Abstract: An electronic apparatus includes a circuit portion having a connector to which an interface cable is connected, a case for accommodating the circuit portion and having a wiring route for the interface cable leading from the connector to an external space and a connection opening for exposing the wiring route, and a cover for opening or closing the connection opening.

Abstract: A multi-stage mezzanine board mounting assembly within a computer chassis includes a mezzanine tray and mezzanine mounting brackets. The mezzanine tray includes a clamping mechanism. The mezzanine mounting brackets are disposed within the computer chassis and configured to engage with the mezzanine tray when the mezzanine tray is mounted thereon. The clamping mechanism is configured to clamp the mezzanine tray against the mezzanine mounting brackets such that the mezzanine tray is locked in place on the mezzanine mounting brackets. A method of installing a mezzanine board includes disposing mezzanine mounting brackets within a computer chassis; mounting a mezzanine tray onto the mezzanine mounting brackets such that insertion alignment members of the mezzanine tray engage with an engaging portion of the mezzanine mounting brackets; rotating rotatable clamping levers such that the mezzanine tray is locked in place on the mezzanine mounting brackets when the rotatable clamping levers are fully engaged.

Abstract: A software architecture for a mobile terminal for a wireless telecommunications system and for other applications. The software architecture includes a plurality of layers arranged in order from layers providing higher level services to layers providing lower level services, at least one software module in each layer, and interface means for permitting communication among software modules pursuant to a set of defined dependency rules.

Abstract: A memory card includes a first memory unit and the second memory unit. The first memory unit and the second memory unit are detachably connected together and are capable of storing and transmitting data, and are capable of working independently. A memory card holding structure using the memory card is also described. The first memory unit and the second memory unit are detachably incorporated together and electrically connected to the connector. Thus, each memory unit can be respectively detached and replaced, which does not affect normal operation of other memory unit. Moreover, the memory cards have two or more memory chip card functions.

Abstract: An electrical power distribution unit (1) for an electrical system has a printed circuit board (200) with a punched grid (100) arranged thereon. An electrical component (300, 310) is arranged on the printed circuit board on a side of the punched grid (100). An electrical contact (350) of the electrical component projects through a passage opening in the printed circuit board. The punched grid is arranged between the electrical component and the printed circuit board, and an opening is formed in the punched grid in an area (130) around the electrical contact. The punched grid has a current infeed (110) which comprises a plurality of tongues (111, 112; 113). At least one of the tongues is bendable out of a plane of the punched grid in such a way that two of the tongues form a mutually adjacent common portion (115), which is electrically contactable by an electrical plug connector.

Abstract: A semiconductor device comprises: a plurality of semiconductor chip; a socket; and a mounting board equipped with the socket. Each of the semiconductor chips has a major surface, a back surface and a plurality of connection terminals on the major surface. The socket has internal connection terminals inside and external connection terminals outside, and the internal connection terminals are in contact with the connection terminals of the semiconductor chips.

Abstract: An Active edge connector for memory modules has a base including two PCB sides and a spacer separating the sides, with driver chips mounted on each side of each side, printed wiring electrically connecting a first set of electrical signals from each of the driver chips to a mother board on which the connector is mounted, and printed wiring for electrically connecting a second set of electrical signals from each of the driver chips to a memory module inserted in the edge connector. When a group of connectors are mounted on a mother board, electrical signals arriving at the first connector are routed to its driver chips, producing re-driven signals to the next connector, and so on. A decoder circuit provides addressing signals determining the last such connector to which the signals are intended, and which prevents the signals from going to any connectors containing memories not addressed.

Abstract: A printed circuit board assembly has plural printed circuit boards that are mechanically and electrically connected to each other with them being stacked, and a connection layer that connects the adjacent two printed circuit boards to each other is provided. The connection layer includes an insulation portion and an electric conduction portion. The insulation portion contains an insulating member and is adhered to each of the adjacent two printed circuit boards. The electric conduction portion passes through the insulation portion and connects electrode terminals of the adjacent two printed circuit boards.

Abstract: A connector for mounting to a panel is provided that includes a housing that has a front edge configured to be located proximate an opening in the panel. The connector also includes a tab that extends from the front edge of the housing where the tab is oriented to engage an outer surface of the panel. A spring member also extends from the front edge of the housing and is positioned to engage an inner surface of the panel. The spring member is flexible toward and away from the tab.

