Abstract: The present invention relates to a string lamp. The string lamp includes a bulb, a lamp holder, a hollow connecting base and a capacitor embedded in the connecting base in a separable mode. A lower part of the bulb is contained in the lamp holder. At least two lamp pins extend out from wire holes formed in the lower part of the lamp holder. The inner side wall of the connecting base is provided with at least two separately arranged conductive pieces, and the conductive pieces are electrically contacted with the corresponding lamp pins. The capacitor is arranged below the lamp holder, and connecting pins of the capacitor are electrically contacted with the corresponding conductive pieces as well. The string lamp of the present invention is compact in structure, and the capacitor and the lamp holder are convenient to maintain and replace.

Abstract: This invention relates to an optical device, more particularly, to a method for manufacturing an optical device substrate in which an optical device can be arranged in a various manner.

Abstract: There is disclosed a lighting apparatus including t light emitting unit including a light emitting part having a LED, a base part in which the light emitting part is mounted, a plurality of heat pipes fixed to the base part, and a plurality of heat radiation plates comprising a plurality of insertion holes to pass the plurality of the heat pipes there through and a flow hole for flowing external air there through, respectively, wherein a plurality of auxiliary pin arrays comprising a plurality of auxiliary pins inclined a preset angle are provided in each of the heat radiation plates, and a turbulence generation unit for generating turbulence flow when external air is flowing is provided in the auxiliary pin.

Abstract: A backlight module and a liquid crystal display are disclosed. The backlight module includes a back frame and a support. The back frame is arranged on the support and is fixedly connected with the support. A receiving cavity is formed between the back frame and the support for receiving flexible circuit boards and printed circuit boards connecting to the flexible circuit boards. By adding the support at the outer side of the back frame, the receiving cavity is formed between the back frame and the support to receive the doubled flexible circuit boards and printed circuit boards. Not only the resolution of the liquid crystal display is achieved, but also the reliability of the mechanical components of the liquid crystal display is enhanced.

Abstract: A retention structure for retaining a recessed lighting fixture behind a ceiling includes an attachment structure that has a first wall and a second wall. The attachment structure is designed to be attached to a housing of a recessed light fixture. The retention structure further includes a screw attached to the first wall of the attachment structure and to the second wall of the attachment structure. The retention structure also includes a pawl attached to the threaded screw. The pawl is rotatable along with the threaded screw. The pawl is also axially movable along the threaded screw between the first wall of the attachment structure and the second wall of the attachment structure.

Abstract: A light source device has a light-emitting element structure body having a light-emitting element, a base member configured to be fitted in a lamp, and an installation portion disposed on the base member. The light-emitting element structure body is installed on the installation portion. The base member has a heat dissipation chamber communicating with an outside of the device. The heat dissipation chamber is formed inside the installation portion.

Abstract: A light assembly that includes a mounting frame on which a light engine is mounted so as to direct light through the mounting frame opening and out of an opening in the ceiling. The light assembly is designed to permit the light engine to be rotated and tilted, in some embodiments without the need for tools.

Abstract: Disclosed are a light source heat dissipation structure and a backlight module. The light source heat dissipation structure comprises at least one light bar having two lateral faces; and a heat dissipation base, comprising: a frame having an inner space, at last one open and a upper surface, and the open is formed on the frame and connected to the inner space, and the open comprises at least one open edge; and at least one elastic abutting wall having an attached surface; wherein the elastic abutting wall is fixed on the open edge, and the light bar is embedded in the open, and the attached surface is attached to the lateral face of the light bar to enlarge the contact area between the light bar and the heat dissipation base. The heat dissipation efficiency and the usage lifetime of the LED packaged structure can be improved accordingly.

Abstract: An illumination device includes a light emitting module having a module substrate and a semiconductor light emitting element mounted to the module substrate, a base having a mounting surface on which the light emitting module is mounted, and a cover portion configured to cover an edge portion of the module substrate without pressing the edge portion. The module substrate includes a surface which is bonded to the mounting surface of the base through an adhesive layer. The base includes a protrusion provided to protrude upward from the mounting surface without being covered by the module substrate. The cover portion is provided on the protrusion.

