Abstract: A monitoring system includes a serial advanced technology attachment dual-in-line memory module (SATA DIMM) with a circuit board, a motherboard having a monitoring unit, and a monitoring device. An edge connector is set on a bottom edge of the circuit board to engage in a memory slot of the motherboard. A SATA connector is arranged on the circuit board and connected to a storage device interface of the motherboard. The monitoring unit receives a working state signal and a data transfer rate signal of the SATA DIMM module and outputs the received signals to the monitoring device.

Abstract: A serial advanced technology attachment (SATA) DIMM device includes a board body. A control chip is arranged on the board body. First and second extending boards extend from an end of the board body and a space is defined between the first and the second extending boards. A first edge connector is set on the first extending board and a second edge connector is set on the bottom edges of the second extending board and the board body. The first edge connector includes a number of signal pins connected to the control chip, and a number of ground pins.

Abstract: A driver device includes a circuit board, a number of sockets, a number of driver chips, a control switch, and a signal output element. The sockets are positioned on the circuit board. Each driver chip is received in and electrically connected to a corresponding socket. The control switch includes a number of switches. An input of each switch is electrically connected to a corresponding socket. An output of each switch is electrically connected to the computer motherboard through the signal output element.

Abstract: A computer system includes a serial advanced technology attachment dual-in-line memory module (SATA DIMM) with a circuit board, a motherboard, and an indicating unit. An edge connector is set on a bottom edge of the circuit board to engage in a memory slot of the motherboard. A SATA connector is arranged on the circuit board and connected to a storage device interface of the motherboard. The indicating unit is connected to the motherboard for indicating the data transfer rates of the SATA DIMM module through two light emitting diodes.

Abstract: A motherboard assembly includes a serial advanced technology attachment dual-in-line memory module (SATA DIMM) with a circuit board, a memory slot, and an interface. An edge connector is set on a bottom edge of the circuit board. A SATA connector is arranged on the circuit board, and connected to a control chip and the interface, enabling a motherboard communication with the SATA DIMM module.

Abstract: An electronic device includes a main frame structure, a plurality of functional modules fixed to the main frame structure, a plurality of cables connecting the functional modules, a cable collector board fixed to the main frame structure, and a motherboard detachably connected to the main frame structure. The cable collector board includes a plurality of first printed circuits electrically collecting the cables, and a first connector electrically collecting the first printed circuits. The motherboard includes a plurality of second printed circuits and a second connector collecting the second printed circuits. The second connector is detachably electrically connected to the first connector.

Abstract: A backplane arrangement is provided for an electronic mounting rack with a base backplane with several contact strips, wherein a free space, into which at least one additional backplane can be inserted, is provided on the base backplane.

Abstract: A serial advanced technology attachment dual-in-line memory module (SATA DIMM) assembly includes a SATA DIMM module with a circuit board and a cable member. A first edge connector is set on a bottom edge of the circuit board to be connected to a memory slot of a motherboard. A second edge connector is arranged on an end of the circuit board. The cable member includes a cable, a first storage device interface extending from a first end of the cable to be connected to a second storage device interface of the motherboard, and a third edge connector formed on a second end of the cable and soldered to the second edge connector.

Abstract: A repair system which prevents heating of weakly heat resistant devices together and causing deterioration of the quality when preheating a first surface of the circuit board, wherein an electromagnetic induction material is buried in advance inside the circuit board near a specific electronic device envisioned as needed repair when becoming a defective electronic device in a production process and an electromagnetic coil emitting electromagnetic waves to an electromagnetic induction member in the vicinity of the repair device is provided and the heat generated by the electromagnetic induction member due to the electromagnetic waves enables the repair device to be heated and detached from the circuit board.

Abstract: A combination of an interconnect board and a module board for connecting a plurality of electronic modules to a processing unit is described. The interconnect board comprises a plurality of interconnect data lines connected between a plurality of interconnect board input terminals and interconnect board output terminals. The module board comprises at least one electronic module connected to a module connection input terminal, a plurality of module board data lines connected between a plurality of module board input terminals and a plurality of module board output terminals, and an unconnected module board output terminal. A first one of the interconnect board output terminals is connectable to the module connection input terminal, and the unconnected module board output terminal is connectable to one of the interconnect board input terminals.

Abstract: An expansion apparatus includes a serial advanced technology attachment dual-in-line memory module (SATA DIMM) with a first circuit board, an expansion card with a second circuit board, and a cable member. A first edge connector is set on a bottom edge of the first circuit board and includes a number of first power pins connected to a control chip, a number of first storage chips, and a first connector, and a number of first ground pins. A second edge connector is set on a bottom edge of the second circuit board and includes a number of second power pins connected to a number of second storage chips and a second connector, and a number of second ground pins. The cable member includes a cable, a third connector connected to the first connector, and a fourth connector connected to the second connector.

