Abstract: An image-sensing module for reducing its overall thickness and preventing electromagnetic interference (EMI) includes a flexible substrate, an image sensor, and a plurality of electronic elements. The flexible substrate has a first PCB (Printed Circuit Board), a flexible bending board bent upwards from one side of the first PCB, and a second PCB extending forwards from the flexible bending board and disposed above the first PCB. The second PCB has at least one first opening. The image sensor is electrically disposed on the first PCB, and the image sensor is exposed by the first opening of the second PCB. The electronic elements are selectively electrically disposed on the first PCB and/or on the second PCB so that the electronic elements are disposed between the first PCB and the second PCB.

Abstract: A power semiconductor module and a method of manufacture thereof includes a lead frame carrying lead having inner and outer lead portions. The outer lead portions, which are connected by soldering to semiconductor chips simultaneously, eliminate the need for using bonding wires. Since no bonding wire is used for connecting the leads and the semiconductor chips, a sufficient current capacity is obtained. The bonding between an insulating circuit board and the semiconductor chips and the bonding between the semiconductor chips and the leads can be made simultaneously in a single step of reflow-soldering. As a result, the mounting time can be shortened and the power semiconductor module can be manufactured more efficiently.

Abstract: An input/output module for an automation device includes a housing having a lower part separable from an upper part; a first printed circuit board disposed in the housing; and an electronic subassembly for an input/output function of the input/output module. The electronic subassembly includes a plurality of connection elements disposed on the first printed circuit board and configured to connect signal lines and process voltage lines, the plurality of connecting elements being accessible from a front side of the upper part; and a plurality of optical waveguides disposed on the front side, wherein each one of the plurality of optical waveguides is assigned to a respective one of the plurality of connection elements and each configured to signal a state of at least one input/output channel of the input/output module.

Abstract: A plated module is for an IC card and includes a printed circuit having a plurality of conductive areas, delimited by a network of insulating channels, for covering an integrated circuit chip intended to be hosted in a recess of a plastic support of the IC card. At least some of the conductive areas are connected to a corresponding contact points of the integrated circuit chip. At least some of the conductive areas are linked to corresponding extended areas by one or more bridges. The conductive areas are separated from the extended areas by an insulating channel crossed by the bridges. The insulating channels surround the conductive areas as a protection frame for the contact points. At least a major side of at least one of the conductive areas may be curved. Several of the advanced extended areas form a rounded border of the plated module.

Abstract: A circuit structure 10 includes a circuit board 11 for mounting switching devices 13 and bus bars 12 wired into the circuit along the circuit board 11, and the case 20 includes a frame 21 that is disposed and secured in position around a perimeter edge of the circuit board 11 and a cover 24 that is assembled to the frame 21 so as to cover the circuit board 11. The frame 21 contains a second connector housing, and the second connector housing includes an hood 26a for accommodating the second terminals 15 formed at the ends of the bus bars 12. A deformation restricting portion 32 formed on the cover 24 is configured to abut the upper wall portion 26c (the outer face) of the hood 26a, thereby deformation of the hood 26a is restricted.

Abstract: A printed board includes a printed board body and throwaway boards provided on opposite sides of the printed board body through joining portions spaced away from each other in a longitudinal direction. Bores are provided in areas bridging the joining portions and throwaway boards. The bores can receive guide pins on a conveying unit for carrying the printed board to an electronic element mounting apparatus. The joining portions and throwaway boards can be removed from the printed board body after mounting the electronic elements on the printed board. This structure can minimize a width of a throwaway board and reduce total costs without lowering mounting efficiency of electronic elements in an electronic element mounting step.

Abstract: A printed circuit board 1 including a group of consecutive soldering lands 3 for soldering a lead-type electronic part 2 with a plurality of leads 2a, includes a solder drawing land 4 having a cross-shaped slit 4a and being provided adjacently to a rearmost portion of the group of the consecutive soldering lands 3.

Abstract: An electronic unit, in particular a control device for a motor vehicle, has a printed circuit board, populated with electronic components, and a housing enclosing the printed circuit board. The printed circuit board has at least one first section, arranged at a distance from the housing and equipped with electronic components on both sides thereof, and at least one second section which is connected to the housing by way of a heat-conducting adhesive layer.

