Abstract: A CPU mounting apparatus is disclosed. The CPU mounting apparatus includes a CPU receiver, two lever holders, two clips, two resilient members, a pair of levers, and a handle. The CPU receiver defines a cavity for receiving a CPU. The two clips are slidably mounted between the lever holders and the CPU receiver and include clip ends for holding the CPU. The resilient members apply resilient forces on the clips so that the clips can hold the CPU firmly. The levers are fixed on the lever holders and are positioned between the clips for pushing the clips to move. The handle is mounted on the lever holders above the levers for driving the levers to move. The CPU mounting apparatus is used to load/remove a CPU to/from a socket.

Abstract: A technique is provided for improvement in convenience and in cost reduction of a fixing part of a printed board unit. A printed board unit includes a plurality printed board including a first printed board and a second printed board; and at least one fixing part, interposed between the first printed board and the second printed board, fixing the first printed board and the second printed board such that the first printed board and the second printed board overlap and keep a predetermined space between the first printed board and the second printed board, and the fixing part variably determines the predetermined space.

Abstract: An adapter module is described. The adapter module includes a circuit board, a first socket and an adapter device. One face of the first socket is electrically connected to the circuit board on the first face of the circuit. The other face of the first socket connects to a first central processing unit (CPU). One face of the adapter base is electrically connected to the circuit board on the second face of the circuit board. The other face of the adapter base connects to a second socket. The circuit board sends signals from the second socket, through the adapter base and the first socket, to the first CPU. When the adapter base is not connected to the second socket, the second socket is capable of connecting to a second kind of CPU.

Abstract: An optically connectable circuit board and optical components mounted thereon. At least one component includes optical transceivers and provides an optical connection to the board. Electronic components may be directly connected to the board electrically or optically. Also, some electronic components may be indirectly connected optically to the board through intermediate optical components.

Abstract: A memory module adapted for installation in an open memory socket on a mainboard of a computer. The memory module includes a substrate with an edge connector comprising pins along an edge of the substrate, and at least one memory package mounted to the substrate and containing a memory die electrically connected to input/output leads located along the perimeter of the memory package and through which data signals are transmitted to and from the memory die. Data signal lines electrically connect a plurality of the input/output leads of the memory package to a plurality of the pins of the edge connector. Termination resistors individually electrically connect each of the data signal lines to ground, a supply voltage, or a reference voltage of the memory package so as to reduce noise and signal reflections through the data signal lines.

Abstract: An Active edge connector for memory modules has a base including two PCB sides and a spacer separating the sides, with driver chips mounted on each side of each side, printed wiring electrically connecting a first set of electrical signals from each of the driver chips to a mother board on which the connector is mounted, and printed wiring for electrically connecting a second set of electrical signals from each of the driver chips to a memory module inserted in the edge connector. When a group of connectors are mounted on a mother board, electrical signals arriving at the first connector are routed to its driver chips, producing re-driven signals to the next connector, and so on. A decoder circuit provides addressing signals determining the last such connector to which the signals are intended, and which prevents the signals from going to any connectors containing memories not addressed.

Abstract: A power supply is described. The power supply includes a main power connector and one or more circuit boards rigidly connected to the main power connector, including mechanical and electrical connection. The main power connector has a body that includes a plurality of contacts. The main power connector is configured to mate with a corresponding connector on a motherboard in a computer. The motherboard is coupled to one or more processors. A first plane including a first circuit board in the one or more circuit boards is substantially parallel to a symmetry plane of the body. The symmetry plane includes a direction of insertion of the main power connector when mated with the corresponding connector. The one or more circuit boards include one or more switched mode power supplies to convert an input signal to one or more output signals.

Abstract: A method of assembling and configuring multiple mezzanine cards on a carrier card is disclosed. The method includes the establishing an I/O profile that represents the I/O configuration of a mezzanine card. The I/O of the mezzanine card is not enabled unless the I/O profile matches a known value stored on the carrier card. In this way, the electronic circuitry is protected if an incorrect mezzanine card is connected to the carrier card.

