Abstract: A memory heat sink device having an enlarged heat dissipating area is provided. The memory heat sink device includes two cooling fins that are respectively attached to a front side and a back side of a memory. Raised dots are protruded from a front (or back) side of the cooling fin attached to the front (or back) side of the memory. Each of the raised dots on the cooling fin has at least one sectional area and at least one connection portion. Thus, the heat sink area of the cooling fin increases and heat generated by the memory is easily dissipated by the sectional area through thermal convection.

Abstract: An avionics chassis comprises a housing having a substantially thermally non-conductive frame comprising a composite of carbon fibers laid up in an epoxy matrix. The housing also includes at least two walls, at least one of which is a thermally conductive wall comprising a composite of carbon fibers in a carbonized matrix, and a plurality of spaced, thermally-conductive, card rails provided on the at least two walls. The at least two walls are mounted to the frame in opposing relationship such that corresponding card rails on the walls define an effective slot therebetween in which a printed circuit board may be received and the card rails and the at least one thermally conductive wall form a thermally conductive path from the interior to the exterior.

Abstract: A power amplification device includes a first power amplification unit having the positions of connectors thereof reversed, a second power amplification unit not having the positions of connectors thereof reversed, and a heat sink having a first flank thereof abutted on the heat radiation surface of the first power amplification unit, and having a second flank abutted on the heat radiation surface of the second power amplification unit. A transmitter using the power amplification device includes a plurality of power amplification devices, a distributor directly coupled to the input connectors of the power amplification devices, and a synthesizer directly coupled to the output connectors of the power amplification devices.

Abstract: The present invention is a universal patterned metal thermal interface. The thermal interface eliminates the need for surface processing of one or both contact surfaces that are to accommodate the thermal interface. In one embodiment, a thermal interface for coupling a first solid to a second solid includes a patterned metal insert, a corrosion resistant layer coating at least one exterior side of the insert, for protecting the insert from corrosion, and an organic layer coating the corrosion resistant layer, for facilitating bonding of the insert to one of the first solid or the second solid.

Abstract: In a mobile terminal device, at least one heat conduction layer formed of a member, such as copper, aluminum or carbon, being excellent in heat conductivity is provided inside a circuit board on which electronic components are mounted. The heat generated in the electronic components is promptly dispersed in the direction of the face of the circuit board by the heat conduction layer, and transferred from the whole face of the circuit board to the operation member, such as keys, and the housing, and then radiated to the outside. With this structure, the local temperature rise at the operation member and the housing can be suppressed, and the temperature on the surface of the mobile terminal device can be made uniform, without significantly increasing the cost and the thickness of the mobile terminal device. In addition, high-performance electronic components can be used by adopting this structure.

Abstract: A flat panel display including a base frame, a display panel module, and a heat-conductive structure is provided. The base frame includes a control unit. The display panel module is disposed in the base frame and includes a back bracket, a first heating element, and a second heating element. The first heating element and the second heating element are disposed in the back bracket and electrically connected to the control unit. A first distance is formed between the back bracket and the base frame to define a first air passage, a second distance is formed between the back bracket and the base frame to define a second air passage, and the first distance is shorter than the second distance. The heat-conductive structure is disposed in the first air passage, and the position of the heat-conductive structure is corresponding to the position of the first heating element.

Abstract: A socket for mounting a network device is provided. The socket includes a top portion and a bottom portion. The top portion and bottom portion are sized to engage with a network communication device that may be inserted into an interior of the socket from a first side of an installation surface. The top portion and bottom portion may be operable to draw heat away from the network device and release the heat on a second side of the installation surface.

Abstract: A package board and a method for the manufacturing of the package board are disclosed. A package board, which includes a first metal layer, a heat-release layer stacked on the first metal layer with a first insulation layer interposed in-between, a cavity formed in the heat-release layer, a mounting layer formed in the cavity in contact with the first insulation layer, a first component mounted on the mounting layer, and a second insulation layer covering at least a portion of the heat-release layer and the cavity, may offer improved heat release and smaller thickness.

