Abstract: An electronic device of the present invention includes: a base made of a ceramic material; an electronic device element arranged in a central area of the upper surface of the base, in a way that the electronic device element is placed on a first heat transfer layer; a first heat dissipation layer formed in a central area of the lower surface of the base; a plurality of thermal vias arranged in the base, and which connects the first heat transfer layer and the first heat dissipation layer; and a second heat transfer layer buried in the base, the second heat transfer layer crossing the plurality of thermal vias, while extending from a position above a central area of the lower surface of the base to a position above a peripheral area of the lower surface of the base.

Abstract: A thermal insulation structure is disposed on an outer surface of a housing of an electronic device. The thermal insulation structure includes a plurality of tubular structures arranged in parallel, and each of the tubular structures extends along an extension direction. Each tubular structure has at least one tube wall enclosing to form a hollow space. Due to the tubular structures, the thermal isolation structure has anisotropic thermal conductivity. In the thermal isolation structure, heat transfer in every direction is different, and the hot spot area is relative enlarged to reduce the highest temperature on the surface of the thermal isolation structure. Thus, high temperature hot spot area caused by the heat generating element is prevented to be formed on the surface of the electronic device.

Abstract: A circuit board (1) has a top face (2) for positioning an electronic component and a bottom face (4) used as a support on a heat-dissipating base. A plurality of heat transfer holes (12) provide heat transfer from the top face (2) to the bottom face (4). The heat transfer holes (12) are unevenly or non-uniformly distributed on the top face (2) in such a way that the top face (2) is provided with several free sectors (14) which are free of heat transfer holes (12) in order to connect the electronic component to the circuit board (1). The free sectors (14) are configured as columns or lines. A plurality of heat transfer holes (12) are placed at least along the long sides of the free sectors (14). The circuit board has a low thermal resistance between the electronic component and the heat-dissipating base.

Abstract: A lamp base having a heat sink is connected to a bulb having two electrodes. The lamp base includes a heat sink, a first electrically conductive piece, a second electrically conductive piece, and leads. The heat sink comprises a heat-dissipating base formed with a trough for accommodating the bulb therein. The first electrically conductive piece is fixed in the trough and is electrically connected to an electrode of the bulb. The second electrically conductive piece is fixed in the trough and is electrically connected to the other electrode of the bulb. The second electrically conductive piece is electrically insulated from the first electrically conductive piece. The leads are electrically connected to the first electrically conductive piece and the second electrically conductive piece respectively. With the heat sink dissipating the heat generated by the bulb, the lamp base has extended lifetime.

Abstract: The invention relates to an electronic appliance (1), provided with a cooling assembly (10) for cooling a module (4) that during use can be inserted in the appliance (1) by a consumer. The cooling assembly (10) comprises a cooling body (12) and sliding means (8A, 8B). The sliding means are arranged to engage the module with a low frictional contact surface, so as to facilitate insertion of the module. The sliding means are furthermore arranged to form a thermally conductive bridge between the module and the cooling body. At least one of the cooling body and the sliding means is resiliently deflectable, thereby allowing the sliding means to be pushed out of the way by the module, when this module is being inserted or removed.

Abstract: A heat exchange structure includes a plurality of elongated air ducts. The heat exchange structure has an exterior heat exchange surface and interior heat exchange surfaces, the interior surfaces being in the elongated air ducts. The heat exchange structure includes a plurality of heat generators that are distributed on the exterior heat exchange surface along an elongated direction of the air ducts, in which air flowing in the air duct is heated successively by heat from the heat generators, and air flow in the air duct is enhanced by buoyancy of heated air.

Abstract: The invention relates to a junction box for solar panels, with which the heat produced in the protecting diodes, MOSFETs or other corresponding power semiconductors of a solar panel can be reliably dissipated. In the junction box, the electronic components are pressed against the housing (1) or into recesses (3) corresponding to the geometry of the components by means of pressure elements, and electrical isolation, preferably a thermally conductive silicone rubber, is provided between the housing (1) and the components.