Abstract: A method of wiring data transmission lines between a CPU including CPU data pins identified by a set of pin numbers and a DRAM including DRAM data pins also identified by the set of pin numbers, the method including connecting the CPU data pins to the DRAM data pins with data transmission lines including unit-bit data transmission lines so that the unit-bit data transmission lines do not cross each other and without matching the pin numbers of the CPU data pins to the pin numbers of the DRAM data pins.

Abstract: A circuit board has a curved portion provided in at least one side of an external shape thereof. An external connecting terminal is provided on a first main surface of the circuit board. A semiconductor element is mounted on a second main surface of the circuit board. A first wiring network is provided in a region except the terminal region on the first main surface. A second wiring network is provided on the second main surface. Distance from the side including the curved portion to the first wiring network is larger than distance from at least one of the other sides to the first wiring networks, and distance from the side including the curved portion to the second wiring network is larger than distance from at least one of the other sides to the second wiring networks.

Abstract: Provided are a semiconductor package and a module printed circuit board (PCB) for mounting the same. Each of the semiconductor package and the module PCB includes a substrate, a first-type pad structure disposed in a first region of the substrate, and a second-type pad structure disposed in a second region of the package substrate. The first-type pad includes a first conductive pad disposed on the package substrate and a first insulating layer coated on the package substrate. The first insulating layer has a first opening by which a portion of a sidewall of the first conductive pad is exposed, and partially covers the first conductive pad. The second-type pad includes a second insulating layer coated on the package substrate to have a second opening and a second conductive pad disposed on the package substrate in the second opening to have an exposed sidewall.

Abstract: An anti-tamper enclosure system comprises an optical medium; at least one photosensitive sensor configured to measure at least one characteristic of a light wave transmitted in the optical medium; at least one logic circuit coupled to the at least one photosensitive sensor, the at least one logic circuit configured to initiate security measures when the at least one characteristic of the light wave changes; an enclosure coupled to the optical medium and configured to enclose the optical medium, the at least one photosensitive sensor, and the at least one logic circuit; and a plurality of attachment posts configured to be coupled to a printed circuit board, wherein at least one of the plurality of attachment posts is also coupled to the optical medium.

Abstract: A portable electronic device includes a circuit board and at least one treatment element mounted adjacent to the circuit board and storing volatile maintaining matters therein. The circuit board generates heat when the portable electronic device is working to heat the treatment element, and then the maintaining matters volatilize to maintain the portable electronic device.

Abstract: Various embodiments of the invention relate to electronics modules, enclosure assemblies housing at least one such electronics module, and systems (e.g., missiles or unmanned vehicles) that may employ such enclosure assemblies. In one embodiment, an electronics module includes a first plate extending generally in a first plane, and a second plate spaced from the first plate and extending generally in a second plane. The electronics module further includes a plurality of electronic board assemblies each of which extends generally in a respective plane and is in thermal communication with at least one of the first and second plates. Each electronic board assembly may be positioned between the first and second plates and oriented so that the respective plane thereof is non-parallel relative to the first and second planes.

Abstract: A printed circuit board and a method of manufacturing a printed circuit board are disclosed. Using a method of manufacturing a printed circuit board, which includes: forming a multilayer board by alternately stacking circuit pattern layers and insulation layers such that a predetermined thickness of a partial area has only insulation layers stacked therein; and removing insulation layers from the partial area of the multilayer board, a printed circuit board can be manufactured that is suitable for a slim module.

Abstract: A method and apparatus for rapid and dynamic RF and Microwave circuit prototyping and integration provides a standard test fixture for testing any single device from any device vendors, provides a rapid dynamic tool for sub-system and system integration and prototyping, provides a flexibility to make any single function or multi-function assembled module quickly and economically. This prototyping approach can help RF/microwave companies share development times and costs. The combination of standard PCB function cells and dynamic standard mechanical cells helps build a prototype design quickly and reduce R&D costs.

