Abstract: A high speed voltage mode sensing is provided for a digital multibit non-volatile memory integrated system. An embodiment has a local source follower stage followed by a high speed common source stage. Another embodiment has a local source follower stage followed by a high speed source follower stage. Another embodiment has a common source stage followed by a source follower. An auto zeroing scheme is used. A capacitor sensing scheme is used. Multilevel parallel operation is described.

Abstract: A data transmission circuit includes a read data transmission unit configured to, when a read signal is asserted, detect and amplify a voltage level of a first data line, transmit an amplified voltage level to a second data line, and substantially prevent a voltage level of the second data line from being amplified to be substantially equal to or more than a preset voltage level, and a write data transmission unit configured to transmit the voltage level of the second data line to the first data line when a write signal is asserted.

Abstract: A memory column redundancy mechanism includes a memory having a number of data output ports each configured to output one data bit of a data element. The memory also includes a number of memory columns each connected to a corresponding respective data port. Each memory column includes a plurality of bit cells that are coupled to a corresponding sense amplifier that may differentially output a respective data bit from the plurality of bit cells on an output signal and a complemented output signal. The memory further includes an output selection unit that may select as the output data bit for a given data output port, one of the output signal of the sense amplifier associated with the given data output port or the complemented output signal of the sense amplifier associated with an adjacent data output port dependent upon a respective shift signal for each memory column.

Abstract: A bitline precharge voltage generator comprises a leakage trimming unit and a bitline precharge voltage providing unit. The leakage trimming unit applies a leakage current to an output node to place a bitline precharge voltage at an edge of a dead zone. The bitline precharge voltage providing unit provides the bitline precharge voltage to the output node, and sets the bitline precharge voltage to a target level. The bitline precharge voltage generator generates the bitline precharge voltage having a distribution including the dead zone.

Abstract: Techniques for controlling a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method for controlling a semiconductor memory device including applying a plurality of voltage potentials to a plurality of memory cells arranged in an array of rows and columns.

Abstract: A semiconductor device includes a memory cell, a bit line coupled to the memory cell, first and second wells arranged adjacently to each other, the first and second wells being different in conductivity type from each other and defining a boundary therebetween, first and second transistors formed in the first and second wells, respectively, and being different in channel type from each other, gate electrodes of the first and second transistors being connected in common to the bit line, and a third transistor formed in the first well such that the third transistor is sandwiched between the boundary and the first transistor, and a gate of the third transistor being supplied with a bit line precharge signal.

Abstract: A semiconductor memory device includes a bit line sense amplifier configured to sense and amplify data of a first bit line coupled to a first memory cell of a first cell block when a refresh operation is performed on the first cell block, and sense and amplify data of a second bit line coupled to a second memory cell of a second cell block when a refresh operation is performed on the second cell block. A first switch may be configured to block coupling between the first bit line and the bit line sense amplifier when a refresh operation is performed on the second cell block and a second switch may be configured to block coupling between the second bit line and the bit line sense amplifier when a refresh operation is performed on the first cell block.

Abstract: Systems and methods of testing a reference cell in a memory array are disclosed. In a particular embodiment, a method of testing a reference cell in a memory array includes coupling a first reference cell of a first reference cell pair of the memory array to a first input of a first sense amplifier of the memory array. The method also includes providing a reference signal to a second input of the first sense amplifier. The reference signal is associated with a second reference cell pair of the memory array.

Abstract: The present invention provides a semiconductor memory device, the voltage divider circuit comprises a data line sense amplifier and an input output data sensing circuit. The data line sense amplifier receives a data line signal pair and senses the data line signal pair in a first timing period to generate a first output data and a second output data, wherein, the first output data and the second output data are complementary. The input output data sensing circuit receives at least one reference output data and one of the first and the second output data. The input output data sensing circuit generates a sensed data by comparing voltage levels of the reference output data and the one of the first and the second output data in a second timing period, wherein the voltage level of the reference output data is a pre-determined voltage level.

