Abstract: A memory is disclosed that includes a plurality of memory cells, a plurality of sense amplifiers for reading data of the memory cells, and a voltage regulator coupled to the plurality of sense amplifiers. The voltage regulator includes a reference sense amplifier, a current injector, and a current injector control circuit. The current injector control circuit controls an amount of current provided by the current injector to an output node of the voltage regulator based on a voltage of the reference sense amplifier.

Abstract: Methods for reducing variability in bias voltages applied to a plurality of memory cells during a sensing operation caused by IR drops along a word line shared by the plurality of memory cells are described. In some embodiments, IR drops along a shared word line may be reduced by reducing sensing currents associated with memory cells whose state has already been determined during a sensing operation. In one example, once a sense amplifier detects that a memory cell being sensed is in a particular state, then the sense amplifier may disable sensing of the memory cell and discharge a corresponding bit line associated with the memory cell. In some cases, a bit line voltage associated with a memory cell whose state has not already been determined during a first phase of a sensing operation may be increased during a second phase of the sensing operation.

Abstract: A circuit for sensing a multi-level cell (MLC) comprises a first switch associated with a first read bit, a second switch associated with a second read bit, a first switch control unit to control the first switch in response to a first data bit from a counter, and a second switch control unit to control the second switch in response to a second data bit from the counter.

Abstract: A system on chip (SoC) provides a memory array of self referencing nonvolatile bitcells. Each bit cell includes two ferroelectric capacitors connected in series between a first plate line and a second plate line, such that a node Q is formed between the two ferroelectric capacitors. The first plate line and the second plate line are configured to provide a voltage approximately equal to first voltage while the bit cell is not being accessed. A clamping circuit coupled to the node Q. A first read capacitor is coupled to the bit line via a transfer device controlled by a first control signal. A second read capacitor coupled to the bit line via another transfer device controlled by a second control signal. A sense amp is coupled between the first read capacitor and the second read capacitor.

Abstract: Sense amplifiers, memories, and apparatuses and methods for sensing a data state of a memory cell are disclosed. An example apparatus includes a differential amplifier configured to amplify a voltage difference between voltages applied to first and second amplifier input nodes to provide an output. The example apparatus further includes first and second capacitances coupled to the first and second amplifier input nodes. A switch block coupled to the first and second capacitances is configured to couple during a first phase a reference input node to the first and second capacitances and to the first amplifier input node. The switch block is further configured to couple during the first phase an output of the amplifier to the second amplifier input node to establish a compensation condition. During a second phase, the switch block couples its input nodes to the first and second capacitances.

Abstract: A sensing circuit for programmable resistive device using diode as program selector is disclosed. The sensing circuit can have a reference and a sensing branch. In one embodiment, each branch can have a first type of MOS with the source coupled to a first supply voltage, the drain coupled to the drain of a second type of MOS, which can have the gate coupled to a bias supply voltage. The sources of the second type of MOS in the reference and sensing branches can be coupled to a reference resistor and a programmable resistance element, respectively, and they are further coupled to a second supply voltage through their diodes. The gate of the first type of MOS in the sensing branch can be coupled to the gate of the first type of MOS in the reference branch, which can have the drain coupled to the gate. The resistance difference between the reference resistor and the programmable resistive element can be sensed through the drain of the first type of MOS in the sensing branch into a logic level.

Abstract: A semiconductor memory includes a real memory cell; a sense amplifier configured to amplify data read from the real memory cell in response to activation of a sense amplifier enable signal; a replica circuit including a plurality of replica units connected in series, each of replica units including a plurality of dummy memory cells connected in parallel, wherein one of dummy memory cells of one of replica units is accessed in response to data which is read from one of dummy memory cells of one of replica units of a prior stage; and an operation control circuit configured to activate a dummy access signal to access one of dummy memory cells of one of replica units of a first stage in response to a read command, and to activate the sense amplifier enable signal in response to data read from one of replica units of a last stage.