Abstract: The present invention relates to a clamping member for pressing power components (9) against cooling surfaces of the cooling flanges (7) of a housing, particularly for receiving an electronic circuit. The clamping member comprises a housing frame (13) having at least one receiving chamber for the cooling flange (7) and the power semiconductor (9) to be contacted with the cooling flange (7), the receiving chamber being surrounded by the frame walls (14a, 14b, 15) of the housing frame. A pressure element (17) is disposed between a frame wall (14a, 14b) and the power component (9) disposed opposite thereof, or the cooling flange (7) disposed opposite thereof. A separating gap, into which an expanding element (18) can be introduced on one side non-positively and/or positively such that the power component (9) is pressed against the cooling flange (7), is provided between the pressure element (17) and the frame wall (14a, 14b).

Abstract: Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 ?m or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 ?m or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.

Abstract: The present invention provides a cooling device including a heat generating device having a device surface with a device surface contour on at least a portion of the device surface and a base having a base surface with a base surface contour on at least a portion of the base surface. The device surface contour and the base surface contour are substantially similar such that at least a portion of the device surface and the base surface fit in close proximity to each other.

Abstract: Disclosed is a heat dissipating material which is interposed between a heat-generating electronic component and a heat dissipating body. This heat dissipating material contains (A) 100 parts by weight of a silicone gel cured by an addition reaction having a penetration of not less than 100 (according to ASTM D 1403), and (B) 500-2000 parts by weight of a heat conductive filler. Also disclosed is a semiconductor device comprising a heat-generating electronic component and a heat dissipating body, wherein the heat dissipating material is interposed between the heat-generating electronic component and the heat dissipating body.

Abstract: Various apparatuses and methods for a preferentially cooled electronic device are disclosed herein. For example, some embodiments provide an electronic apparatus including a package substrate and with a semiconductor die electrically and thermally connected to the package substrate by a plurality of connection nodes. At least one thermal trace interconnects at least one subset of the plurality of connection nodes. At least one heat dissipation trace on the package substrate is connected to the at least one subset of the plurality of connection nodes.

Abstract: A power amplification device includes a first power amplification unit having the positions of connectors thereof reversed, a second power amplification unit not having the positions of connectors thereof reversed, and a heat sink having a first flank thereof abutted on the heat radiation surface of the first power amplification unit, and having a second flank abutted on the heat radiation surface of the second power amplification unit. A transmitter using the power amplification device includes a plurality of power amplification devices, a distributor directly coupled to the input connectors of the power amplification devices, and a synthesizer directly coupled to the output connectors of the power amplification devices.

Abstract: Electric control units are known having a printed circuit board substrate 2 on which an electronic circuit 9 is situated which includes multiple electrical components 11 which are interconnected via printed conductors 12 of the printed circuit board substrate, housing parts 3, 4 for covering the electrical components on the printed circuit board substrate and at least one device plug connector part 6 which is electrically connected to the components and situated on the printed circuit board substrate outside the section of the printed circuit board substrate 2 covered by the housing parts 3, 4, the electrical connections between the components and the device plug connector part being established via printed conductors 14 of the printed circuit board substrate.

Abstract: An electrical configuration having at least one component which has at least one current bar, particularly a lead frame, and having an electronic circuit which has at least one heat dissipation surface and at least one electric terminal that is connected mechanically and electrically to the current bar. It is provided that the unit made up of the component and the electronic circuit is mounted on a support layer that effects the heat dissipation in such a way that, because of the fastening of the component onto the support layer, the heat dissipation surface is pushed against the support layer, based on the spring property of the current bar.

Abstract: A module assembly includes a component housing having a plurality of walls forming a cavity. At least one of the walls includes an opening therethrough open to the cavity. The heat transfer plate is mounted within the opening of the component housing and his exposed on an exterior of the component housing. The heat transfer plate forms at least a portion of a mounting surface of the component housing.

Abstract: A display device includes: a display unit which displays an image; a casing which supports the display unit; a pair of supporting members which are respectively combined at peripheral areas of a backside of the display unit and are supported by the casing; and a connecting member which has higher heat resistance than the supporting members and interconnects the supporting members.

Abstract: A power semiconductor module is disclosed, including a plate-type substrate fitted with at least one component, and a base plate provided for dissipating heat from the component via the substrate. In at least one embodiment, a supporting apparatus, which keeps the substrate in thermal contact with the base plate, has a central pressure bolt adjoined by a plurality of stamps which extend in different directions and are intended to contact-connect the substrate, the individual stamps being at non-uniform distances from the substrate in the mechanically unloaded state of the pressure bolt.