Abstract: A light emitting device mounting structural body includes a wiring substrate having wirings disposed on a base member and a light emitting device having a resin molded body mounted on the wiring substrate. The wiring substrate has a recess in its periphery. The resin molded body has a lower surface and a side surface. The lower surface has an arrangement portion and a projecting portion, the arrangement portion has an outer lead electrically connected to the wiring portion disposed beneath the arrangement portion, and the projecting portion is projected further downward relative to the arrangement portion. The side surface has an opening with a light emitting element mounted thereon, the opening is expanded in the projecting portion, and at least a portion of the opening is housed in the recess of the wiring substrate.

Abstract: An illumination device includes a light emitting module having a module substrate and a semiconductor light emitting element mounted to the module substrate, a base including a mounting surface on which the light emitting module is mounted, a circuit unit provided at a side of a rear surface of the base opposite to the mounting surface and configured to drive the light emitting unit; and a circuit case which accommodates and holds the circuit unit in an internal space thereof. The circuit case includes a tubular portion having an opening arranged to face the rear surface of the base and an insulation portion interposed between the rear surface of the base and the circuit unit to cover the opening of the tubular portion. The insulation portion includes a window through which the internal space of the circuit case leads to the rear surface of the base.

Abstract: A vehicle lift system includes a support structure having a top surface for supporting a vehicle supported by the vehicle lift system, and at least one lighting module. The lighting module is mounted to the top surface of the support structure. The lighting module is configured to illuminate a region of the vehicle, for example, but not limited to, the underside of the vehicle. The lighting module can be mounted generally flush relative to the top surface of the support structure. In a vehicle wheel alignment lift system, the lighting module can be disposed adjacent a movable support surface of the wheel runway apparatus to provide illumination during wheel alignment procedures.

Abstract: A beacon light and lens system includes a base, a light emitting diode assembly having at least one light emitting diode secured to the base, a lens including optics configured to capture and direct light from the at least one light emitting diode, a driver board configured to power the at least one light emitting diode, a power source connected to the driver board wherein the lens is mounted on the base. The system generates a 360° horizontal beam pattern and a predetermined vertical beam pattern.

Abstract: The invention relates to an LED light source comprising a light unit and a hollow curved cap covering the light unit. The light unit comprises a plurality of light emitting diodes (LEDs) distributed in the form of a spatial arrangement having a center position. The plurality of LEDs includes at least two different types of LEDs. Each type of LED is arranged for the emission of radiation within a different wavelength range. The cap is substantially transparent for radiation emitted by the light unit. The cap is further provided with an axially symmetric protrusion forming a depression in the exterior of the cap. The symmetry axis of the protrusion substantially coincides with the center position of the spatial arrangement of the plurality of LEDs.

Abstract: An LED light bulb system that has a socket base and a contactor arranged in the socket base. The light bulb system also has a support circuit board secured to the socket base and a plurality of circuit boards connected to the support circuit board in a vertical direction. The light bulb also uses at least one resistor on each of the plurality of circuit boards to operate the LED.

Abstract: An LED light bulb system that has a socket base and a contactor arranged in the socket base. The light bulb system also has a support circuit board secured to the socket base and a plurality of circuit boards connected to the support circuit board in a vertical direction. The light bulb also uses at least one resistor on each of the plurality of circuit boards to operate the LED.

Abstract: The disclosure is to provide a light emitting module that suppress a dark section from forming in an end portion thereof, a tube type light emitting lamp and a luminaire. The light emitting module includes a long substrate that has a connection member provided in an end portion thereof in a longitudinal direction; a first light emitting element that is provided on the substrate to line up in a row with the connection member in a short direction; and a second light emitting element that has a light emitting surface area larger than the first light emitting element, and is provided closer to a center side of the substrate in the longitudinal direction than the first light emitting element.

Abstract: In one aspect, a circuit board includes a base board and a layer of an elastic material comprising a first surface and a second surface. The layer of elastic material is adhered to the base board via the first surface. The circuit board further includes an electrical trace disposed on the second surface of the layer of elastic material. At least a portion of the layer of elastic material stretches or shrinks when the base board expands or contracts. A method of manufacturing a circuit includes obtaining an aluminum board, obtaining a layer of an elastic material, and applying a layer of adhering material to a surface of the aluminum board. The method further includes disposing the layer of the elastic material onto the layer of adhering material, and adhering the layer of the elastic material onto the aluminum board via the layer of adhering material.

