Abstract: A card insulator is formed with slits that conform to height changes required by the components mounted to a card. The insulative sheet has simple linear slits that extend completely through the sheet and allow the insulator to deform with simple linear bends when contacted by the tall components mounted to the card. The linear bends allow the surface of the deformed insulator to be flexible without budding the insulator and without bowing the card.

Abstract: Device, system, and method of flexible hardware connectivity. For example, a Printed Circuit Board (PCB) system includes: a rigid platform having embedded therein at least one programmable logic device; at least one rigid panel having embedded therein a set of connectors; and a flexible connection to flexibly connect, at a non-straight angel, the programmable logic device to the rigid panel along a folding axis of the rigid panel and the rigid platform, wherein a density of wires of the flexible connection is greater than a density of wires entering at least one of the connectors.

Abstract: A semiconductor module and a method of manufacturing a semiconductor module including at least one chip package, at least one module board, at least one conductive element provided between the first chip package and the module board and a protector for applying pressure to the conductive element, the module board, and the first chip package and/or acting as a heat sink for the first chip package.

Abstract: An electrically conductive shock mount system for electrical subassemblies is provided. The shock mount system includes a first assembly having a housing containing a hook member for a hook and loop fastener. The second assembly has a housing containing a loop member for a hook and loop fastener. A plurality of holes in the housings of the first and second assemblies allows the hook member to engage the loop member. In one embodiment, the housings are made from a conductive fabric and include a plurality of conductive columns that extend through the housings.

Abstract: Mesh holes 35a and 59a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50 are not lowered. Here, the diameter of each mesh hole is preferably 75 to 300 ?m. The reason is as follows. If the diameter of the mesh hole is less than 75 ?m, it is difficult to overlay the upper and lower mesh holes on one another. If the diameter exceeds 300 ?m, the insulating properties of the interlayer resin insulating layers deteriorate. In addition, the distance between the mesh holes is preferably 100 to 2000 ?m. The reason is as follows. If the distance is less than 100 ?m, the solid layer cannot function. If the distance exceeds 2000 ?m, the deterioration of the insulating properties of the interlayer resin insulating film occurs.

Abstract: An interface module has an integrated component for replacing a component on a circuit board, the terminal contacts on the bottom side of the interface module being designed as provided for the contacts of the component on the circuit board, the interface module being divided into an adaptor part as a base module and a protocol converter part as a tool access module.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: The present invention discloses an apparatus for operatively connecting a PCI-X or AGP device card (having a PCI-X or AGP bus) to a PCI-E bus connection on a mother board by mounting the PCI-X or AGP device card to a right edge connector mounted on a surface of an adapter card, the adapter card having a PCI-X (or AGP) to PCI-E bridge circuit for interconnecting a PCI-X (or AGP) bus to a PCI-E bus.

Abstract: A radio frequency (RF) module assembly includes a substrate on which a predetermined component is mounted, the substrate comprising a connection terminal, and an RF module mounted on the substrate and processing a predetermined RF signal. The RF module includes a housing forming a body, a jack receiving and transmitting a predetermined RF signal, a jack receiving part provided at the housing to allow the jack to be inserted inside the housing and received, and a terminal connected to a connection terminal of the substrate.

Abstract: The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a two-high CSP stack or module devised in accordance with a preferred embodiment of the present invention, two CSPs are stacked, with one CSP disposed above the other. The two CSPs are connected with flex circuitry. A form standard is disposed between the flex circuitry and a CSP in the stack. The form standard can take many configurations and may be used where flex circuits are used to connect CSPs to one another in stacked modules having two or more constituent CSPs. For example, in stacked modules that include four CSPs, three form standards are employed in preferred embodiments, although fewer may be used. The form standard provides a thermally conductive physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design.