Abstract: Mechanisms and systems for dissipating heat from an optical transceiver module to a module card cage system. In one embodiment, a thermal conductive label having at least one raised portion is attached to a surface of the module. The raised portion is configured to contact at least a portion of the card cage to dissipate heat from the module to the card cage. In another embodiment, the card cage has a protruding depression formed on a part of its surface that is above a slot configured to receive an optical transceiver module. The protruding depression is configured to contact at least a portion of the module to dissipate heat from the module to the card cage.

Abstract: There is provided a motor controller that can easily reduce the size and manufacturing cost of a motor controller by reducing the size of a heat sink without increasing the number of parts much. The motor controller includes a heat sink, a plurality of power semiconductor modules that is in close contact with the heat sink, a substrate (6) that is electrically connected to the plurality of power semiconductor modules, and a fan (8) that generates the flow of external air and supplies cooling air to the heat sink. The heat sink is formed by the combination of two kinds of heat sinks that include a first heat sink (9) and a second heat sink (10), and at least one of the power semiconductor modules is in close contact with each of the first and second heat sinks (9) and (10).

Abstract: In certain embodiments, a structure for electronic components includes a baseplate having a substantially planar shape. The baseplate defines one or more openings allowing air flow. The structure includes a frame coupled to the baseplate. The frame includes a planar support with a substantially planar shape that is substantially parallel to the baseplate. Then planar support and baseplate at least partially defines one or more plenums. The planar support is also configured to support one or more transmit/receive integrated microwave modules. The frame also includes a plurality of frame supports that define one or more channels for air flow. Each channel corresponds to one of the plenums. Additionally, the frame includes a ventilated panel with a surface defining a plurality of air inlets. The air inlets allow air into one of the one or more plenums. Also, the frame includes one or more thermal interfaces configured to dissipate heat.

Abstract: A heat sink includes a base plate and a plurality of cylindrical pins extending upwardly from the base plate. The cylindrical pins each include an upper dissipating portion, a lower mounting portion, and an engaging portion between the dissipating portion and the mounting portion. The mounting portion is interferentially fitted in a lower part of a corresponding aperture of the base plate. The engaging portion has a diameter smaller than that of the mounting portion. The engaging portion is cramped by an interior wall of the base plate defining an upper part of the corresponding aperture of the base plate by punching an upper surface of the base plate downwardly at a rim of the corresponding aperture.

Abstract: A switching power supply includes: a coil; and a pedestal fixed to the coil, the pedestal includes a supporting member configured to support the coil in such a manner as to form a space through which air flows on a surface of the coil attached to the pedestal.

Abstract: On a typical motherboard the processor and memory are separated by a printed circuit data bus that traverses the motherboard. Throughput, or data transfer rate, on the data bus is much lower than the rate at which a modern processor can operate. The difference between the data bus throughput and the processor speed significantly limits the effective processing speed of the computer when the processor is required to process large amounts of data stored in the memory. The processor is forced to wait for data to be transferred to or from the memory, leaving the processor under-utilized. The delays are compounded in a distributed computing system including a number of computers operating in parallel. The present disclosure describes systems, method and apparatus that tend to alleviate delays so that memory access bottlenecks are not compounded within distributed computing systems.

Abstract: An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device further contains a thermally conductive mass that is thermally coupled to both the heat generating components and to the power supply leads. When the power supply leads are coupled to receive electricity from the external power supply circuit, heat generated by the device is thermally conducted into the external power supply circuit via the power supply leads.

Abstract: A high reliability power module which includes a plurality of hermetically sealed packages each having electrical terminals formed from an alloy of tungsten copper and brazed onto a surface of a ceramic substrate.

Abstract: A plastic liquid cooled variable speed drive or inductor provided. The cooler provides lightweight, space conservative, corrosive free cooling to the components as well as provides a mounting area for modules. A cooler can be mounted to the core of an inductor to absorb heat generated by the core losses.