Abstract: The light fixture includes a frame, wherein at least a portion of the frame defines a first channel and a second channel, and the frame has a thickness of no more than about 1.0 inches. The light fixture includes a substantially flat light emitting diode (LED) panel disposed within the frame, and power circuitry disposed within the frame. The power circuitry includes a first LED driver sized to be positioned within the first channel, and a second LED driver sized to be positioned within the second channel. The power circuitry is configured to electrically couple the substantially flat LED panel to an external power supply. The first LED driver and the second LED driver are configured to convert an AC input into a DC output suitable for powering the substantially flat LED panel.

Abstract: The LED mounting substrate of the present invention includes a thermally conductive layer (thermally conductive sheet (10)) made of a composition containing boron nitride powder and a fluororesin, and the fluororesin contains polytetrafluoroethylene. The thermally conductive layer has a thermal conductivity of 2 W/(m·K) or more. The thermally conductive layer has a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm.

Abstract: An LED module may include at least one passage opening from a first side of the LED module to a mounting side of the LED module, located opposite the first side. The passage opening is formed in such a way that a screw for fixing the LED module to a mounting element can be inserted into the passage opening from the first side to the mounting side of the LED module, and with a film which, at least in part, is arranged in an adhesive manner on the first side of the LED module. The film has at least one structure which includes at least one piercing of the film in the area of the at least one passage opening of the LED module.

Abstract: An LED module includes: an opaque substrate on which a wiring circuit is provided; a submount bonded to a surface of the opaque substrate with a first bond; an LED chip bonded with a second bond to an opposite side of the submount from the opaque substrate; and wires electrically connecting the LED chip to patterned wiring circuit. In the LED module, the first bond and the second bond each allow light emitted from the LED chip to pass therethrough. The submount is a light-transmissive member. A lighting device includes a device main body and the LED module. The lamp includes the LED module.

Abstract: A ceramics substrate for mounting a light-emitting element includes a ceramic sintered body, the ceramic sintered body having a mounting section on which a light-emitting element is mounted, in a surface portion on a mounting section side of the ceramic sintered body, a ratio of crystal grains having a crystal grain size of 0.2 ?m to 1.0 ?m in equivalent circle diameter being in a range of 45% to 80%, a ratio of crystal gains having a crystal grain size of 2.0 ?m to 6.0 ?m in equivalent circle diameter being in a range of 5% to 15%, and a ratio of crystal grains having a crystal grain size of more than 6.0 ?m in equivalent circle diameter being 2.7% or less.

Abstract: This application discloses a bracket device used for mounting outdoor solar lighting on various types of surfaces, including but not limited to block walls, chain link fences, wooden fences and flat walls or for holding outdoor solar lighting devices as stand-alone fixtures.

Abstract: The present invention provides a lamp head assembly with positioning structures for combining with a lamp base. The lamp head assembly includes a conducting head and a supporting barrel. The conducting head has an insulating seat, a first conducting plate and a second conducting plate and a conduction piece. The conduction piece is electrically connected with the first conducting plate. A portion of the second conducting plate is protruded out of the insulating seat, and an end of the insulating seat is formed with a inserting plate. The supporting barrel includes a supporting section connected and an assembling section; wherein, the supporting barrel is assembled on the conducting head through a positioning of the inserting plate and the slot.

Abstract: A lighting assembly that has a heat. sink with an arcuate channel thereon around a circular member to receive wiring. During manufacturing the wiring is connected a printed circuit board. that engages the heat sink and is disposed through an opening in the heat sink within the arcuate channel. Then, during installation the wiring is wrapped around the circular member within the arcuate channel and held in place with an end cap. The wiring is then connected to wiring within a building allowing during which process stress and stain is transferred from the wiring to the heat sink to prevent damage to the connection point between the wiring and the printed circuit board.

