Abstract: A heat-dissipating assembly for a server includes a housing in which a partitioning plate and a power supply mounted on one side of the partitioning plate are provided. The power supply includes a casing and a power-supplying module received in the casing. The heat-dissipating assembly includes a fan received in the casing and located outside the power-supplying module. The partitioning plate and the casing are respectively provided with a plurality of first heat-dissipating holes and second heat-dissipating holes. The first heat-dissipating holes and the second heat-dissipating holes are positioned to correspond to the fan. The airflow caused by the fan drives the air inside the housing to flow out of the housing via the first heat-dissipating holes and the second heat-dissipating holes. In this way, the heat-dissipating efficiency can be improved without affecting the arrangement of other electronic devices in the housing.

Abstract: A computer includes an enclosure, a platform, a motherboard and at least one disk drive. A receiving space is defined by the enclosure. The platform divides the receiving space into at least two housings. The motherboard and the at least one disk drive are located in different housings.

Abstract: In one embodiment, a fan casing may have a direct thermal connection with a heat spreader. The fan casing might be used in an active cooling system of a mobile computing device such as a notebook computer to reduce and/or eliminate the occurrence of thermal hot spots on the skin of the device. In one example, the heat spreader extends from the enclosure and is disposed between a heat source and the skin of the device.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a heat-generating component in the housing, a first radiating portion in the housing thermally connected to the heat-generating component, a second radiating portion in the housing thermally connected to the heat-generating component, and a fan configured to blow air to the first radiating portion and the second radiating portion.

Abstract: A heat dissipation apparatus adapted for simultaneously cooling a first electronic component and a second electronic component includes a heat sink adapted for being thermally attached to the first electronic component, a fan duct receiving the heat sink therein and a fan mounted to the fan duct. The fan duct comprises a top plate and two side plates extending from two opposite sides of the top plate. A receiving space is defined in the fan duct between the top plate and a top of the heat sink and adapted for receiving the second electronic component. Airflow from the fan is guided by the fan duct to blow towards the heat sink and the second electronic component, simultaneously.

Abstract: A motherboard including an electronic component is provided. Airflow flows through the motherboard along a direction. An adhesive air guiding device including at least one air guiding surface facing the direction of the airflow is stuck to the electronic component, for guiding the airflow to flow over the electronic component.

Abstract: A gas ejector capable of effectively dissipating heat generated from a heater while inhibiting noise generation as little as possible, an electronic device equipped with the gas ejector, and a gas-ejecting method are offered. A gas ejector (1) according to the present invention includes a vibrator (25) and ejects gas in a form of a pulsating flow such that vibration of the vibrator allows sound waves respectively generated upon ejection of the gas ejected from nozzles (23) and (24) to deaden out each other. Also, a control section (20) optimizes the frequency of the vibrator (25), hence, by increasing the gas ejection quantity as much as possible while inhibiting noise generation, heat of a heater is effectively dissipated.

Abstract: An electronic device includes a chassis. The chassis has a bottom wall and a rear wall, substantially perpendicular to the bottom wall. A motherboard is disposed on the bottom wall, and a riser card is perpendicularly connected to the motherboard. An expansion card is substantially parallel to the motherboard and coupled to the riser card. The expansion card has a first end and a second end, and the first end is secured to the rear wall. An airflow duct is located on the bottom wall of the chassis. A supporting bar protrudes from the airflow duct. A securing member is pivotably mounted to the airflow duct. The securing member includes a pressing plate. The second end of the expansion card is clamped between the pressing plate and the supporting bar of the airflow duct.

Abstract: An apparatus has a plurality of printed board units each including a printed board, a frame to have the printed board arranged therein, a first rail to be arranged at a first lower end of an inner wall of the frame having the printed board located thereon in a lower opening of the frame, and a second rail to be arranged at a second lower end opposed to the first lower end in the opening; a housing including a rail holding unit to movably hold the first rail of a first printed board unit and the second rail of a second printed board unit adjacent to the first printed board unit among the plurality of printed board units; and a cooling fan to be arranged on an upper side or underside of the housing to send air into the frame.

