Abstract: The present invention relates to a substrate for an optical device, which is configured to connect an optical element substrate and an electrode substrate in a fitting manner, and simultaneously, to form one or more bridge pads which are insulated from the optical element substrate by a horizontal insulating layer, on the optical element substrate.

Abstract: Structures for LED light bulbs comprise a driver board and a lighting structure having one or more LEDs disposed thereon. The driver board, in a Y shape, can be the circuit board and has a positive terminal and a negative terminal for receiving electrical power. The Y-shaped driver board having two prongs connects to the light structure to power the LEDs thereon. The lighting structure can be in the form of a grid having the LEDs disposed thereon.

Abstract: A lighting device pertaining to one aspect of the present invention includes a mount, a light-emitting module, and a substrate holder. The light-emitting module is mounted on a main surface of the mount, and the substrate holder covers a portion of the light-emitting module and is connected with the mount. The light-emitting module includes a substrate, a plurality of light-emitting elements, a sealant and a padding. The padding is provided on a first main surface of the substrate. The light-emitting module is mounted on the main surface of the mount such that a second main surface of the substrate comes into contact with the main surface of the mount, and the light-emitting module is fixed to the mount by pressure applied from the substrate holder via the padding brought into contact with the substrate holder. The padding is made of a same material as the sealant.

Abstract: The present disclosure relates to a lighting apparatus that includes a light engine that is coupled to a heat sink. The light engine provides a light source that generates light, and heat that is generated by the light source is dissipated, at least in part, via the heat sink.

Abstract: An LED light bar includes a plurality of LEDs and a circuit board supporting the LEDs. Solder points are formed on a bottom surface of the LEDs. An anti-solder layer is coated on the circuit board so as to create a plurality of discrete anti-solder pads. A first tenon which is formed on each of the LEDs locates in a void in a corresponding one of the anti-solder pads so as to position the LEDs precisely on the circuit board and maintain their positions.

Abstract: This disclosure relates generally to an electronic package that can include a die and a dielectric layer at least partially enveloping the die. Electrical interconnects can be electrically coupled to the die and passing, at least in part, through the dielectric layer. An optical emitter can be electrically coupled to the die with a first one of the electrical interconnects and configured to emit light from a first major surface of the electronic package. A solder bump can be electrically coupled to the die with a second one of the electrical interconnects and positioned on a second major surface of the electronic package different from the first major surface.

Abstract: A display apparatus includes a lower skin, a honeycomb core coupled to an inner upper surface of the lower skin by honeycomb patterns, an upper skin coupled to an upper surface of the honeycomb core, a fixing member coupled to the upper skin and the lower skin while extending through the upper skin and the lower skin, to fix a circuit including a light emitting diode to one end of the fixing member, and a filler interposed between the upper skin and the lower skin, to increase coupling force among the upper skin, the lower skin and the fixing member.

Abstract: The present invention provides the cooling apparatus assembly of the LED lighting device, consisting of a LED lighting apparatus mounting plate (300), heat pipes (400) that are secured at the opposite surface to the surface where the lighting apparatus is fixed, and heat radiation pins (500) that are mechanically pressed and fixed to the heat pipes. On the mounting plate (300) of said LED lighting apparatus, at least one fixing hole (320) is provided and the heat pipes (400) are fixed rearward by the binding bolt (310), perpendicular to the mounting plate. And the one end of the heat pipes (400) is comprised of a adherence pipe (441) and an inner pipe (442), where the adherence pipe(441), having circumferential uneven or rugged portion(451) at the outer surface, is positioned at the inner side of the heat pipes, and where the inner pipe (442), having a nut screw (410) to receive the binding bolt (310), is inserted into the adherence pipe (441) with pressing force.

Abstract: To provide a glass ceramic composition with which a substrate for a light emitting element having a high reflectance and a high thermal conductivity can be obtained, and which can suppress breakage at the time of production of the substrate for a light emitting element. A glass ceramic composition to be used for production of a substrate on which a light emitting element is to be mounted, which comprises from 30 to 45 mass % of a glass powder, from 35 to 50 mass % of an alumina powder and from 10 to 30 mass % of a zirconia powder, to the total amount of the glass powder, the alumina powder and the zirconia powder, wherein the average particle size of the zirconia powder is at most ¼ of the average particle size of the alumina powder.