Abstract: A semiconductor device includes: a sense amplifier including an equalizing circuit that equalizes a pair of bit lines; an equalizing control circuit that converts the amplitude of an equalizing signal into a VDD level, and a word driver that controls a sub word line based on a timing signal. The word driver includes a level shift circuit for changing the operation timing of the sub word line in accordance with the VDD level, allowing a timing to complete the equalizing operation and a timing to reset the sub word line to synchronize even when the level of the VDD level is changed.

Abstract: A semiconductor device along with circuits including the same and methods of operating the same are described. The device comprises a memory cell including one transistor. The transistor comprises a gate, an electrically floating body region, and a source region and a drain region adjacent the body region. Data stored in memory cells of the device can be refreshed within a single clock cycle.

Abstract: At least one example embodiment discloses a semiconductor device. The semiconductor device includes a first sense amplifier selectively connected between a first bit line and a second bit line, a second sense amplifier selectively connected between the first bit line and the second bit line, a first power supply circuit configured to provide a power supply voltage to the first sense amplifier in response to a first control signal, a second power supply circuit configured to provide a ground voltage to the second sense amplifier in response to a second control signal, and a switching circuit configured to selectively connect the first power supply circuit with the second power supply circuit in response to a third control signal.

Abstract: A system on chip (SoC) provides a nonvolatile memory array that is configured as n rows by m columns of bit cells. Each of the bit cells is configured to store a bit of data. There are m bit lines each coupled to a corresponding one of the m columns of bit cells. There are m write drivers each coupled to a corresponding one of the m bit lines, wherein the m drivers each comprise a write one circuit and a write zero circuit. The m drivers are operable to write all ones into a row of bit cells in response to a first control signal coupled to the write one circuits and to write all zeros into a row of bit cells in response to a second control signal coupled to the write zero circuits.

Abstract: A semiconductor memory device includes a memory cell array layer which includes a first wiring line, a memory cell stacked on the first wiring line, and a second wiring line formed on the memory cell so as to intersect the first wiring line, wherein a step is formed in the first wiring line so that the height of an upper surface of the first wiring line in the memory cell array region where the memory cell array is formed is higher than the height in a peripheral region around the memory cell array region.

Abstract: A buffer and control circuit for a synchronous memory controller includes first and second differential comparators and control logic. The first differential comparator is provided with positive and negative differential input signals and the second differential comparator is provided with offset positive and negative differential input signals. The first and second differential comparators generate output signals based on magnitudes of the positive and negative differential input signals and the offset positive and negative differential input signals. The control logic generates a reference strobe signal based on the output signals.

Abstract: A system connects a signal driver to a first control line that is connected to a first non-volatile storage element, charges the first control line while the signal driver is connected to the first control line, disconnects the signal driver from the first control line while the first control line remains charged from the signal driver, connects the signal driver to a second control line that is connected to a second non-volatile storage element, charges the second control line using the signal driver while the signal driver is connected to the second control line, and disconnects the signal driver from the second control line. The disconnecting of the signal driver from the first control line, the connecting the signal driver to the second control line and the charging of the second control line are performed without waiting for the first non-volatile storage element's program operation to complete.

Abstract: Described embodiments provide a memory having at least one sense amplifier with inputs coupled to at least one pair of bit lines. One of the pair of bit lines is precharged to a power supply voltage and a second one of the pair is precharged to ground. A first switch DC-couples the first one of the pair of bit lines to a first input of a cross-coupled amplifier. A first capacitor AC-couples the second one of the pair of bit lines to a second input of the cross-coupled amplifier. Then a memory cell coupled between the first and second one of the pair of bit lines is enabled. A switch then decouples the first input from the bit line, a second capacitor is used to inject a charge of current into the first input of the cross-coupled amplifier, and then the cross-coupled amplifier is enabled.

Abstract: A method is provided for programming a memory cell having a first terminal coupled to a word line and a second terminal coupled to a bit line. During a first predetermined time interval, the word line is switched from a first standby voltage to a first voltage, the bit line is switched from a second standby voltage to a predetermined voltage, and a voltage drop across the first and second terminals is a safe voltage that does not program the memory cell. During a second predetermined time interval, the word line is switched from the first voltage to a second voltage, and a voltage drop across the first and second terminals is a programming voltage that is sufficient to program the memory cell. Numerous other aspects are provided.