Abstract: Conductive or solder bumps are stacked between a mounted component such as a BGA device and a printed wiring substrate in a multileveled printed circuit board unit. An interposer or relay substrate is interposed between the adjacent stacked conductive bumps. The interposer substrate is made of a porous material. When any difference in the expansion is caused between the printed wiring substrate and the mounted component, one side of the interposer substrate receives a relatively smaller displacement force while the other side of the interposer substrate receives a relatively larger displacement force. A shearing stress is induced in the interposer substrate. Deformation of the porous material serves to absorb the shearing stress in the interposer substrate. The conductive bumps bonded on one side of the interposer substrate as well as the conductive bumps bonded on the other side of the interposer substrate may be relieved from a shearing stress.

Abstract: An automated circuit board assembly system includes at least one movable circuit board receiver that is equipped with an empty circuit board or a hybrid circuit which is transported towards an uptake location at which components are assembled to the board, and an uptake mechanism positioned at the uptake location which detects the circuit board position in preparation for the assembly process. An alignment device positions the circuit board receiver in a predetermined directional position at the uptake location.

Abstract: A high density high reliability memory module with a fault tolerant address and command bus. The memory module includes a rectangular printed circuit board having a first side and a second side, a length of between 149 and 153 millimeters and first and second ends having a width smaller than said length. The memory module also includes a first plurality of connector locations on the first side extending along a first edge of said board that extends the length of the board and a second plurality of connector locations on the second side extending on said first edge of said board. The memory module further includes one or more buffer devices in communication with the circuit board for accessing one or more of the four ranks of memory devices mounted on the first side and second side of the circuit board.

Abstract: A socket for coupling signals between an electrical component and a circuit board or equivalent has a mechanism that, when activated, attaches the electrical component to the socket so that it is not possible to remove the electrical component without damaging it. The mechanism may include a clamshell lid with a one-time locking mechanism, a pin contact mechanism that, after initial locking, will detach the pins of the electrical component if further disturbed, or a moat around the base of the electrical component for disposing an epoxy fastener. The moat may include a heating element to cure the epoxy or other glue. The socket may include an electrical component that allows detection of tampering with the socket.

Abstract: A communication-circuit line protector capable of maintaining reliable connection to a port unit of a communication system, easily checking a disorder or failure of the communication-circuit line protector, and effectively releasing heat generated from an inner portion of the communication-circuit line protector is provided. The communication-circuit line protector include: a housing having a plurality of openings disposed on a side thereof; a ground pin provided to an inner side of the housing, the ground pin having an elastic end portion which cooperates with a lower-side inner wall of the housing opposite thereto to be in close contact with a ground portion, thereby maintain reliable ground contact; and a PCB having the ground pin attached to one side thereof and a conduction member provided to a lower end portion thereof, thereby maintaining good connection at a time of connection to a port.

Abstract: A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component that is mounted into a swivel casing. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. The swivel casing includes a holder that is pivotably mounted into an external housing by way of a pivot pin. The pivot pin is either a separate structure that is inserted into holes formed in the holder and housing, or is integrally formed on the holder.

Abstract: A circuit module includes connection electrodes on a plate-shaped board and connection electrodes on a frame-shaped board that are bonded together with conductive bonding materials there between. Circuit components are provided in portions of a surface of the plate-shaped board, the portions being located inward relative to the frame-shaped board. A sealing resin is filled and cured in a cavity, which is defined by the frame-shaped board and the plate-shaped board. Since the center of each of the connection electrodes on the frame-shaped board is inwardly displaced relative to the center of a corresponding one of the connection electrodes on the plate-shaped board by ?, a curing contraction stress of the sealing resin is mitigated by a curing contraction stress of the conductive bonding materials. Thus, deformation of the frame-shaped board is suppressed.

Abstract: An extended Universal-Serial-Bus (USB) connector plug and socket each have a pin substrate with one surface that supports the four metal contact pins for the standard USB interface. An extension of the pin substrate carries another 8 extension metal contact pins that mate when both the connector plug and socket are extended. The extension can be an increased length of the plug's and socket's pin substrate or a reverse side of the substrate. Standard USB connectors do not make contact with the extension metal contacts that are recessed, retracted by a mechanical switch, or on the extension of the socket's pin substrate that a standard USB connector cannot reach. Standard USB sockets do not make contact with the extension metal contacts because the extended connector's extension contacts are recessed, or on the extension of the connector pin substrate that does not fit inside a standard USB socket.

