local maximum of a return loss magnitude of the acoustic microwave filter and the edge of the passband is at least once the frequency separation of the resonator with the highest resonant frequency.

Abstract: The various embodiments of the present disclosure relate generally bulk-acoustic-wave resonators. An exemplary embodiment of the present invention provides a bulk-acoustic-wave resonator comprising an acoustic reflector, a substantially c-axis oriented hexagonal crystal structure, and a plurality of electrodes. The crystal structure is solidly-mounted to the acoustic reflector. The bulk-wave resonator resonates in at least two non-harmonically-related operational modes.

Abstract: A MEMS resonator has a component which provides a capacitance associated with the transduction gap which has a temperature-dependent dielectric characteristic, which varies in the same direction (i.e. the slope has the same sign) as the Young's modulus of the material of the resonator versus temperature. This means that the resonant frequency is less dependent on temperature.

Abstract: Provided is a surface communication apparatus that includes: propagation sheet through which electromagnetic waves are propagated; an electromagnetic wave transmission unit disposed on a surface of propagation sheet to transmit the electromagnetic waves to propagation sheet, and an electromagnetic wave reception unit disposed on the surface of propagation sheet to receive the electromagnetic waves propagated through propagation sheet. The electromagnetic wave transmission unit includes an electromagnetic wave generator, and a transmission electromagnetic wave coupler that couples electromagnetic waves generated by the electromagnetic wave generator with propagation sheet. The electromagnetic wave reception unit includes a reception electromagnetic wave coupler that couples the electromagnetic waves propagated through propagation sheet, and an electromagnetic wave output unit that outputs the electromagnetic waves coupled by the reception electromagnetic wave coupler.

Abstract: A disk resonator gyroscope includes a quartz base, a quartz resonator disk having a central pillar connected to the base, the quartz resonator disk having a surface facing the base and having plurality of circumferential slots in the surface of the quartz resonator disk around the central pillar, and an electrode comprised of quartz and connected to the base outside of an outer edge of the resonator disk.

Abstract: A MEMS resonator system that reduces interference signals arising from undesired capacitive coupling between different system elements. The system, in one embodiment, includes a MEMS resonator, electrodes, and at least one resonator electrode shield. In certain embodiments, the resonator electrode shield ensures that the resonator electrodes interact with either one or more shunting nodes or the active elements of the MEMS resonator by preventing or reducing, among other things, capacitive coupling between the resonator electrodes and the support and auxiliary elements of the MEMS resonator structure. By reducing the deleterious effects of interfering signals using one or more resonator electrode shields, a simpler, lower interference, and more efficient system relative to prior art approaches is presented.

Abstract: An apparatus includes a capacitance-to-voltage converter circuit configured to be electrically coupled to a micro-electromechanical system (MEMS) sensor circuit. The capacitance-to-voltage converter circuit includes a differential chopping circuit path configured to receive a differential MEMS sensor output signal and invert a polarity of the differential chopping circuit path, and a differential sigma-delta analog to digital converter (ADC) circuit configured to sample the differential MEMS sensor output signal and provide a digital signal representative of a change in capacitance of the MEMS sensor.

Abstract: Embodiments are related to micro-electromechanical system (MEMS) devices, systems and methods. In one embodiment, a MEMS resonating device comprises a resonator element configured to provide timing; and at least one passive temperature compensation structure arranged on the resonator element.

Abstract: A periodic signal generator is configured to generate high frequency signals characterized by relatively low temperature coefficients of frequency (TCF). A microelectromechanical resonator, such as concave bulk acoustic resonator (CBAR) supporting capacitive and piezoelectric transduction, may be geometrically engineered as a signal generator that produces two periodic signals having unequal resonant frequencies with unequal temperature coefficients. Circuitry is also provided for combining the two periodic signals using a mixer to thereby yield a high frequency low-TCF periodic difference signal at an output of the periodic signal generator.

Abstract: In a MEMS device having a substrate 1, a sealing membrane 7, and a movable portion 3 of beam and an electrode 5 which have a region wherein they overlap with a gap in perpendicular to a substrate 1 surface, a first cavity 9 is on the side of the movable portion 3 in the direction perpendicular to the surface of the substrate, and a second cavity is the other cavity, and an inner surface a of a side wall A in contact with the electrode 5, of the first cavity 9, is positioned more inside than an inner surface b of a side wall B in contact with the electrode 5, of the second cavity 10, in the direction parallel to the substrate surface, such that the movable portion 3 does not collide with the electrode 5 when mechanical stress is applied from outside to the sealing membrane 7.

Abstract: A method and system for an acoustic wave band reject filter are disclosed. According to one aspect, an acoustic wave band reject filter includes a substrate and a plurality of acoustic wave band reject filter circuit blocks. The substrate includes bonding pads formed on the substrate. Each one of the plurality of acoustic wave band reject filter circuit blocks is fixed on a separate die. Each separate die has solder balls on a side of the die facing the substrate.