Abstract: In one aspect, the invention concerns a memory system that compensates for power level variations in sense amplifiers for multilevel memory. For example, a compensation circuit can be employed to compensate for current or voltage variations in the power supplied to multilevel memory sense amplifiers. As another example, compensation can be accomplished by application of a bias voltage to the power supply. Another example is a sense amplifier configured with improved input common mode voltage range. Such sense amplifiers can be two-pair and three-pair sense amplifiers. Further examples of the invention include more simplified sense amplifier configurations, and sense amplifiers having reduced leakage current.

Abstract: A memory includes a DRAM array having memory cells, wordlines and bitlines coupled to the memory cells, and sense amplifiers. The memory can be configured to perform a method in which a wordline of the DRAM array is set to an active state. While the wordline is active, signals develop on the respective bitlines according to the flows of charge between the memory cells coupled to the wordline and the respective bitlines. The sense amplifiers connected to the respective bitlines can remain inactive such that the sense amplifiers do not amplify the signals to storable signal levels. Then, when the wordline is set again to the inactive state, insufficient charge remains in the memory cells coupled to the wordline such that the data stored in memory cells coupled to the wordline are erased. These steps can be repeated using each of a remaining number of wordlines of all or a selected range of the DRAM array so as to erase the data stored in all of the DRAM array or a selected range.

Abstract: A sense amplifier includes four sub-circuits: pre-charge, sense enable, sense output, and buffer. The pre-charge sub-circuit provides a voltage between zero volts and the positive power supply (denoted VDD) to the sense enable sub-circuit. The sense enable sub-circuit is configured to adjust the received voltage based on the sensed value of bit lines and sends the adjusted voltage to the sense output sub-circuit. The sense output sub-circuit removes interference, inverts and amplifies the adjusted voltage, and sends an output voltage to the buffer sub-circuit. The buffer sub-circuit amplifies the output voltage of the sense output sub-circuit and provides it to an output bus.

Abstract: A sensing circuit includes a sensing resistor, a reference resistor and a comparator. The comparator has a first input coupled to the sensing resistor, a second input coupled to the reference resistor, and an output. The first input is configured to be coupled to a data bit line associated with a memory cell to receive a sensing input voltage caused by a cell current of the memory cell flowing through the sensing resistor. The second input is configured to be coupled to a reference bit line associated with a reference cell to receive a sensing reference voltage caused by a reference current of the reference cell flowing through the reference resistor. The comparator is configured to generate, at the output, an output signal indicating a logic state of data stored in the memory cell based on a comparison between the sensing input voltage and the sensing reference voltage.

Abstract: An SRAM differential voltage sensing apparatus is coupled to a memory circuit. The memory circuit comprises a memory bank, a plurality of bit lines, a plurality of data lines coupled to the plurality of bit lines via a plurality of transmission gates and a sense amplifier. When the sense amplifier operates in a characterization mode, the transmission gates and pre-charge circuits are turned off. The differential voltage sensing apparatus applies a characterization signal to the sense amplifier and obtains the parameters of the memory circuit through a trial and error process.

Abstract: Electronic apparatus and fabrication of the electronic apparatus that includes detection of the majority of values in a plurality of data bits may be used in a variety of applications. Embodiments include application of majority bit detection to process data bits in a device for further analysis in the device based on the results of the majority bit detection. In an embodiment, such further processing in a memory device after majority bit detection may include data bit inversion prior to outputting the data from the memory device.

Abstract: A memory includes an I/O unit that is shared between multiple storage arrays. The shared I/O unit provides output data from the arrays. The memory includes an isolation unit connected between each storage array and the shared I/O unit. In addition, each of the storage arrays and the shared I/O unit may be connected to a separate switched voltage domain through for example, power gating circuits. If one or more of the storage arrays is placed in retention or low-voltage mode, the isolation units that are coupled to the affected storage arrays may be configured to isolate the bitlines of those storage arrays from the shared I/O data paths.

