Abstract: A cooling or heat transfer apparatus and method is disclosed for cooling an electronic device. The apparatus includes a heat producing electronic device which may include an electronic circuit card with many heat sources. A heat transfer device is connected to the heat producing electronic device which is thermally communicating with the heat producing device for transferring heat from the heat producing device to the heat transfer device. A heat conduit is connected to the heat transfer device and thermally communicating with the heat transfer device for transferring heat to the heat conduit from the heat transfer device. A cooling housing is connected to the heat conduit and the cooling housing thermally communicating with the heat conduit for transferring heat to the cooling housing from the heat conduit. The apparatus enables the replacement of circuit cards in the field because it eliminates the need to apply thermal-interface materials.

Abstract: A heat radiator capable of thermally connect to a heat element includes a pair of heat conducting plates conducting heat from one side surface to other side surface of the heat conducting plate, respectively, the pair of heat conducting plates having a space between each of the heat conducting plates; and a radiation fin arranged between the pair of heat conducting plates, having elastic characteristics between the pair of heat conducting plates, and radiating heat from the heat conducting plate to the space.

Abstract: An electro-optical device may include: an electro-optical panel, a holding member that includes a main body part arranged to surround the periphery of the electro-optical panel, and a holding part protruded from the main body part and holding the electro-optical panel, and a heat radiating member that is disposed opposing the electro-optical panel through an opening of the holding member from the opposite side of the light incident plane of the electro-optical panel.

Abstract: A computer system includes a chassis, a motherboard, an isolation component, and a block. The chassis includes a bottom wall, and a sidewall connected to the bottom wall. The motherboard is secured to the chassis. A heat sink is secured to the motherboard for cooling a chip mounted on the motherboard. An isolation component is secured to the chassis between the bottom wall and the motherboard. The isolation component includes a bent piece attached to the side wall and positioned between the heat sink and the sidewall. A distance is defined between the bent piece and the heat sink. The block is attached to the bent piece and positioned between the heat sink and the sidewall to span the distance.

Abstract: An electronic system such as a computer system includes a casing defining an opening at a side thereof, a motherboard arranged in the casing, a hard disk located at a side of the motherboard and a heat dissipation structure covering the opening of the casing. The motherboard includes a printed circuit board facing toward the opening of the casing, first electronic components and second electronic components mounted on the printed circuit board and facing toward the opening. The heat dissipation structure includes a base engaging with the casing and fins extending from the base and outside of the casing. The base includes a first engaging portion contacting the first and second electronic components and a second engaging portion contacting the hard disk. The first engaging portion and the second engaging portion are in different levels from each other.

Abstract: Provided are a silicon nitride substrate made of a silicon nitride sintered body that is high in strength and thermal conductivity, a method of producing the silicon nitride substrate, and a silicon nitride circuit substrate and a semiconductor module that use the silicon nitride substrate. According to the silicon nitride sintered body, in a silicon nitride substrate consisting of crystal grains 11 of ?-type silicon nitride and a grain boundary phase containing at least one type of rare earth element (RE), magnesium (Mg) and silicon (Si), the grain boundary phase consists of an amorphous phase 12 and a MgSiN2 crystal phase 13; the X-ray diffraction peak intensity of any crystal plane of a crystal phase containing the rare earth element (RE) is less than 0.0005 times the sum of the diffraction peak intensities of (110), (200), (101), (210), (201), (310), (320) and (002) of the crystal grains of the ?-type silicon nitride; and the X-ray diffraction peak intensity of (121) of the MgSiN2 crystal phase 13 is 0.

Abstract: Some embodiments of a method, apparatus and computer system are described for inverted vortex generator enhanced cooling. In various embodiments an apparatus may comprise a first surface comprising at least one heated component, a second surface in proximity to the first surface, the second surface comprising a non-heated surface, and one or more inverted vortex generators attached to the non-heated surface, a portion of the one or more inverted vortex generators in proximity to and configured to dissipate heat from the at least one heated component. Other embodiments are described.