Abstract: A sensing circuit (100) for sensing the content of a memory cell (101), wherein the sensing circuit comprises a sense node (103) connectable to the memory cell (101) so that a signal indicative of the content of the memory cell (101) is providable to the sense node (103). The sensing circuit (100) further comprises a logic gate (102) having a first input, a second input and an output, wherein a reference signal (105) is providable to the first input and wherein the sense node (103) is coupled to the second input. The sensing circuit (100) further comprises a feedback loop (104) for coupling the output of the logic gate (102) to the second input of the logic gate (102) so that, during sensing the content of the memory cell (101), an electrical potential at the sense node (103) is used to make a decision but after a result is obtained, the memory and sense amplifier combination are configured so that the result is held indefinitely and so that no static current continues to flow.

Abstract: A method for data storage includes providing at least first and second readout configurations for reading storage values from analog memory cells, such that the first readout configuration reads the storage values with a first sense time and the second readout configuration reads the storage values with a second sense time, shorter than the first sense time. A condition is evaluated with respect to a read operation that is to be performed over a group of the memory cells. One of the first and second readout configurations is selected responsively to the evaluated condition. The storage values are read from the group of the memory cells using the selected readout configuration.

Abstract: According to one embodiment, a dummy cell simulates an operation of a memory cell. A main dummy bit line transmits a signal read out from the dummy cell. An inverter makes a sense amplifier circuit to operate based on a potential of the main dummy bit line. n (n is a positive integer) number of auxiliary dummy bit lines are provided. A switching element connects at least one of the n number of auxiliary dummy bit lines to the main dummy bit line.

Abstract: A circuit comprises a first driver, a second driver, and a remote sense amplifier. The first driver is configured to generate a first data signal on a first data line. The second driver is configured to generate a control signal on a control signal line. An RC delay of the control signal line is less than an RC delay of the first data line. The remote sense amplifier is configured to receive the first data signal, a second data signal on a second data line, and the control signal. The control signal line is configured for the control signal to enable the remote sense amplifier to amplify the voltage difference between the first data signal and the second data signal at inputs of the remote sense amplifier, if the voltage difference reaches a predetermined value.

Abstract: A semiconductor storage device in accordance with the present invention includes a first SRAM cell that stores data, and a word line circuit that outputs a first control signal used to activate the first SRAM cell. The word line control circuit gradually raises the voltage level of the first control signal from a substrate potential to a first power supply potential in a first activation period, maintains the voltage level of the first control signal at the first power supply potential in a second activation period subsequent to the first activation period, and raises the voltage level of the first control signal from the first power supply potential to a second power supply potential in a third activation period subsequent to the second activation period.

Abstract: Embodiments are described including those pertaining to an input buffer having first and second complementary input terminals. One example buffer has a symmetrical response to a single input signal applied to the first input terminal by mimicking the transition of a signal applied to the second input terminal in the opposite direction. The buffer includes two amplifier circuits structured to be complementary with respect to each other. Each of the amplifier circuits includes a first transistor having a first input node that receives an input signal transitioning across a range of high and low voltage levels, and a second transistor having a second input node that receives a reference signal. The first input node is coupled to the second transistor through a capacitor to mimic the second input node transitioning in the direction opposite to the transition of the input signal.

Abstract: A readout circuit has a sense amplifier to compare a cell current which changes according to whether a memory cell is on or off to a reference current to output a comparison signal of a first logic value upon detecting that the cell current is smaller than the reference current, and to output a comparison signal of a second logic value upon detecting that the cell current is greater than the reference current, the readout circuit outputting a data output signal depending upon an output of the sense amplifier. The reference current is set to be greater than a middle value between a first cell current, which flows when the memory cell is in an off-state, and a second cell current, which flows when the memory cell is in an on-state, the reference current is greater than the first cell current and is smaller than the second cell current.

Abstract: A semiconductor memory device comprises a plurality of memory cell mats, a plurality of sub-word driver regions and a plurality of sense amplifier regions, a plurality of intersection regions, a sub-amplifier, and a start signal (a control signal) supply circuit (a sub-amplifier control circuit). A plurality of sub-word driver regions and a plurality of sense amplifier regions are disposed adjacent to the plurality of memory cell mats. A plurality of intersection regions are intersection regions between the plurality of sub-word driver regions and the plurality of sense amplifier regions. The sub-amplifier is disposed in a first intersection region among the plurality of intersection regions. The start signal supply circuit is disposed in a second intersection region among the plurality of intersection regions, and supplies a start signal (a control signal) of the sub-amplifier to the sub-amplifier based on a sub-amplifier timing signal supplied from the extending direction of the sub-word driver region.