Abstract: An electronic control unit includes a circuit board, multiple circuit patterns, multiple semiconductor devices, multiple leads, and at least one thermal-conduction limiting portion. Each of the semiconductor devices is installed to the corresponding circuit pattern formed on the circuit board. Each of the leads electrically and mechanically connects each of the semiconductor devices to the corresponding circuit pattern. The thermal-conduction limiting portion, which can limit conduction of heat generated from the semiconductor devices, is placed between corresponding two of the circuit patterns.

Abstract: An electronic device includes a casing, an electronic component received in the casing, and a fixing member. The casing includes a cutout defined in a side wall thereof for assembly or disassembly a heat dissipation member into or out of the electronic device. The fixing member is connected to the top wall of the casing. The fixing member includes an elongated pole, a guiding pole connected to an outer end of the elongated pole and located adjacent to the cutout, and a resilient element at an inner end of the elongated pole and located over the electronic component. The resilient element is compressed and abuts the heat dissipation member when the heat dissipation member is assembled into the electronic device to contact with the electronic component.

Abstract: An electronic device includes an FPC, a circuit chip arranged on the flexible flat cable, a heat sink arranged on the circuit chip to release a heat of the circuit chip, and an elastic member arranged on a lower surface of the FPC. The upper surface of the FPC is large enough to cover a contact surface of the circuit chip. The elastic member does not overlap with an apex portion of the circuit chip, but overlaps with the circuit chip at an inner side of the apex portion. Therefore the elastic member does not press the FPC against the apex portion of the circuit chip. Accordingly, the FPC at a position corresponding to an apex of the circuit chip is suppressed from being distorted, and there is no fear of breaking of wire and exfoliation of the circuit chip.

Abstract: A hermetically sealed and/or ignition protection housing is provided with heat bridges at discreet points. The heat bridges form mounting faces in the interior space of the housing and also on the outer side. Heat from the interior of the housing generated by an item on the interior mounting faces is dissipated outwardly at the corresponding points by means of the heat bridges.

Abstract: An avionics chassis comprises a housing having a substantially thermally non-conductive frame comprising a composite of carbon fibers laid up in an epoxy matrix. The housing also includes at least two walls, at least one of which is a thermally conductive wall comprising a composite of carbon fibers in a carbonized matrix, and a plurality of spaced, thermally-conductive, card rails provided on the at least two walls. The at least two walls are mounted to the frame in opposing relationship such that corresponding card rails on the walls define an effective slot therebetween in which a printed circuit board may be received and the card rails and the at least one thermally conductive wall form a thermally conductive path from the interior to the exterior.

Abstract: An avionics chassis comprises a carbon fiber reinforced housing, a card rail for holding an electronic circuit board mounted to an interior surface of the housing, at least one heat-dissipating fin composed of carbon fiber and extending from the outer surface of the housing, a plurality of isotropic carbon fibers extending from an interior of the fin through the housing and in abutting contact with the card rail. The plurality of isotropic fibers form a direct conductive path from the card rail to the heat-dissipating fin.

Abstract: The emphasis for transporting heat energy to ambient in an efficient manner is critical for many semiconductor components to maintain highest performance. A heat dissipation system with low thermal resistance for the packaging of high power electrical components, and the methods for assembling a low thermal resistance system, is proposed. Unique in this method is the emphasis on moving heat with a primary thermal conductor away from the source and creating large area interface zones to improve heat transfer.

Abstract: An inverter unit includes a reactor and switching elements that form a voltage boost circuit that boosts a power supply voltage; a switching element for an inverter that forms an inverter circuit to be supplied with the power supply voltage boosted by the voltage boost circuit; and a cooling unit provided with a coolant passage that carries coolant along a cooling face with which the reactor and the switching elements of the voltage boost circuit and the switching element of the inverter circuit are in contact.