Abstract: A memory module assembly (100) includes a memory card (200) having a right side surface (240) and a left side surface (220), a heat sink (400) and a heat pipe (500). The heat sink includes a base member (420) attached to the left side surface of the memory card and a shell (440) attached to the right side surface of the memory card and coupled to the base member. The base member includes a substrate portion (422) attached to the left side surface of the memory card and a support portion (424) extended from the substrate portion and supported on a top edge of the memory card. The heat pipe includes an evaporator (520) in thermal engagement with one of the shell and the substrate portion and a condenser (540) in thermal engagement with the support portion.

Abstract: An image display apparatus is provided. At least one heat radiating frame is stacked in a heat radiating frame coupled between a circuit board and a panel, a heat radiating frame to which the circuit board is fixed can secure a space by a height of a protruded part as the protruded part is formed by drawing the frame itself, and thus fastening means for fixing the circuit board without a PEM nut can be fastened, and as a sound absorbing material is filled within a protruded part formed in a heat radiating frame opposite to the panel, vibration noise generating when driving the panel can be reduced.

Abstract: An apparatus and method are provided for limiting failure noise and smoke emissions produced as a result of electrical failure conditions and/or failed electronic devices or assemblies of electronic equipment, such as IT and telecommunications equipment. In one aspect, the apparatus includes a conformable pad, a gasket and a clip that are disposed along one or more surfaces or planes of one or more electronic devices or assemblies such that the apparatus helps to form a substantially air tight seal around the one or more devices or assemblies. The air tight seal the apparatus defines minimizes or eliminates failure noise and smoke emissions generated as a result of failure conditions or catastrophic failure of the one or more devices or assemblies. The apparatus thereby provides a non-electronic solution to limiting failure noise and smoke that is relatively inexpensive to manufacture and implement, and enables in-field servicing of its components and the devices or assemblies to which it is applied.

Abstract: Assembling a power converter for a multiple phase electric drive propulsion system in a machine includes arranging a plurality of rectangular capacitor units of a capacitor subassembly for conditioning electrical power in the power converter in a first packaging arrangement. In the first packaging arrangement, major capacitor axes of each one of the capacitor units are co-linear with one another and minor capacitor axes of each one of the capacitor units are oriented parallel but not co-linear with one another. Assembling the power converter further includes arranging a plurality of IGBT modules of a transistor subassembly for power switching in the power converter in a second packaging arrangement. In the second packaging arrangement major module axes of each one of the IGBT modules are oriented parallel but not co-linear with one another and minor module axes of each one of the IGBT modules are co-linear with one another.

Abstract: Modular soft starters are disclosed having a plurality of soft starter modules with stacked SCRs and heat sinks for accommodating a single phase of a three phase motor, where the modules may be connected serially for starting each phase of a higher voltage motor, and where the modules can be mounted in a cabinet in a variety of different orientations to facilitate optimized cabinet space utilization.

Abstract: A heat sink for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate forms a protrusion projecting downwardly therefrom. A bottom surface of the protrusion is milled to be flat and smooth, whereby the bottom surface can intimately contact the electronic component. A method for manufacturing the heat sink comprising milling a bottom surface of a protrusion punched downwardly from a lower plate, whereby the bottom surface can be flat and smooth sufficiently to have an intimate contact with an electronic component, and sequentially welding an upper plate on the lower plate and a plurality of fins on the lower plate and the upper plate, respectively.

Abstract: A securing device (30) is used for securing a heat sink (10) to a printed circuit board (40) with a heat-generating electronic component (41) mounted thereon. The securing device includes a V-shaped elongated main body (31), a first locking leg (34), a second locking leg (332) and a resilient member (32). The first locking leg and second locking leg are connected to two opposite ends of the main body respectively for engaging with a retention frame (20) on the printed circuit board. The resilient member includes a planar-shaped supporting plate (321) engaging with a bottom portion of the main body and at least one resilient foot (322) extending downwardly from the supporting plate. The resilient foot deforms to exert a resilient force on the heat sink when the heat sink is assembled to the electronic component by the securing device.