Abstract: In a static random access memory (SRAM) device having a hierarchical bit line architecture, a local sense amplifier (SA) circuit includes P-channel transistors which precharge local bit lines connected to memory cells, P-channel transistors each having a gate connected to a corresponding one of the local bit lines and a drain connected to a corresponding one of global bit lines, and N-channel transistors each having a gate connected to a corresponding one of the global bit lines and a drain connected to a corresponding one of the local bit lines. As a result, restore operation to a non-selected memory cell during write operation can be achieved without the need of a fine timing control, the speed of read operation by a feedback function can be increased, and the area can be reduced.

Abstract: The data transmission circuit includes: a plurality of local bit line pairs through which data is read simultaneously; a plurality of voltage change detection circuits provided for the plurality of local bit line pairs; a global bit line pair; a plurality of column selection circuits configured to select one of the local bit line pairs and connect the selected local bit line pair to the global bit line pair; and a sense amplifier connected to the global bit line pair. The sense amplifier is controlled by a sense amplifier activation signal to which the outputs of the plurality of voltage change detection circuits are connected, whereby the voltage of a selected read data line pair is amplified using discharge of a non-selected read data line pair, to achieve high-speed read.

Abstract: A nonvolatile memory device includes a cell array including a plurality of phase change memory cells, a switching unit configured to select any one of the plurality of phase change memory cells, a clamping unit coupled between the switching unit and a sensing line and configured to adjust an amount of a clamping current flowing through the sensing line, a program switching unit configured to couple the switching unit to the sensing line during a program operation, a voltage driving unit configured to supply the sensing line with a write voltage corresponding to data to be written during the program operation, and supply the sensing line with a constant read voltage during a data sensing operation, and a sense amplifier configured to compare and amplify a voltage of the sensing line and a preset read reference voltage.

Abstract: Systems and methods are disclosed for providing selective threshold voltage characteristics via use of MOS transistors having differential threshold voltages. In one exemplary embodiment, there is provided a metal oxide semiconductor device comprising a substrate of semiconductor material having a source region, a drain region and a channel region therebetween, an insulating layer over the channel region, and a gate portion of the insulating layer. Moreover, with regard to the device, the shape of the insulating layer and/or the shape or implantation of a junction region are of varied dimension as between the gate-to-drain and gate-to-source junctions to provide differential threshold voltages between them.

Abstract: A memory device includes: a memory unit in which an electric charge discharging rate between two electrodes is different in accordance with logic of stored information; a sense amplifier that detects the logic of the information by comparing a discharge electric potential of a wiring to which one electrode of the memory unit is connected with a reference electric potential; and a replica circuit that has a replica unit emulating the memory unit and controls a sense timing of the sense amplifier in accordance with a discharge rate of the replica unit.

Abstract: A memory system has a first memory having an array of memory cells that includes a redundant column. The redundant column substitutes for a first column in the array. The first column includes a test memory cell. The array receives a power supply voltage. The test memory cell becomes non-functional at a higher power supply voltage than the memory cells of the array. A memory controller is coupled to the first memory and is for determining if the test memory cell is functional at a first value for the power supply voltage. This is useful in making decisions concerning the value of the power supply voltage applied to the array.

Abstract: A Static Random Access Memory (SRAM) includes word lines WL, bit lines BL, address decoders that select one of the word lines WL in response to an address signal AD, a sense amplifier that is activated in response to a sense amplifier enable signal SAE, and a sense amplifier control circuit that generates the sense amplifier enable signal SAE. In this device, the more distant the word line WL is from the sense amplifier, the longer the sense amplifier control circuit sets the delay time of the sense amplifier enable signal SAE so that the more distant the word line WL is from the sense amplifier, the later the sense amplifier is activated.