Abstract: A highly reliable covered multilayer module includes a plurality of side electrodes extending in a lamination direction of ceramic layers are provided at least at one of side surfaces of a multilayer module body. At least one of inner conductor layers is exposed at the side surface provided with the side electrodes, in a region interposed between an adjacently arranged pair of the side electrodes. A claw portion of a metal case is soldered to the side electrodes and the inner conductor layer. The plurality of inner conductor layers may be exposed at the side surface of the multilayer module body in the region interposed between the adjacently arranged pair of side electrodes such that at least a part of the inner conductor layer is superposed on the other inner conductor layer when seen in the lamination direction of the ceramic layers.

Abstract: Disclosed is a contacting unit, with plug-in card-shaped housing, having a base plate and a cover plate, between which a slit-like plug-in channel opening on one end of the housing is formed to receive a chip card, and which is provided on the other side with a connector strip, in which the plug-in channel is essentially open on both sides over its entire length in the plug-in direction of the chip card, and the base plate and the cover plate are firmly connected to each other only in the area connected to the plug-in channel in the plug-in direction, wherein at least one lateral guide device is arranged on one end on base plate and/or cover plate, which at least partially bounds the plug-in channel.

Abstract: A component-embedded module includes a module substrate having wiring electrodes on the upper surface thereof, first circuit components mounted on the wiring electrodes, a sub-module disposed on an area on which no wiring electrodes are provided, and an insulating resin layer provided on substantially the entire upper surface of the module substrate such that the insulating resin layer covers at least a portion of the first circuit components and sub-module. The second circuit components including an integrated circuit element are mounted on the sub-module or embedded therein. Via conductors are provided through the module substrate from the lower surface thereof and are directly coupled to terminal electrodes on the lower surface of the sub-module. By using a substrate having a wiring greater accuracy than that of the module substrate, a reliable component-embedded module is obtained.

Abstract: A power module has several circuit units (20, 21) that are electrically connected in parallel and are provided with terminal contacts (5, 5?) which are electrically and mechanically interconnected via at least one current-conducting saddle (26). In order to create a power module which is easy to produce and in which the current-conducting saddle (26) requires little space, the saddle (26) is embodied in several parts while encompassing a terminal element (12) that can be connected in a fixed manner to a terminal contact (5) of a circuit unit (20) independently of a connecting element (25) of the saddle (26). The connecting element (25) of the saddle (26) extends on a plane that is spaced apart from the circuit unit (20) while being electrically connected to the terminal element (12).

Abstract: A process yield of a semiconductor device is enhanced. To that end, there is provided a semiconductor device comprising a substrate having a component mount face with semiconductor chips mounted thereon, the substrate being provided with a plurality of connection leads, and a cap made of resin, placed over the component mount face of the substrate so as to cover the same, the a cap having a first body part, and a second body part larger in thickness than the first body part. Because product information in the form of inscriptions is engraved on the top surface side of the second body part of the cap, the product information can be displayed without the use of an ink mark, it is possible to prevent occurrence of marking defects due to ink bleed, and so forth, thereby enhancing the process yield of a memory card (the semiconductor device).

Abstract: A modular circuit board structure for a large current area includes a circuit board having an electric conducting circuit and at least one large current area, and a conducting plate device having conducting plates installed onto the circuit board according to the shape of the large current area. When electronic components are inserted onto the circuit board by a surface mount technology, the conducting plates are attached onto the large current area to form a solder area portion on the conducting plates for allowing a large current to pass through, so as to provide a flexible combination function for the large current area of the circuit board and simplify the stamping molds of different shapes. The invention can avoid a waste of copper plates, assure the reliability, quality and safety of the circuit board, and enhance the cost effectiveness of the manufacture and the competitiveness of the product.

Abstract: A daughter board of a computer system is connected to a front panel of a computer housing. The daughter board includes a main body mounted thereon a solid-state storage device for storing data and a control circuit for control data access to the solid state storage device, for example, by surface mount technology.

