Abstract: A media content receiving device, such as a set top box, includes a chassis that incorporates a heat bridge, a heat shield or both. The heat bridge may take the form of a structural wall coupled to, but preferably integrated with, the chassis to facilitate conductive heat transfer into a chassis panel. The heat bridge may be configured to receive heat radiated from a chip having a die to be cooled. The heat shield may take the form of a wall-type structure protruding from a chassis panel. For example, the heat shield may extend from a top panel of the chassis in a fin-like or flange-like manner to provide a thermal barrier between adjacent electrical components arranged on a circuit board. While the heat shield protects the adjacent component from potential thermal damage or degradation, it may also operate to transfer heat into the chassis.

Abstract: An electronic assembly has a plurality of functional units each including a board element populated with electronic modules, which board element has in each case a number of contact locations arranged in at least one row, and a contact board, which has for each board element at least one row of contact receptacles that are directly electrically connected to the contact locations of the associated board element. These rows point toward a side of the contact board in their longitudinal direction. A plurality of similar assemblies are produced compactly and cost-effectively by providing a communication unit separate from the contact board and serving for communication with modules of the board elements. The communication unit is connected to the contact board via a plurality of data lines which are contact-connected to the contact board on the side to which the rows point.

Abstract: The present invention relates to an electronic device for switching currents and a method for producing such a device that is reliable and durable. Such an electronic device comprises a power semiconductor that can be actuated for switching between at least two states; a substrate having thermomechanical properties compatible with the power semiconductor on which the power semiconductor is disposed on one side; a bus bar disposed on the other side of the substrate for conducting the current, wherein the substrate and the bus bar are coupled to each other such that a heat-conductive connection is provided so that heat can be dissipated from the power semiconductor to the bus bar.

Abstract: A power semiconductor module includes: a first metal substrate on which a power semiconductor device is mounted; a second metal substrate on which a power semiconductor device is not mounted; and an electrically insulating resin package which seals the first metal substrate and the second metal substrate. The back surface of the first metal substrate on the side opposite to the mounting surface of the power semiconductor device is made to expose outside the resin package to form a heat dissipation surface.

Abstract: A heat sink having auto switching function, a heat sink system and a heat sinking method are disclosed. The heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control power ON or power OFF of a thermoelectric cooler of the heat sink device or to control power ON, power OFF, or change rotation speed setting of a heat sink fan in the heat sink device. Thus, the heat sink auto switches operations of the heat sink device correspondingly according to temperature changes of the external device.

Abstract: A wedge lock for use with a single board computer includes a cooling plate positioned with respect to a printed circuit board (PCB), a clamp device configured to secure the single board computer in an operating environment, and a heat conductance plate positioned along a top surface of the cooling plate and a top surface of the clamp device to facilitate conduction cooling of the PCB.

Abstract: A translating hinge includes a translation element which provides translational movement between two objects coupled by the translating hinge and a rotating assembly coupled to the translation element.

Abstract: It is an object to improve a conventional point that mounting an electronic component that requires a high current and heat radiation, such as an LED, together with other general electronic components on the same board has been difficult. To achieve this object, a different thickness lead frame partially having different thicknesses is used. On a thick portion of the different thickness lead frame, a special electronic component, such as an LED, for which a high current and heat radiation are required is mounted. Further, a thin portion of the different thickness lead frame is formed at a fine pitch, and general electronic components are mounted at a high density on the thin portion. Thus, unitization or modularization of electronic components for which a high current and heat radiation are required becomes possible.

Abstract: A LCD device includes color LEDs, a light-mixing optical guide plate and a main optical guide plate for guiding lights from the color LEDs, a LCD panel for receiving lights from the main optical guide plate, a housing for supporting the LCD panel, light-mixing optical guide plate and main optical guide plate in block, and a heat sink for dissipating the heat transferred from the LEDs. On the rear surface side of the light-mixing optical guide plate, a heat receiving member is provided having a higher heat receiving capability than the rest of the housing.