Abstract: A method having a socket for coupling signals between an electrical component and a circuit board or equivalent has a mechanism that, when activated, attaches the electrical component to the socket so that it is not possible to remove the electrical component without damaging it. The mechanism may include a clamshell lid with a one-time locking mechanism, a pin contact mechanism that, after initial locking, will detach the pins of the electrical component if further disturbed, or a moat around the base of the electrical component for disposing an epoxy fastener. The moat may include a heating element to cure the epoxy or other glue. The socket may include an electrical component that allows detection of tampering with the socket.

Abstract: An electrical signal connection, an electrical signaling system, and a method of connecting printed circuit boards. The electrical signal connection having a first conductive via and a second conductive via disposed in a first printed circuit board. A first conductive trace with a first end and a second end has the first end electrically coupled to the first conductive via at a first distance from the top surface of the first printed circuit board. The second end of the first conductive via is electrically coupled to the second printed circuit board. A second conductive trace with a first end and a second end has the first end being electrically coupled to the second conductive via at a second distance from the top surface of the first printed circuit board. The second end being is electrically coupled to the second printed circuit board.

Abstract: An electronic gaming machine interface system including a first circuit board, a bracket coupled to the first circuit board, a fan coupled to the bracket and disposed over the first circuit board, a second circuit board coupled to the bracket, a first cable coupled between a connector of the first circuit board and a connector of the second circuit board; and a second cable coupled between a connector of the first circuit board and a connector of the second circuit board.

Abstract: A circuit board with a simple structure is manufactured. A circuit board 19 has thereon a foil circuit 21 provided on a synthetic resin plate 20 formed by injection molding, made of a copper foil, and having a pattern different for circuit board 19. Anchor pins 20a projecting upward are provided on the resin plate 20 and passed through pinholes made in the foil circuit 21. The foil circuit 21 are positioned and secured to the resin plate 20. In a required portion of the resin plate 20, a terminal insertion hole 20c is provided, and receiving terminal 22 is secured to the required portion of the terminal insertion hole 20c and connected to the foil circuit 21.

Abstract: The micro-sensor includes a first circuit substrate and a second circuit substrate. One surface of the first circuit substrate has an image sensing device electrically connected to main printed wires formed by a first wire group and a second wire group. On the other surface of the first circuit substrate has a main connector electrically connected to the second wire group. A plurality of first signal transmission lines connected to the first wire group. The second circuit substrate has a sub-connector that is electrically connected to sub printed wires having an equivalent number as and corresponding to the second wire group. The other end of the sub printed wires is electrically connected to a plurality of second signal transmission lines. Through connecting the connectors respectively disposed in different circuit boards to overcome the difficulty in the manufacturing process of concentrating all devices on a single circuit board.

Abstract: A light-emitting module for a lighting apparatus comprises at least two substrates, each provided with a printed circuit having an LED, and plural matching terminal blocks and buckles so that the substrates can be structured into a planar light-emitting module having a relatively large area by assembly of the terminal blocks and the buckles. The light-emitting module is adaptive to be used in a billboard, a traffic sign, a three-dimensional lighting apparatus or a lighting display screen.

Abstract: A method for producing a multilayer substrate includes stacking a first substrate, the first substrate having a circuit pattern; stacking a connector, the connector coupling onto said first substrate, the connector having a ring structure, the ring structure having a plurality of holes separated a predetermined distance from one another; and stacking a second substrate, the second substrate coupling onto said first substrate by inserting said connector, the second substrate having a circuit pattern, the circuit pattern being electrically connected to a circuit pattern formed on said first substrate, the circuit pattern being electrically connected using the plurality of holes formed on said connector. The method of producing a multilayer substrate can shield the EMI generated by a high-speed switching element.

Abstract: An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin.

Abstract: A portable electronic device includes a housing, a circuit board received in the housing, and a memory card retaining mechanism received in the housing. The memory card retaining mechanism includes a plurality of conductive parts. The plurality of conductive parts cooperatively form an antenna integrated with the memory card retaining mechanism and connected to the circuit board.

Abstract: A cable connects a circuit board mounted with an electronic circuit to a BT module that controls wireless communications compliant with Bluetooth (Registered Trademark). The cable is a connection cable that elastically deforms and applies pushing force in a direction to make the BT module leave away from the circuit board. A second holding piece, which is cantilever-shaped, moves to a releasing position at which holding the BT module is released by elastic deformation as well as moves to a supporting position at which the second holding piece presses the BT module by release of elastic deformation.

Abstract: According to one embodiment, an electronic apparatus includes a case, a main circuit board in the case, a connector on the main circuit board, an auxiliary circuit board includes one end portion connected to the connector and an extending portion extending outside the main circuit board, and a spring supporting mechanism between the case and the extending portion of the auxiliary circuit board. The spring supporting mechanism includes a spring portion configured to support the extending portion elastically deformable in a direction across a surface of the auxiliary circuit board, and is fixed to the extending portion to prevent the auxiliary circuit board from moving along the surface thereof.