Abstract: Provided is a connector for connection to a module board including an eject mechanism selectively ejecting a module from a module accommodating section. The eject mechanism includes a locking member that has a locking nib engageable with a recess of a case of the module. The locking member is rotatably supported by a sidewall section of a guide rail member, and thus can stay in an opening of the sidewall section. An eject button of the connector for connection to a module board has an operation section provided with a flange. The flange is pressed against the inner peripheral surface of a housing of an electronic device by a biasing force of coil springs all the time except for when the operation section is pushed in.

Abstract: A suspension device mounts a superconducting magnet heat shield enclosure that encompasses a low-temperature container, that encompasses a superconducting magnet and holds coolant for cooling the superconducting magnet. The low-temperature container has an outer heat shield layer and an inner heat shield layer. A vacuum jacket encompasses the heat shield enclosure and has an outer vacuum shell and an inner vacuum shell. A first set of suspension parts connects the outer vacuum shell with the low-temperature container, and a second set of suspension parts connects the outer heat shield shell with the low-temperature container. Since the second set of suspension parts connect the heat shield enclosure directly with the low-temperature container, this reduces the relative movement between the two parts, thus alleviating the streaking phenomenon in a magnetic resonance image, if the superconducting magnet is part of a magnetic resonance imaging system.

Abstract: According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a shield (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the shield. In another exemplary embodiment, a thermal interface material (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the thermal interface material.

Abstract: An apparatus and method of providing an electrical component interface is disclosed. For one embodiment, the electrical component interface includes an electrical component adapter. The electrical component adapter includes an electronic component solder pattern for receiving and allowing attachment of an electrical component. An adhesive backing is adjacent a surface of the electrical component adapter. The adhesive backing provides attachment of the electrical component adapter to a second surface.

Abstract: A power module includes a power device having a top electrode and a bottom electrode, an upper metal block connected to the top electrode, a lower metal block connected to the bottom electrode, a resin covering the power device, the upper metal block and the lower metal block so as to expose a upper surface of the upper metal block and a lower surface of the lower metal block, an upper terminal-cooling power-applying block connected to the upper metal block, a lower terminal-cooling power-applying block connected to the lower metal block, an upper terminal connected to the upper terminal-cooling power-applying block, a lower terminal connected to the lower terminal-cooling power-applying block, and a insulating case covering all elements so as to expose a part of the upper terminal and a part of the lower terminal.

Abstract: A thermal management configuration for a flip chip semiconductor device is disclosed. The device includes a high power silicon based die having a metal bonding surface. A plurality of interconnects are formed on the metal surface and connected to a substrate. A plurality of thermal management stud bumps are formed on the metal bonding surface, the thermal management stud bumps positioned distinct from the interconnects and local to die hot spots, exposed ends of the thermal management stud bumps spaced from the substrate.

Abstract: A support system for an electrical device arranges the plurality of heat-sink assemblies in an orientation that allows the forces associated with an electrical fault that are transferred to the support structure to be reduced. The arrangement allows the electrical fault forces to cancel one another out such that the resulting net force applied to the support structure is significantly reduced. The size, strength and/or robustness of the support system can be reduced as the forces transmitted thereto are greatly reduced. The heat-sink assemblies can be arranged to facilitate ease of maintenance by allowing the heat-sink assemblies to be removed from a front access panel of the electrical device.

Abstract: A COF includes, in at least one embodiment, a heat dissipating material on a back surface of an insulating film. The heat dissipating material has a slit for reducing a degree of thermal expansion. Thus, at least one embodiment of the invention provides the COF in which deformation and disconnection of wiring are prevented.

Abstract: A housing is constructed of a transmission case and an oil pan and has a space therein. A through hole passes through the transmission case. A pressure control unit is housed in the housing and controls hydraulic pressure supplied to a transmission mechanism by the operation of a solenoid valve. An internal cable is housed in the housing and is electrically connected to the solenoid valve of the pressure control unit. An external cable is electrically connected to an engine control unit outside the housing. A connector is arranged in such a way as to pass through the through hole and is electrically connected to the internal cable and the external cable. The connector has an external exposed portion, which is exposed outside the housing, formed in such a way as to be able to pass through the through hole.