Abstract: A display device includes a display panel 11, a holding member 50, a circuit board 18 and a heat-transfer member 60. The display panel 11 is configured to display images. The holding member 50 holds the display panel 11. The circuit board 18 arranged so as to face the holding member 50 and connected to the display panel 11. The heat-transfer sheet 60 is arranged between the circuit board 18 and the holding member 50 so as to be in contact with the circuit board 18 and the holding member 50. The heat-transfer sheet 60 has a circuit board fixing portion 61, a holding member fixing portion 62 and flexible connection portions 63 that make connections between the fixing portions 61 and 62. The circuit board fixing portion 61 is attached to the circuit board 18 and separated from the holding member 50. The holding member fixing portion 62 is attached to the holding member 50 and separated from the circuit board 18. Therefore, a display quality is less likely to decrease.

Abstract: The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module. A casing houses: semiconductor modules 20, 30 constituting a main circuit for power conversion; a capacitor 50 electrically connected to the main circuit; drive circuits 70, 71 that provide main circuit with a drive signal used in power conversion operation; a control circuit 74 that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage 28 is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material.

Abstract: According to one embodiment, the electronic device includes: a heating element that has: a first electronic part; and a plurality of connection terminals provided around the first electronic part; a first circuit board that has: a first surface; a second surface opposite to the first surface; an opening; and a plurality of pads provided around the opening at the first surface to be electrically connected with the connection terminals, respectively; a heat receiving member that has a heat receiving portion faced to the heating element and that is thermally connected to the heating element; a pressing member that presses the heat receiving member toward the first circuit board; and a support member that supports the first circuit board at a periphery of the opening from the second surface.

Abstract: The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module. A casing houses: semiconductor modules 20, 30 constituting a main circuit for power conversion; a capacitor 50 electrically connected to the main circuit; drive circuits 70, 71 that provide the main circuit with a drive signal used in power conversion operation; a control circuit 74 that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage 28 is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules 20, 30 are housed inside the cooling chamber, and at least the capacitor 50 and the control circuit 74 are disposed outside the cooling chamber.

Abstract: In a metal-based print board formed with radiators, a metal foil is affixed to a front surface of a metal plate having good thermal conductivity, an insulating adhesive layer interposed therebetween. A radiator is integrally provided on a reverse surface of the metal plate, the radiator having a plurality of thin radiating fins formed upright in a tabular shape due to having been dug out by an excavating tool. The radiating fins give the radiator a large area over which heat can be released. The thickness of a first metal plate portion formed between adjacent radiating fins is less than the original thickness of the metal plate.

Abstract: It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. In the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25.

Abstract: According to various aspects of the present disclosure, an apparatus is disclosed that includes a small form factor mobile platform including a system-on-package architecture, the system-on-package architecture arranged as a stack of layers including a first layer having a first conformable material; a second layer having a second conformable material; one or more electronic components embedded within the stack of layers; and a vertical filtering structure arranged periodically between the one or more electronic components, wherein the first conformable material, the second conformable material, or both are configured to allow high frequency signal routing.

Abstract: According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a shield (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the shield. In another exemplary embodiment, a thermal interface material (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the thermal interface material.

Abstract: A power semiconductor module that includes a substrate having at least one power semiconductor element; a heat sink for dissipation of heat from the at least one power semiconductor element and a housing having a cutout which is arranged on a lower face of the housing facing the heat sink and holds the substrate; and to a method for production of such power semiconductor modules. The power semiconductor module has at least one holding element, which engages in a recess, which is associated with the at least one holding element, on the lower face of the housing and is designed such that it limits any movement of the substrate in the direction of the lower face of the housing.

Abstract: A method and associated assembly for cooling electronic heat generating components of a computer including dual-in-line memory (DIMM) array(s) is provided. The assembly comprises a cooling component having a plate with a first and a second (reverse) side, thermally coupling to the heat generating components including the DIMM array(s). The first plate side has a coolant conduit connected at one end to a supply manifold via flexible tubing and at another end to a return manifold via another flexible tubing such that when coolant is supplied, the coolant circulates from the supply manifold to the return manifold by passing through said first plate's conduit.