Abstract: A motherboard assembly includes a motherboard having an expansion slot and a storage device interface, and a serial advanced technology attachment dual in-line memory module (SATA DIMM) with a circuit board. A control chip and a storage chip are arranged on the circuit board. Two voids are defined in a top side of the circuit board. A first extending board is formed on the top side of the circuit board between the voids. An edge connector is arranged on the first extending board and connected to a power supply. The edge connector includes power pins connected to the control chip and the storage chip. A second extending board is extended from an end edge of the circuit board and includes a connector connected to the storage device interface of the motherboard. A bottom side of the second extending board is in alignment with a bottom side of the circuit board.

Abstract: An AMB component and a connection interface for a memory installation with fully buffered Dimm memory modules connected in series. The AMB component is disposed on a connecting line from memory modules to a memory controller of the memory installation to re-amplify the connecting line between two consecutive FBD memory modules. The connection interface includes an AMB amplifier component for the connection of a main memory card that includes at least one processor, to an auxiliary memory card of the type having a series of memory modules. Two series of FBD memory modules are connected to respective FBD channels in the auxiliary memory card using FBD connectors in a daisy-chain arrangement.

Abstract: A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors of the first substrate. The conductors of the second substrate have an existing density which is set higher than an existing density of the conductors of the first substrate, and the first substrate and/or the second substrate is embedded in the rigid multilayer board.

Abstract: A motherboard assembly includes a motherboard and an expansion card. The motherboard includes an expansion slot, a storage device interface, a power connector, and a central processing unit (CPU). The expansion slot includes a protrusion, first signal pins connected to the CPU, first power pins connected to the power connector. The expansion card includes a circuit board. A storage unit, a display unit, a power circuit, and a serial advanced technology attachment (SATA) connector connected to the storage unit and the storage device interface of the motherboard are all arranged on the circuit board. A notch is defined in a bottom edge of the circuit board, to receive the protrusion. An edge connector is arranged on a bottom edge of the circuit board and includes second power pins connected to the power circuit, and second signal pins connected to the display unit.

Abstract: A holding member for connecting an electric part to an electric circuit board. The holding member has a base section, a pair of first leg sections, and a second leg section. The base section has a plate-like shape. The pair of first leg sections includes respective spring sections and hook sections. The second leg section includes a control section. The pair of first leg sections configured to be inserted into a through hole in the electric circuit board.

Abstract: A motherboard includes a main circuit board, a CPU socket, and an interface. The main circuit board includes a holding surface and a side wall connected to the holding surface. The CPU socket is positioned on the holding surface. The interface is positioned on the side wall. The interface is electrically connected to the CPU socket. The interface provides a connection between the main circuit board and a sub-circuit board.

Abstract: A dual bus interface PCB includes a main chipset component, a first type bus interface connector, and a second type bus interface connector. The PCB can be configured at fabrication time to enable a variety of configurations for operation. Optionally, the PCB can also be provided at least one memory chip and a NIC (Network Interface Card) chip. By virtue of having a dual interface, the PCB can be used with either the first type or the second type bus. Furthermore, the dual interface PCB eliminates the need by chipset manufacturers to carry multiple PCB variations of the same product in order to support various bus interfaces. In one embodiment, the PCB is a dual PCI-X/PCI-E interface PCB.

Abstract: A motherboard assembly includes a motherboard having an expansion slot and two storage device interfaces, and a serial advanced technology attachment dual in-line memory module (SATA DIMM) with a circuit board. A first extending board is formed on a top side of the circuit board. An edge connector is arranged on the first extending board and connected to the second storage device interface and a universal serial bus (USB) control chip. A second extending board is extended from an end edge of the circuit board and includes a connector connected to the first storage device interface. A bottom side of the second extending board is in alignment with a bottom side of the circuit board. A second edge connector is arranged on the bottom edges of the second extending board and the circuit board.

Abstract: Disclosed herein is a wiring board including: a differential-line pair including two lines for transmitting differential signals; and two connection pads each electrically connected to one of the two lines pertaining to one of the differential-line pairs, wherein a plurality of the differential-line pairs are laid out side by side; a plurality of the connection pads are provided to form a plurality of columns; and on each of the columns of the connection pads, any two the connection pads electrically connected to the lines pertaining to the same differential-line pair are provided at locations adjacent to each other on the same one of the columns.