Abstract: A machine tool with a heat conduction structure comprises a machine tool and a heat dissipation seat installed on the machine tool. The machine tool has a handle. The handle has an accommodation space accommodating a circuit board and having an opening at one end. The heat dissipation seat has a heat dissipation member arranged on the opening and a carrying member connected with the heat dissipation member and extended to the accommodation space. The carrying member carries the circuit board, contacts heat sources of the circuit board, and conducts heat to the heat dissipation member. As the machine tool is exempted from forming heat dissipation holes on the handle, the present invention can effectively prevent dust from entering the handle and damaging the circuit board. Further, the present invention can dissipate heat generated by the circuit board and maintain normal operation of the circuit board and the machine tool.

Abstract: A circuit board assembly includes a motherboard defining a number of plug slots, and a fixing mechanism for securing a heat sink. The fixing mechanism is positioned between two adjacent plug slots, and includes a support member mounted on the motherboard, two fixing brackets mounted on opposite ends of the support member, two bars rotatably connected to the fixing brackets, and a connection member detachably connected to the support member by the bars. The opposite borders of the support member extend in the same direction substantially parallel to the plug slots, and the support member forms four connecting portions for securing the heat sink on opposite sides thereof, and the connecting portions are located between the opposite borders.

Abstract: An electronic circuit device includes a bus bar, a base component and an electronic component. The bus bar has an external connector terminal capable of receiving electric power from an external power source. The base component has a metallic heat radiation portion and is disposed to oppose the bus bar. The electronic component is held between the bus bar and heat the radiation portion of the base component. The bus bar further includes fixing terminals extending toward the base component. The fixing terminals are fixed to the base component to constitute fixing portions. The fixing portions are configured to have elasticity and exert a restoring force such that a distance between the bus bar and the base component reduces. The electronic component is in pressure contact with the bus bar and the base component by the restoration force of the elasticity of the fixing portions.

Abstract: A printed circuit board is provided with at least one via hole, in which a heat dissipating element is arranged, wherein at least one radiant source is arranged on the heat dissipating element. The lighting device is provided with at least one such printed circuit board.

Abstract: An electronic apparatus includes: a housing; a circuit board accommodated in the housing; a face mounting component mounted on the circuit board; a heating component mounted on the circuit board; a reinforcing member having a thermal conductivity and configured to reinforce a region on the circuit board on which the face mounting component is mounted; and a radiation unit extended from the reinforcing member and connected thermally to the heating component.

Abstract: A heat dissipation module includes a heat sink, a wind-guiding element and a pivot. The wind-guiding element is disposed on the heat sink, and the pivot is connected between the heat sink and the wind-guiding element to allow the wind-guiding element to rotate relative to the heat sink via the pivot. The wind-guiding element can change a direction of airflow to provide an optimal heat dissipation effect. Additionally, an electronic device using the heat dissipation module is also provided. The heat dissipation module can provide superior heat dissipation effect to an electronic component on the electronic device and maintain a normal operation of the electronic component.

Abstract: A heat sink type module includes a mounting seat and a heat sink. The mounting seat includes a supporting plate, and two substantially parallel first side plates extending up from opposite first sides of the supporting plate. A latch protrudes from an inner surface of each first side plate. A heat sink includes a base plate and fins extending up from a top surface of the base plate. The base plate includes two substantially parallel first sides. The latches of the first side plates latch the first sides of the base plate to fix the heat sink.

Abstract: A system to improve an in-line memory module may include an edging carried by the in-line memory module to stiffen, support, protect, and/or aid in handling the in-line memory module. The system may also include guide ribs carried by the edging to facilitate positioning of the in-line memory module during installation. In one embodiment, the system includes a heat spreader to aid in cooling a plurality of heat sources carried by the in-line memory module. The system may further include a compliant member to regulate the heat spreader's positioning relative to the plurality of heat sources.

Abstract: A storage apparatus S comprises a disk controller 1 for controlling data I/O processing between a host H and a disk unit 2. The disk controller 1 includes a plurality of circuit board modules each having a circuit board 210 and a module case 200 storing the same, and a chassis 100 shaped like a hollow cylinder having a front side opening and a rear side opening and configured to store the circuit board modules from the front and rear side openings. A CM module 20 is configured to introduce cooling air from a cooling fan 10F through an opening provided on at least one side surface toward a circuit component mounted on the circuit board 210. A MP module 30 is configured to introduce cooling air by a cooling fan 10R through an opening provide on a front surface of the module case 200.