Abstract: A sense amplifier having a pre-amplifier and a main-amplifier is disclosed. The pre-amplifier is connected to paired data line, senses and amplifies data on the paired data line using voltage mode and outputting a pair of differential signal. The main-amplifier is connected to the paired data line, senses and amplifies data on the paired data line using current mode and generating a first amplified signal, senses and amplifies the first amplified signal using voltage mode in response to the pair of differential signal, and outputting an amplified data.

Abstract: A data input/output circuit includes: an amplification unit configured to generate a data signal by amplifying data of a first input/output line coupled to a bank during a read operation, and generate a driving signal by amplifying data of a second input/output line coupled to a data input/output pad during a write operation; a read driving unit configured to drive the second input/output line in response to the data signal during the read operation; and a write driving unit configured to drive the first input/output line in response to the driving signal during the write operation.

Abstract: An input-output line sense amplifier configured to drive input data signals over an input-output signal line to an output driver circuit, the input-output line sense amplifier having an output driver stage having a plurality of different programmable output drive capacities to tailor the output drive of the sense amplifier.

Abstract: A sense amplifier includes a first inverter having an input terminal connected to a first line and an output terminal connected to a second line, and a second inverter having an input terminal connected to the second line and an output terminal connected to the first line, wherein an NMOS transistor of the first inverter and an NMOS transistor of the second inverter have well biases different from each other.

Abstract: A semiconductor device includes the following elements. A sense amplifier amplifies signal on a bit line. A column switch is between the bit line and a local input-output line. A sub-amplifier amplifies signal on the local input-output line. A write switch is between the local input-output line and a main input-output line. A write amplifier amplifies write data and supplies the amplified write data to the main input-output line when data write operation is performed. A test circuit activates the sense amplifier while the test circuit deactivating the sub-amplifier and the write amplifier when a data read operation is performed in test mode. The test circuit places the column switch and the write switch in conductive state.

Abstract: Methods for measuring the resistance of multiple memory elements are disclosed. The memory elements may be multi-bit memory and through precise measurement of resistance of the multi-bit memory elements, determination of how many and which memory elements fall into specific memory ranges can be accomplished. Furthermore, storage and/or display of this information may allow for the creation of resistance distribution histograms for modeling of one or more memory arrays.

Abstract: A sense amplifier is disclosed comprising a first sense input, a second sense input, a latch, a first p-channel control transistor arranged to electrically power a first section of the latch and having a gate terminal linked to the first sense input, and a second p-channel control transistor arranged to electrically power a second section of the latch and having a gate terminal linked to the second sense input. Application may be in particular to low power embedded memories.

Abstract: A sense amplifier for a series of cells of a memory, including a writing stage comprising a CMOS inverter, the input of which is directly or indirectly connected to an input terminal of the sense amplifier, and the output of which is connected to an output terminal of the sense amplifier intended to be connected to a local bitline addressing the cells of the series, and a reading stage that includes a sense transistor, the gate of which is connected to the output of the inverter and the drain of which is connected to the input of the inverter.

Abstract: A circuit comprises a plurality of memory cells, a word line, a plurality of pairs of bit lines, a pre-charge and equalization device, a column select device, and a sense amplifier. The word line is configured to control the plurality of memory cells. Each pair of bit lines of the plurality of pairs of bit lines corresponds to a memory cell of the plurality of memory cells and is coupled to a pair of switches. The sense amplifier is coupled to the plurality of pairs of bit lines, the pre-charge and equalization device, and the column select device.

Abstract: When an I/O number is 8 bit, a semiconductor device includes a first memory mat that is selected when X13 is (0) and X11 and X12 are (0, 0), a second memory mat that is selected when X13 is (1) and X11 and X12 are (0, 0), and a third memory mat that is selected irrespective of a value of X13 when X11 and X12 are (0, 0). When the I/O number is 16 bit, X13 is ignored, and the first to third memory mats are selected when X11 and X12 are (0, 0). In this manner, because the third memory mat is shared between so-called upper side and lower side, control is prevented from becoming complicated and an area is prevented from increasing.