Abstract: A force distributor is configured for disposition between a printed circuit board and a stiffening plate, which is spaced from the printed circuit board. The force distributor is configured to distribute a compressive force between the printed circuit board, an interposer and a land grid array module carried on a side of the printed circuit board opposite the stiffening plate. The force distributor comprises a spring element comprising a first portion and a second portion with the first portion extending radially outward from the second portion. The spring element is configured for placement so that the first portion is secured to the stiffening plate and the second portion is biased in unsecured, pressing contact against the printed circuit board.

Abstract: An electronic apparatus includes a circuit portion having a connector to which an interface cable is connected, a case for accommodating the circuit portion and having a wiring route for the interface cable leading from the connector to an external space and a connection opening for exposing the wiring route, and a cover for opening or closing the connection opening.

Abstract: The present invention provides a transceiver housing comprising: an opening at a proximal end thereof for receiving a optical receptacle; an electrical contact for engaging the optical receptacle and retaining the optical receptacle in the housing body; and a first side and a second side, each of the first side and the second side including mountings for mounting a printed wire assembly within the housing. In a preferred embodiment, the transceiver housing of the present invention has a uni-body construction.

Abstract: The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern and the second wiring pattern are electrically connected, wherein the first board includes: a board insertion opening in which the second board is inserted; and a first connection pattern provided inside the board insertion opening and electrically connected to the first wiring pattern, and the second board includes: an inserting portion to be inserted into the board insertion opening of the first board; and a second connection pattern provided at a position opposed to the first connection pattern and electrically connected to the second wiring pattern in the case where the inserting portion of the second board is inserted into the board insertion opening of the first board, and further comprising: solder or brazing filler metal applied at least to a surface of one of the first connection pattern and second connection

Abstract: In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate. In order to make the high-frequency power amplifier module small in size, a substrate-side bonding electrode electrically connected to a wire set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate-side output electrode electrically connected to an output wire. A substrate-side input electrode electrically connected to an input wire is located at a distance from the side of the semiconductor chip about equal to the distance from the side of the semiconductor chip to the substrate-side output electrode, or at a location farther from the side of the semiconductor chip than the substrate-side bonding electrode is.

Abstract: In a communication unit 100, a ground layer section 101 which is a sheet-like conductive material and a power-source layer section 102 which is a sheet-like conductive material are laid out in such a way that their one sides face each other, a voltage is applied in such a way that the power-source layer section 102 has a predetermined reference electric potential to the ground layer section 101, a plurality of conductive layer sections 103 which are sheet-like conductive materials are laid out between the ground layer section 101 and the power-source layer section 102, each conductive layer section 103 and the power-source layer section 102 are coupled together by a pull resistor section 104, a transmission communication element transmits a signal by changing the electric potential of the conductive layer section 103 connected to that communication element with respect to the ground layer section 101, and a reception communication element receives the signal by directly or indirectly detecting a change in ele

Abstract: In electronic devices with signal traces positioned between a ground layer and a voltage reference layer, systems and methods are provided for connecting a hot pluggable device to the electronic device in a manner that diminishes signal degradation due to parasitic effects. The first device has a second reference layer near the connector that connects to a second device voltage reference layer maintained at a given voltage level across the connector. In the first device near the connector the signal trace is positioned in between a ground layer of the first device and the second reference layer which is maintained at a given voltage by a voltage regulator of the second device. The signal return current travels past the second reference layer to a first reference layer of the first device which is maintained by the first device's voltage regulator through AC decoupling capacitors minimizing the current return path discontinuity.

Abstract: The present invention discloses an apparatus for operatively connecting a PCI-X or AGP device card (having a PCI-X or AGP bus) to a PCI-E bus connection on a mother board by mounting the PCI-X or AGP device card to a right edge connector mounted on a surface of an adapter card, the adapter card having a PCI-X (or AGP) to PCI-E bridge circuit for interconnecting a PCI-X (or AGP) bus to a PCI-E bus.

Abstract: Wiring circuit board for connecting an electronic control system or an electronic control module to a connection circuit board, on which service lines for the electronic control system or the electronic control module can be hooked up in terminals, wherein the wiring circuit board has a plug and socket connector, which can be plugged directly or via a connection cable into a mating connector of the connection circuit board, which is in electrically conducting connection with the terminals of the connection circuit board, and at least one socket, into which the electronic control system or the electronic control module can be plugged, and the plug and socket connector is joined in electrical conduction via the wiring circuit board to the at least one socket.