Abstract: A capacitive/resistive device provides both resistive and capacitive functions. The capacitive/resistive device may be embedded within a layer of a printed wiring board. Embedding the capacitive/resistive device conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability.

Abstract: A compact module with a pair of transformers and a double pole single throw relay (DPST) mounted onto a housing to create a self contained assembly for installation in a ground fault circuit interrupter (GFCI) as a unit. The first transformer has a core and is electrically coupled to a first set of terminals for connection to a printed circuit board (PCB). The second transformer is located adjacent to and magnetically coupled to the core of the first transformer and is electrically coupled to a second set of terminals for connection to the PCB. The DPST relay has a pair of stationary contacts and a pair of movable contacts for selectively connecting line phase and neutral conductive paths to a load.

Abstract: The invention discloses a double-sided pluggable backplane, having one side on which one or more than one front backplane connector is disposed according to width of plot positions and the other side on which one or more than one rear backplane connector is disposed according to width of plot positions, the front backplane connector and the adjacent rear backplane connector being located at the same horizontal level on the double-sided pluggable backplane and staggered right-and-left in turn, meanwhile the front backplane connector and the rear backplane connector having uniform specifications and the same contact pin definitions. The double-sided pluggable backplane according to the present invention can realize interchangeability of front boards and rear boards and have no special requirements for design and manufacture of printed circuit boards and machining of the backplane.

Abstract: A printed circuit board (PCB) includes an antenna for an RFID chip. An RFID chip for a tag is operable to be placed on the PCB such that the RFID chip is connected to the antenna and is operable to use the antenna to transmit data.

Abstract: A wired circuit board has a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer and including at least one pair of wires arranged in mutually spaced-apart and opposed relation having different potentials, a semiconductive layer formed on the insulating base layer to cover the conductive pattern and electrically connected to the metal supporting board on one side outside a region where the pair of wires are opposed, and an insulating cover layer formed on the semiconductive layer.

Abstract: Semiconductor assemblies include a first package, each having at least one die affixed to, and electrically interconnected with, a die attach side of the first package substrate, and a second substrate having a first side and a second (“land”) side, mounted over the molding of the first package with the first side of the second substrate facing the die attach side of the first package substrate. Z-interconnection of the package and the substrate is by wire bonds connecting the first and second substrates. The assembly is encapsulated with both the land side of the second substrate and a portion of the land side of the first package substrate exposed, so that second level interconnection and interconnection with additional components may be made.

Abstract: An electronic digital controller, such as a load cell indicator, is disclosed in which a number of components, such as a circuit board, display, and keypad are placed within an enclosure, and the enclosure is bonded closed, such as using an adhesive, to render the enclosure watertight. The keypad is a touch sensitive, capacitive keypad with no moving parts, and it is housed behind a rigid panel. An optoelectronic transceiver allows for data exchange with an electronic memory device housed in the adhesively sealed enclosure and allows for data exchange and for updating or modification of software code housed therein. Other components, such as another circuit board, a power supply, and block connectors, are placed in an adjacent enclosure, and the circuit boards in the two enclosures are electrically connected. The power supply is preferably a potted AC power supply but may also include a battery.

Abstract: A universal serial bus (USB) flash drive pen device for deploying and retracting a USB plug connector having a pusher assembly including a USB flash drive and a USB plug connector, in accordance with an embodiment of the present invention. The USB flash drive pen device further includes a housing assembly at least partially enclosing said pusher assembly for deploying said USB plug connector, said USB flash drive being coupled to said USB plug connector, said pusher assembly retracting said USB plug connector into said housing assembly, said USB flash drive pen device for deploying said USB plug connector to couple said USB flash drive to a USB port.

Abstract: A memory card module includes a first circuit board, and a second circuit board. On one surface of the first circuit board, there are flash memories and a controller. The second circuit board is installed at one end of the first circuit board and is electrically connected with the first circuit board so as to form a transmitting interface port. On a first surface of the second circuit board, there are a plurality of interface connecting points. On a second surface of the second circuit board, part of the second surface is hollowed out. A space formed between the hollowed out area and the corresponding first circuit board increases the area for circuit layouts and the mounting components for the first circuit board. Therefore, quantity of accommodated memory components may be increased so as to increase the total storage capacity of the memory card under limitation of small dimensions.