Abstract: A storage card includes a circuit board, a USB interface arranged on the circuit board and connected to a storage device interface of a motherboard. A control chip arranged on the circuit board and connected to the USB interface, and a number of storage chips arranged on the circuit board and connected to the control chip and the USB interface. A first extending board is extended from a bottom edge of the circuit board, to be inserted into an expansion slot of the motherboard.

Abstract: A semiconductor module, a socket for the same, and a semiconductor module/socket assembly are disclosed. The semiconductor module includes a printed circuit board including a plurality of semiconductor devices, a plurality of insulating layers and a plurality of metal layers, the plurality of insulating layers and the plurality of metal layers are alternately stacked. Exposed portions of the metal layers are exposed to the outside of the semiconductor module at a first and a second ends of the printed circuit board. The first end and the second end are at opposite ends of the printed circuit board.

Abstract: Example embodiments of the inventive concept are directed to solid state device products, intermediate solid state devices, and methods of manufacturing and testing the same, with removable test terminals, which may permit in situ testing of one or more components of the solid state device products.

Abstract: A connector for connecting surface mount devices, such as light emitting diodes (LEDs), to printed circuit boards (PCBs). The connector may be prepackage with an LED assembly or on a PCB to which the LED assembly will be mounted. Connection complexity can be moved from the PCB to the connector, and LED assemblies may be customized differently for different customers. One to many and many to one connections are readily supported with variations on the connector.

Abstract: A spacer-connector and connection arrangements between daughter boards and motherboards are disclosed. Assemblies may include a daughter board one or more spacer-connectors spacing the daughter board above a motherboard and conductive elastomers providing electrical connections between the daughter board and spacer-connector and between the spacer-connector and the motherboard. The spacer-connector may include ground, power, digital and/or controlled impedance RF pathways to conduct signals between the daughter board to the mother board.

Abstract: A circuit board includes a foil circuit provided on a synthetic resin plate formed by injection molding, made of a copper foil, and having a pattern different for the circuit board. Anchor pins projecting upward are provided on the resin plate and passed through pinholes made in the foil circuit. The foil circuit is positioned and secured to the resin plate. In a required portion of the resin plate, a terminal insertion hole is provided, and a receiving terminal is secured to the required portion of the terminal insertion hole and connected to the foil circuit.

Abstract: A programmable routing module is disclosed for interconnecting field wiring with a control system. The routing module includes a field connection to connect field signals from a controlled process to the routing module, an I/O connection to connect I/O signals from the control system to the routing module, and a configurable interconnection system that selectively couples particular field and I/O signals with one another.

Abstract: An expansion structure is used for electrically connecting an expansion card to a motherboard and includes a flexible printed circuit board (FPC) and a connection board. The FPC is electrically connected to the motherboard. One end of the FPC is electrically connected to the motherboard, another end of the FPC is electrically connected to the connection board. The connection board is electrically connected to the expansion card as the FPC permits deformation, and the expansion card is electrically connected to the motherboard through the connection board and the FPC.

Abstract: A printed circuit board (PCB) includes a top layer, a memory controller, two gaps, and two connectors. The memory controller is located on the top layer. A number of golden fingers are respectively set on the top layer near each gap and electrically connected to the memory controller. Each connector includes a first slot to hold the gold fingers near a corresponding one of the gaps and a second slot to hold a number of gold fingers of a corresponding one of two memory chips. The first slot is electrically connected to the second slot. Each memory chip and the PCB are coplanar.

Abstract: In a lead mounting method of mounting, onto a principal surface of a printed board, a lead to be connected to a terminal, a flat lead is prepared which lead has a mounted part to be disposed on the principal surface of the printed board and a connected part to be connected to the terminal. The flat lead is bent into an L shape so that the mounted part and the connected part are perpendicular to each other to obtain an L-shaped lead. The mounted part of the L-shaped lead is connected and fixed onto the principal surface of the printed board by soldering.

Abstract: A connector assembly includes a riser card, a first connector, a bent connector, and a second connector. The riser card includes a first side and a second side. The first connector is mounted on the first side of the riser card. The first connector includes at least one first pin extending through the riser card and protruding from the second side of the riser card. The bent connector is mounted on the second side of the riser card. The bent connector is coupled with the first connector in the riser card. The bent connector includes a first portion mounted on the second side and a second portion spaced from the riser card. The second connector is connected to the second portion. A gap is defined between the second connector and the riser card, and the at least one first pin of the first connector is located in the gap to avoid interfering with the second connector.