Abstract: A heat exchange structure includes elongated air ducts. Each air duct has a first opening and a second opening at two ends of the air duct to allow air to enter and exit the air duct, respectively. The heat exchange structure includes an exterior heat exchange surface and interior heat exchange surfaces, in which the exterior heat exchange surface is configured to receive thermal energy from heat generators that are mounted on the exterior heat exchange surface, and the exterior heat exchange surface dissipates a portion of the thermal energy received from the heat generators and transfers another portion of the thermal energy to the interior heat exchange surfaces. The interior heat exchange surfaces are in the elongated air ducts and configured to exchange thermal energy with air flowing in the air ducts, enhancing air flow in the air ducts by buoyancy of heated air.

Abstract: An electro-optic device includes an electro-optic panel and a holding member provided with a heat emitting portion on the side opposite to a surface to which the electro-optic panel is adhered by an adhesive. In the electro-optic device, a groove portion to be filled up with the adhesive is provided in a portion of the holding member to which the electro-optic panel is adhered.

Abstract: An electro-optic device includes an electro-optic panel, a first holding member that holds the electro-optic panel, and a second holding member provided with a heat emitting portion on the side opposite to a surface to which the electro-optic panel is adhered. In the electro-optic device, a predetermined gap is provided between the first holding member and the second holding member.

Abstract: In an arrangement for a power electronics unit in a HEV, the HEV including a combustion engine, an electric motor/generator, a transmission, the power electronics unit is shaped as a plate. The plate is extended along a transmission side, the power electronics unit is fixed to the power train with a first attachment point. All attachment points have a total thermal conductivity corresponding to more than 10 degrees temperature difference on a Kelvin-scale between the power electronics unit and outside surface of said first transmission side and/or outside surface of the motor/generator for 5 kW of heat originating from one side of said attachment point. Embodiments also including sound damping capabilities are disclosed. The arrangement facilitates use of fewer parts and increased functionality.

Abstract: A LED array cooling system including a LED array and a substrate attached to the LED array wherein the LED array includes a plurality of walls that at least in part define a plurality of passages through the LED array.

Abstract: There is provided a heatsink for radiating heat from a heat-producing device. The heatsink includes a heatsink body; a clip that has a pair of arms and is fitted to the heatsink body along a heat radiation surface of the heat-producing device such that the heat-radiation surface of the heat-producing device and the heatsink body closely contact with each other while being sandwiched between the pair of arms; and a guide plate integrally formed with the heatsink body. The guide plate is configured such that an interval between the guide plate and the heatsink body is smaller than an arm interval between the pair of arms of the clip on a front side in a fitting direction of the clip and is larger than the arm interval on a deep side in the fitting direction of the clip.

Abstract: An enclosed electronic apparatus including a first continuous heat-transfer band forming at least a portion of the exterior surface of the enclosure, with continuous lateral edges on either side thereof, and mounting points on an internal side of the continuous heat transfer band to which a printed circuit board assembly is mountable. A printed circuit board assembly is mounted to the heat transfer band at the mounting points, with a thermally conductive portion forming a thermal path between a heat-producing electronic component of the printed circuit board assembly and the heat transfer band. A thermally conductive gasket between the printed circuit board assembly and the heat transfer band at the mounting points facilitates heat transfer. Opposing first and second enclosure portions seal the respective continuous lateral edges of the heat transfer band against penetration of fluid or debris.