Abstract: A power module is proposed to package an electronic system having flip chip power MOSFET devices. The power module includes a front surface cover board and a multi-layer printed circuit laminate bonded thereto. Notably, the front surface of the printed circuit laminate includes recessed pockets each having printed circuit traces atop its floor. Inside the recessed pockets are power MOSFET and other circuit components bonded to the printed circuit traces. As the circuit components are encased inside the power module, it features a low profile, an increased mechanical robustness and EMI/RFI immunity. Additionally, some circuit components can be provided with a front-side bonding layer that is also bonded to the front surface cover board to realize a double-side bonding to the interior of the power module. Methods for making the low profile power module are also described.

Abstract: A memory system has first and second primary memories and first and second secondary memories coupled to the first and second primary memories, respectively, the coupling comprising at least one point-to-point connection. A memory module includes at least two of the first and second primary and first and second secondary memories. A first connection element, such as a connector or solder, connects the memory module to a mother board. A second connection element, such as a connector or solder, connects at least one other of the first and second primary and first and second secondary memories to the mother board. At least one of the memories on the first memory module is coupled to at least one of the other memories. The memory system also includes a memory controller which is connected to the primary memories by a point-to-two-point link.

Abstract: A four-way lead flat package IC-mount printed circuit board, carrying a four-way lead flat package IC and having front soldering land groups placed in front of the four way lead flat package IC and rear soldering land groups placed in the rear of the four-way lead flat package IC, has solder drawing lands, in a neighboring area, between the front soldering land groups and the rear soldering land groups adjacent to the front soldering land groups, and/or a trailing area of the rear soldering land groups. The solder drawing lands are formed with slits substantially parallel to the lines of soldering lands of the front soldering land groups or the rear soldering land groups placed in front of the solder drawing lands. These result in an advantageous effect of enabling the prevention of the occurrence of soldering bridges and soldering residues in the front soldering land groups or the rear soldering land groups.

Abstract: An electronic device is provided that includes a main printed circuit board (PCB) having a top surface, a bottom surface, and a hole extending between the top surface and the bottom surface. The electronic device further includes a module PCB having at least one electrical component mounted on a top surface of the module PCB, wherein the module PCB is inverted and assembled adjacent the main PCB such that the top surface of the module PCB faces the top surface of the main PCB, and the at least one electrical component extends into the hole. In addition, the electronic device includes a cover on the bottom surface of the main PCB that substantially covers the hole.

Abstract: A printed circuit board assembly is configured and arranged so that memory modules are mounted thereto. At least two connectors are mounted on a printed circuit board. The connectors are configured so that the memory modules are connected thereto. An electromagnetic wave absorption sheet is provided to at least one of the connectors. The electromagnetic wave absorption sheet is attached so as to cover a side surface of the one connector facing a side surface of the other connector.

Abstract: An electronic digital controller, such as a load cell indicator, is disclosed in which a number of components, such as a circuit board, display, and keypad are placed within an enclosure, and the enclosure is bonded closed, such as using an adhesive, to render the enclosure watertight. The keypad is a touch sensitive, capacitive keypad with no moving parts, and it is housed behind a rigid panel. An optoelectronic transceiver allows for data exchange with an electronic memory device housed in the adhesively sealed enclosure and allows for data exchange and for updating or modification of software code housed therein. Other components, such as another circuit board, a power supply, and block connectors, are placed in an adjacent enclosure, and the circuit boards in the two enclosures are electrically connected. The power supply is preferably a potted AC power supply but may also include a battery.

Abstract: The present invention provides a flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line formed on one surface of a base sheet, wherein the plural mounting pads are faced each other and spaced a pad clearance gap apart, and one or more semiconductor mounting paste guide paths are formed in the mounting pads. The flip chip mounting substrate can reduce voids that might be produced in the semiconductor mounting paste, when flip-chip-mounting an IC chip on a flip chip mounting substrate.