Abstract: Electrical apparatus is provided including a housing for containing one or more electrical components therein. The housing has at least one connector means (29) for allowing the connection of at least one electrical cable thereto. Channel means (28) are provided adjacent the connector means for containing at least a part of the electrical cable adjacent a connection end thereof which is to be connected to the connector means on the housing in use.

Abstract: A shielding apparatus is disclosed suitable for use in providing electromagnetic interference shielding for an electrical component on a substrate. The shielding apparatus includes a frame that is at least partially drawn in construction and is configured for installation to the substrate. Side walls of the frame generally surround the electrical component, and a cover is attachable to the frame for substantially covering the electrical component. The cover includes an upper surface having an inverted embossment formed therein, and a cover member extending generally downwardly from the upper surface adjacent the inverted embossment. The inverted embossment and cover member define a guide for guiding and receiving at least part of the frame into the guide when the cover is attached to the frame. The guide is configured to help facilitate and generally hold the cover in electrical contact with the frame when the cover is attached to the frame.

Abstract: Signal line conductors passing through vertical vias in an insulative substrate for supporting and interconnecting integrated circuit chips are provided with shielding conductors in adjacent vias that link respective power and ground planes. The shielding conductors' presence in positions around a signal via is made possible through the employment of power plane and ground plane conductive grids that are laid out in rhomboid patterns. The power plane and ground plane grids possess a left-right mirror relation to one another and are displaced to place the rhomboid's corners to avoid overlapping any of the grid lines.

Abstract: Provided is a method for manufacturing a multilayer wiring board, by which interlayer connection is efficiently performed and a non-penetrating hole having a hollow structure or a through hole can be formed at the same time without damaging a plated portion on the inner wall of the through hole. A first printed board (1) is provided with a wiring, which has a wiring section and a bump mounting pad (14), and a substrate section. The method is provided with a step of forming a solder bump (3) on at least a bump mounting pad on the first printed board or a pad section of a second printed board (2) having the pad section (15) by using a solder paste, and a step of bonding the first printed board and the second printed board in layers by having an insulating adhesive (4) between the first printed board and the second printed board and electrically connecting the first printed board with the second printed board.

Abstract: A multilayered module board with mounted high-frequency electronic components such as a CPU and a graphic circuit is mounted on one face of a base board with mounted low-frequency electronic components. The multilayered module board is a squared multilayered board smaller than the base board. The electronic components are wired with an inner layer-wiring pattern. Connector terminals are solder-jointed to four sides of the multilayered module board. The multilayered module board is mounted to the base board via the connector terminal.

Abstract: A packet switch appliance for connection to a packet switching network, the packet switch appliance has a motherboard that includes a processor, a network switch chip, and a connector. The packet switch appliance also includes a daughter board configured to be removably connected to the motherboard through the connector. The daughter board may include one or more of a network switch chip and a processor unit.

Abstract: The present invention relates to an interconnection system of a first substrate (1) comprising at least one first transmission line (3) with a second substrate (10) comprising at least one second transmission line (11), the orientation of the first substrate with respect to the second substrate being arbitrary. The first substrate (1) comprises at least one metallized hole at one extremity of said first line and the second substrate (10) comprises a projecting element extending said second line and a ground saving, said projecting element being inserted into the metallized hole. The invention notably applies in the domain of microwaves and can interconnect a substrate comprising a printed antenna with a substrate receiving the processing circuits of the signal.

Abstract: A programmable routing module is disclosed for interconnecting field wiring with a control system. The routing module includes a field connection to connect field signals from a controlled process to the routing module, an I/O connection to connect I/O signals from the control system to the routing module, and a configurable interconnection system that selectively couples particular field and I/O signals with one another.

Abstract: A printed circuit board including a P1 connector, a P2 connector, and a first common connector configured to connect an application-specific connector to the printed circuit board.

Abstract: An electronic apparatus that can prevent occurrence of crosstalk between different differential signals on a printed circuit board on which a wiring pattern of a differentially operated signal line is formed, and reduce unnecessary radiation noises. First and second wiring patterns are disposed on the printed circuit board and through which differentially operated signals are transmitted, and the first and second wiring patterns are electrically connected to first and second connection terminals, respectively. An electronic component is disposed on the printed circuit board, and includes first and second terminals electrically connected to the first and second wiring patterns, respectively. The first and second terminals of the electronic component are disposed on the printed circuit board, respectively, so that the first and second wiring patterns do not intersect each other.