Abstract: Embodiments of the invention are related to sense amplifiers. In an embodiment involving a sense amplifier used with a memory cell, signals BL, ZBL, SN and SP are pre-charged and equalized to a voltage reference, e.g., Vref, using an equalizing signal. A compensation signal, e.g., SAC, is applied to compensate for the mismatch between transistors in the sense amplifier. The word line WL is activated to connect the memory cell to a bit line, e.g., bit line ZBL. Because the memory cell shares the charge with the connected bit line ZBL, it causes a differential signal to be developed between bit lines BL and ZBL. When enough split between bit lines BL and ZBL is developed, signals SP and SAE are raised to VDD (while signal SN has been lowered to VSS) to turn on the sense amplifier and allow it to function as desire. Other embodiments and exemplary applications are also disclosed.

Abstract: A circuit includes a first node, a second node, a first current mirror circuit, and a second current minor circuit. The first current mirror circuit has a reference end and a mirrored end. The reference end of the first current minor circuit is coupled to the first node, and the mirrored end of the first current minor circuit is coupled to the second node. The second current minor circuit has a reference end and a mirrored end. The reference end of the second current minor circuit is coupled to the second node, and the mirrored end of the second current minor circuit is coupled to the first node.

Abstract: The present invention provides a semiconductor memory and a control method therefor, the semiconductor device including a first current-voltage conversion circuit connected to a core cell provided in a nonvolatile memory cell array, a second current-voltage conversion circuit connected to a reference cell through a reference cell data line, a sense amplifier sensing an output from the first current-voltage conversion circuit and an output from the second current-voltage conversion circuit, a compare circuit comparing a voltage level at the reference cell data line with a predefined voltage level, and a charging circuit charging the reference cell data line, if the voltage level at the reference cell data line is lower than the predefined voltage level during pre-charging the reference cell data line. According to the present invention, the pre-charging period of the reference cell data line can be shortened, and the data read time can be shortened.

Abstract: The data read circuit includes a variable current generation circuit and a data sensing circuit. The variable current generation circuit is configured to generate a variable current that varies in response to an external temperature. The data sensing circuit is configured to sense and amplify data on a bit line connected to a non-volatile memory cell according to the variable current and to configured to output the sensed and amplified data. The data sensing circuit controls a margin for sensing the data according to the variable current.

Abstract: A dynamic sense current supply circuit and an associated method for rapidly characterizing a resistive memory array is disclosed. In one embodiment, the disclosed circuit comprises a first and second dynamically programmable current mirror sub-circuit. Responsive to a bank of control signals, each dynamically programmable current mirror sub-circuit provides a dynamically adjustable current scaling factor. These scaling factors are used to scale a supplied reference current to generate a plurality of sense currents which can be used within a plurality of read operations on a resistive memory array. A digital circuit is also provided to sense and store the result of each read operation.

Abstract: The present disclosure includes resistive memory devices and systems having resistive memory cells, as well as methods for operating the resistive memory cells. One memory device embodiment includes at least one resistive memory element, a programming circuit, and a sensing circuit. For example, the programming circuit can include a switch configured to select one of N programming currents for programming the at least one resistive memory element, where each of the N programming currents has a unique combination of current direction and magnitude, with N corresponding to the number of resistance states of the at least one memory element. In one or more embodiments, the sensing circuit can be arranged for sensing of the N resistance states.

Abstract: A dynamic random access memory (DRAM) having pairs of bitlines, each pair being connected to a first bit line sense amplifier, wordlines crossing the bitlines pairs forming an array, charge storage cells connected to the bitlines, each having an enable input connected to a wordline, the bit line sense amplifiers being connected in a two dimensional array, pairs of primary databuses being connected through first access transistors to plural corresponding bit line sense amplifiers in each row of the array, apparatus for enabling columns of the first access transistors, databus sense amplifiers each connected to a corresponding data bus pair, a secondary databus, the secondary databus being connected through second access transistors to the databus sense amplifiers, and apparatus for enabling the second access transistors.

Abstract: An SRAM differential voltage sensing apparatus is coupled to a memory circuit. The memory circuit comprises a memory bank, a plurality of bit lines, a plurality of data lines coupled to the plurality of bit lines via a plurality of transmission gates and a sense amplifier. When the sense amplifier operates in a characterization mode, the transmission gates and pre-charge circuits are turned off. The differential voltage sensing apparatus applies a characterization signal to the sense amplifier and obtains the parameters of the memory circuit through a trial and error process.