Abstract: The invention relates to a 3D electronic module comprising a stack (100) of at least a first slice (10) and a second slice (30), the first slice (10) having on a face (101) at least one set (4) of electrically conductive protrusions (41), and the second slice (30) comprising at least one zone (61) of electrically insulating material, traversing the thickness of the slice. The second slice (30) comprises at least one electrically conductive element (3) traversing said slice in a zone (61) of electrically insulating material, able to receive a set (4) of protrusions (41) of the first slice (10).

Abstract: An electrical connector assembly (100) includes an insulative housing (2), a micro chip (1) arranged on the insulative housing, a PCB (3) located below the insulative housing, a number of contacts (5) received in the insulative housing and a locking element (4) interconnecting the insulative housing onto the PCB. The contacts extend beyond an upper surface of the insulative housing and solder with the micro chip. The contacts extend below a lower surface of the insulative housing and contact with the PCB.

Abstract: The present invention discloses a communication apparatus. The communication apparatus includes one or more board and a backplane. The board includes a connector and a function processing unit circuit connected to the connector. The backplane includes at least one group of board connectors. Each group of the board connectors includes two board connectors that receive signals from different boards. The board connector includes connection terminals connected to the connector on boards. The two board connectors are distributed up and down, and the connection terminals of the two board connectors are distributed symmetrically around a center. The foregoing communication apparatus and backplane are cost-efficient.

Abstract: An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin.

Abstract: A key assembly comprises a base plate, two elastic elements and a key body. The elastic elements are both mounted to the base plate, and the elastic elements are spaced from and opposite to each other. The key body is slidably mounted to the base plate between the two elastic elements. The key body includes a first key section and a second key section connected with the first key section. The first key section has an arcuate first contacting portion formed thereon. The second key section has an arcuate second contacting portion formed thereon. The first key section resists one of the two elastic elements, the second key section resisting another elastic element. When the first key section slides toward and compresses the elastic element that resists the first key section, the second key section slide away from the elastic element that resists the second key section.

Abstract: A computer motherboard includes a printed circuit board which includes a central processing unit (CPU) socket and a group of memory slots. The group of memory slots includes an in-line type memory slot and a surface mounted device (SMD) type memory slot. The in-line type memory slot includes a number of plated through holes. The SMD type memory slot is set between the in-line type memory slot and the CPU socket. The through holes of the in-line type memory slot are connected to the CPU socket through traces, pads of the SMD type memory slot are connected to corresponding through holes of the in-line type memory slot having the same pin definition.

Abstract: A circuit board assembly includes two external circuit boards, at least one electrical connector, at least one electronic component, and at least one hollow substrate. Each external circuit board includes an external electromagnetic shielding layer, a circuit layer and a dielectric layer. In each external circuit board, the dielectric layer is located between the external electromagnetic shielding layer and the circuit layer. The electrical connector is connected between the circuit layers located between the external electromagnetic shielding layers. The electronic component is disposed between the external circuit boards and connected with one of the circuit layers. The hollow substrate with plural openings is disposed between the external circuit boards. The electronic component and the electrical connector are located in the openings. Both a thickness of the electronic component and a height of the electrical connector are smaller than or equal to a thickness of the hollow substrate.

Abstract: Software architecture for a mobile terminal for a wireless telecommunications system and for other applications. The software architecture includes a plurality of layers arranged in order from layers providing higher level services to layers providing lower level services, at least one software module in each layer, and interface means for permitting communication among software modules pursuant to a set of defined dependency rules.

Abstract: A chip adapter used to install a chip on a first chip arranging area of a circuit board includes a board. The size of the board has the same size as the first chip arranging area of the circuit board. Edges of the chip adapter define a number of gaps corresponding to first pads of the circuit board. A second chip arranging area of the same size as the chip is arranged in a center of the chip adapter. A number of second pads are arranged around the second chip arranging area of the chip adapter corresponding to pins of the chip. Each second pad is electrically connected to a sidewall of the corresponding gap of the chip adapter.

Abstract: Sensors modules adapted to be mounted to a motherboard under challenging conditions by using automated manufacturing processes are disclosed. A sensor module can include a sensor mounted to a sensor PCB, a connector coupled to the sensor and having a plurality of guide pins extending therefrom in a vulnerable manner, with the guide pins being adapted to be inserted into guide pin holes on an associated motherboard, and a disposable carrier adapted to hold the connector and protect the guide pins thereof prior to mounting. The disposable carrier is removed from the sensor module before the sensor module is mounted directly to a motherboard by press-fitting the guide pins into guide pin holes on the motherboard and soldering connections thereto in an automated surface mounting operation. Disposable carrier protected sensor modules can be stored and processed in a tray or tape-and-reel automated manufacturing system.