Abstract: A computer system includes a cover and a chassis. The chassis includes a bottom plate parallel to the cover, a first side plate, and a second side plate corresponding to the first side plate. A motherboard and a power supply are fixed on the bottom plate. The power supply is adjacent to the first side plate. The motherboard includes a first heat generating component. The power supply includes a first fan module. A second fan module is secured on the first heat generating component. A first airflow inlet is defined in the first fan module. A second airflow inlet is defined in the second fan module. The first and second airflow inlets are perpendicular to the bottom plate. A third airflow inlet is defined in the cover. The second airflow inlet is located between the first heat generating component and the second side plate.

Abstract: An active heat-dissipating mechanism includes a fan module, an airflow-guiding part and an airflow shunt part. The fan module includes an airflow inlet and an airflow outlet. The airflow-guiding part is disposed at the same side of the airflow outlet of the fan module and in communication with the fan module. An airflow channel is defined by the airflow-guiding part. An airflow inhaled by the fan module is guided to a hotspot region of the electronic device through the airflow channel so as to remove the heat generated from the hotspot region. The airflow shunt part is formed on the airflow-guiding part. The airflow shunt part defines a stopping block in the airflow channel. A portion of the airflow is hindered by the stopping block and guided into a sub-hotspot region of the electronic device so as to remove the heat generated from the sub-hotspot region.

Abstract: An electronic device includes a casing, a centrifugal blower and sidewall received in the casing. The casing is adapted for accommodating electronic components therein, and includes a bottom cover and an opposite top cover. The centrifugal blower is surrounded by the sidewall and includes a sleeve directly mounted to the bottom cover, a bearing member mounted in the sleeve, a stator mounted to the sleeve and an impeller rotatably supported by the bearing member. The bottom cover of the electronic device functions as a bottom plate of the centrifugal blower.

Abstract: The invention relates to an electrical cabinet (1) for receiving electrical and/or electronic and/or optoelectronic devices, in particular low-current distribution devices, which is particularly suited for installation outdoors, comprising an inner cabin (2) and an outer cabin (3), a first cooling channel (12) and a second cooling channel (23) being configured to be bordering externally on boundary surfaces (6) of the inner cabin (2) and separated from each other.

Abstract: An adjustable blocking arrangement for electronic hardware or computer racks, for preventing the undesired leakage of air through rack spaces not filled with hardware. An airflow control device is provided comprising a flexible web and a magazine adapted to receive the part of the flexible web that is not deployed. The device is adapted such that a length of the web may be deployed to sealingly block a space in the rack that is not filled with hardware modules, to prevent the flow of air through the space. The device may comprising a detection system adapted to detect the space in the rack that is not filled with hardware modules, and a processing system adapted to receive a signal from the detection system, and as a function of the signal to automatically deploy or retract the flexible web so as to sealingly block the space.

Abstract: An electronic device includes a chassis, a motherboard, an airflow duct, and an expansion card. The chassis includes a bottom wall, a rear wall, and a sidewall. A motherboard is disposed on the bottom wall, and a riser card perpendicularly connected to the motherboard. An expansion card is parallel to the motherboard and inserted in the riser card. The expansion card has a first end and a second end. The first end is secured to the rear wall of the chassis. An airflow duct is located on the bottom wall of the chassis. The airflow duct includes a mounting wall parallel to the chassis rear wall. The first end of the expansion card is secured to the rear wall, and the second end of the expansion card is mounted to the mounting wall of the airflow duct.

Abstract: In one embodiment, an air mover may include a first electrode, a second electrode and an ionization device to selectively ionize molecules in an electric field between the first and second electrodes. The ionized molecules can drive airflow between the first and second electrodes. In certain embodiments, the ionization device has an operational characteristic that prevents ionization of oxygen so that the airflow is ozone-free.

Abstract: Heat dissipating electronic components and circuitry in a communication chassis are cooled by moving air at least through a midplane, between two groups of channels that are laterally oriented relative to one another. In an illustrative embodiment, channels of one group are oriented vertically while channels of another group are oriented horizontally. Each channel, regardless of whether it is vertical or horizontal, is defined by space in the chassis between adjacent circuit boards. Circuit boards on one side of the midplane are electrically connected to circuit boards on the other side of the midplane by orthogonal connectors on the midplane. The midplane additionally has openings that enable movement of air between vertically-oriented channels and horizontally-oriented channels. Circuit boards of the two orientations are cooled by increasing air pressure in vertically-oriented channels or by decreasing air pressure in horizontally-oriented channels or both, depending on the embodiment.