Abstract: An orientation detector within a device package is used to establish the device orientation. A host controller coupled to the device supplies a control signal to at least one of the pins on the device during a setup phase. The pin that receives the control signal is used for active signaling during normal operations of the device. Based on the control signal, the orientation detector generates an orientation signal within the device. An analog or digital selector circuit connects the pins to correct internal circuit components according to the device orientation.

Abstract: A battery cell interconnect and voltage sensing assembly and a method for coupling a battery cell assembly thereto are provided. The battery cell interconnect and voltage sensing assembly includes a circuit board, electrical interconnect members, and an electrical connector. The circuit board further has slots therethrough for receiving the electrical interconnect members thereon. Electrical terminals from battery cell assemblies are coupled to the electrical interconnect members. The circuit board also has electrical traces for routing voltages at the electrical interconnect members to the electrical connector for sensing voltages of the battery cell assemblies.

Abstract: An electric power steering apparatus requires no external connecting member connecting between a power main body and a control main body, and hence can be reduced in size and cost, and the reliability of electrical connection between the power main body and the control main body can be improved. High current parts constituting the power main body and low current parts constituting the control main body are mounted on opposite sides of a circuit board, and are electrically connected with one another via conductor layers of the circuit board and through holes formed therein.

Abstract: A memory card comprising a substrate having opposed top and bottom surfaces and a plurality of terminals disposed on the bottom surface thereof. Mounted to the top surface of the substrate is at least one component which is itself electrically connected to the terminals of the substrate. Formed on the bottom surface of the substrate is a first encapsulation part. Formed on the top surface of the substrate is a second encapsulation part which encapsulates the component mounted thereto.

Abstract: A control box for electrical actuators comprises a cabinet consisting of a lower part (2) containing a control printed circuit board and provided with a row of gates (3) for various plugs, and an upper part (4) with a power supply and optionally also a battery pack. The lower part (2) is configured as an independent closed housing, and the upper part (4) is configured as two independent closed housings (5, 6). The upper side of the lower part (2) is provided with an area (7) for receiving a lower side of the two independent housings (5, 6) of the upper part, and means (13, 14; 16, 17) are provided in the lower part and the two housings of the upper part for securing the housings of the upper part to the lower part. The two housings of the upper part do not or essentially do not extend outside the area on the upper part.

Abstract: Provided circuit modules employ flexible circuitry populated with integrated circuitry (ICs). The flex circuitry is disposed about a rigid substrate. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. A strain relief portion of the flex circuitry has preferably fewer layers than the portion of the flex circuitry along which the integrated circuitry is disposed and may further may exhibit more flexibility than the portion of the flex circuit populated with integrated circuitry. The substrate form is preferably devised from thermally conductive materials.

Abstract: A signal-segregating connector for use in a system having a printed circuit board, a first electrical structure and a second electrical structure. The connector includes a first set of conductive elements to convey signals between the first electrical structure and the printed circuit board, and a second set of conductive elements to convey signals between the first electrical structure and the second electrical structure.

Abstract: An over-molded electronic module (2) includes a frame (10), an electronic assembly (20), and a polymeric body (32). The frame (10) includes a sidewall (14) that defines an opening (12) to provide a position for the electronic assembly (20), and includes an upper face (16) and a lower face (18) opposite the upper face (16) to act as sealing surfaces during over-molding. The polymeric body (32) is formed of a polymeric composition encapsulating both sides of the electronic assembly (20) and a portion of the frame (10).

Abstract: Memory module flex circuitry is devised to accommodate packaged integrated circuit devices (ICs) of varying heights or thicknesses. The invention may be employed to advantage in a variety of modules that employ flex circuitry including, but not limited to, fully-buffered, registered or more simple memory modules. Many such modules may replace conventionally-constructed DIMMs without change to the system in which the module is employed. Regions of the flex circuitry devised to provide one or more mounting locales for ICs are delineated, in part, from the main body of the flex circuit. The delineation may be implemented in a preferred embodiment by separating a designated IC mounting area or peninsula from the main body of the flex circuitry either with isolating areas or separations or with tabs that extend from the primary perimeter of the flex circuitry.