Abstract: Provided are a semiconductor package and a module printed circuit board (PCB) for mounting the same. Each of the semiconductor package and the module PCB includes a substrate, a first-type pad structure disposed in a first region of the substrate, and a second-type pad structure disposed in a second region of the package substrate. The first-type pad includes a first conductive pad disposed on the package substrate and a first insulating layer coated on the package substrate. The first insulating layer has a first opening by which a portion of a sidewall of the first conductive pad is exposed, and partially covers the first conductive pad. The second-type pad includes a second insulating layer coated on the package substrate to have a second opening and a second conductive pad disposed on the package substrate in the second opening to have an exposed sidewall.

Abstract: A module includes a board having a through-hole provided therein, an auxiliary board provided on a lower surface of the board, a first electronic component mounted on an upper surface of the board, a conductive cover covering the first electronic component, and a second electronic component mounted on an upper surface of the auxiliary board. The auxiliary board includes a sealing portion sealing the through-hole. The second electronic component is positioned in the through-hole provided in the board and on the upper surface of the auxiliary board. The second electronic component is taller than the first electronic component. This module is thin.

Abstract: A printed circuit board (PCB) assembly provides a two layer capacitive trackpad sensor in which an EMI ground grid is interposed among the sensor's capacitive elements on each of its layers. The EMI grid on each of the two layers is electrically coupled via, typically, vias. The described arrangement of sensor elements (capacitor plates) and EMI ground grid traces may be incorporated into a PCB having additional layers (e.g., a four, six or eight layer PCB). If used in this manner, additional vias are provided on the PCB which permit electrical coupling between these “additional layers” and which are electrically isolated from, and shielded by, the EMI ground grid.

Abstract: A layered board is disclosed which can avoid the occurrence of cracks in a core layer due to shearing stress caused by a difference in coefficient of thermal expansion between the core layer and a buildup layer. The layered board includes a core layer which serves as a printed board, a buildup layer which includes an insulation part and a wiring part, is overlaid on the core layer, and is electrically connected to the core layer, and an edge layer formed at least at an edge on the periphery of the core layer, the edge layer being different from the core layer. Alternatively, the core layer projects outward from an edge on the periphery of the buildup layer.

Abstract: In some embodiments, a chip includes transmitter circuitry, receiver circuitry, and control circuitry to detect whether a memory module is coupled to the receiver circuitry. The control circuitry selectively provides memory chip configuration signals to the transmitter circuitry to be provided to memory chips to control how many interface lanes in the memory chips are to be used to carry read data in response to a read request and whether some of the interface lanes are used for carrying read data signals or command signals. Other embodiments are described.

Abstract: An express card adapted to receive and utilize a SIM card that can be electrically coupled with a computer is disclosed. The express card includes an extended portion with a printed circuit board (PCB) and a SIM card connector for coupling a SIM card with the PCB. An external antenna jack is electrically coupled with the PCB extended portion. An antenna/SIM card support structure is mounted on the PCB extended portion covering the SIM card connector. The antenna/SIM. card support structure forms a slot adapted to receive and seat a SIM card and form an electrical connection between the SIM card and the SIM card connector. A metallic flex antenna can be affixed to the antenna/SIM card support structure such that the antenna characteristics of an external antenna can be affected based on the metallization pattern and placement of the metallic flex antenna.

Abstract: A casing for a handheld communication device includes a set of individual parts, each individual part being formed from the same metal. The set of individual parts have a purity of at least a hallmark purity level. The set of individual parts is severable from the casing without reducing the purity of the set of individual parts below the hallmark purity level.

Abstract: In a first embodiment, the invention provides a memory module having an electronic printed circuit board and a plurality of semiconductor chips of the same type that are mounted on at least one outer face of the printed circuit board. The printed circuit board has a connector strip, which runs at a first edge of the at least one outer face in a first direction and has a multiplicity of electrical contacts that are lined up in the first direction. The printed circuit board extends in the first direction between two opposite second edges. At least nine of the semiconductor chips of the same type are respectively mounted next to one another on the outer face of the printed circuit board between the center of the printed circuit board and the respective second edge of the printed circuit board. The semiconductor chips of the same type respectively have a smaller dimension and, in the direction perpendicular to the smaller dimension, a larger dimension that is larger than the smaller dimension.