Abstract: Voltage coupling/decoupling devices are provided within DRAM devices for improving the bias sensing of sense amplifiers and thus the refresh performance. The voltage coupling/decoupling devices couple or decouple bias voltage from corresponding digit lines coupled to the sense amplifiers. By coupling and decoupling voltage from the digit lines, the time interval between refresh operations can be increased.

Abstract: A semiconductor device comprises a first region and a second region. The first region includes a plurality of memory cells each of which holds respective data and a plurality of sense amplifiers that respectively amplify the data in the plurality of memory cells, based on a first voltage. The second region is provided along one side of the first region and includes a first power supply generation circuit that generates the first voltage, based on a second voltage. The second voltage being supplied to the first power supply circuit by a first power supply interconnect extends on the first region in a first direction parallel to the one side of the first region.

Abstract: A nonvolatile memory apparatus includes a memory cell configured to receive a first current and a second current through a bit line which is connected to a sensing node; a sensing node level control unit configured to be driven in response to a control signal, compare a reference voltage and a voltage of the sensing node, and output a driving signal to a driving node; a first current driving unit configured to output the first current to the driving node by using a first driving voltage in response to the driving signal; and a current control unit configured to perform a discharge operation of the bit line or electrically connect the driving node and the sensing node, in response to the control signal.

Abstract: A bit alterable memory may include current generators in a periphery outside the main memory core. Current may be generated in the periphery and driven into the core. As a result, the capacitance of the memory cells has a lowered effect. The current may be generated using the chip supply voltage and then mirrored using a pump voltage. In some embodiments, the mirroring may be ratioed at the partition level and multiplied at the plane level. A delay may be provided before applying the currents to the cell to accommodate for transients.

Abstract: A sense amplifier includes a first inverter responsive to a first output of a latch. The first inverter is powered by a sense enable signal. The sense amplifier also includes a second inverter responsive to a second output of the latch. The second inverter is also powered by the sense enable signal.

Abstract: A memory includes at least one first flag cell configured to store first flag data, at least one second flag cell configured to store second flag data, at least one first sensing node having a voltage level determined by the first flag data of the first flag cell, at least one second sensing having a voltage level determined by the second flag data of the second flag cell, a selection circuit configured to select the first sensing node or the second sensing node in response to a flag address; and a determination circuit having an internal node through which current corresponding to a voltage level of a selected sensing node flows and configured to determine a logic value of flag data corresponding to the selected sensing node among the first and second flag data by using an amount of current flowing through the internal node.

Abstract: A semiconductor memory apparatus includes a first switch, a second switch and a control unit. The first switch couples/separates a first bit line and a sense amplifier to/from each other in response to a first bit line separation signal. The second switch couples a second bit line and the sense amplifier to each other in response to a second bit line separation signal. The control unit generates a bit line separation signal for a refresh operation, of which enable period is shorter than that of the second bit line separation signal, and provides the generated bit line separation signal for the refresh operation to the second switch in the refresh operation.

Abstract: As memory geometries continue to scale down, current density of magnetic tunnel junctions (MTJs) make conventional low current reading scheme problematic with regard to performance and reliability. A body-voltage sense circuit (BVSC) short pulse reading (SPR) circuit is described using body connected load transistors and a novel sensing circuit with second stage amplifier which allows for very short read pulses providing much higher read margins, less sensing time, and shorter sensing current pulses. Simulation results (using 65-nm CMOS model SPICE simulations) show that our technique can achieve 550 mV of read margin at 1 ns performance under a 1V supply voltage, which is greater than reference designs achieve at 5 ns performance.