Abstract: An electric component is mounted on a circuit board, and a pre-foamed heat radiating member is applied on the electric component. The circuit board is inserted into a chassis having a box shape with an opening in one side toward an opposite side of the opening. A thickness of the pre-foamed heat radiating member is less than a distance between a front surface of the electric component and an inner surface of the chassis. Thus, the pre-foamed heat radiating member is not removed by scraping when the circuit board is inserted into the chassis. Then, the pre-foamed heat radiating member is heated and expands until the radiating member reaches the chassis, and a heat radiating path between the electric component and the chassis is provided. Therefore, the heat radiating property of the electric component can be increased.

Abstract: The semiconductor device includes a circuit board. The circuit board has an insulating substrate, a metal circuit fixed on a first side of the insulating substrate, and a metal plate fixed on a second side of the insulating substrate. The semiconductor device further has a semiconductor element mounted on the metal circuit, a stress reducing member fixed on the metal plate, and a heat sink fixed on the stress reducing member. The stress reducing member is plate-shaped and has round-shaped corners.

Abstract: A heat dissipation unit is provided. The heat dissipation unit includes a heat sink, a first fixing station, a first heat pipe, a second fixing station and a second heat pipe. The first fixing station is located on a first plane. The first heat pipe is connected to the first fixing station and the heat sink. The second fixing station is located on a second plane, wherein a gap is formed between the first plane and the second plane. The second heat pipe is connected to the second fixing station and the heat sink, wherein the first fixing station partially overlaps the second fixing station.

Abstract: The high-frequency circuit cooling apparatus comprises a package container 14 for housing a high-frequency circuit, a tank 16 for storing a gas to be introduced into the package container 14, a cold head 12 for cooling the package container 14 and the tank 16, pipes 24, 26 connected to the tank 16, for supplying the gas into the tank 16, pipes 18, 22 detachably connected between the tank 16 and the package container 14, for introducing the gas in the tank 16 into the package container 14, and pipes 34, 36 detachably connected to the package container 14, for discharging the gas in the package container 14.

Abstract: A flange (3) for sealing an opening (1) of a fuel container (2) of a motor vehicle maintains an electronic component (9) which is arranged on the external side (5) on a carrier (12). The carrier (12) is embodied as a single piece and has a heat-conducting element (13) which can penetrate the wall (4) of a flange (3). The heat-conducting element (13) dissipates the heat which is produced by the electronic component (9) to the inside (7) of the fuel container (2).

Abstract: A fastener includes a connecting pole, a sleeve, an elastic element enclosing the sleeve and a baffling portion. The connecting pole includes a shaft, a head and a thread portion. The sleeve includes an engaging portion and a receiving portion extending from the engaging portion. The engaging portion encloses a top end of the shaft therein and abuts against the head. The receiving portion encloses a bottom end of the shaft and a top end of the thread portion. The receiving portion includes a plurality of spaced resilient pieces. The baffling portion screws onto the thread portion of the connecting pole. When the connecting pole rotates relative to the sleeve, the baffling portion moves upwardly along the thread portion to push the pieces of the receiving portion outwardly to make the pieces abut against a bottom surface of a printed circuit board.

Abstract: The manufacturing process of a circuit board includes forming a thermal interface layer on a first metal thin layer of a thermal plate. Joining a second metal layer of a main circuit board comprises at least one opening with the thermal interface layer. Then, reflowing the main circuit board with the joined thermal plate. A circuit board with a cooling function using the foregoing manufacturing process is also provided.

Abstract: An electronic apparatus includes: a housing; a circuit board accommodated in the housing; a face mounting component mounted on the circuit board; a heating component mounted on the circuit board; a reinforcing member having a thermal conductivity and configured to reinforce a region on the circuit board on which the face mounting component is mounted; and a radiation unit extended from the reinforcing member and connected thermally to the heating component.

Abstract: A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a centrifugal fan located adjacent to the fin unit, a heat-conducting board attached to the electronic component and a heat pipe thermally connecting the fin unit and the electronic component. An engaging portion protrudes upwardly from a top face of the heat-conducting board. The heat pipe has an evaporating section extending through the engaging portion and being fixed to the top face of the heat-conducting board, and a condensing section attached to the fin unit.