Abstract: A light head, light device, assembling method of light head and light device are provided. The light device includes a light head and a third unit. The light head includes a first unit, a second unit, a cable, a fixing sheet, a first pin, a conducting sheet, and multiple second pins. The first unit has a side surface, a bottom surface, a pair of slots, and a protrusion portion. The slots are on the bottom surface. The second unit encircling the first unit exposes the protrusion portion. The fixing sheet electrically connected to a first conducting terminal of the cable is inserted into the slots. The first pin inserts into the protrusion portion to make the cable contact the first pin and the protrusion portion. The conducting sheet is under the second unit. The second pins make the conducting sheet, the first and second units assembled together.

Abstract: An embodiment of the invention provides a low inductance light source module, which may have a small footprint and comprise a printed circuit board (PCB) mount having first and second conducting traces formed on a side of the PCB mount and a semiconducting light source having a first electrical contacts for receiving power that is bonded to the first conducting trace with a conducting bonding material and a second electrical contact for receiving power that is connected by at least one bondwire to the second conducting trace.

Abstract: A light source assembly for a vehicle includes a frame having at least one device region; a heat radiator disposed above the at least one device region and spaced apart from the frame by a predetermined interval; a light source including at least one light emitting device disposed above the heat radiator in a position corresponding to the at least one device region; and an auxiliary heat radiator provided to the heat radiator by penetrating through the frame, thereby easily increasing and decreasing an amount of heat radiated by the heat radiator corresponding to an amount of heat generated by the light source.

Abstract: The invention describes an adapter part (2, 9) for a modular lighting assembly (1) comprising a number of light-emitting diodes (4) mounted on a separate base part (3), which adapter part (2, 9) comprises a number of first electrical connectors (21) arranged to connect the light-emitting diodes (4) to an external power supply; at least one electrical component (5) arranged in a body of the adapter part (2, 9); and a number of second electrical connectors (22) arranged to connect external circuitry to an electrical component (5) arranged in the body of the adapter part (2, 9). The invention further describes a modular lighting assembly (1) comprising a base part (3) upon which a number of light-emitting diodes (4) is mounted; and an adapter part (2, 9) according to the invention.

Abstract: The invention relates to a modular LED light fixture, which comprises an LED component, an LED drive circuit component, a radiator and a connecting pedestal, wherein the LED component is arranged at the upper end of the inside of the radiator; the LED drive circuit component is arranged at the lower end of the inside of the radiator; the LED component is connected with the LED drive circuit component through leads; the LED drive circuit component is connected with terminals of the connecting pedestal through leads; and the connecting pedestal is fixedly connected with the radiator.

Abstract: An assembling structure includes a base, an assembling body and a fastening element. The base has a ring groove. The assembling body includes at least two first fastening portions. The fastening element is disposed inside the ring groove and can be rotatably installed on the base. The fastening element includes at least two second fastening portions. The fastening element can rotate relative to the base and has a fastening position and a releasing position. When the fastening element is at the fastening position, the two first fastening portions are fastened with the two second fastening portions respectively. When the fastening element is at the releasing position, the two first fastening portions are detached from the two second fastening portions respectively.

Abstract: To provide a glass ceramic body, whereby light which transmits through the substrate and leaks (i.e. emits) out of the incident direction is reduced, and the number of voids at the surface of the substrate and in the inside of the substrate is low, A glass ceramic body 10 comprising a glass matrix 11 and flat fillers 12 dispersed therein, wherein the flat fillers 12 are dispersed in the glass matrix 11 so that their individual thickness directions would be substantially in the same direction; and in a cross-section along the thickness direction of the flat filler 12 in the glass matrix 11, the occupation area of the flat fillers 12 having a length in their flat direction of from 0.5 to 20 ?m and a length in their thickness direction of from 0.02 to 0.25 ?m per unit area of the cross-section is from 30 to 48%.