Abstract: A dynamic radon access memory (DRAM) module includes a printed circuit board, a number of DRAM units, a number of flash memory units, a number connecting pins and an interface controller. The DRAM units and the flash memory units are distributed on the printed circuit board. The connecting pins are formed at an edge of the printed circuit board. The interface controller is electrically connected to the flash memory units and a portion of the connecting pins, wherein each of the interface controller provides at least one serial interface between the flash memory units and the portion of connecting pins thereby enabling data transmission through the portion of connecting pins in at least one serial mode. The flash memory units integrally constitute a flash disk drive in the DRAM module. Therefore, frequently installation and uninstallation of the flash memory drive can be avoided. A motherboard assembly including the aforementioned DRAM module can be developed.

Abstract: An electrical connecting box suitable to widely-ranging temperature conditions from high temperature to low temperature inside the engine room of a vehicle is described, having a printed circuit board 300 and a first protecting member 100 and a second protecting member 200 housing the printed circuit board in a sandwich state. In this electrical connecting box an extended portion 310 being a part of electrical parts is formed upon a board surface 301 on the side of the first protecting member of the printed circuit board. Additionally, first pillar portions 110 and a second pillar portion 120 are formed upon the inside surface of the first protecting member facing one side of the board surfaces, and a tip 111 and a tip 121 of these pillar portions, according to bending of the first protecting member, can be in either a contacted state or a spaced state with respect to the board surface 301 or, alternatively, a projecting body 321 fixed to the board surface.

Abstract: Data processing modules including a housing and connectors carried by the housing, and systems including the same.

Abstract: The invention provides an integrated-inverter electric compressor and an inverter device thereof which allow handling of the inverter device by neither touching nor holding a CPU substrate. An integrated-inverter electric compressor includes an inverter module integrating a power-related metal substrate on which a power semiconductor switching device is mounted and a resin case integrally insert-molded with a plurality of terminals, and is provided with a CPU substrate on which a control and communication circuit having a device that operates at low-voltage is mounted on the upper surface of the inverter module, wherein the resin case is integrated with a grip which extends in a horizontal direction at an upper edge of a circumference thereof.

Abstract: In a multilayer ceramic electronic component, a pedestal portion is provided on a region of a first main surface of a multilayer ceramic body and includes a non-metallic inorganic powder and a resin so that the pedestal portion is fixed to the first main surface with at least the resin, the multilayer ceramic body being formed by stacking a ceramic base material layer and a shrinkage-inhibiting layer having a predetermined conductor pattern. Also, a via hole conductor is disposed in the pedestal portion so that one of the end surfaces is exposed in a surface of the pedestal portion, and a surface mounting-type electronic component such as a semiconductor element is connected, through a conductive binder, to the one of the end surfaces of the via hole conductor exposed in the surface of the pedestal portion. A resin is provided between the surface mounting-type electronic component and the pedestal portion, the resin having the same composition as in the resin of the pedestal portion.

Abstract: A connector assembly or interface cassette (300), comprising a housing (304) comprising a jack interface (314), said jack interface having a receptacle jack (370) therein, said receptacle jack being configured to receive a plug; and a sensor bezel (20) removably attachable to said jack interface, said sensor bezel comprising a cavity extending therethrough to allow passage of a plug when inserted into said receptacle jack, said sensor bezel including a circuit board proximate said jack cavity, and at least one sensor contact (340) aligned with, and configured to engage, a sensor probe associated with a plug insertable into said receptacle jack, characterised in that the bezel includes connection means (22) accessible from the front of the bezel whereby the bezel can be electrically connected to a sensing component independently of any components inside the said housing.

Abstract: A device may include protective housing including a battery backup unit circuit, at least one L-hook disposed on the protective housing including a battery backup unit circuit, the L-hook configured for being coupled to a test point loop disposed on a memory module, and/or at least one retention arm configured to couple the protective housing including a battery backup unit circuit to the memory module. Additionally, a RAID controller card and a method utilizing the device are disclosed.