Abstract: A fixing mechanism for fixing an object to a base plate is provided. The object defines a hole and includes a ring extending from an edge of the hole. The ring includes a threaded hole. The base plate includes a post on its top surface and respectively opposing to the hole. The fixing mechanism includes an elastic element, a first hollow bolt and a second bolt. The first hollow bolt passes through the hole and the elastic element, and includes an externally threaded portion engaging with the threaded hole of the ring. The second bolt is inserted into the first hollow bolt, and engages with the post of the base plate.

Abstract: In an electronic control unit, a semiconductor device that is installed to a circuit board includes a semiconductor chip, multiple leads and a resin body. The semiconductor chip is electrically connected to the circuit board through the leads and is molded in the resin body. A case receives the semiconductor device. A heat releasing gel contacts the semiconductor device, and conducts heat generated from the semiconductor device to a first cover of the case located on one side of the semiconductor device, which is opposite from the circuit board. A groove portion as a movement limiting means is placed at a location between the circuit board and the first cover. Therefore, movement of the heat releasing gel is limited, and heat can be released to a side of the case through the heat releasing gel with high efficiency.

Abstract: A heat dissipation apparatus adapted for cooling an electronic component received in a metal housing includes a heat sink thermally attached to the electronic component and a plurality of resilient tabs arranged between the heat sink and the metal housing. The resilient tabs are elastically deformed by the metal housing and thermally contact an inner face of the metal housing.

Abstract: An electronic device includes a chassis, a circuit board installed in the chassis, a memory card coupled to the circuit board, and a heat sink for cooling the memory card. The heat sink includes a first cooling plate, a second cooling plate, and a connection member connected between corresponding sides of the first cooling plate and the second cooling plate. A conducting member extends from the connection member, and contacts the chassis.

Abstract: The present invention relates to a device adapted in order to decrease stress on connection points between a heat generating source and a substrate. The device 13 comprises a larger heat-dissipating part 7, and at least one smaller heat-dissipating part 6. The larger part 7 is arranged with at least one cavity 8 for housing the at least one smaller part 6. The at least one smaller part 6 is adapted to be attached to at least one heat-generating source 2, and at the same time more mobile in the cavity 8 and/or less affected by changes in temperature than the larger part.

Abstract: A power supply unit of an arc discharge device includes a semiconductor module 1 and a radiator fitted onto the semiconductor module 1. The semiconductor module 1 includes a module casing 2 and common units 3a to 3c retained by the module casing 2. Each of the common units 3a to 3c has: a ceramic substrate 50 having a circuit surface disposed with a semiconductor element 54 and a radiation surface on a side opposite to the circuit surface and a package 35 that exposes the radiation surface and seals the circuit surface with heat resistant resin. The radiator is fitted onto the module casing 2 to be thereby brought into abutting contact with all of the radiation surfaces of the common units 3a to 3c.

Abstract: A module for use with an expandable wedge clamp assembly in a chassis channel is provided. The module comprises a first side, a second side, a first extension attached to the first side, and a second extension attached to the second side. The first extension and the second extension are flexible. When the wedge clamp assembly is expanded, the first extension and the second extension flex from a first position to a second position. When the wedge clamp is returned from the expanded position to a relaxed position, the first extension and the second extension return from the second position to the first position.

Abstract: In some embodiments, an apparatus includes a printed circuit board and a thermal interface member. The printed circuit board is configured to be coupled to an electronic device, such as, for example, a removable (or “pluggable”) optical transceiver. A first surface of the printed circuit board includes a thermally-conductive portion, and a second surface of the printed circuit board includes a thermally-conductive portion that is coupled to the thermally-conductive portion of the first surface by a thermally-conductive via between the first surface and the second surface. The thermal interface member is coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface. The portion of thermal interface member is deformable and thermally-conductive.

Abstract: The invention relates to a portable electronic device, e.g. a mobile phone, comprising a shell, a display, a battery, a processor and a receiver. In the portable electronic device is at least one of the components configured to heat exchange with a phase changing material which is arranged within the portable electronic device.