Abstract: A temperature control apparatus for a hard disk drive includes a thermal chamber for receiving the hard disk drive. The apparatus also includes an oscillatory air movement generator for generating air movement within a region between the thermal chamber and the hard disk drive when the hard disk is received in the thermal chamber, thereby to facilitate heat transfer between the thermal chamber and the hard disk drive.

Abstract: An electronic device having a piezoelectric pump. The electronic device includes: an audio input section; an audio recording section recording input sound from the audio input section; a piezoelectric pump cooling air by a piezoelectric element; a drive circuit driving the piezoelectric element; and a control circuit monitoring and controlling operation of the audio input section, the audio recording section, and the drive circuit, wherein when an operation mode being monitored is an audio recording mode, in which the input sound is used for recording by the audio recording section, the control circuit controls the drive circuit to decrease the amount of air flow exhausted outside from the piezoelectric pump, and when the operation mode being monitored is another mode without audio recording, the control circuit maintains the amount of the air flow.

Abstract: A heat dissipation device is used for dissipating heat generated from a plurality of memory modules inserted on a motherboard. The memory modules are parallel to each other. Two hooks are disposed at two ends of the slot of each memory connector, respectively, to clamp the memory module corresponding to the slot when the memory module is inserted in the slot. The heat dissipation device includes two fixing frames, a connection frame, and two fans. The two fixing frames are disposed at two opposite ends of the memory connectors and fastened with the hooks at two ends of each slot, respectively. Additionally, the connection frame is connected between the two fixing frames. The two fans are disposed on the two fixing frames, respectively. An air inlet of one of the two fans faces an air outlet of the other one.

Abstract: A heat source recycling unit includes at least one heat removing device, a heat source conversion device and a heat preservation box. The heat removing device includes a heat inlet end connects with the pre-recycling heat source and, a heat outlet end connects with the heat source conversion device. The heat preservation box includes a heat preservation room and a refrigeration room. The heat source conversion device converts the received heat energy into heat energy and cold energy, and then transmits them to the heat preservation room and the refrigeration room respectively. The invention also provides a heat source recycling system.

Abstract: A display apparatus having a front substrate that is a display panel, a rear substrate disposed at a predetermined distance apart from the front substrate and facing the front substrate, the rear substrate comprising a back light unit, and a cooling device to remove heat generated by the rear substrate. The cooling device includes an actuator disposed between the front substrate and the rear substrate, the actuator to generate an ion wind using a voltage, a transparent electrode installed to face the actuator and which is grounded, a plurality of supports to support ends of the actuator, and a high-voltage power source to apply a voltage to the actuator.

Abstract: In one embodiment, a cooling system is disclosed. The cooling system comprises: a cooling channel for receiving a cooling media, a substrate disposed near the cooling channel, and a fluidic jet disposed within the substrate and in fluid communication with the cooling channel. The cooling channel is for thermal communication with a component to be cooled. The cooling channel has a height of less than or equal to about 3 mm and a width of less than or equal to 2 mm. The fluidic jet comprises a cavity defined by a well and a membrane. In one embodiment, a method of cooling an electrical component comprises: passing a cooling media through a cooling channel, drawing the cooling media into one or more of the fluidic jets, expelling the cooling media from the one or more fluidic jets into the cooling channel, and removing thermal energy from the electrical component.

Abstract: A circuit card enclosure comprises a backplane including a plurality of connectors. First and second conduction rails are thermally coupled to a heat exchanger, the first and second conduction rails each comprising an inner body at least partially encapsulated by an outer body. The inner body comprises a thermally conductive material. The outer body comprises a structural material. Card slots of the circuit card enclosure are defined between opposed card channels of the first and second conduction rails. Each card slot is constructed and arranged to register an inserted circuit card with at least one of the connectors, the card channels including a thermally conductive region constructed and arranged to thermally interface with a thermal frame of an inserted circuit card, the thermally conductive region of the card channels being thermally coupled to the inner body of the conduction rail.