Abstract: A low voltage sensing scheme reduces active power down standby leakage current in a memory device. A clamping device or diode is used between a Psense amplifier control line (e.g. ACT) and Vcc and/or between an Nsense amplifier control line (e.g. RNL*) and Vss (ground potential). The clamping diode is not enabled during normal memory operations, but is turned on during active power down mode to reduce leakage current through ACT and/or RNL* nodes. The clamping device connected to the ACT node may reduce the voltage on the ACT line during power down mode, whereas the clamping device connected to the RNL* node may increase the voltage on the RNL* line during power down mode to reduce sense amplifier leakage current through these nodes. Because of the rules governing abstracts, this abstract should not be used to construe the claims.

Abstract: A sense amplifier system includes a first path, a second path, a memory cell, a first reference cell, a second reference cell, and a switch component. The switch component is configured to switch connections between the first and second reference cells and the first and second paths according to a sampling phase and an amplification phase.

Abstract: A method is provided for operating a memory system. The method includes reading nonvolatile memory cells using a first soft read voltage, a voltage level difference between the first soft read voltage and a first hard read voltage being indicated by a first voltage value; and reading the nonvolatile memory cells using a second soft read voltage paired with the first soft read voltage, a voltage level difference between the second soft read voltage and the first hard read voltage being indicated by a second voltage value. The second voltage value is different than the first voltage value. Also, a difference between the first voltage value and the second voltage value corresponds to the degree of asymmetry of adjacent threshold voltage distributions among multiple threshold voltage distributions set for the nonvolatile memory cells of the memory system.

Abstract: A semiconductor memory device includes a switching unit coupled between a local sense amplifier and a bit line sense amplifier and configured to be turned on in response to a switching signal which is enabled in synchronization with an enable signal for enabling the local sense amplifier and disabled at a time point where a preset period passes after a first power for enabling the bit line sense amplifier is precharged.

Abstract: Methods and systems for measuring the resistance of multiple memory elements are disclosed. The memory elements may be multi-bit memory and through precise measurement of resistance of the multi-bit memory elements, determination of how many and which memory elements fall into specific memory ranges can be accomplished. Furthermore, storage and/or display of this information may allow for the creation of resistance distribution histograms for modeling of one or more memory arrays.

Abstract: A method for improving data retention in a 2T/2C ferroelectric memory includes baking a ferroelectric memory configured to operate as an array of 1T/1C memory cells for a period of time, and then configuring the ferroelectric memory to function as an array of 2T/2C memory cells, wherein the baking pre-imprints the ferroelectric capacitors in the ferroelectric memory and stabilizes a 2T/2C opposite state margin and enhances data retention. A corresponding memory circuit for configuring an array of memory cells for either 1T/1C operation or 2T/2C operation includes a plurality of sense amplifiers, a configurable reference circuit coupled to a logic circuit, a memory array, and a column decoder, wherein components are coupled together through a bit line and a complementary bit line, and wherein the logic circuit can configure the reference circuit for 1T/1C operation or 2T/2C operation.

Abstract: An embodiment of a sense amplifier includes a sense circuit and a monitor circuit. The sense circuit is configured to convert a first signal that corresponds to data stored in a memory cell into a second signal that corresponds to the data, and the monitor circuit is configured to indicate a reliability of the second signal. The monitor circuit allows, for example, adjusting a parameter of a memory in which the memory cell is disposed to increase the read accuracy, and may also allow recognizing and correcting an error due to an invalid second signal.

Abstract: A semiconductor device includes a differential circuit and a power supply circuit that provides a power supply to the differential circuit. Current to be supplied to the differential circuit by the power supply circuit is controlled, based on logics of a burn-in mode signal and an activation control signal for the differential circuit.

Abstract: Circuits, devices and methods are provided, such as an amplifier (e.g., a voltage regulator) that includes a feedback circuit that supplies negative feedback through a feedback path. One such feedback path includes a capacitance coupled in series with a “one-way” isolation circuit through which a feedback signal is coupled. The “one-way” isolation circuit may allow the feedback signal to be coupled from a “downstream” node, such as an output node, to an “upstream” node, such as a node at which an error signal is generated to provide negative feedback. However, the “one-way” isolation circuit may substantially prevent variations in the voltage at the upstream node from being coupled to the capacitance in the isolation circuit. As a result, the voltage at the upstream node may quickly change since charging and discharging of the capacitance responsive to voltage variations at the upstream node may be avoided.