Abstract: A peripheral connector includes a peripheral signal terminal set and a test signal terminal set for respectively electrically connecting a peripheral interface and a boundary scan interface of a microcomputer. A socket is selectively connectable to a peripheral device for data transmission between the peripheral device and the microcomputer or a test module for conducting a boundary scan test on the microcomputer. A converting unit has a logic circuit and a transmission circuit. The logic circuit converts an electric potential, which is transmitted from the socket and corresponds to one of the peripheral device and the test module that is connected to the socket, into a digital control signal for controlling enablement or disablement of the transmission circuit. The test module is able to conduct a boundary scan test on the microcomputer only when the transmission circuit is enabled.

Abstract: A high-speed signal transmission apparatus comprises: a housing; a plurality of daughter boards juxtaposed to one another in the housing; board-side connectors each provided on corresponding each of the juxtaposed daughter boards; and cable-side connectors fixed in the housing; wherein each of the board-side connectors is insertable/removable into/from corresponding each of the cable-side connectors, and wherein a cable group whose impedance matching can be achieved makes connection between the predetermined cable-side connectors.

Abstract: Printed circuit boards (PCB's) with edge connectors undergo bending stresses whenever the edge connectors are plugged into mating connectors. The bending stresses causes deformation of the printed circuit board, which can have deleterious effects on electrical components thereon. Slots are provided on the PCB to enable the portion of the PCB surrounding the edge connector to bend relative to the remainder of the PCB, thereby confine the bending to a localized area between the ends of the slots, and isolate the electrical components from any stresses caused thereby.

Abstract: A semiconductor device mounting board, a method of manufacturing the same, a method of inspecting the same, and a semiconductor package are provided. The semiconductor device mounting board is capable of implementing a high-density and fine structure corresponding to a narrowing pitch and has high mounting reliability. A semiconductor device mounting board includes a wiring construction film including an insulating layer and a wiring layer, and a first electrode pattern disposed on one surface of the wiring construction film in which a periphery of a side surface of the electrode pattern is in contact with the insulating layer. At least a rear surface of the first electrode pattern is not in contact with the insulating layer.

Abstract: In one aspect, an electronic assembly includes an interconnection substrate, a component, and a discontinuity compensator. The interconnection substrate includes a signal conductor and a ground conductor. The component includes a device having a signal line and a ground conductor, a package, and a signal lead. The signal lead is electrically coupled to an internal signal path of the package and has an external portion extending from the package to the signal conductor of the interconnection substrate. The discontinuity compensator electrically couples a ground path of the package to the ground conductor of the interconnection substrate. The discontinuity compensator includes an electrically conducting planar surface that is oriented in a plane intersecting the interconnection substrate and forms with at least a substantial part of the external portion of the signal lead a transmission line structure having an impedance substantially matching the nominal impedance over the specified bandwidth.

Abstract: A method and apparatus are disclosed for distributing multiple signals having audio and/or video components for processing by an audio and/or video processor, including a chassis having a midplane connection and number of slots for receiving plural circuit boards, where at least one of the circuit boards receives a combination of multiple audio and/or video signals via a common slot of the midplane. The midplane is configured to electrically connect to one or more of the plural circuit boards and distribute portions of the multiple signals to plural circuit boards. The midplane has electrical signal interconnects within it for electrically connecting a first one of the plural circuit boards, when inserted into a first one of the slots, to multiple other circuit boards, inserted in other slots. A video signal received from an external device via the first circuit board is supplied to at least one of the circuit boards for video signal processing.

Abstract: A socket for coupling signals between an electrical component and a circuit board or equivalent has a mechanism that, when activated, attaches the electrical component to the socket so that it is not possible to remove the electrical component without damaging it. The mechanism may include a clamshell lid with a one-time locking mechanism, a pin contact mechanism that, after initial locking, will detach the pins of the electrical component if further disturbed, or a moat around the base of the electrical component for disposing an epoxy fastener. The moat may include a heating element to cure the epoxy or other glue. The socket may include an electrical component that allows detection of tampering with the socket.