Abstract: A heat radiating structure for an electronic module and an electronic device having the same structure thereon. The heat radiating structure is formed at the bottom of the electronic module to release the generated heat from the electronic module, and includes an impact absorber, which absorbs impact transferred from the outside. A heat radiating sheet is formed with a plurality of the multi-layered heat conductive sheets and is in contact with the bottom of the electronic module by covering the outside of the impact absorber.

Abstract: According to one embodiment, an electronic device includes a circuit board, a heat generating element, a heat dissipater, and a pushing member. The circuit board is housed in a housing. The heat generating element is mounted on the circuit board. The heat dissipator is configured to dissipate heat generated by the heat generating element. The pushing member is configured to push part of the heat dissipator against the heat generating element. At least part of the pushing member is attached to a structure other than the circuit board.

Abstract: A conduction cooled circuit board assembly may include a frame and at least one circuit board attached to the frame, having at least one area to be cooled. The assembly may also include at least one rail attached to the frame, and at least one heat pipe having a first end and a second end, the first end disposed near the area and the second end in contact with the rail so as to transfer heat from the area to the rail.

Abstract: Embodiments described herein provide a chip, comprising a first device on a substrate and a second device on the substrate. The chip further comprises a heat distribution structure in thermal proximity to the first device and the second device, wherein the heat distribution structure is thermally isolated and reduces a thermal gradient between the first device and the second device.

Abstract: Provided is a display apparatus including a display panel for displaying an image, a heat source arranged at a side surface of at least one side of the display panel, a heat absorbing section for absorbing heat generated by the heat source, a back surface plate arranged at a back surface side of the display panel and made of a metal, a portion of the back surface plate being in close contact with the heat absorbing section, a front surface plate arranged at a front surface side of the display panel and made of a metal, and a middle chassis arranged between the front surface plate and the heat absorbing section.

Abstract: A semiconductor apparatus 10 includes a radiator 30 on which plural semiconductor modules 20 that include semiconductor elements 21 are mounted, the semiconductor apparatus 10 characterized by the radiator 30 including a first main surface 30B and a second main surface 30C configured to be located on the opposite side of the first main surface 30B. Semiconductor module mount-surfaces 30B1, 30B2, 30C1, 30C2 are arranged in the first main surface 30B and the second main surface 30C in a zigzag pattern in cross-sectional view; and the semiconductor modules 20 are mounted onto some or all of the semiconductor module mount-surfaces 30B1, 30B2, 30C1, 30C2.

Abstract: Apparatus for securing or retaining a heatsink. The heatsink retention apparatus includes a heatsink module that cooperates with first and second spring loaded latches secure to a circuit board on opposing sides of a heat-generating component. The heatsink module includes a handle pivotally secured to opposing sides of the heatsink body, and bails pivotally secured to the handle. In addition, the bails extend downward to dispose a lower bail member adjacent the spring loaded latches. As the handle pivots between a first position to raise the bails and a second position to lower the bails, the bails automatically move from a locked position to an unlocked position. Each of the spring loaded latches include a hook and at least one pre-loaded spring to transfer a minimum downforce to the lower bail members when the bails are raised. Accordingly, embodiments may be operated from the top of the heatsink without the use of tools, while providing a desired downforce over a range of heatsink heights.

Abstract: A semiconductor module has switching semiconductor elements connected in parallel to each other and at least a free wheeling semiconductor element reversely connected in parallel to the switching semiconductor elements. The free wheeling semiconductor element is placed between the switching semiconductor elements. At both end parts of the semiconductor elements, each of the switching semiconductor elements is placed. A longitudinal side of each of the switching semiconductor elements and the free wheeling semiconductor element is placed in parallel to a short side of the semiconductor module. An electric-power conversion device has a plurality of arms. Each arm is composed of the semiconductor elements.

Abstract: A motor controller, which is inexpensive and has small size, is provided by reducing the size of a heat sink used in the motor controller and the number of all parts of the motor controller, wherein said motor controller includes a heat sink, a power semiconductor modules that is in close contact with the heat sink, a substrate (4) that is electrically connected to the power semiconductor module, and a fan (6) that generates the flow of external air and supplies cooling air to the heat sink, wherein said heat sink is formed by combining two kinds of heat sinks, which include a first heat sink (7) and a second heat sink (8), so as to conduct heat therebetween, and, wherein said power semiconductor module is in close contact with the second heat sink (8).