Abstract: An information technology enclosure has a processing subsystem and infrastructure subsystem in separate shipping containers that cooperate to process information. The processing subsystem has increased information processing density by concentrating information handling systems in a first processing shipping container that is supported with infrastructure equipment in a second infrastructure shipping container. In one embodiment, the shipping containers are arranged in a stacked configuration so that cooled air and exhausted air are exchanged through aligned vents formed in the ceiling and floor of stacked shipping containers.

Abstract: Aspects of the invention include a method and apparatus for cooling a hard drive in a hard drive array. In one example, the cooling device has similar dimensions as a hard drive on a server. Within the cooling device is a fan. The positioning of the fan provides both impingement and indirect airflow on a hard drive. The cooling device may also have power and data connections identical to those of the hard drive. These connections allow the cooling device to be connected and controlled by a control unit. The control unit may operate to monitor and control the temperature of the hard drive by controlling the power and speed of the fan. In another example, the cooling device is operable to cool DIMMs on a circuit board.

Abstract: The invention proposes a new aeraulic cooling design for ARINC series 600 computers. Using a network of ducts (N) and holes (HM) on an intermediate plate (M) situated just above the bottom place (B) through which a stream of cool air (AF) is injected into said computer (C), the present invention makes it possible to effectively cool the dissipative areas and the identified hot spots on the electronic modules (E) that it contains.

Abstract: A thermal management system (101), comprising (a) a synthetic jet actuator (103), and (b) a processor (107) in communication with the synthetic jet actuator, the processor being adapted to receive programming instructions, and being further adapted to modify the operation of the synthetic jet actuator in response to the programming instructions.

Abstract: A display unit is disclosed. A display apparatus includes a panel unit displaying images, a circuit unit provided a rear surface of the panel unit, a chamber surrounding the circuit unit, the chamber forming a predetermined space and at least one ventilation fan ventilating air inside the chamber along a circulation path passing beyond the circuit unit. According to a display apparatus according to the present invention, parts which are mounted in the display apparatus may be protected from external moisture or dust. Furthermore, heat radiation may be performed efficiently in the display apparatus according to the present invention even if environments of heat exchanging with an outside may not be formed enough in a structure of the display apparatus.

Abstract: Articles for supporting computers on users' laps and for isolating the users from heat from the computers. Embodiments may include a body, a top surface for contacting the computer, a bottom surface for contacting the user's lap, and back and front walls or surfaces. In various embodiments, the body defines a hollow area and a side opening, the back is taller than the front, the top surface is at an acute angle to the bottom surface, the bottom surface has a greater horizontal dimension from front to back than the top surface, the bottom surface has a greater horizontal dimension from left to right than the top surface; the article has a cross section that is a trapezoid (e.g., isosceles), the article comprises a foam portion (e.g., tubular) and fabric covering the foam portion, or a combination thereof. In some embodiments, each surface comprises the foam covered with fabric.

Abstract: A server blade chassis having at least one mechanically actuated variable air flow damper is presented. One or more variable air flow dampers are aligned with server blades in the server blade chassis. When a server blade is pressed into a slot in the server blade chassis, one or more of the variable air flow dampers are mechanically opened, to variable degrees of movement, by the server blade pressing against the variable air flow dampers.

Abstract: A cooling fan assembly includes a cooling fan unit having a rotating shaft and a plurality of rotating vanes combined with the rotating shaft, and a flow control unit provided in a front of a ventilation direction of the cooling fan unit to control a flow of air to reproduce a rotational directional flow component and to reduce a resistance of the flow of the air in a central portion thereof.

Abstract: Dilatant enclosure systems and methods are provided. A dilatant enclosure system can include an open framework; an electronic device disposed at least partially within the open framework; and a breathable, dilatant material covering at least a portion of the open framework. A dilatant enclosure method can include at least partially covering an open framework with a breathable, dilatant fabric material. The method can further include disposing an electronic device at least partially within the open framework.

Abstract: According to one embodiment, the electronic device includes a housing, the first to third printed circuit boards, and a fan unit. The first printed circuit board includes the first heat-generating part secured to the first wiring board. The second printed circuit board includes the second and third heat-generating parts, has an amount of heat generation larger than that of the first printed circuit board, and is located between the first printed circuit board and the second wall. The third printed circuit board includes the fourth heat-generating part, has an amount of heat generation smaller than that of the first printed circuit board, and is located between the first printed circuit board and the first wall.