Abstract: A transponder assembly for use with fiber optic digital communication cables having multiple parallel optic fiber elements. The transponder assembly features a transmitter port and receiver port for connection with separate parallel optic cables for separately transmitting and receiving data and an electrical connector for connecting with computer or communication systems. The transponder assembly includes a parallel optic transmitter module and a parallel optic receiver module having pluggable edge connectors. The assembly also includes a circuit board on which a semiconductor chip useful for signal processing and the electrical connector are mounted. A flex circuit is used in connecting the circuit board to the parallel optic modules. The semiconductor chip and electrical connector are mounted directly across from one another on opposite surfaces of the circuit board.

Abstract: An FPC board includes a base insulating layer made of polyimide, for example. A conductor layer made of copper, for example, is formed on one surface of the base insulating layer. The conductor layer is composed of a pair of rectangular collector portions and extraction conductor portions extending in long-sized shapes from the collector portions. A coating layer is formed on the base insulating layer so as to coat the conductor layer. The coating layer is formed so as to coat the collector portions and the extraction conductor portions of the conductor layer. The coating layer is made of a resin composition containing carbon.

Abstract: An improved printed circuit board (PCB) includes first and second substrates, which are disposed being distanced or spaced mutually and in which at least one or more semiconductor chips are mounted, and a signal transmission part for providing a signal transmission path between the first and second substrates, the signal transmission part being extended out of a region having a size smaller than a maximum size of the first substrate within the first substrate, and being extended in the second substrate. In disposing two substrates in a spaced-apart structure of upper and lower positions, a length of flexible printed circuit (FPC) connecting the two substrates can be reduced, and an impedance mismatching caused in use of the FPC can be reduced.

Abstract: A method of reducing noise induced from reference plane currents is disclosed. The method includes routing a first path for an electrical trace on a circuit board such that the first path references a voltage plane. The method further includes routing a second path for the electrical trace on the circuit board such that the second path references a ground plane whereby the second path is substantially similar to the first path. The method further includes electrically coupling the first path to the second path at each of the ends of the first and second paths such that noise induced into the electrical trace is reduced.

Abstract: A flexible cable is provided for a lighting system having a power supply that includes a power supply input to receive a first signal having a first frequency and a circuit for converting the first signal to a second signal, and at least one luminaire coupled to a lamp driver. The cable comprises a first leg of wires for carrying the second signal. The first wire electrically connects a loop output of the power supply to an input of the lamp driver and a second wire electrically connects an output of the lamp driver to a loop return of the power supply. The cable further comprises a second leg of wires electrically connected to a ground of the power supply and the ground of the lamp driver. The second signal has a substantially constant current and a second frequency distinctly higher than the first frequency. The flexible cable further comprises a modular connector.

Abstract: A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board.

Abstract: A fastening structure for stacking a plurality of electronic modules on a mainboard is provided. The fastening structure includes a locking member and a plurality of supporting members. The locking member is disposed on a first electronic module for locking the first electronic module onto the mainboard by locking elements. The supporting members are connected to the locking member and are used to carry a second electronic module above the first electronic module. Therefore, under a limited space for disposing the first/second electronic modules, the fastening structure of the present invention increases the space utilization, thereby enhancing the strength of the structure for the first/second electronic modules.

Abstract: An embodiment of the present invention includes a super slim compact flash (CF) light Universal Serial Bus (USB) device having a top cover, a top cover slot formed within the top cover and forming a top cover slot cavity, a sliding plug connector positioned within the cavity and flexibly movable therein, a plastic frame disposed below and around the top cover, a retractable slim USB plug connector sub-assembly on top of which and connected thereto is placed the sliding plug connector, the sub-assembly including a retractable slim USB plug connector positioned within the device to be flexibly retracted from or pulled into the device by the sliding plug connector for causing connection to a mating USB plug connector.

Abstract: The invention is directed to a device that functions as an adaptor for a micro-memory card. The device includes a port to receive the micro-memory card and an internal interface within the port allows for electrical connection between the device and the micro-memory card. The device also includes a card interface that conforms to a standard sized memory card. The device can be inserted into another device that accepts such standard sized memory card so that the other device can store data onto the micro-memory card connected to the port. In addition, the device also includes a host interface, such as an external shieldless USB tab protruding from an edge of the device, or a wireless USB interface to allow for wireless USB communication.