Abstract: A low profile computer processor retention device, the computer processor including a processor substrate and a heat spreader mounted on the processor substrate. The retention device includes a retention housing. The retention housing is shaped to fit around a socket. The retention device also includes a load frame. The load frame is operatively coupled to the retention housing and is configured to retain the computer processor in the socket of a motherboard with direct contact between the load frame and the processor substrate. The load frame has a cutout. The retention device also includes a heat sink fastening member coupled to the retention housing and configured to fasten a heat sink to the retention housing and configured to couple the heat sink to the heat spreader through the cutout of the load frame.

Abstract: This document describes apparatus and methods for a self-contained assembly having an encapsulated electronic module coupled to a heat removal device by a thermally conductive substance. In an illustrative example, the module includes at least one heat dissipating device thermally coupled by internal members to selected portions of a housing. The module housing includes a flat top surface with a perimeter adjoined to side surfaces. In one example, the heat removal device includes a cavity interior surface with an upper surface to match the module top surface, and side walls that match at least 50% by area of the selected portions of the module side surfaces. The cavity interior surface may receive at least 50% of the housing surface area. The matched portion of the cavity side surfaces may be at least 33% by area of the portion of the cavity upper surface that matches the module top surface.

Abstract: A thermal-electrical assembly (200) provides with improved heat sinking, electrical shielding and electrical grounding. The thermal-electrical assembly is configured using a shield (202) having a windowed aperture (204), a pliable frame (206) formed of thermally and electrically conductive material having contours (210) that fit within and are retained by the windowed aperture, and a thermal insert (208) formed to fit within the pliable frame. The combination of pliable frame 206 and thermal insert (208) close off the shield (202) while providing contact areas for dissipating heat from heat generating circuitry or components. Communication devices, such as portable radios having tight space constraints, can incorporate the thermal-electrical assembly (200) to minimize electrical emissions while maximizing heat dissipation.

Abstract: The invention provides an integrated circuit packaging and method of making the same. The integrated circuit packaging includes a substrate, a semiconductor die, a heat-dissipating module, and a protection layer. The substrate has an inner circuit formed on a first surface, and an outer circuit formed on a second surface and electrically connected to the inner circuit. The semiconductor die is mounted on the first surface of the substrate such that the plurality of bond pads contact the inner circuit. The heat-dissipating module includes a heat-conducting device, and the heat-conducting device, via a flat end surface thereof, contacts and bonds with a back surface of the semiconductor die. The protection layer contacts a portion of the first surface of the substrate and a portion of the heat-conducting device, such that the semiconductor die is encapsulated therebetween.

Abstract: The present invention relates to a substantially package-like discrete electronic component of the type comprising a power electronic circuit, a body or casing, substantially parallelepiped, and electric connecting pins connected inside the body with said circuit and projecting from said body for an electric connection on the electronic printed circuit board. The body has a heat dissipating header having at least one surface emerging from the body and laying on a plane whereas the pins project from the body for a first section initially extended parallel to the plane. Advantageously a pair of pins has a substantially U-shaped bending, after the first section parallel to the plane for allowing a more stable bearing of the component during the step of welding to a heat dissipating intermediate die.

Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

Abstract: A motor controller which is inexpensive and has high cooling performance by using an extrusion heat sink (1), reducing the number of parts, and reducing the man-hours of assembling is provided. In a motor controller including an extrusion heat sink (1), and a power semiconductor module (4) including a plurality of external electrode terminals which closely contact the extrusion heat sink (1), and a printed circuit board having the plurality of external electrode terminals connected thereto, die-casting frames (2) in which a pedestal (2a) for attaching a motor controller and bosses (2b) for attaching a printed circuit board are molded are provided at both ends of the extrusion heat sink (1).