Abstract: Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required to insert the memory module into a module socket may be decreased.

Abstract: A versatile multi-layer electronic part built-in board compatible with different external circuits to be connected thereto is provided. Sensors are connected to a connector through connection lines that are connected to electronic parts. The electronic parts are directly connected to the connector and can be mounted on the top layer, the bottom layer or both the top and bottom layers of the multi-layer electronic part built-in board. When the sensor to be connected, for example, is changed to another having a different characteristic, an electronic part mounted on the top and bottom layers correspondingly to the sensor can be changed.

Abstract: The present invention discloses a mini power supply module comprising a circuit board and a power connector. Said power connector is abutted and electrically connected with said power connector through coupling parts. Said power connector is provided with an orientating mechanism to change the angle between said power connector and said circuit board. Said power connector is further included with an input port for receiving the input of an external power source, a contact terminal for matching with the connector on motherboard, and at least one output port for outputting power to peripheral devices.

Abstract: A junction structure and a joining method of substrates are provided that stably can join the substrates and achieve high workability during joining. A second substrate 2 to be joined with solder to a first substrate 1 is bent with elasticity generated by a bending portion 9, and first joints 5 on the first substrate 1 and second joints 6 on the second substrate 2 are joined with solder in a state in which the first substrate 1 is brought into contact with, in a direction that increases the bending angle of the bending portion 9, a part where the joints 6 are formed on the second substrate 2.

Abstract: The invention relates to a printed circuit board arrangement (20) having at least two printed circuit boards (11; 12?), which are located alongside one another on a common, electrically conductive base plate (13?), have two mutually opposite edges, forming an intermediate space (14), and are connected to one another, bridging the intermediate space (14) by means of electrical connections (21), in order to transmit extremely high frequencies. In the case of a printed circuit board arrangement such as this, RF-compatible electrical connections are made between the printed circuit boards in a simple and space-saving manner when the printed circuit boards are fitted on the base plate and without any further necessary additional tasks or reworking, in that the electrical connections are each made via at least one contact-making element (21), via which the printed circuit boards make detachable electrical contact with one another when mounted on the base plate (13?).

Abstract: An apparatus and method is provided for determining the orientation of a blade server with respect to a blade chassis, whenever the blade is inserted into a chassis with either vertical or horizontal slots. In an embodiment, wherein the blade server has opposing first and second edges, first and second connectors are located in pre-specified corresponding relationship with the first and second blade server edges. A first device in the blade chassis generates an information signal, wherein the information signal has an element that indicates the spatial location of a reference feature of the chassis. The embodiment includes a path for sending the information signal to either the first connector or the second connector, according to the orientation of the blade inserted into the chassis. A second device identifies the connector that receives the information signals, and uses the connector identity and the signal element together to determine the orientation of the inserted blade with respect to the chassis.

Abstract: A circuit board device, a wiring board connecting method, and a circuit board module device are provided for controlling a compression ratio of anisotropically conductive members within an optimal range, for restraining variations in the impact resilient force of the anisotropically conductive members even if an increased number of wiring boards are laminated, for restraining deformations of the wiring board and fluctuations in the impact resilient force of the anisotropically conductive members even if a static external force or the like is applied, for suppressing a linear expansion of the anisotropically conductive members, even if the ambient temperature changes, to increase the stability of electric connections, and for reducing the impact resilient force of the anisotropically conductive members to allow for a reduction in thickness.

Abstract: Disclosed herein is a printed circuit board assembly of an electronic appliance including a plurality of boards on which electrical parts to perform functions necessary for the electronic appliance are separately arranged according to the specification of the electronic appliance. The printed circuit board assembly is divided into a plurality of boards, such that electrical parts having a common specification and electrical parts having different specifications are arranged on different boards, thereby optimizing the printed circuit board assembly and configuring the boards according to the specification of the electronic appliance without loss. Microprocessors are arranged on the boards, and the boards are connected to each other in a serial communication, thereby reducing the number of wiring harnesses (W/H) and thus configuring the printed circuit board assembly with high reliability.

Abstract: A circuit board includes a main body and a connecting member mounted on the main body. The main body defines a separating groove and is divided into two segments by the separating groove, such that the main body is broken along the separating groove to separate the two segments from each other when a force is applied thereto. When the main body is broken along the separating groove to separate the two segments from each other, the connecting member electronically connects the two segments to each other.