Abstract: The present invention provides an LED bulb and a lamp head structure hereof. The lamp head structure includes an insulating seat, a first conducting plate, a second conducting plate and a conducting piece. The insulating seat has a first accommodating space and a second accommodating space separately arranged and an opening slot communicating with the second accommodating space. The first conducting plate is accommodated in the first accommodating space. One end of the conducting piece inserted in the first conducting plate is electrically conducted with each other, and the other end is protruded out of the insulating seat. The insulating seats could be provided for different types of LED bulb. Thus the development time will be shortened, and the production cost will be reduced.

Abstract: An optoelectronic lighting device includes a lighting module with an optoelectronic semiconductor chip. A connection carrier has a first main surface and a second main surface facing away from the first main surface. The lighting module is arranged on the first main surface of the connection carrier, and the connection carrier adheres to a heat sink on account of a magnetic attraction.

Abstract: Provided is an insulated radiating rubber molded article that can be pre-installed in an electrical apparatus such as an LED package, can improve handling properties during attachment work, and moreover can exert superior insulating characteristics and radiating characteristics. To achieve the objective, the insulated radiating rubber molded article, which, by means of being interposed between a base and the electrical apparatus when attaching the electrical apparatus, which emits heat alongside the operation thereof, to the base, promotes radiating from the electrical apparatus and electrically insulates the electrical apparatus from the base, is characterized by having a 3D shape by means of being integrally provided with: a flat surface section disposed between the electrical apparatus and the base; and a lateral surface section disposed around the electrical apparatus.

Abstract: The invention describes a lighting unit (1), comprising a plurality of lighting modules (10) and a number of connecting elements (2) with coupling means (21, 22), wherein each lighting element (10) comprises at least one planar light-emitting element (11) in an enclosure (12) and a number of counter-coupling means (J1, J2) arranged along at least one edge of the enclosure (12); and wherein neighboring lighting modules (10) are coupled together detachably by means of at least one connecting element (2) such that the light-emitting element (11) of a first lighting module (10) is electrically connected to the light-emitting element (11) of a second lighting module (10) by an interaction of at least part of the coupling means (21, 22) of the connecting element (2) and at least part of the counter-coupling means (J1, J2) of the corresponding lighting modules (10). The invention also describes a connecting element (2) and a lighting module (10) for assembling such a lighting unit (1).

Abstract: A lamp includes a collar with internal and outer surfaces, where two or more connection pins extend from the internal surface of the collar. At least two connection pins have a head portion distal from the collar internal surface. The head portions include a slot. The lamp includes a light source with at least two external lead-in wires. The lead-in wires are located within respective slots and are mechanically coupled to respective surfaces of the slots in a press-fit manner which may be free of wrapping, winding, twisting, or soldering. A PCB disposed inside the lamp has two opposing surfaces and a rim between the two opposing surfaces. There are conductive surfaces disposed on at least one of the rim and one of the opposing surfaces at positions corresponding to connection pin slots. The PCB is located between connection pins with the conductive surfaces in electrical communication with the lead-in wires.

Abstract: A lighting device includes: a circuit board placed on a base; and a transformer provided in the circuit board. The transformer includes: a winding pattern formed on the circuit board; and a core having an outer leg portion. The circuit board has an outer leg insertion portion through which the outer leg portion of the core is inserted, and the circuit board and the base have therebetween a gap which is air space. The base and at least a lateral face of the outer leg portion are bonded together by a first resin that is insertable from the outer leg insertion portion.

Abstract: Disclosed is a substrate for mounting light emitting element with a high positional accuracy and a method of fixing the substrate. A substrate for mounting light emitting element defines a first recess and a second recess in first side in a plan view. The first recess is defined by two corner portions and a straight portion which connects the two corner portions, and the second recess further includes at least two straight portions each narrowing toward the inner end portion.

Abstract: A light source module includes a circuit board, board pads disposed on the circuit board, and a light emitting diode chip disposed on the board pads. The light emitting diode chip includes a substrate and a semiconductor stacking part disposed between the substrate and the circuit board, and the substrate includes an inclined part disposed at an upper portion thereof and a discharging part disposed at one side surface thereof.