Abstract: Provided is a light emitting semiconductor device comprising a flexible dielectric layer, a conductive layer on at least one side of the dielectric layer, at least one cavity or via in the dielectric substrate, and a light emitting semiconductor supported by the cavity or via. Also provided is a support article comprising a flexible dielectric layer, a conductive layer on at least one side and at least one cavity or via in the dielectric substrate. Further provided is a flexible light emitting semiconductor device system comprising the above-described light emitting semiconductor device attached to the above-described support article.

Abstract: Implementations of the present invention comprise lighting fixture assemblies that minimize the visibility of hardware and shadows. In particular, the lighting fixture assemblies may include no supporting hardware extending through an internal space defined, in whole or in part, by the lighting fixture assembly. In addition, the lighting fixture assemblies may include a gap between a bottom/top panel and a side panel of the lighting fixture assembly. Accordingly, lighting fixture assemblies of one or more implementations of the present invention can reduce or eliminate the visibility of internal supporting hardware and shadows on the exterior surfaces of the lighting fixture assemblies.

Abstract: In various embodiments, a lighting device is provided. The lighting device may include at least one first part and at least one second part, fastened to the first part, which first and second parts are interconnected by a potting compound, the parts being positively interconnected by the potting compound.

Abstract: A LED lamp includes a lamp base unit including an insulative base, a mating connection device configured like the base of a conventional incandescent bulb and located at the bottom side of the insulative base, an insulative hollow column located at the top side of the insulative, a heat sink including a plurality of radiation fins radially arranged around the insulative hollow column, a light-emitting module including a heat transfer plate fastened to the heat sink at the top, a circuit board supported on the heat transfer plate and light-emitting devices installed in the circuit board, and a light transmissive lampshade fastened to the heat sink and covered over the light-emitting module.

Abstract: Provided is a printed circuit board including: a support substrate including a first area in which a light emitting device is mounted, and a second area extending from the first area; a bending part which is configured such that a part between the first area and the second area is bent; a through hole passing through the bending part; a connection wiring connected to the light emitting device and disposed on the bending part; and a wiring connected to the connection wiring.

Abstract: The present invention relates to an electrical circuit arrangement, in particular an electrical signal circuit arrangement and preferably a signal lamp which is used in hazardous areas. The circuit arrangement is equipped with at least one electrical component (1) which is arranged on a printed circuit board (2) produced from a heat-conducting material. The electrical component (1) is, in particular, a luminous means (1). A cooling device (6, 7) which is in thermal contact with the printed circuit board (2) is also realized. According to the invention, the cooling device (6, 7) is in at least two parts, with a heat sink (7) and at least one heat pipe (6). In this case, the heat pipe (6) thermally connects the printed circuit board (2) to the heat sink (7).

Abstract: A lighting assembly (10) comprising: a casing (24) having a bowl-like structure with a bottom wall (24a) defining a window opening (26), and joined to said casing (24), a stack of elements comprising: a light radiation source (12, 14) situated opposite said opening (26) so as to direct said light radiation towards the outside of the casing (24); and a driving circuit board (16) for said radiation source (12, 14)

Abstract: Provided are a light emitting apparatus and a light unit having the same. The light emitting apparatus includes a light emitting device includes a light emitting element and a plurality of external leads, and a plurality of electrode pads under the light emitting device.

Abstract: A downlight support to enable installation of a downlight luminaire within a fixture is provided. The support includes has a tubular band. The tubular band has a first section, having a first diameter, and a second section, having a second diameter. The first diameter and the second diameter are arrayed about a longitudinal axis. A plurality of leaf springs is positioned on the second diameter. Each leaf spring in the plurality of leaf springs extends parallel to the longitudinal axis. A plurality of pairs of tension spring receptors is arrayed about the first diameter. Each pair of tension spring receptors extends inwardly toward the longitudinal axis.

Abstract: An illuminated interface cable with a connector interface on at least one end. A light circuit including a light and a mechanical switch, the light circuit configured to energize the light upon actuation of the mechanical switch. The light and momentary switch coupled to the connector interface, the light oriented to illuminate an interconnection area of the connector interface. The light may be provided, for example, as a light emitting diode.