Abstract: An electronic circuit, preferable as a sensor node, has a highly sensitive radio function and is capable of performing a low-power-consumption operation. The electronic device has a board; a connector for connecting a sensor; a first signal processor circuit receiving an input of sensor data from the sensor through the connector and forming transmission data; and a second signal processor circuit converting a transmission signal from the first signal processor circuit into a high-frequency signal. The connector and the first signal processor circuit are mounted on a first surface of the board, and the second signal processor circuit is mounted on a second surface of the board.

Abstract: A backplane for an electronic data communication system is disclosed. The backplane comprises at least one ultra-wideband transmitter configured to transmit data in the form of a plurality of pulses in a wireless manner and at least one ultra-wideband receiver configured to receive the plurality of pulses and decode the plurality of pulses to retrieve the data. The data is to be transmitted wirelessly from a first module comprising the at least one ultra-wideband transmitter to a second module comprising the ultra-wideband receiver within the electronic communication system, the first and second modules residing in the system housing.

Abstract: Methods, devices and systems for coupling an HVAC controller to an HVAC system are provided. In several embodiments, a sub-base is provided allowing an HVAC controller to be coupled to a printed wire board to allow, in some cases, modification of the HVAC controller function. The sub-base may include a plurality of terminals, each terminal having a contact mating feature for receiving a pin of an HVAC controller, a terminal block location for receiving an end of a wire, and a transformation pin-out adapted to couple to a printed wire board, with the contact mating feature, the terminal block location, and the transformation pin-out being electrically coupled together. In one embodiment, an HVAC controller is modified to allow a controller adapted for use with a single fuel system to control dual fuel system.

Abstract: A circuit board comprising at least one slot provided on a surface of the circuit board. An add-in card can be mated to the slot. The slot comprises a first electrical connection adapted to couple to an add-in card of a first type and a second electrical connection adapted to couple to an add-in card of a second type. The first or second types of add-in cards are different.

Abstract: In a flying capacitor type battery voltage detector on a circuit substrate, a large number of photo MOS switches having performance highly depending from temperature are dividedly disposed on front and back surfaces of the circuit substrate such that the photo MOS switches of the back surface are lying over the photo MOS switches of the front surface. Each of pairs of photo MOS switches connects a pair of surface lines with first and second floating lines to transmit an output voltage of each cell of a battery pack connected with the surface lines to a differential amplifier through a flying capacitor connected with the floating lines. Because of the division of the photo MOS switches on the surfaces of the circuit substrate, temperatures of the photo MOS switches have less dispersion, and an S/N ratio of each signal indicating the output voltage can be improved.

Abstract: A memory extension memory module, a memory module system, and a memory module is disclosed. The memory module including at least one memory device and a connector for connecting the memory module to a computer system, wherein the memory module additionally includes a surface-mounted connector for connecting a memory extension memory module to the memory module. Furthermore, a method for manufacturing a memory module is disclosed. The memory module including at least one memory device and at least one connector for connecting a memory extension memory module to the memory module, wherein the at least one memory device and the at least one connector are connected to the memory module in a single manufacturing process.

Abstract: A method and apparatus to mount a uniform force hydrostatic bolster plate to a substrate. One embodiment of the invention involves a method to assemble a uniform force hydrostatic bolster plate on a substrate. A second embodiment of the invention involves a method to fabricate a uniform force hydrostatic bolster plate. A third embodiment of the invention involves an assembled substrate with a uniform force hydrostatic bolster plate on the opposite side of the assembled substrate, under an electrical contact area of a component on the assembled substrate.

Abstract: A USB device in which all of the devices ICs are located on a lower surface of a PCB (i.e., opposite to the metal contacts) to minimize the device's thickness, and at least one of the ICs is positioned on a relatively narrow portion of the USB plug to minimize the device's length. A card-like carrier for protecting the USB device when not in use includes a frame-like base portion having peripheral walls surrounding a relatively wide main chamber, and an end portion that is attached to the base portion and includes end walls that define a relatively narrow slot communicating with the main chamber. The USB device plug structure is inserted through the main chamber into the slot until a front edge of the handle structure abuts the end walls, and then the device is rotated downward into the main chamber.