Abstract: A lighting device installation method includes the following steps. Firstly, a holder including a first stopping structure and a first engaging structure is fixed on an installation surface. Then, a lighting device including a second stopping structure and a third stopping structure is provided. The second stopping structure and the third stopping structure are collaboratively defined as a second engaging structure. Then, the second engaging structure of the lighting device is stopped by the first stopping structure of the holder, so that the lighting device is supported by the lower portion of the holder. Then, electrical connection between the lighting device and a power source is established. Afterwards, the second engaging structure of the lighting device is engaged with the first engaging structure of the holder, so that the lighting device is supported by the upper portion of the holder.

Abstract: The present invention relates to a contact element (3, 3?, 3?), a base (2, 2?, 2?, 2??), a clamping element (4, 4?, 4?), an arrangement (1, 1?, 1?, 1??, 1??, 1???) and a mounting section (301, 301?, 301?) for electrically contacting a light-emitting diode (LED) (100, 100?). In order to conveniently and cost-effectively hold and electrically contact the LED (100, 100?), the present invention provides that the contact element (3, 3?) comprises a mounting section (301, 301?) adapted for mounting the contact element (3, 3?) to the base (2, 2?) in a manner that the contact element (3, 3?) is pivotable about a pivot axis (P) extending through the mounting section (301, 301?), and comprises a contact arm (302, 302?) protruding laterally from the mounting section (301, 301?) and having on a distal end a contact point (303) facing essentially in a contact direction (K) for contacting the LED (100), wherein the contact direction is running essentially in parallel to the pivot axis (P).

Abstract: A light emitting module including a complex circuit board, a light emitting element and an electronic element is provided. The complex circuit board has a light emitting element predetermined area, an electronic element predetermined area and an interval area formed between the light emitting element predetermined area and the electronic element predetermined area. The complex circuit board located at the light emitting element predetermined area and the electronic element predetermined area includes a flexible circuit board, a first rigid substrate and a second rigid substrate. The flexible circuit board has an upper surface and a lower surface. The first rigid substrate is disposed on the upper surface. The second rigid substrate is disposed on the lower surface. The flexible circuit board of the complex circuit board located at the interval area is exposed and not covered by the first rigid substrate or the second rigid substrate.

Abstract: A tape package includes a body portion including a flexible material, a driving circuit disposed on the body portion, a first sub-connection portion extending from the body portion in a first direction, a first main-connection portion extending from the first sub-connection portion in the first direction, a first lead line including a first end electrically connected to the driving circuit and a second end extending in the first direction, the first end being opposite to the second end and a protrusion extending from the first sub-connection portion in a third direction perpendicular to the first direction on a same plane with the first sub-connection portion. Accordingly, a crack of the lead line may be reduced or effectively prevented.

Abstract: Included are a plurality of cylindrical holders having holes into which laser modules are fitted and fixed, respectively; a plate-like base that has a first surface, a second surface opposite to the first surface, and a plurality of through holes through which the laser beams from the plurality of laser modules fixed to the holder pass, the holders abutting against the first surface so as to connect the holes thereof to the through holes of the base, the second surface of the base being arranged with a plurality of lenses corresponding to the through holes; and adhesives applied to outer corners of abutment portions, at which the base and the LD holders abut against each other, for fixing the base and the LD holders to each other.

Abstract: Disclosed is a Z-shaped lamp panel applied in a lamp and configured as a comb-shaped body. The Z-shaped lamp panel includes an installing portion disposed at a position corresponding to a comb-handle position and a plurality of carrying portions corresponding to comb-tooth positions respectively. The installing portion is coupled to a side of the carrying portions, and the carrying portions are arranged with an interval apart from each other and provided for installing a plurality of light emitting diodes. Therefore, the cost of the lamp panel can be reduced while the lamp can maintain the light emitting diodes in a matrix form to ensure a maximum illumination range.

Abstract: In implementations, a glass-based multichip package includes a photodefinable glass-based substrate, at least one electronic component disposed on the photodefinable glass-based substrate, and a portion of the photodefinable glass-based substrate that has been exposed to ultraviolet light, where the portion of the photodefinable glass-based substrate includes ceramic. Additionally, the sensor package may include additional electronic components, a glass touch panel, and/or a printed circuit board. In implementations, fabricating the sensor package device includes receiving a photodefinable glass-based substrate, etching the photodefinable glass-based substrate, and forming a ceramic portion of the photodefinable glass-based substrate.