Abstract: A liquid crystal display device includes a liquid crystal display panel and a backlight disposed at the back of the liquid crystal display panel. The backlight includes a frame, a light source, a reflective sheet, and a heat dissipating plate formed in a rectangular shape and housing the light source, the reflective sheet, and the heat dissipating plate. The heat dissipating plate is disposed between the reflective sheet and a bottom surface of the frame and includes a first portion and a second portion facing the first portion, and has a plurality of first openings at the first portion and at least one second opening at the second portion. The plurality of first openings are formed along the first portion, and each of the first openings has a first edge and a first fin formed at a part of the first edge.

Abstract: A multi-layer system-on-chip (SoC) module structure is provided. The multi-layer SoC module structure includes at least two circuit board module layers and at least one connector module layer. Each connector module layer is sandwiched between and thus electrically connects two circuit board module layers such that the SoC module structure is formed by stacking. Each circuit board module layer is composed of at least one circuit board module while each connector module layer is composed of at least one connector module. Hence, the SoC module structure can be manufactured as a three-dimensional structure, thus allowing highly flexible connections within the SoC module structure.

Abstract: A solid state relay having an internal heat sink for dissipating heat produced by a solid state switching device. The relay being enclosed within a nonmetallic housing and mountable on a DIN type rail system.

Abstract: An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

Abstract: A printed circuit board assembly includes a printed circuit board, a first heat dissipating module, and a second heat dissipating module. The printed circuit board includes a first heat generating element and a second heat generating element. The first heat dissipating module is disposed on the first heat generating element. The first heat dissipating module includes a heat sink and a first heat pipe. The first heat pipe includes a pipe body and an extending portion extending from the pipe body. The second heat dissipating module is disposed on the second heat generating element. The pipe body is connected to the heat sink and the extending portion is connected to the second heat dissipating module.

Abstract: A memory module assembly includes a plurality of memory modules and a heat sink assembly. Each of the memory modules includes at least one heat source. The heat sink assembly includes a heat dissipating plate and a plurality of heat transfer mediums. Each of the heat transfer mediums includes a base attached to the heat dissipating plate, and at least one resilient sheet extending from an end of the base. The base and the resilient sheet define an included angle which is non-right angle so that the resilient sheet can snugly clip to the respective heat source.

Abstract: A module comprises a metallic terminal pins for connection and a circuit board with electronic components mounted thereon, a circuit board connecting side of the connector. The electronic components and the circuit board with the electronic components mounted thereon are encapsulated with the same resin. A metallic base is united to the module to obtain an electric conduction between the metallic base and the circuit board.

Abstract: A module substrate having a heat-generative electronic component mounted thereon includes first and second dielectric substrates and an intermediate heat transfer film. The heat-generative electronic component is flip-chip bonded on a wiring layer formed on the main surface of the first dielectric substrate through a solder bump. The second dielectric substrate is attached to the upper surface of the electronic component through an insulating layer. The intermediate heat transfer film for transferring heat generated by the electronic component to the second dielectric substrate is attached between the insulating layer and the second dielectric substrate so as to make the intermediate heat transfer film in close contact with the lower surface of the second dielectric substrate, thereby suppressing the temperature of the heat-generative electronic component in operation from increasing.

Abstract: A tuner module includes a circuit board, an electronic component, mounted on the circuit board, for demodulating a high frequency reception signal received from an antenna unit to produce a speech signal, a metal case accommodating the circuit board and the electronic component therein, and a heat conductive sheet, disposed between the electronic component and the metal case, made of an elastic body. The heat conductive sheet has dimensions which are substantially equal to or slightly lower than outer dimensions of the electronic component. The metal case has at least one slit-shaped hole which is formed along an outer shape of the electronic component.

Abstract: An electronic control unit includes: a printed circuit board, which supports an electric circuit, a plurality of electronic components electrically connected to the electric circuit, and at least one connector electrically connected to the electrical circuit. A housing accommodates therein the printed circuit board and comprises a base which supports the printed circuit board and a lid which closes over the base. At least one deformable, elastic, expanded blocking block is fixed to an internal surface of the lid near at least one electronic component, has sufficient thickness to vertically interfere with the first electronic component to be compressed between the lid and the first electronic component. It presents a larger area than the first electronic component to laterally encompass the first electronic component.