Abstract: Power switching circuitry has a heat absorbing structure, and a heat conductive substrate having power switching components on a first surface and a second surface adjacent to the heat absorbing structure. Electrically conductive members, comprising first and second members, are on the first surface and extend along a first axis orthogonal to the heat conductive substrate. The second portion is more remote from the heat conductive substrate, and has a smaller cross-sectional area than, the first portion to define a shoulder region orthogonal to the first axis. A circuit board is located on the shoulder regions, with the second portions extending through the circuit board. An urging mechanism urges the circuit board against the shoulder regions, whereby the electrically conductive members provide a current path between the heat conductive substrate and the circuit board, and urge the heat conductive substrate into thermal contact with the heat absorbing structure.

Abstract: An electronics assembly for a photovoltaic panel includes a substrate of a thermally conductive material, wherein the substrate defines a thermal contact area for thermally contacting the electronics assembly to a photovoltaic panel; and at least one electronic component provided on the substrate and in thermal contact with the substrate, so that when the electronics assembly is in thermal contact with the photovoltaic panel. The thermal contact provides a heat conductive channel between the at least one electronic component and the photovoltaic panel, wherein the heat conductive channel enables the electronics assembly to use the photovoltaic panel as a heat sink for heat produced by the at least one electronic component.

Abstract: Apparatuses are provided for compressing a thermal interface material between a heat generating electrical component and a cooling electrical component. Embodiments include a draw rod coupled at one end to the cooling electrical component, the draw rod passing through the heat generating electrical component; wherein the draw rod includes a pin on the end opposite the end coupled to the cooling electrical component; and a rotatable latch coupled to the heat generating electrical component, the rotatable latch including a hook at one end; wherein when the rotatable latch is in an engaged position, the hook of the rotatable latch engages the pin of the draw rod such that the thermal interface material adhered to the heat generating component is coupled to the cooling electrical component; wherein when the rotatable latch is in an unengaged position, the hook of the rotatable latch is not engaged with the pin of the draw rod.

Abstract: Cooling systems for computers are disclosed. In particular, embodiment of such cooling solutions may effectively be used in conjunction with mobile computers that have a polymer (or other type of) chassis. More specifically, embodiments of the present invention use micro vapor plates to conduct the heat generated by one or more electronic components of a mobile computer to the chassis of the mobile computer such that the heat from the electronic components is conducted into, and spread over, at least a portion of the surface of the chassis. The mobile computer can then be cooled by convection or radiation.

Abstract: An exemplary electronic device includes a shell, a mother board and a metal sheet disposed at an inner side of the shell, an electronic apparatus fixed on the mother board, and a heat conducting plate thermally connecting the electronic apparatus with the metal sheet. The metal sheet is located between the shell and the mother board to shield electro magnetic interference from the electronic apparatus. The electronic apparatus generates heat when working. The electronic apparatus is located between the mother board and the metal sheet, and is spaced from the metal sheet.

Abstract: A matrix assembly is provided for an electrical system such as, for example, a power distribution unit for an aircraft. The electrical system includes an enclosure and a number of current carrying components such as, for example, electrical bus members, electrical switching apparatus, and/or fuses. The matrix assembly includes a matrix member having a generally planar portion, a plurality of attachment points for attaching the current carrying components to the generally planar portion, and a plurality of mounting points for attaching the generally planar portion to a thermally conductive structure such as, for example, an aluminum airframe structure. The matrix member is a thermally conductive liquid crystalline polymer.

Abstract: An electronic equipment includes: an attachment plate; attachments disposed on the attachment plate and each provided with a female screw; a printed circuit board placed on the attachments; electronic parts mounted on the surface of the printed circuit board opposite to the attachments, and whose surfaces opposite to the surface of the printed circuit board serves as heat release surfaces; and a heat sink having a thermal-conduction surface and screw insertion holes. The thermal-conduction surface is abutted in common against the heat release surfaces with a heat release grease between them, male screws inserted into the screw insertion holes are penetrated through the printed circuit board, and meshed with the female screws threaded in the attachments, the heat sink is attached together with the printed circuit board to the attachments, and at least one of the attachments can be displaced in the thickness direction of the printed circuit board.

Abstract: A multi-layer system-on-chip (SoC) module structure is provided. The multi-layer SoC module structure includes at least two circuit board module layers and at least one connector module layer. Each connector module layer is sandwiched between and thus electrically connects two circuit board module layers such that the SoC module structure is formed by stacking. Each circuit board module layer is composed of at least one circuit board module while each connector module layer is composed of at least one connector module. Hence, the SoC module structure can be manufactured as a three-dimensional structure, thus allowing highly flexible connections within the SoC module structure.