Abstract: A package assembly with a heat dissipating structure includes a thermal conductive lower metal layer, an electric insulating ceramic layer, a patterned upper metal layer and an electronic component. The electric insulating ceramic layer is disposed on and bonded to the thermal conductive lower metal layer. The patterned upper metal layer is disposed on and bonded to the electric insulating ceramic layer. The patterned upper metal layer is a single-layered metal layer and has an opening from which the electric insulating ceramic layer is exposed. The electronic component is disposed in the opening of the patterned upper metal layer, mounted on the electric insulating ceramic layer through a thermally conductive adhesive or solder, and electrically connected to the patterned upper metal layer.

Abstract: A circuit board using a heat radiating member that can cool an electronic component sufficiently without causing a substrate to break, increasing the total weight of the substrate, lowering the productivity, or increasing cost and device size. A circuit board has a substrate main body (4) having a wiring pattern (3) formed on a surface side, and a structure in which an LED module (1) is connected to the wiring pattern (3). The circuit board is characterized in that: a through hole (6) is provided in a portion of the substrate main body (4) so as to penetrate the substrate main body (4) from the surface side to a back side thereof; a heat radiating member (5) is provided on the back side of the substrate main body (4) so as to close one end of the through hole (6); and the LED module (1) is disposed in the through hole (6) so that the heat radiating member (5) and the LED module (1) are directly in contact with each other.

Abstract: A heat sink includes two heat spreaders spaced from each other and a plurality of heat dissipation fins connected between the two heat spreaders. The heat dissipation fin is wave-shaped from one of the heat spreaders to the other one of the heat spreaders. The heat dissipation fins are spaced from each other. When a force is applied to two heat spreaders of the heat sink, the heat dissipation fin is resiliently deformed to change a distance between the two heat spreaders. The present disclosure also discloses an electronic device incorporating the heat sink and the heat dissipation fin.

Abstract: A control device housing for an electronic brake system includes a lid, a housing part closable by the lid, a component support member for electronic components, and a cooling element that is in direct or indirect thermal contact with at least part of the electronic components. The cooling element may be either a planar additional cooling plate or a lid that is at least partly made of metal. The cooling element and the component support member are spaced from each other, and thin heat conductive elements are arranged in the resulting intermediate space between the cooling element and the electronic components that are to be cooled or the component support member. The heat conductive elements are configured flexibly for tolerance compensation and inhere good heat conductivity in addition.

Abstract: This disclosure suggests microelectronic substrates with thermally conductive pathways. In one implementation, such a substrate includes a body and a thermally conductive member. The Body has a first surface that includes a microelectronic component mounting site, a second surface separated from the first surface by a thickness, and an opening extending through at least a portion of the thickness. The opening is outwardly open at one or both of the surfaces and has a first portion having a first transverse dimension and a second portion having a larger second transverse dimension. The thermally conductive member includes a first thickness, which is received in the first portion of the opening, and a second thickness, which is received in the second portion of the opening. A transverse dimension of the second thickness of the thermally conductive member is greater than the first transverse dimension of the opening.

Abstract: A printed circuit board (PCB) assembly is provided. The PCB assembly is adapted for mounting at least one heat-generating electrical device and providing integrated heat dissipating capability to dissipate heat generated by the electrical device. The PCB assembly has a top surface and a bottom surface and comprises a signal carrying layer and an insert of pyrolytic graphite (PG). The signal carrying layer, disposed between the top surface and the bottom surface, comprises a material that is both thermally conductive and electrically conductive (such as at least one of aluminum, copper, and silver and alloys thereof) and has at least a portion lying in a first plane. The insert of PG is disposed within at least a portion of the first plane of the signal carrying layer, is in thermal contact with the signal carrying layer, and is constructed and arranged to have its greatest electrical conductivity in the first plane.

Abstract: A display device is disclosed. In one embodiment, the display device includes i) a display panel configured to display an image, ii) a chassis base configured to support the display panel, iii) an auxiliary chassis disposed between the display panel and the chassis base, wherein one end of the auxiliary chassis covers and contacts an edge of the chassis base. The display device further includes i) a driving board disposed at the back of the chassis base and configured to drive the display panel and ii) at least one signal transmission member comprising at least one circuit device and configured to electrically connect the display panel and the driving board, wherein one side of the at least one signal transmission member is supported by the auxiliary chassis, and wherein the one side faces the edge of the chassis base.