Abstract: The invention relates to an electronic board that comprises: a planar projection plate (42) provided between an intake opening (70) and a discharge opening (72); and a plurality of rectilinear nozzles (86-90) extending through said plate along a projection direction, the projection direction of each nozzle defining an angle relative to a direction perpendicular to a sole (78) of the electronic component (6) to be cooled, the angle ? being comprised in a range of ?30 and +30°.

Abstract: A heat sink includes two heat spreaders spaced from each other and a heat dissipation fin disposed and connected between the two heat spreaders. The heat dissipation fin includes a plurality of hollow tubular heat dissipation units arranged linearly from one of the heat spreaders to the other one of the heat spreaders. The heat dissipation units are connected together with their axes along length directions thereof being parallel to each other. Each of the heat dissipation units can resiliently deform to change a distance between the two heat spreaders. The present disclosure also discloses an electronic device incorporating such a heat sink.

Abstract: A conforming heat dissipating structure transfers heat to an irregular surface from a heat source mounted on its bottom surface. The heat dissipating structure includes an open container filled with metal shavings and balls covered by a flexible retainer. The shavings and balls beneath the flexible retainer are pressed against the irregular surface and conform to its irregular shape. In one application, light emitting diodes are mounted to the bottom of the heat dissipating structure, and the shavings are compressed against the inside cover of a street light. A flexible heat rod enables heat to be transferred over a flexible path from a heat source on one heat dissipating structure to a heat sink pressed against another heat dissipating structure. The many strands that make up the flexible heat rod are spread out inside each open container and are pressed between the metallic shavings to achieve a good thermal contact.

Abstract: A power module package including a fully enclosed package comprising sidewalls; wherein at least one of said sidewalls includes a conductive substrate; wherein circuit elements are mounted on said conductive substrate on a first side comprising an inner side of said enclosed package; and, wherein a majority area of a second side of said conductive substrate is exposed, the power package has an improved interconnection configuration and compact power I/O terminals, offering low electrical parasitics, a plurality of individual power module packages can be attached seamlessly and positioned in a liquid coolant with multiple top portion open channels, as well as attached to a laminar power connector (busbar) to form various electrical power conversion topologies, the module offers low thermal resistance and low electrical parasitics, in addition to small volume, light weight and high reliability.

Abstract: An apparatus is disclosed that may include a printed circuit board (PCB) and an electronics package may be disposed about the first surface of the PCB. The PCB may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core. The metal layer may be disposed on a core first surface. The metal layer may comprise metal or other conductive material suitable to define traces, which may be circuit paths for electronic components affixed to the PCB. In some aspects, the core may be electrically non-conducting, and may be thermally insulating, and, accordingly, inhibit the transfer of heat from the electronics package through the PCB. However, pins may be configured to pass through the PCB including the core from the core first surface to the core second surface to conduct heat generated by the electronics package away for dispersion.

Abstract: A semiconductor module is provided which includes a beat heat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. At least one of the electrically conductive leads is common to both of the semiconductors. The semiconductor module also includes a termination resistor electrically coupled to at least one of the semiconductors. A method of making a semiconductor module is also taught, whereby a plurality of electrically conductive leads are provided. At least two semiconductors are electrically coupled to the plurality of electrically conductive leads, where at least one of the electrically conductive leads is common to both of the semiconductors. The semiconductors are then thermally coupled to a heat spreader. Subsequently, a termination resistor is electrically coupled to at least one of the semiconductors.

Abstract: A semiconductor module is provided which includes a beat heat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. At least one of the electrically conductive leads is common to both of the semiconductors. The semiconductor module also includes a termination resistor electrically coupled to at least one of the semiconductors. A method of making a semiconductor module is also taught, whereby a plurality of electrically conductive leads are provided. At least two semiconductors are electrically coupled to the plurality of electrically conductive leads, where at least one of the electrically conductive leads is common to both of the semiconductors. The semiconductors are then thermally coupled to a heat spreader. Subsequently, a termination resistor is electrically coupled to at least one of the semiconductors.