Abstract: An I/O system and device for use with superconducting device provides multi-stage filtering using superconducting electrical pathways, while providing good thermal conductivity to maintain low temperature of the various components and allowing the easy mounting and dismounting of a device sample from a refrigerated environment. Filtering may include a lumped element filter assembly including multiple plates each carrying a number of lumped element filters. Filtering may include a metal powder filter assembly including multiple metal power filters formed in passages of a substantially non-magnetic portions. A device sample holder assembly secures a device sample, for example a superconducting quantum processor, and provides signals, ground and good thermal conduction.

Abstract: A composite cover for a portion of a motor vehicle transmission has an integral, internal heat sink to which an electronic controller is attached. The cover, which may be fabricated of any temperature appropriate plastic or composite, closes off and protects that portion of a motor vehicle transmission having electrical and electronic components such as valves, solenoids, motors and sensors. Spaced from the inside surface of the cover where it is subjected on both sides to flow of transmission fluid is a plate or heat sink. An electronic controller is disposed on the outside of the cover and attached by heat transferring mechanical fasteners such as studs or bolts to the plate inside the cover. Preferably, the housing of the controller also includes a heat sink.

Abstract: An electronic apparatus and a keyboard supporting module thereof are provided. The electronic apparatus includes a heat source, the keyboard supporting module and a push-button key module. The keyboard supporting module includes a keyboard supporting structure and an insulator. The keyboard supporting structure is thermally connected to the heat source. Particularly, the keyboard supporting structure supports the push-button key module with the insulator.

Abstract: An electronic apparatus includes a substrate, a device including a flange, the device being mounted at a first side of the substrate, a plate arranged at a position corresponding to the device at a second side of the substrate, the second side being opposite to the first side, and a securing member that secures the device to the substrate.

Abstract: In a power conversion device including: a converter which steps up or down a voltage of a direct current power supply; and an inverter which converts the direct current voltage obtained by the converter into an alternating voltage to drive an electric motor, a plurality of magnetic parts are arranged above a switching element assembly unit with a water-cooled type second heat sink interposed between the switching element assembly unit and the plurality of magnetic parts, the switching element assembly unit configured by mounting all the switching element modules on upper and lower surfaces of a water-cooled type first heat sink. Accordingly, it is possible to provide a power conversion device capable of housing many switching element modules in a compact space and cooling them effectively, while preventing the influence of a noise due to the magnetic parts from acting on the switching element modules as much as possible.

Abstract: The present invention relates to a clamping member for pressing power components (9) against cooling surfaces of the cooling flanges (7) of a housing, particularly for receiving an electronic circuit. The clamping member comprises a housing frame (13) having at least one receiving chamber for the cooling flange (7) and the power semiconductor (9) to be contacted with the cooling flange (7), the receiving chamber being surrounded by the frame walls (14a, 14b, 15) of the housing frame. A pressure element (17) is disposed between a frame wall (14a, 14b) and the power component (9) disposed opposite thereof, or the cooling flange (7) disposed opposite thereof. A separating gap, into which an expanding element (18) can be introduced on one side non-positively and/or positively such that the power component (9) is pressed against the cooling flange (7), is provided between the pressure element (17) and the frame wall (14a, 14b).

Abstract: A power inverter comprises at least a box-shaped housing; and a power module, a smoothing capacitor, a base plate made of a flat plate, and a rotating electric machine control circuit board arranged in order in the housing. The base plate is arranged with the fringes fixed to the inner wall surfaces of the housing, and the smoothing capacitor and rotating electric machine control circuit board are fixed.

Abstract: The invention relates to a power semiconductor module including a module housing and at least one substrate populated with at least one power semiconductor chip. The module housing has a bottom side and a top side spaced away from the bottom side in a positive vertical direction. In addition, the substrate has a bottom side facing away from an interior of the module housing. The substrate is arranged in an opening of the module housing configured in its bottom side and attached to the module housing by a resilient bonding agent for freedom of movement of the substrate parallel to the vertical direction in relation to the module housing. In the non-mounted condition of the power semiconductor module, the substrate assumes a resting position in relation to the module housing. To deflect the substrate from the resting position parallel to the vertical direction, a deflection force of 0.1 N to 100 N per mm is applied.