Abstract: A circuit comprises a first read bit line, a second read bit line, and a sense amplifier. First and second read bit lines couple a plurality of memory cells and a reference cell of a memory array, respectively. The sense amplifier is configured to receive the first read bit line as a first input and the second read bit line as a second input. When a memory cell of the first plurality of memory cells is read, the memory cell is read activated, the first reference cell is configured to be off, the second reference cell is configured to be on, and the sense amplifier is configured to provide an output reflecting a data logic stored in the memory cell based on a voltage difference between a first voltage of the first read bit line and a second voltage of the second read bit line.

Abstract: Disclosed is a semiconductor memory apparatus which improves the time to transmit write data to a memory cell and improves data retention time of the memory cell. To this end, the semiconductor memory apparatus includes a bit-line sense amplifier that senses and amplifies data of bit-line pairs by driving power supplied through a pull up power line and a pull down power line and transmits the amplified data to a memory cell. A bit-line sense amplification power supply unit supplies pull up driving voltage and pull down driving voltage to the pull up and pull down power lines in an active mode and supplies an over driving voltage and the pull down driving voltage having a higher voltage level than the pull up driving voltage to the pull up and pull down power lines until the memory cell is deactivated in a precharge mode.

Abstract: Herein, a voltage sensing circuit, which is capable of controlling a pumping voltage to be stably generated in a low voltage environment, is provided. The voltage sensing circuit includes a current mirror having first and second terminals, a first switching element configured to control current on the first terminal of the current mirror by a reference voltage, a second switching element configured to control current from the second terminal of the current mirror in response to a pumping voltage, and a third switching element configured to control current sources of the first and second switching elements to receive a negative voltage.

Abstract: A resistance-based memory with a reduced voltage I/O device is disclosed. In a particular embodiment, a circuit includes a data path including a first resistive memory cell and a first load transistor. A reference path includes a second resistive memory cell and a second load transistor. The first load transistor and the second load transistor are input and output (I/O) transistors adapted to operate at a load supply voltage similar to a core supply voltage of a core transistor within the circuit.

Abstract: Disclosed herein is a memory device including: first and second wires; memory cells including a variable-resistance storage element having a data storage state making a transition by a change of a voltage applied and an access transistor connected in series between the first and second wires; driving control sections controlling a direct verify sub-operation by applying a write/erase pulse between the first and second wires in a data write/erase operation respectively for causing a cell current to flow between the first and second wires through the memory cell for a transition of the data storage state; sense amplifiers sensing an electric-potential change occurring on the first wire in accordance with control on the direct verify sub-operation; and inhibit control sections determining whether or not to inhibit a sense node of the sense amplifier from electrically changing at the next sensing time on the basis of an electric potential appearing at the sense node at the present sensing time.

Abstract: A semiconductor device includes a bit line, a memory cell, and a control circuit. The memory cell includes a switch circuit coupled to the bit line and a memory element configured to store either one of first and second data. The control circuit controls a voltage of the bit line to turn on the switch element in a first time period and to turn off the switch element in a second time period following the first time period when the control circuit writes the first data to the memory element. The control circuit controls the voltage of the bit line to turn on the switch element in the first time period and to maintain an on-state of the switch circuit in the second time period when the control circuit writes the second data to the memory element.

Abstract: An offset removal circuit (10) includes a removal circuit (1) and a removal circuit (2). The removal circuit (1) digitally removes offset voltage from an input voltage Vin. The removal circuit (2) removes offset voltage, in an analog manner, from the voltage subjected to offset voltage removal by the removal circuit (1). Then, the removal circuit (2) outputs the voltage subjected to the offset voltage removal to a non-inverting input terminal of a differential amplifier (20).

Abstract: A semiconductor device includes a pad for sense amplifier ground potential as an electrode pad supplying ground potential voltage to a sense amplifier, a first conductive line connected to the pad for sense amplifier ground potential, and a second conductive line connected to an electrode pad closest to the pad for sense amplifier ground potential among plural electrode pads included in a pad row. The second conductive line extends to the opposite side of the first conductive line with the pad row as a reference.