Abstract: A motor controller which eliminates a positioning operation between a power semiconductor element and a base plate to improve the assembly process is provided. The motor controller has a power semiconductor element closely contacted with a heatsink and mounted in a first base plate, wherein a spacer having an engaging section formed therein as a hole for the power semiconductor element is interposed between the heatsink and the base plate, and the power semiconductor element is positioned in the spacer. Further, the peripheral wall of the hole is arranged so as to shut off a space between a terminal projecting from the side of the power semiconductor element and the heatsink.

Abstract: The invention relates to a heat sink arrangement with a heat sink element, with a cylindrical interior, in particular a housing of an electric motor or housing part for such, with power electronics integrated into the housing or housing part, with at least one electronics component attached to the heat sink element from inside, in which the heat sink element is a sector of a cylinder adapted to the cylindrical interior of the heat sink arrangement, and that a springy clip is present that presses onto the ends of the sector such that the heat sink element is pressed against the cylindrical interior by spreading, as well as to an electric motor, a housing part and a springy clip.

Abstract: A method attaches a semiconductor chip to a substrate, applies a thermal interface material to a top of the semiconductor chip, and positions a lid over the semiconductor chip typically attached to the substrate with an adhesive. The method applies a force near the distal ends of the lid or substrate to cause a center portion of the lid or substrate to bow away from the semiconductor chip and increases the central thickness of the thermal interface material prior to curing. While the center portion of the lid or substrate is bowed away from the semiconductor chip, the thermal interface material method increases the temperature of the assembly, thus curing the thermal interface material and lid adhesive.

Abstract: A heat sink apparatus for dissipating heat generated from a heat generating component includes a first heat dissipating assembly attached to one side of the heat generating component, a second heat dissipating assembly attached to another side of the heat generating component; and a connecting device connecting between the first heat dissipating assembly and the second heat dissipating assembly thereby forming a continuous heat dissipation passage between the first heat dissipating assembly and the second heat dissipating assembly.

Abstract: In some embodiments, a stacked package assembly may include a first socket defining an interior cavity, a first semiconductor device coupled to the first socket, a second socket positioned within the interior cavity of the first socket, and a second semiconductor device removably coupled to the second socket within the cavity of the first socket. The second socket may be positioned between the first semiconductor device and the second semiconductor device and provide an electrical connection between the first semiconductor device and the second semiconductor device. Other embodiments are disclosed and claimed.

Abstract: The present invention provides a semiconductor device comprising a semiconductor element, a single-layer wiring board on which the semiconductor element is mounted, a connector section located at an end of the single-layer wiring board, a thermally and electrically conductive radiator plate, a relay electrode section formed on the single-layer wiring board, and a connecting member that electrically connects the radiator plate and the relay electrode section together. The single-layer wiring board is structured so that a power supply potential and/or a ground potential received by the connector section is transmitted through a path comprising the radiator plate, the relay electrode section, and the connecting member to the semiconductor element.

Abstract: The power inverter includes: a case made of a metal; a first power module provided in the case and including a DC terminal and an AC terminal; a second power module provided in the case and including a DC terminal and an AC terminal; and a cooling formation body for decreasing heat generated from the first and second power modules. The first and second power modules are disposed in a manner such that the DC terminals face each other.

Abstract: An automatic transmission includes a pressure adjusting unit that controls hydraulic pressure supplied to a transmission mechanism by the operation of a solenoid valve. A housing has a heat radiating portion for radiating heat to the outside and houses the pressure adjusting unit. A first connector is so arranged as to pass through the housing and has a control circuit unit electrically connected to the solenoid valve of the pressure adjusting unit. A second connector is electrically connected to an engine control unit outside the housing and engages with the first connector and the heat radiating portion. The second connector is electrically connected to the control circuit unit and presses the first connector onto the heat radiating portion.

Abstract: The invention relates to an inverter casing, said inverter casing comprising in the bottom at least one depression for receiving heat dissipating electric components, coils in particular.