Abstract: A portable electronic device (100) includes an upper housing (40), a circuit board (10), a display (12), a battery (14), and a lower housing (20). The upper housing defines a display section (424) therein. The circuit board has a top surface (11) and a bottom surface (13) at an opposite side of the top surface. The display is seen outwardly through the display section. The battery and the display are formed adjacent to each other on the top surface of the circuit board. The circuit board, the battery and the display are placed in-between the lower housing and the upper housing. The upper housing is detachably mounted to the lower housing for detachably holding the battery.

Abstract: The FPC that is designed to have the special shape, an elastic portion, can shorten its length by elastic force after it is turned over to the reverse side of the light source unit for achieving the purposes without wasting any space of the LCD module and incurring the inconvenience of user.

Abstract: Controller assemblies and packaging for electronic control systems of electric motors utilized in utility vehicles or other power equipment. Features of the controller assemblies and packaging described herein allow for, among other things, modularity, scalability, and improved heat transfer.

Abstract: An electronic module for a trip device has been optimised so as to integrate the known functionalities, in particular threshold parameter setting, current measurements, voltage taps, read-out display and communication. An electromagnetic actuator is further present in the electronic module to optimise breaking of the associated circuit breaker. The space occupation constraints inherent to location of the trip device in existing switchgear units have been respected.

Abstract: The principles described herein relate to methods for soldering electrode terminals, pins or lead-frames of commercial electric components for high temperature reliability. In one embodiment, prior to soldering the electric components, a pre-plated solder layer is removed from the lead frame or pins, and nickel and/or gold films are formed with electroless plating. The removal of the pre-plated solder layer avoids excess pre-plated Sn with high-Pb solder that lowers the melting point to between 180° C. and 220° C. and weakens solder joints. The nickel layer formed with an electroless plating acts as a barrier to the interdiffusion of tin from solder with copper of the lead frame material, which may otherwise occur at high temperatures. Interdiffusion forms an intermetallic compound layer of copper and tin and degrades solder joint strength. The novel soldering processes improve high temperature reliability of solder joints and extend electronics life-time.

Abstract: A memory module, a method for manufacturing a memory module and a computer system is disclosed. One embodiment includes a printed circuit board including a component area and a connector area, wherein a number of signal layers is larger in the component area than in the connector area, the connector area being configured to be plugged into a slot. The memory module further includes memory components mounted on the printed circuit board in the component area.

Abstract: In a burn-in test configuration wherein a chip board having a plurality of semiconductor chips engages a heat sink board having a plurality of heat sinks. When the boards are operationally engaged, each semiconductor chip has a heat sink spring-loaded against the semiconductor chip. Posts coupled to one board engage posts located on the other board. The engagement of the posts orients and secures the relative positions of the two boards. A clip is provided that secures the relative position of the two boards when the two sets of posts are engaged. To uncouple the two boards, a pressure on the side of the clip permits the two boards to separate.

Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.

Abstract: Parallel stacking mid-frame structural supports for use with a portable electronic device are presented including: a first side member; a second side member disposed substantially parallel to the first side member, the first member and the second member each configured with; a support feature for providing structural support when an applied load exceeding a predetermined threshold is exerted on the portable electronic device, and an attachment feature; a third side member mechanically contiguous with and disposed substantially perpendicular to the first side member; and a fourth side member mechanically contiguous with and disposed substantially perpendicular to the first side member. In some embodiments, the mid-frame structural support also includes: a first number of rib supports for supporting a printed circuit board (PCB), and a second number of rib supports for supporting the PCB. In some embodiments, the predetermined threshold is approximately 800 grams.

Abstract: The invention is directed to a memory card that includes two or more connectors that conform to different connector standards. In one embodiment, the first connector conforms to a device communication connector (DCC) standard to facilitate direct coupling of the memory card to a portable device such as a voice recorder, a digital video camcorder, a digital camera, a personal digital assistant (PDA), a cellular phone, a video game, a digital television, a photo printer, or the like. The second connector may comprise a host computer connector (HCC) for direct coupling to a computing device without an adapter or reader.

Abstract: A circuit board module includes a circuit board and a reinforcing substrate. At least one electronic element is disposed on one surface of the circuit board. The reinforcing substrate is connected to a portion of the surface and disposed around the electronic element. A method for reinforcing the structure of the circuit board module is also disclosed.