Abstract: An electronic device includes a server, a plurality of fans, a fan holder attached to one outer side of the server and a plurality of fan ducts received in the fan holder. The server defines an inner cavity therein. Each fan is centrifugal fan and has a fan intake and a fan outlet perpendicular to the fan intake. The fan holder accommodates the fans therein. Each fan duct has an inlet communicating with the fan outlet and an outlet communicating with the inner cavity of the server through the fan holder to allow airflow from the fans into the server.

Abstract: A fan module is disposed in an electrical device. The electrical device has a main board and a casing. The fan module includes a vane module, a fan motor, a circuit board and a fan housing. The vane module has a hub and a plurality of vanes disposed around the edge of the hub. The fan motor is disposed in the hub. The circuit board is used to control the fan motor, so that the vanes rotate related to an axis of the hub for generating an air flow. The fan housing has a main body portion, a protruding portion and a fixing portion, wherein the protruding portion is located in a side of the main body portion, the vane module and the fan motor are disposed in the main body portion and the circuit board is disposed in the protruding portion.

Abstract: An electronic apparatus for a vehicle, includes an electronic device, a waterproof housing that receives the electronic device, and a filter. The housing has a ventilation hole that penetrates through a housing wall of the housing. The filter is attached to a filter attachment portion of the housing wall to cover the ventilation hole. A wall surface of the ventilation hole includes a slope surface section that has an increasing cross-sectional area, which progressively increases from an inner end to an outer end of the slope surface section toward an outer surface of the housing wall in a penetrating direction of the ventilation hole. Furthermore, a distance between the filter attachment portion and the outer surface is larger than that between the inner end of the slope surface section and the outer surface in the penetrating direction.

Abstract: Techniques for cooling in a data center are provided. In one aspect a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets, and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.

Abstract: In accordance with at least some embodiments, a computer system include a chassis and a main airflow channel within the chassis. The computer system also includes multiple processors and multiple memory banks positioned in the main airflow channel. The computer system also includes a removable airflow guide assembly installed in the main airflow channel, wherein the removable airflow guide assembly divides the main airflow channel into a processor-side airflow channel and a memory-side airflow channel.

Abstract: An electronic unit includes: a circuit board that has a device mounting surface mounted with circuit devices and that is supported in a condition that the device mounting surface is arranged in a direction of gravity; an opposed member that is disposed in opposition to the circuit board so that a passage space through which a refrigerant for cooling the circuit devices passes is formed between the opposed member and the device mounting surface; an exhaust unit that is disposed in opposition to the circuit devices disposed on the circuit board and that exhausts the refrigerant having passed through the passage space; and a protruding member that is provided in an upper portion of the exhaust unit in the direction of gravity and that protrudes from the opposed member toward the circuit devices.

Abstract: A heat dissipating module includes a detecting component and a ventilation device. The ventilation device includes a housing whereon an opening is formed, at least one vane covering on the opening in a movable manner, and a driving unit electrically connected to the vane for driving the vane to move relative to the opening so as to adjust an aperture between the vane and the opening. The heat dissipating module further includes a fan for inhaling or exhaling airflow through the opening of the ventilation device, and a control unit electrically connected to the detecting component, the ventilation device, and the fan for controlling the driving unit to drive the fan to move relative to the opening according to a detecting result of the detecting component.

Abstract: One embodiment provides an air baffle assembly for controlling airflow through a cable opening in a rack. The rack is configured for removably supporting a plurality of modular electronic components. The cable opening on the rack receives a plurality of cables connected to the modular electronic components. The air baffle assembly includes a track secured to the rack adjacent to the cable opening and an air baffle movably supported on the track over the cable opening. The track includes a rail guideway. The air baffle includes at least a flexible first rail movably received by the first rail guideway. The first rail flares laterally along a range of engagement of the first rail with the first rail guideway, to bias the air baffle in one longitudinal direction.