Abstract: The invention relates to a lighting unit, in particular for a household appliance, for example for the drum of a washing machine, a tumble dryer or the like, comprising a printed circuit board, comprising a light-emitting means arranged on the printed circuit board, and comprising a base for receiving the printed circuit board. The printed circuit board is arranged on a metallic holding part in such a way that good thermally conductive contact is provided between the printed circuit board and the holding part. Furthermore, the holding part is fastened on the base in such a way that, in turn, good heat transfer is provided from the holding part to the base.

Abstract: A method for manufacturing an organic electroluminescent display device (OLED), wherein an arrangement of layers is applied to a substrate such that first conductors extend in a first direction as well as in a second direction, while between intersections of the conductors an organic electroluminescent connection has been provided which, under the influence of an electric tension, emits light. The substrate is manufactured from plastic and is provided with a surface structure which forms a boundary for at least a number of the layers to be applied. Also provided is a substrate intended for use in a method for manufacturing an organic electroluminescent display device, wherein the substrate has been manufactured from plastic and is provided with a surface structure which forms a boundary for at least a number of the layers to be applied. Further provided is an organic electroluminescent display device obtained with the method.

Abstract: A lamp is disclosed. The lamp includes an illuminant and a lamp holder. The lamp holder includes a driving circuit board and a base body. The driving circuit board is connected to the illuminant. The driving circuit board includes a conductive part and a conductive fastening part. The base body includes a conductive case and a conductive contacting part. The conductive part connects the conductive case. The conductive contacting part is used for connecting the conductive fastening part.

Abstract: A lighting assembly includes: a heat sink having a mounting surface for a light source; a light source board having said light source thereon, said light source board being arranged against said mounting surface and having an outer perimeter edge, and a drive board carrying drive circuitry for said light source, said drive board being fixed onto said heat sink with said light source board sandwiched therebetween, said drive board having an aperture with an inner edge complementary to said outer edge of said light source board, whereby said light source is left uncovered by said drive board, and wherein: said inner edge of said drive board has an inwardly protruding frame formation with said outer perimeter edge of said light source board abutting against said frame formation, and said light source board has a thickness whereby said drive board and said mounting surface have a clearance therebetween.

Abstract: A supporting body for mounting a light emitting element having excellent heat dissipation performance to suppress damage to the base or decrease of air tightness caused by heat even in cases where a high-power light emitting element is mounted thereon. The supporting body for mounting a light emitting element is obtained by integrally molding an insulating base that has a mounting part on which a light emitting element is mounted and a lead frame for packaging a light emitting element that is mounted on the insulating base. The supporting body for mounting a light emitting element is characterized in that the insulating base is composed of a sintered body of a glass ceramic composition that contains a low melting point glass powder and a ceramic filler and the low melting point glass powder has a softening point of not more than 630° C.

Abstract: This backlight device 12 of the present invention includes: a cold cathode fluorescent tube; a chassis 14 that houses at least the cold cathode fluorescent tube on a front surface 14a1 side of a bottom plate 14a of the chassis; and a circuit substrate 32 having a front surface 32a on which electronic components 38a and 38b are disposed, the front surface 32a facing a rear surface 14a2 of the bottom plate 14a of the chassis 14. The heat generated from the electronic components 38a and 38b circulates towards the chassis 14 with ease, and therefore the heat generated from the electronic components 38a and 38b on the circuit substrate 32 can be effectively dissipated by the bottom plate 14a of the chassis 14.

Abstract: A substrate having a plurality of light-emitting elements mounted thereon is described. The substrate may be mounted in a lighting apparatus and may include a surface on which the plurality of light-emitting elements are mounted and one or more holes through which heat may be conducted from the first surface to another surface of the substrate. For example, a heat conductive and electrically non-conductive material may cover a surface of the one or more holes. According to some arrangements, the surface of the substrate may include an electrically non-conductive layer and an electrically conductive layer such that the electrically non-conductive layer is electrically isolated or separated from the electrically conductive layer.