Abstract: An electronic apparatus includes: a housing; a motherboard that is accommodated in the housing; a first daughterboard that is accommodated in the housing; a second daughterboard that is accommodated in the housing; a host controller that is mounted on the motherboard; a bridge controller that is mounted on the first daughterboard and electrically connected to the host controller; a first chip that is mounted on the first daughterboard and electrically connected to the bridge controller; and a second chip that is mounted on the second daughterboard and electrically connected to the bridge controller.

Abstract: A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.

Abstract: A system comprises a chassis and a system board contained within the chassis. The system board has an edge connector adapted to receive an add-in card in a configuration in which the system board and add-in card are substantially co-planar.

Abstract: One embodiment of a reconfigurable graphics processing system includes a first MXM edge connector and a second MXM edge connector affixed to an interposer board and a first MXM board and a second MXM board coupled to the interposer board via the first and second MXM edge connectors, respectively. Each MXM board includes a GPU and other elements necessary to process graphics data. The system couples to the motherboard of a computing device through an interface connector on the interposer board. One advantage of such a system is that it may be configured to deliver more performance than a standard desktop graphics board, while occupying substantially the same volume, through the use of multiple, small form factor MXM boards.

Abstract: A computer system includes a chassis (10) having a bottom plate (12), a drive bracket (20) for securing at least one data storage device therein, a motherboard (40), and a riser card (30). The drive bracket is secured in the chassis above the bottom plate, and has a sidewall (203) perpendicular to the bottom plate of the chassis. The motherboard is secured on the bottom plate of the chassis forming a socket (41) thereon. The riser card electrically engages in the socket of the motherboard, and is secured on the sidewall of the drive bracket.

Abstract: There is described an electrical system including a device which features a load current circuit and connection terminals for connection of the load current circuit. In the supply line to the connection terminals, separation contacts are present for separating the load current circuit during operation of the device. Means for explosion protection are provided in connection with the separation contacts.

Abstract: A component and card coupling alignment and support apparatus includes a card. A primary component connector is mounted to the card. A primary component including a connection edge engages the primary component connector. A secondary component extends from the primary component. An alignment and support member is included on the secondary component, whereby the card engages the alignment and support member on the secondary component. The engagement of the alignment and support member with the card aligns the primary component with the primary component connector during their coupling and supports the primary component in the primary component connector after their coupling. The card may then be coupled to an information handling system connector in an information handling system.

Abstract: In one example embodiment, a pluggable optoelectronic module includes a shell with a front, back, and first and second sides. A first guiderail protrudes from the first side and extends from the front of the shell to the back of the shell. A second guiderail protrudes from the second side and also extends from the front of the shell to the back of the shell. A first thumbscrew runs the length of the module and is housed within the first guiderail. A second thumbscrew also runs the length of the module and is housed within the second guiderail. The two thumbscrews are configured to secure the module to a host device when the module is plugged into the host device.

Abstract: A circuit package includes a circuit substrate having a cutout portion defined therein, an interconnect electrically coupled to the circuit substrate and an active circuit component disposed off the circuit substrate within the cutout portion and electrically coupled to the interconnect. An optical circuit includes a lead frame and an optical component electrically coupled to the lead frame. The lead frame includes a first lead portion at a first level having an upper surface and a lower surface, and a second lead portion at a second level lower than the first level and electrically connected to the first lead portion. The lower surface of the first lead portion is arranged to electrically connect to a surface of a circuit substrate. The second lead portion includes an upper surface and a lower surface. The optical component is disposed on the upper surface of the second lead portion.

Abstract: A gaming control board having low-power circuitry and high-power circuitry for controlling the operation of a gaming machine. The low-power circuitry includes logic components including a CPU that executes instructions for randomly selecting a plurality of game outcomes in response to wagers inputted by a player. The high-power circuitry includes high-power components such as lamp drivers for interfacing high-power signals between the gaming control board and a game interface board. Two connectors are provided on the gaming control board, one to interface low-power signals and another to interface high-power signals. The high-power circuitry is located near the connector interfacing the high-power signals for optimal EMI suppression.

Abstract: This invention is to provide a half-sized PCI CPU card and a computer device having the capability of PCIe expansion, wherein the half-sized PCI CPU card comprises a PCI golden finger and a PCIe golden finger aligned at an edge of the half-sized PCI CPU card so that the half-sized PCI CPU card may be inserted by means of the golden fingers into corresponding PCI and PCIe slots provided on a backplane of the computer device, enabling the half-sized PCI CPU card to utilize the hot pull-plug and high transmission properties of the PCIe bus and communicate with a PCIe bus compatible peripheral inserted into the back plane.