Abstract: An improved method of packaging a sensor is provided. The method includes the step of affixing a tuning fork to a platform. The tuning fork includes tines comprising one or more surfaces, with each tine further comprising an electrode and a piezoelectric material. An application specific integrated circuit (ASIC) is affixed to the platform. Electrical communication between the ASIC and the electrode of each tine is established for providing stimulus to the tuning fork and for receiving a response signal from the tuning fork. A protective layer is applied to cover the platform and a portion of the tuning fork while maintaining a portion of a surface of each tine free from the protective layer such that the surface can displace the fluid in contact therewith.

Abstract: A MEMS device includes a substrate, one or more anchors formed on a first surface of the substrate, and a piezoelectric layer suspended over the first surface of the substrate by the one or more anchors. Notably, the piezoelectric layer is a bimorph including a first bimorph layer and a second bimorph layer. A first electrode may be provided on a first surface of the piezoelectric layer facing the first surface of the substrate, such that the first electrode is in contact with the first bimorph layer of the piezoelectric layer. A second electrode may be provided on a second surface of the piezoelectric layer opposite the substrate, such that the second electrode is in contact with the second bimorph layer of the piezoelectric layer. The second electrode may include a first conducting section and a second conducting section, which are inter-digitally dispersed on the second surface.

Abstract: An electronic component module includes: a multi-layered wiring board formed by stacking insulating layers, an inner wiring layer formed between the insulating layers, and a surface wiring layer formed on an outermost insulating layer of the insulating layers; and an acoustic wave device located inside the multi-layered wiring board, wherein the acoustic wave device includes a functional element and a sealing portion, the functional element being located on a substrate and exciting an acoustic wave, and the sealing portion sealing the functional element so as to form an air-space above the functional element, and a terminal portion of the surface wiring layer does not overlap the air-space of the acoustic wave device as viewed from a stacking direction of the multi-layered wiring board, the terminal portion being a region to which a terminal of an electronic component is fixed in the surface wiring layer.

Abstract: An acoustic resonator structure comprises a first electrode disposed on a substrate, a piezoelectric layer disposed on the first electrode, a second electrode disposed on the piezoelectric layer, a frame disposed within a main membrane region defined by an overlap between the first electrode, the piezoelectric layer, and the second electrode, and having an outer edge substantially aligned with a boundary of the main membrane region, and a collar formed separate from the frame, disposed outside the main membrane region, and having an inner edge substantially aligned with the boundary of or overlapping the main membrane region.

Abstract: A contour mode micromechanical piezoelectric resonator. The resonator has a bottom electrode; a top electrode; and a piezoelectric layer disposed between the bottom electrode and the top electrode. The piezoelectric resonator has a planar surface with a cantilevered periphery, dimensioned to undergo in-plane lateral displacement at the periphery. The resonator also includes means for applying an alternating electric field across the thickness of the piezoelectric resonator. The electric field is configured to cause the resonator to have a contour mode in-plane lateral displacement that is substantially in the plane of the planar surface of the resonator, wherein the fundamental frequency for the displacement of the piezoelectric resonator is set in part lithographically by the planar dimension of the bottom electrode, the top electrode or the piezoelectric layer.

Abstract: A method of designing an acoustic microwave filter comprises selecting a filter section based on frequency response requirements. The filter section includes an input, an output, and a plurality of circuit elements. The circuit elements have at least in-line acoustic resonators or in-shunt acoustic resonators. The method further comprises selecting a value for each circuit element, selecting a number of filter sections, and cascading the selected number of filter sections to create a cascaded filter circuit design, such that at least one pair of immediately adjacent filter sections are connected to each other via their inputs or their outputs. The method further comprises adding parasitic effects to the cascaded filter circuit design to create a pre-optimized filter circuit design, optimizing the pre-optimized filter circuit design to create a final filter circuit design, and constructing the acoustic microwave filter based on the final filter circuit design.

Abstract: Aspects of the subject disclosure include, for example, obtaining a mechanical resonating structure comprising a compensating structure, where the compensating structure comprises one or more materials having an adaptive stiffness that reduces a variance in a resonating frequency of the mechanical resonating structure (f0), and adjusting at least one of a value of f0 of the obtained mechanical resonating structure or a value of a temperature for which temperature coefficient of frequency of the obtained mechanical resonating structure is approximately zero (T0) by altering a thickness of at least one targetable material of the mechanical resonating structure. Other embodiments are disclosed.

Abstract: A method of configuring a device comprising a MEMS resonator includes initiating operation of the device, estimating a first parameter of the MEMS resonator based on the initiated operation, the first parameter not varying with the bias voltage, monitoring the operation of the device at a plurality of levels of the bias voltage, calculating a second parameter of the MEMS resonator based on the monitored operation, the second parameter varying with the bias voltage, determining an operational level of the bias voltage based on the estimated first parameter and the calculated second parameter, and configuring the device in accordance with the determined operational level of the bias voltage.

Abstract: A micro-electromechanical resonator comprising a material having anisotropic directional elasticity characteristics. A shape of the resonator is such that a first distance in a first direction from a centroid of the resonator to a first point on a peripheral edge of the resonator is greater than a second distance in a second direction from the centroid to a second different point on the edge. This is true for every first direction and every second direction wherein the material has a lesser modulus of elasticity in the first direction than the second direction.