Abstract: A substrate having a plurality of light-emitting elements mounted thereon is described. The substrate may be mounted in a lighting apparatus and may include a surface on which the plurality of light-emitting elements are mounted and one or more holes through which heat may be conducted from the first surface to another surface of the substrate. For example, a heat conductive and electrically non-conducting material may cover a surface of the one or more holes. According to some arrangements, the surface of the substrate may include an electrically non-conducting layer and an electrically conductive layer such that the electrically non-conducting layer is electrically isolated or separated from the electrically conductive layer.

Abstract: Disclosed is a luminaire mounting interface including an interface body configured for association with a luminaire, and an interface surface of the interface body, the interface surface including at least two association points separated by 20 mm to 83 mm.

Abstract: The present invention provides a Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) LED package having excellent heat dissipation and protection to the LED, thus extending the lifespan of the LED. Each of the SHDMIP LED package comprises a dual lead frame assembly comprising bottom and top lead frame, protection and driver circuit electrically connected to the top or bottom lead frame and a LED electrically connected to the top lead frame. The bottom lead frame comprises heat sink pad for heat dissipation purpose. Plurality of SHDMIP LED packages of the present invention can be configured in a matrix or row, forming a SHDMIP LED array for various lighting solutions.

Abstract: A substrate having a plurality of light-emitting elements mounted thereon is described. The substrate may be mounted in a lighting apparatus and may include a surface on which the plurality of light-emitting elements are mounted and one or more holes through which heat may be conducted from the first surface to another surface of the substrate. For example, a heat conductive and electrically non-conductive material may cover a surface of the one or more holes. According to some arrangements, the surface of the substrate may include an electrically non-conductive layer and an electrically conductive layer such that the electrically non-conductive layer is electrically isolated or separated from the electrically conductive layer.

Abstract: A cover of a backlight module for protecting backlight components is disclosed. The cover includes: a main body; and bent clasping sheets arranged on at least one edge portion of the main body, the clasping sheet is fixed in a groove cavity between a backplane and a front frame so as to fix the cover on the backplane. In addition, a backlight module and a liquid crystal display are disclosed. The above-mentioned cover, the backlight module, and the liquid crystal display may simplify the assembly process of the backlight module, and may reduce the cost at the same time.

Abstract: Provided herein is an improved apparatus, method and system for providing a modular LED circuit assembly. Specifically, examples of the present invention include a modular LED circuit which may be scaled and used in a wide variety of form factors. One example of the present invention may provide an apparatus for supporting a light-emitting diode which includes an LED circuit board including a first major surface and a second major surface. The first major surface may include a first contact pad and a second contact pad, where each of the first contact pad and the second contact pad are configured to receive a respective connector from the LED. The second major surface of the LED circuit board may include a first area, a second area, and a third area, where a substrate is attached to the LED circuit board across the third area.

Abstract: Techniques and architecture are disclosed for providing a modular lighting system/luminaire having an integrated heat sink assembly. In some cases, the system/luminaire may comprise a plurality of individual modular light sources which have been operatively coupled with one another. In some instances, a modular light source may include one or more light engines (e.g., light emitting diodes or LEDs) which have been operatively coupled with an individual heat sink module. When assembled, the plurality of heat sink modules may define, in the aggregate, a plurality of heat conduits which dissipate thermal energy from the light engines by convective heat transfer. Also, in some cases, the heat sink modules may be electrically isolated from one another, allowing for the heat sink assembly itself, in part or in whole, to function as part of the desired circuit.

Abstract: A display device and method of assembling the same are disclosed. In one aspect, a display device includes a display panel bent in a first direction and a guide unit for fastening the display panel in a bent state. The guide unit includes a first frame member bent corresponding to curvature of the display panel in the first direction and combined with an edge of the display panel in the first direction, and a second frame member combined with an edge of the display panel in a direction perpendicular to the first direction.

Abstract: In one embodiment, the display device includes a display panel and a support frame. The display panel includes a flexible upper substrate, at least one light emitting diode, and a flexible lower substrate (30). The display panel has a display area formed at a portion corresponding to the light emitting diode, and a non-display area formed at a portion other than the display area. The display panel is coupled to the support frame such that a portion of the non-display area is bent with respect to the display area.