Abstract: A signal-segregating connector for use in a system having a printed circuit board, a first electrical structure and a second electrical structure. The connector includes a first set of conductive elements to convey signals between the first electrical structure and the printed circuit board, and a second set of conductive elements to convey signals between the first electrical structure and the second electrical structure.

Abstract: The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The present invention can be used to advantage with packages of a variety of sizes and configurations ranging from larger packaged base elements having many dozens of contacts to smaller packages such as, for example, die-sized packages such as DSBGA. In a preferred embodiment devised in accordance with the present invention, a base element CSP integrated circuit and a support element CSP integrated circuit are aggregated through a flex circuit having at least two conductive layers that are patterned to selectively connect the two CSP elements. A portion of the flex circuit connected to the support element is folded over the base element to dispose the support element above the base element while reducing the overall footprint. The flex circuit provides a thermal and electrical connection path between the module and an application environment such as a printed wiring board (PWB).

Abstract: An embodiment of the present invention is a technique to assemble multi-core dice. A first socket has first N sets of front side bus (FSB) contacts to house a first package having first 2N dice. Each of the first 2N dice has M cores. N and M are positive integers. A first chipset has 2N FSB signal groups interfacing to the first package via the first N sets of FSB contacts using first N FSB signal groups of the 2N FSB signal groups.

Abstract: An electronic unit includes a first circuit board having a power semiconductor device and an electrolytic capacitor and a second circuit board having an electronic component to control the power semiconductor device. The second circuit board is arranged perpendicular to the first circuit board and along the surface of the electrolytic capacitor. The electronic unit further includes a connecting member being jointed at one end thereof to the first circuit board and jointed at the other end thereof to the second circuit board for electrical connection between the first and second circuit boards.

Abstract: An apparatus, and a method for forming, a split thin film capacitor for providing multiple power and reference supply voltage levels to electrical devices such as integrated circuits, may be useful in space restricted applications, and in applications that require very close electrical connections between the power consumer and the power supply. An example of both a space restricted application and a close coupling application may be an integrated circuit (IC) such as a microprocessor. The capacitor supplying and moderating power to the microprocessor needs to be closely coupled in order to respond to instantaneous power demands that may be found in high clock rate microprocessors, and the space inside a microprocessor package is very restricted.

Abstract: The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The present invention can be used to advantage with packages of a variety of sizes and configurations ranging from larger packaged base elements having many dozens of contacts to smaller packages such as, for example, die-sized packages such as DSBGA. In a preferred embodiment devised in accordance with the present invention, a base element CSP integrated circuit and a support element CSP integrated circuit are aggregated through a flex circuit having at least two conductive layers that are patterned to selectively connect the two CSP elements. A portion of the flex circuit connected to the support element is folded over the base element to dispose the support element above the base element while reducing the overall footprint. The flex circuit provides a thermal and electrical connection path between the module and an application environment such as a printed wiring board (PWB).

Abstract: A power shunt for use within a semiconductor device of a type having a motherboard and an integrated circuit package electrically coupled to the motherboard and of a type having a spaced portion located between the motherboard and the package. The power shunt comprises a capacitor within the spaced portion between the motherboard and the package of the semiconductor device. The capacitor includes a conductive layer of a first type, a conductive layer of a second type, and a dielectric layer that electrically isolates the first type conductive layer from the second type conductive layer, wherein said first type conductive layer and second type conductive layer form a conductive bridge between the motherboard and the package. The arrangement of the capacitor fulfills the dual function of providing decoupling capacitance with the capability of supplying an additional path of current between the motherboard and package to the die load.

Abstract: A modular patch panel module is mountable on an electronics enclosure and includes an angled patch face and mounting structure that enables stacking of modular patch panels without interference of patch panel cords with the top of the enclosure or another patch panel stacked thereon. The patch panel modules may each contain a plurality of RJ-45 ports and punchdown blocks. A cover plate may snap fit to the module to retain the patch panel electrical components therebetween.

Abstract: A motherboard may have contact pads arranged along a peripheral region on one or both surfaces thereof. A memory module may have unit packages fixed to an upper plate and a lower plate of a module frame. The unit packages may be spaced apart from each other. The upper and the lower unit packages may have contact terminals facing each other. The contact terminals may be elastically bendable, and/or the unit packages may be mounted on the plates via elastic members. The peripheral region of the motherboard may be inserted into the memory module, so the contact terminals of the memory module may elastically contact with and be electrically coupled to the contact pads of the motherboard.