Abstract: A light emitting diode (LED) lamp includes a hollow connector, an LED module mounted on the connector, and a fin unit received in the connector. The connector has an inlet and an outlet couple to the inlet. Heat generated from the LED module is transferred to the connector to dissipate. The fan unit includes a first fan and a second fan rotating along contrary directions.

Abstract: An attachment adapted to fix a semiconductor light source unit to a support member is provided. The attachment includes a frame having an opening periphery portion defining an opening to allow light emitted from the semiconductor light source unit to pass through the opening, and first and second conductive terminal pieces extending from the opening periphery portion. The first conductive terminal piece extends in one direction to contact a first power receiving portion of the semiconductor light source unit. The second conductive terminal piece extends in the same direction to contact a second power receiving portion of the semiconductor light source unit.

Abstract: A light-emitting device comprising a lamp casing, a heat dissipation element and a light-emitting module is provided. A first opening and a second opening are formed on an upper end and a lower end of the lamp casing respectively. An edge of the lamp casing adjacent to the first opening is bended inward to form a bending portion. The heat dissipation element has several carrying portions separated from each other and arranged in radial-shape, and several fins perpendicular to the carrying portions. Each fin is bended downward and vertically from an edge of the carrying portions and extended toward the second opening. The light-emitting module comprises a substrate and several light-emitting elements. An edge of the substrate leans against the bending portion, such that the light-emitting module is sandwiched between the carrying portions and the e bending portion.

Abstract: A lampholder includes a housing and a plurality of electrical terminals. The lampholder is adapted to hold a light-emitting diode (LED) tube light assembly supported at two ends of the tube light. The lampholder includes at least one terminal that electrically couples before the remaining terminals located in the same housing to ensure a first-connect, last-disconnect electrical connection when inserting the LED tube light into and removing the LED tube light from the lampholder.

Abstract: A light emitting diode bulb includes a cover, a lighting module, a driving circuit module, a holder, and a conductive connector. The lighting module is arranged at one side of the cover and includes a plurality of light emitting diodes. The driving circuit module is arranged at the other side of the cover. The holder is assembled with the cover such that the lighting module is arranged between the holder and the cover. The conductive connector is assembled with the holder and opposite to the cover.

Abstract: According to one embodiment, a semiconductor device includes a board, a controller chip, a semiconductor chip, a sealing portion, and a component. The board includes a first surface and a second surface opposite to the first surface, the first surface comprising a terminal. The controller chip is on the second surface of the board. The semiconductor chip is on the second surface of the board. The sealing portion integrally covers the controller chip and the semiconductor chip and does not cover a region of the second surface of the board. The component is on the region of the second surface of the board to perform an operation with respect to the outside of the semiconductor device.

Abstract: An attachment structure of a lighting device has: a holder provided on a top surface of a door pocket that constitutes a door lining, the lighting device being placed in the holder; walls for fixing the lighting device placed in the holder; a light source supporting part; and a connector supporting part. In this case, the attachment structure and the top surface of the door pocket are configured integrally.

Abstract: An edge mounted LED light includes an LED chip having an LED chip first terminal and an LED chip second terminal. A layer assembly has conduction layers, namely a first conduction layer and a second conduction layer that sandwich an insulation layer between them. The first conduction layer and the second conduction layer are made of metal having thermal conductivity and electrical conductivity. An edge of the layer assembly includes a first conduction layer mounting surface formed on the first conduction layer, and a second conduction layer mounting surface formed on the second conduction layer. The insulation layer is located between the first conduction layer mounting surface and the second conduction layer mounting surface. An LED chip first terminal is formed on the LED chip, and an LED chip second terminal is formed on the LED chip.

Abstract: A readout and signal transduction (ROST) component includes a universal fixture adapted to receive and align one or more optical elements and one or more opto-mechanical elements, wherein the optical elements and one or more opto-mechanical elements are stacked in the universal fixture, one or more optical elements configured for integration into the universal fixture; and one or more opto-mechanical elements configured for integration into the universal fixture.