Abstract: Disclosed is a portable computer carrying and securement device, comprising an elastic covering adapted to surround the outer structure of a closed laptop computer or tablet, wherein the covering includes an internal cable attaching to a rotating spool for tightening the cable and covering around the laptop for security purposes. Attached to the upper portion of the covering is a ratcheting and carrying handle, which attaches to the spool for winding the cable therearound and for applying compression onto the outer portion of the computer to prevent tampering or unauthorized access. The handle is further capable of releasing the spool and thus the tension on the cable via a directed outward release motion. This motion is prevented by a locking mechanism and combination privy to only authorized users. The device further incorporates accessories that facilitate recharging of the laptop, locking the assembly to an external structure and an outward-facing display.

Abstract: The present invention relates to a combination type illumination apparatus that includes a lamp body, a lamp cap module and a LED light emitting module. The LED light emitting module is disposed on the lamp body. The lamp body has an accommodation hole and a center sleeve stored in the accommodation hole. The center sleeve includes a first joggle structure. The lamp cap module includes a second joggle structure. The second joggle structure of the lamp cap module is assembled to the first joggle structure of the center sleeve. With such structure configuration, manufacturers may assemble the combination type illumination apparatus in a joggling way instead of in a screwing or gluing method.

Abstract: A light fixture including a mounting assembly for securing the light fixture to a static structure. The mounting assembly includes a gripper attachable to the static structure and a bar having a gripping region and a first end secured with respect to a main body portion of the light fixture. The mounting assembly may be adjustable such that the light fixture is held in a selected one of a plurality of possible orientations. In such embodiments, the gripper and the bar are configured for a finite number of the orientations such that the light fixture is held in a selected one of a plurality of orientations.

Abstract: A device (230, 1330, 1430) includes: a first electrode (232); an electro-statically movable second electrode (234, 1734, 1834); and an electrically insulating layer (233) disposed between the first and second electrodes. The electro-statically movable second electrode is configured to have a first geometric configuration in response to a first electrical potential between the first and second electrodes, and is further configured to have a second geometric configuration in response to a second electrical potential between the first and second electrodes. The device is configured to receive a time-varying voltage and in response thereto the electrostatically movable second electrode is configured to repeatedly transition between the first geometric configuration and the second geometric configuration to influence a flow of a fluid (235) for cooling at least one heat-generating element (310).

Abstract: A proximity touch sensor device having an inner housing defining a cavity, an integrated circuit positioned within the cavity of the inner housing, the integrated circuit having an input port and an output port that outputs an output signal, and a USB connector protruding from the inner housing. The proximity touch sensor device also includes a light emitting diode integrated into the inner housing, positioned above the USB connector and electrically coupled to the output port of the integrated circuit, a sensing device positioned around the inner housing and electrically coupled to the input port of the integrated circuit, and an outer housing completely covering the inner housing and the sensing device such that contact with the outer housing causes the sensing device to send a signal to the input port of the integrated circuit to activate the light emitting diode.

Abstract: The present disclosure provides a method including providing a light-emitting diode (LED) device (e.g., a LED element and PCB) and a heat sink. The LED device is bonded to the heat sink by applying an ultrasonic energy. In an embodiment, the bonding may form a bond comprising copper and aluminum. The PCB may be a metal core PCB (MC-PCB).

Abstract: A light module is disclosed. The light module includes a first printed circuit board, a second printed circuit board, a light source, and a fixing casing, wherein the first printed circuit board and the second printed circuit board each has a fixing part, and the fixing part of the second printed board is attached to the fixing part of the first printed board. The light source is disposed on the first printed circuit board to couple to the first printed board and the second printed board. The fixing casing has a contact surface. When the fixing casing is fixed onto the fixing parts of the second printed circuit board and the first printed circuit board, the contact surface contacts the fixing part so that the second printed circuit board is clamped between the contact surface and the first printed circuit board.

Abstract: Provided is an LED lighting apparatus. The LED lighting apparatus include an LED, a socket part supplying a power into the LED, a heat sink body having one side on which the LED is mounted and the other side to which the socket part is coupled, and a heat sink pin disposed along a circumference of the heat sink body, the heat sink pin having one side extending downward from the heat sink body. The heat sink body may be modified in shape to reduce a weight and improve heat dissipation performance.