Abstract: An object of the present invention is to provide a flexible printed wiring board which relaxes stress concentration in the flexible printed wiring board during production steps, thereby preventing wire breakage in inner lead portions and cracking in solder resist which would otherwise be caused during mounting of devices such as IC chips and LSI chips. The flexible printed wiring board of the present invention includes an insulating layer; a wiring pattern formed of a plurality of wirings being juxtaposed, which wiring pattern is formed through patterning a conductor layer stacked on at least one surface of the insulating layer and on which wiring pattern a semiconductor chip is to be mounted; and grid-like dummy patterns formed in a blank area where the wiring pattern is not provided, wherein the dummy patterns are formed in a width direction generally symmetrically with respect to the longitudinal direction of the flexible printed wiring board.

Abstract: A structure of a circuit board interface for electrically connecting at least one fuel cell module and at least one electronic device is disclosed. The circuit board interface comprises at least one base plate having a electronic circuit disposed thereon, a first interface positioned on the base plate for electrically connecting to the electronic circuit and the fuel cell module, a second interface positioned on the base plate for electrically connecting to the electronic circuit and the electronic device.

Abstract: A method and apparatus to eliminate conductive contamination reliability problems for assembled substrates, such as electrical arcing in power semiconductor leads. One embodiment of the invention involves a method for assembling an electrical component having leads on a substrate having conductive contacts, wherein an elastomer part encapsulates the leads of the electrical component. A second embodiment of the invention involves assembling an electrical component having leads to a substrate having conductive contacts, wherein an elastomer shape cut by a punch die encapsulates the leads of the electrical component. A third embodiment of the invention involves an assembled substrate including an electrical component having leads, and an elastomer surrounding the leads to encapsulate the leads.

Abstract: An apparatus for buffering power transients in a supply power for expansion cards inserted into expansion slots on a computer motherboard. The apparatus comprises a printed circuit board, a connector on the printed circuit board, and at least one capacitor on the printed circuit board. The connector is configured to fit into one of the expansion slots on the motherboard, and comprises at least one power pin and at least one ground pin. The at least one capacitor is connected to the power and ground pins of the connector and has sufficient capacitance to buffer power transients within the supply power to the expansion slots.

Abstract: An electronic circuit, preferable as a sensor node, has a highly sensitive radio function and is capable of performing a low-power-consumption operation. The electronic device has a board; a connector for connecting a sensor; a first signal processor circuit receiving an input of sensor data from the sensor through the connector and forming transmission data; and a second signal processor circuit converting a transmission signal from the first signal processor circuit into a high-frequency signal. The connector and the first signal processor circuit are mounted on a first surface of the board, and the second signal processor circuit is mounted on a second surface of the board.

Abstract: A circuit board assembly includes a motherboard defining a motherboard plane, and a daughter board defining a daughter board plane which is substantially parallel to the motherboard plane. The motherboard and the daughter board electrically connect to each other through a set of circuit board connectors. The circuit board assembly further includes a set of edge clips. Each edge clip extends outwardly from the daughter board along the daughter board plane and is configured to operate as a mounting platform through which to physically secure the daughter board to the motherboard.

Abstract: An extendable enclosure for circuit cards provides the capability for a customer to purchase a low cost system up-front, but still allow for growth.

Abstract: A fiber optic module includes a connector connected to a mother board of a host computer, an LD semiconductor IC for converting serial data received from the mother board to an LD electric signal for a laser diode, an LD module for converting the LD electric signal to an LD optical signal, a PD module for converting a photodiode optical signal to a PD electric signal, a PD semiconductor IC for converting the PD electric signal to PD serial data, a circuit board having the connector and carrying LD semiconductor IC and PD semiconductor IC, an LD shielding plate and a PD shielding plate for electrically shielding the LD module and the PD module, respectively, a first frame and a second frame for holding the circuit board, LD module and PD module.

Abstract: A fiber optic module includes a connector connected to a mother board of a host computer, an LD semiconductor IC for converting serial data received from the mother board to an LD electric signal for a laser diode, an LD module for converting the LD electric signal to an LD optical signal, a PD module for converting a photodiode optical signal to a PD electric signal, a PD semiconductor IC for converting the PD electric signal to PD serial data, a circuit board having the connector and carrying LD semiconductor IC and PD semiconductor IC, an LD shielding plate and a PD shielding plate for electrically shielding the LD module and the PD module, respectively a first frame and a second frame for holding the circuit board, LD module and PD module.