Abstract: The present invention relates to an electric vehicle and a method of cooling a vehicular DC/DC converter. A fuel cell vehicle, as one example of an electric vehicle, includes a DC/DC converter connected between an electricity storage device and a fuel cell for converting a voltage generated by the electricity storage device and applying the converted voltage to a motor, and converting a regenerated voltage produced by the motor in a regenerative mode or a voltage generated by the fuel cell and applying the converted voltage to the electricity storage device, and a cooling apparatus for cooling the DC/DC converter. The cooling apparatus includes a cooling fluid passage therein for a cooling fluid that flows therethrough, the cooling fluid passage including a bend. The cooling apparatus is constructed such that the cooling fluid flowing upstream of the bend cools upper arm devices, while the cooling fluid flowing downstream of the bend cools lower arm devices.

Abstract: A method for providing a high in-plane and through-plane thermal conductivity path between a heat producing electronic device and a heat sink is described. A vapor chamber, or other type of heat spreader, is provided that has a substantially flat top copper surface and a substantially flat bottom copper surface. A ceramic submount is also provided, where the submount has a top copper metallization layer patterned for connection to electrodes of a heat-producing die, and where the submount has a bottom copper metallization layer. Prior to a working fluid being introduced into the vapor chamber, and prior to a die being mounted on the submount, the top copper surface of the vapor chamber is diffusion bonded to the bottom copper metallization layer of the ceramic submount under heat and pressure. The working fluid is then introduced into the vapor chamber, and the chamber is sealed. Dies are then mounted on the submount. The bottom of the vapor chamber is then affixed over a heat sink.

Abstract: According to one embodiment, a cooling structure includes a first heat radiating member receiving heat generated by a first heat generating body, and including a plurality of first heat radiating fins projecting toward a second housing, a first flow-in portion provided to the first housing to be open in one of first directions, a second heat radiating member receiving heat generated by a second heat generating body, and including a plurality of second heat radiating fins projecting toward a first housing, and a first flow-out portion provided to the second housing to be open in one of second directions crossing the first directions. The cooling structure includes a cooling fan unit configured to supply the air that has flown from outside to the first heat radiating fins, thereafter supply the air to the second heat radiating fins and cause the air to flow to the outside.

Abstract: A wiring substrate with a lead pin is formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials. In the lead pin, a conic protrusion part whose side surface is formed in a concave surface is formed in the end face side opposed to the electrode pad of a head part formed in one end of a shaft part. The lead pin is bonded to the electrode pad in a state in which the conductive material extends to the back surface side of a head part beyond a flange part of the head part and reaches the shaft part of the lead pin.

Abstract: The present invention is a robust LED display module for use in an electronic sign which display module includes a metallic housing, a heat conductive interface panel, an LED circuit board and LEDs, and a metallic mask arranged in intimate contact and association therewith, and which components operate synergistically in concert with each other in order to evenly distribute, reduce and dissipate heat along, about and within the structure of the present invention. Display uniformity is provided by the use of major metallic structures in order to prevent warpage and to protect the geometric integrity of the LED display module.

Abstract: A heat dissipation device adapted for cooling an electronic device mounted on a printed circuit board comprises a base plate adapted for being thermally attached to the electronic device and a clip attached on a top face of the base plate. The base plate comprises two protruding poles protruding downwardly from a bottom face thereof. The protruding poles are capable of extending through the printed circuit board, thereby establishing a location for the heat dissipation device on the printed circuit board. The clip fastens the heat dissipation device on the printed circuit board after the location for the heat dissipation device on the printed circuit board has been established.

Abstract: An electronic device includes a casing, an electronic component accommodated in the casing; and a composite heat conductive layer between the casing and the electronic component. The composite heat conductive layer includes a graphite layer and a thermal pad layer between the electronic component and the graphite layer. The thermal pad layer is attached to the electronic component. The graphite layer is attached to an inner surface of the casing. The graphite layer is located between the casing and the thermal pad layer. Heat conductive efficiency of the graphite layer along a horizontal spreading direction thereof exceeds that along a vertical thickness direction thereof. A surface area of the graphite layer is not less than that of the electronic component. Heat generated by the electronic component is evenly transferred and is spread to the casing via the graphite layer of the composite heat conductive layer.