Abstract: An electronic circuit apparatus for a compressor includes a board and a case. One corner of the board is fixed to case such that the board cannot move in the thickness direction and is movable in the flattening direction. According to this structure, even when an electronic part generates heat or outside air temperature of the case varies, the expansion or contraction of the board in the flattening direction is not affected by the expansion or contraction of the case in the flattening direction. Therefore, it is possible to prevent the deformation of the board and stress from being repeatedly applied to a soldering portion of the electronic part. As a result, it is possible to ensure the reliability of soldering strength for a long time.

Abstract: A fixing heat dissipating unit that is disposed in an electronic device is connected to a substrate and a heat source. The fixing heat dissipating unit includes a fixing element and a heat conducting element. The fixing element is connected to the substrate to hold the substrate in the electronic device. The heat conducting element is respectively connected to the heat source and the fixing element. The heat source is a part of the electronic device and the fixing element is integrated with the heat conducting element as a single component. An electronic device having the fixing heat dissipating unit is also disclosed.

Abstract: An inverter assembly for a vehicle includes a housing, a first inverter, and a second inverter. The housing comprises a plurality of walls. The plurality of walls form an inlet for cooling fluid to enter the housing, an outlet for the cooling fluid to exit the housing, and a channel, and a channel for the cooling fluid to flow therebetween. The first inverter is disposed within the housing proximate the channel, and is configured to be cooled by the cooling fluid flowing through the channel. The second inverter is also disposed within the housing proximate the channel, and is also configured to be cooled by the cooling fluid flowing through the channel.

Abstract: The electronic control device includes: a printed circuit board; a heat-generating member having a plurality of legs which are mounted on the printed circuit board by connections between the legs and the printed circuit board; and a casing which radiates heat that is transferred from the heat-generating member, wherein: the legs are connected via press-fit connections with the printed circuit board.

Abstract: Provided are a low-temperature-cofired-ceramic (LTCC) package and a method of manufacturing the same. The LTCC package includes: an LTCC substrate including a plurality of LTCC layers and a recess in which a device is mounted; a thermal conductive element adhered onto a first LTCC layer exposed by the recess using a first thermal conductive adhesive member; the device adhered onto the thermal conductive element using a second thermal conductive adhesive member; and a connection member for electrically connecting the device with the LTCC substrate. In the LTCC package and the method, portions of the LTCC layers disposed under a high-heating device except a lowermost LTCC layer contacting a heat sink, which correspond to a thermal transmission path, are removed and replaced by a higher thermal conductive material to minimize heat dissipation resistance and heat resistance caused by thermal conduction.

Abstract: The LED module comprises a first and a second printed circuit boards comprising one surface formed with at least one of concave and convex parts so that the first and the second printed circuit boards are coupled to each other, and an LED on at least one of the first and the second printed circuit boards, in which a concave part is formed at a portion of a coupling surface of the second printed circuit board corresponding to a convex part formed at a portion of a coupling surface of the first printed circuit board, and an insulating layer is formed at a portion of the coupling surface of the second printed circuit board so as to support a convex part of the first printed circuit board.

Abstract: A technique for installing a heatsink in an electronic assembly includes simultaneously applying force to multiple fastener assemblies that each retain a respective fastener in a body of the heatsink. The heatsink is then attached to the electronic assembly by actuating the fasteners while the force is simultaneously applied to the multiple fastener assemblies.

Abstract: A heat dissipation apparatus (10) includes a heat spreader (30), and first and second resilient plates (40, 50) provided at two opposite sides of the heat spreader. The first resilient plate includes a mounting arm (41) and two fixing arms (42) extending from two opposite ends of the mounting arm, respectively. The mounting arm defines a first mounting hole (43) therein, and each of the fixing arms defines a first fixing hole (44) therein. The second resilient plate defines a second mounting hole (53) and two second fixing holes (54) therein. The first resilient plate is fixed on the heat spreader via the first fixing holes. The second resilient plate is fixed on the heat spreader via the second fixing holes. The heat spreader is fixed on a circuit board via the first and the second mounting holes.

Abstract: An LED illumination lamp device, including a polygonal-prism-shaped supporting member having a plurality of rectangular side surfaces, plate-like wing members configured to project outwardly from each of ridge lines formed by two adjacent rectangular side surfaces of the supporting member and having at least two opposing rectangular surfaces, and a plurality of LED elements disposed on the rectangular side surfaces of the supporting member and the rectangular surfaces of the wing members.