Abstract: A chassis may include a front section that contains a first electronic circuit board oriented in a first plane, a rear section that contains a second electronic circuit board oriented in a second plane, where the first plane and the second plane are substantially orthogonal, a midplane dividing the front and the rear sections, and a fan tray assembly including a plurality of fans to cool both the first electronic circuit board of the front section and the second electronic circuit board of the rear section.

Abstract: A cooling duct for cooling heat generating elements inside a casing with outside air includes an intake vent through which outside air taken in from outside the casing is drawn, a guiding unit configured to guide the outside air drawn through the intake vent to a first target element being a heat generating element to be cooled, a discharge vent through which the outside air guided by the guiding unit is discharged to the first target element, and a branch pipe provided in the guiding unit and configured to guide part of the outside air flowing in the guiding unit to a second target element being another heat generating element to be cooled.

Abstract: A method and system for increasing cooling of an enclosure is provided. The component enclosure includes one or more sidewalls defining a volume, the sidewalls are configured to substantially surround a heat generating component positioned within the volume. The component enclosure further includes a synthetic jet assembly positioned adjacent at least one of the sidewalls. The synthetic jet assembly includes at least one synthetic jet ejector having a jet port. The jet port is aligned at least one of perpendicularly, parallelly, and obliquely with a surface of the at least one sidewall. The synthetic jet assembly is configured to direct a jet of fluid through the port at least one of substantially parallel to the surface, perpendicularly onto the surface, and obliquely toward the surface.

Abstract: An electronic device includes a fan including a frame, and an enclosure. The frame includes a plurality of mounting holes respectively positioned in a plurality of diagonal corners of the frame. The enclosure includes a plurality of sidewalls and a plurality of fixing members to fix the fan in the enclosure. Each of the plurality of fixing members projects from an inner surface of one of the plurality of sidewalls and is integrally formed with the sidewall. Each of the plurality of fixing members includes a clasping portion, and a cushioning portion between the clasping portion and the sidewall and having an angled shape. The plurality of cushioning portions are corresponding to the plurality of mounting holes and positioned between the fan and the sidewall.

Abstract: An apparatus includes a side plate and a rear plate perpendicular to the side plate. A motherboard is mounted on the side plate. The motherboard has a heat source attached thereon. The rear plate defines a ventilation area. The ventilation and the heat source are located at different heights. A fan is mounted on the ventilation area. The fan inclines towards the plurality of expansion cards.

Abstract: Some embodiments discussed relate to a method and apparatus, comprising a power amplifier module, a transceiver module coupled to provide a signal to an input of the power amplifier module. The transceiver module comprising an integrated temperature sensor to sense an instantaneous operating temperature of the transceiver and providing a first sensor output signal dependent upon the operating temperature, and an integrated voltage sensor to sense a transceiver supply voltage and generate a second sensor output signal dependent upon the instantaneous transceiver supply voltage, and a processor configured to receive the first and the second sensor output signals, provide a control signal to the power amplifier module to reduce the output power of the power amplifier responsive to the first and the second sensor output signals.

Abstract: An acoustically absorptive apparatus is provided which includes an acoustically absorptive panel and an attachment mechanism. The acoustically absorptive panel is configured to reside along a side of an electronics rack, and includes a multilayer structure to attenuate noise. The attachment mechanism slidably mounts the acoustically absorptive panel to the electronics rack and facilitates sliding of the panel relative to the rack between retracted and extended positions. In the refracted position, the panel is disposed along the side of the rack, and in the extended position, the panel extends beyond a front or back edge of the electronics rack to facilitate attenuating noise emanating from the rack or an aisle alongside a row of multiple racks. In addition, the acoustically absorptive panel hingedly couples along a vertical edge to the attachment mechanism such that the panel is also rotatable outward away from the side of the electronics rack.

Abstract: Articles for supporting a computer on a user's lap, for cooling the computer, and for isolating the user from heat from the computer. Different embodiments may include a top surface for contacting the computer, a bottom surface for contacting the user's lap, a hollow area, a top aperture through the top surface to the hollow area, a fan, or a combination thereof. The top surface may be at an acute angle to the bottom surface, the fan may include an electric motor powered through a USB cable, or both, as examples. Various embodiments may include at least one side opening or rear opening to the hollow area to allow air to circulate, a foam portion, fabric covering the foam, a plastic portion which provides increased stiffness, or a combination thereof.