Abstract: A semiconductor package includes a semiconductor chip, a circuit board at which a wire pattern is formed, and a metal structure including a portion inserted through an opening of the circuit board and upon which the semiconductor chip rests. With the semiconductor chip in direct contact with the metal structure, thermal characteristics improve. With the circuit board supported by the metal structure, mechanical stability improves.

Abstract: A memory module comprises a printed circuit board with a main surface bounded by a first side and a second side, the first side being longer than the second side, a first and a second generally rectangular memory device each having a long side and a short side, the first and second memory devices positioned on the main surface of the printed circuit board in such a way that the first memory device long side is generally parallel to the printed circuit board first side and the second memory device long side is generally perpendicular to the printed circuit board first side, and a first set of passive components connected to the first memory device and a second set of passive components connected to the second memory device, the first and second sets of passive components positioned on the main surface of the printed circuit board between the first memory device and interconnection pads.

Abstract: A work machine includes a bulkhead separating an operator cab from an engine compartment. An electronic module includes a cantilever arranged mounting flange mounted to the bulkhead. The electronic module includes a rigid and thermally conductive frame. An electronics board is mounted to one side of the frame, and a power board is mounted to an opposite side of the frame. The electronics board carries a plurality of electronic components, and the power board carries a plurality of replaceable power elements. Each power element is a fuse, relay and/or circuit breaker. A housing encloses the electronics board and the power board. The housing includes an access cover to the power board.

Abstract: A portable telephone includes a lower case and elastic sheet, an operation button portion component, and an operation button illuminating light source. Predetermined openings are formed in each of the lower case and elastic sheet to arrange a plurality of front surface operation buttons and plurality of side surface operation buttons such that the openings are in one-to-one correspondence with the operation buttons. The operation button portion component is arranged by bending along inner sides of front and side surfaces of the lower case and elastic sheet. The operation button portion component is obtained by fixing the respective operation buttons on an elastic sheet with a predetermined design. The operation button illuminating light source is arranged on a circuit board frame to be incorporated in the portable telephone and illuminates the front surface and side surface operation buttons. A method of manufacturing the portable telephone is also disclosed.

Abstract: This invention provides a multilayer printed wiring board having flat via holes. This is a multilayer printed wiring board formed by alternately laminating multiple metal foils and insulating layers, in which an interlayer connection via pad provided in a first insulating layer, a wiring circuit and an interlayer connection via bottom pad of a second insulating layer are provided in the same surface layer and at least the interlayer connection via pad and the interlayer connection via bottom pad of the second insulating layer have the same thickness.

Abstract: Shielding cases each include a pair of opposed first surfaces with catching pieces protruding therefrom and a pair of second surfaces without catching pieces. A motherboard forms substrates each including a pair of opposed first side surfaces with catching grooves and a pair of second side surfaces without catching grooves when it is divided. The shielding cases are mounted on the motherboard such that the intervals A between the second surfaces of two adjacent shielding cases are equal to or less than the widths B of cutting allowances for cutting the motherboard. The motherboard is cut from the opposite side of a surface of the motherboard on which the shielding cases are mounted at predetermined positions where the second side surfaces are formed on each substrate. In this manner, the motherboard is divided into electronic components with shielding cases.

Abstract: A semiconductor multi-package module has stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by wire bonding, and in which the upper package is inverted. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper molded package including an upper substrate in inverted orientation onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.

Abstract: A pivoting apparatus with a shielding function rotatably connects a main body and a folder of a foldable device. The pivoting apparatus includes a flexible printed circuit board (FPCB), a first metal sleeve, and a second metal sleeve. The first metal sleeve is disposed around the FPCB for fixing the first end of FPCB on the main body. The second metal sleeve is disposed around the FPCB for fixing the second end of FPCB on the folder. The first and second metal sleeves are rotatably connected for receiving the FPCB. When the folder is rotated relatively to the main body, the second metal sleeve twists the second end of FPCB relative to the first end of FPCB.