Abstract: A resonator fabrication method is provided. A method includes providing a plurality of electrode patterns disposed apart from each other on a substrate using a nano-imprint technique; and forming an extended electrode pattern connected to a plurality of electrode patterns, and forming a nano structure laid across an extended electrode patterns. Therefore, a nano-electromechanical system (NEMS) resonator is easily fabricated at a nanometer level.

Abstract: One embodiment of the present inventions sets forth a method for decreasing a temperature coefficient of frequency (TCF) of a MEMS resonator. The method comprises lithographically defining slots in the MEMS resonator beams and filling the slots with a compensating material (for example, an oxide) wherein the temperature coefficient of Young's Modulus (TCE) of the compensating material has a sign opposite to a TCE of the material of the resonating element.

Abstract: MEMS resonators containing a first material and a second material to tailor the resonator's temperature coefficient of frequency (TCF). The first material has a different Young's modulus temperature coefficient than the second material. In one embodiment, the first material has a negative Young's modulus temperature coefficient and the second material has a positive Young's modulus temperature coefficient. In one such embodiment, the first material is a semiconductor and the second material is a dielectric. In a further embodiment, the quantity and location of the second material in the resonator is tailored to meet the resonator TCF specifications for a particular application. In an embodiment, the second material is isolated to a region of the resonator proximate to a point of maximum stress within the resonator. In a particular embodiment, the resonator includes a first material with a trench containing the second material.

Abstract: Systems and methods for manufacturing a chip comprising a MEMS-based radio frequency filter arranged in an integrated circuit are provided. In one aspect, the systems and methods provide for a chip including electronic elements formed on a semiconductor material substrate. The chip further includes a stack of interconnection layers including layers of conductor material separated by layers of dielectric material. A radio frequency filter is formed within the stack of interconnection layers by applying gaseous HF to the interconnection layers. The radio frequency filter includes a plurality of mechanically decoupled resonator elements.

Abstract: A method of making a handheld, electromechanical device useful in mammalian body-care includes the steps of: a) forming a one-piece housing having a single opening defined by a rim; b) assembling a unitary insert; c) inserting the unitary insert through the single opening of the housing; d) removably applying a cover having an exterior surface to close the opening of the one-piece housing; and e) attaching the unitary insert to at least one of the one-piece housing and the removable cover. The rim of the one-piece housing circumscribes a rim area, and the one-piece housing has a projected area that is substantially larger than the rim area. The unitary insert is dimensioned to be insertable through the opening defined by the rim, and it has a frame having disposed thereon electromechanical elements interconnected in an electrical circuit. The cover closes off the opening of the one-piece housing.

Abstract: Described herein is a method for testing a microelectromechanical device provided with a microstructure having a fixed structure and a movable mass, which is capacitively coupled to the fixed structure and mechanically connected thereto so as to be movable between a rest position and at least one position of maximum extension. The method envisages: applying a test voltage between the movable mass and the fixed structure so as to set up an electrostatic force between them and displace the movable mass into the position of maximum extension; keeping the movable mass in the position of maximum extension for a time interval; releasing the movable mass from the position of maximum extension; and detecting a current position of the movable mass.

Abstract: An object is to obtain a steep and large attenuation amount in attenuation bands close to each other out of a band of a TV wave and to provide a filter in which the use number of inductors is reduced thereby to be able to contribute to downsizing of a device. Elastic wave resonators of a plurality of parallel arms for each forming plurality of attenuation band are connected to the same electric potential point in a signal path without aid of an inductor. Otherwise, a series circuit of a plurality of element parts generating series resonance is connected in a signal path as a parallel arm. Therefore, a large attenuation amount can be obtained in each of the plural attenuation bands, but a region equivalent to what is called a zero point exists between adjacent poles. However, there can be obtained a characteristic in which steep attenuations occur in both sides of the zero point even if the zero point exists.

Abstract: This disclosure provides implementations of filters and filter topologies, circuits, structures, devices, apparatus, systems, and related processes. In one aspect, a device includes one or more LC resonant circuit stages. In some implementations, each LC stage includes an inductor and a capacitor. Each LC stage also has a corresponding resonant frequency. The one or more LC stages are arranged to produce an unmodified passband over a range of frequencies having a corresponding bandwidth. One or more microelectromechanical systems (MEMS) resonators are arranged with the one or more LC stages. The one or more MEMS resonators are arranged with the one or more LC stages so as to modify characteristics of the unmodified passband such that the hybrid filter produces a modified passband having a modified bandwidth and one or more other modified band characteristics.

Abstract: Micromechanical resonating devices, as well as related methods, are described herein. The resonating devices can include a micromechanical resonating structure, an actuation structure that actuates the resonating structure, and a detection structure that detects motion of the resonating structure. A bias structure separated from the mechanical resonating structure is provided to tune a resonance frequency of the mechanical resonating structure.