Abstract: In a nonvolatile memory array that stores randomized data, the program level—the number of states per cell stored in a population of memory cells—may be determined from the aggregated results of a single read step. A circuit for aggregating binary results of a read step includes parallel transistors with control gates connected to the data latches holding the binary results, so that current flow through the combined transistors depends on the binary results.

Abstract: Described examples include sensing circuits and reference voltage generators for providing a reference voltage to a sensing circuit. The sensing circuits may sense a state of a memory cell, which may be a PCM memory cell. The sensing circuits may include a cascode transistor. Examples of reference voltage generators may include a global reference voltage generator coupled to multiple bank reference voltage generators which may reduce an output resistance of the voltage generator routing.

Abstract: A data transmission circuit includes a read data transmission unit configured to, when a read signal is asserted, detect and amplify a voltage level of a first data line, transmit an amplified voltage level to a second data line, and substantially prevent a voltage level of the second data line from being amplified to be substantially equal to or more than a preset voltage level, and a write data transmission unit configured to transmit the voltage level of the second data line to the first data line when a write signal is asserted.

Abstract: According to one embodiment, a cache system includes a tag memory includes a volatile memory device, the tag memory includes ways and storing a tag for each line, a data memory includes a nonvolatile memory device including sense amplifiers for reading data, the data memory includes ways and storing data for each line, a comparison circuit configured to compare a tag included in an address supplied from an external with a tag read from the tag memory, and a controller configured to turn off a power of a sense amplifier for a way which is not accessed based on a comparison result of the comparison circuit.

Abstract: An e-fuse array circuit includes a high voltage pumping unit configured to generate a high voltage by pumping a power source voltage, a negative voltage pumping unit configured to generate a negative voltage by pumping a ground voltage, a program/read line supplied with the high voltage when a program operation is activated, a read voltage, which is lower than the high voltage, when a read operation is activated, or the negative voltage when deactivated, a row line supplied with the ground voltage when the row line is activated or the negative voltage when the row line is deactivated, an e-fuse device supplied with voltage of the program/read line, a switch device controlled by the row line and configured to electrically connect the e-fuse device with a column line, and a column circuit configured to supply the negative voltage to the column line when the column line is activated.

Abstract: A circuit and method for dynamically changing trip point voltage in a sensing inverter circuit. In one embodiment, the sensing inverter circuit includes: (1) a base inverter circuit couplable to logic-high and logic-low voltage sources at respective inputs thereof and configured to transition an output thereof from a previous logic-level voltage to a present logic-level voltage based on a logic value of an input voltage received by the base inverter circuit, and (2) a feedback circuit associated with the base inverter circuit and configured to employ the previous logic-level voltage to decouple one of the logic-high and logic-low voltage sources from one of the inputs and thereby shift a trip voltage of the base inverter circuit toward the input voltage.

Abstract: A system includes a memory block. The memory block includes a local control circuit that is operable to control a memory operation of the memory block. The local control circuit includes a local sense amplifier. The system also includes a global memory control circuit separate from the memory block, and the global memory control circuit is operable to communicate with the local control circuit. The global memory control circuit includes a global sense amplifier operable to receive a sensed data state from the local sense amplifier.

Abstract: A sense amplifier circuit, a method of modifying a differential voltage in a sense amplifier circuit and a memory system incorporating the sense amplifier circuit or the method. In one embodiment, the sense amplifier circuit includes: (1) a differential amplifier having first and second inputs respectively couplable to first and second complimentary bit lines and configured to receive a differential voltage therefrom representing a current logic value to be read and (2) a sense speed alteration circuit having first and second outputs respectively coupled to the first and second inputs via respective first and second capacitors and configured to cause one of the first and second capacitors to discharge to increase the differential voltage when a previously read logic value is opposite the current logic value to be read.

Abstract: Methods for reading a data location coupled to an electrical conductor. A counter receives a signal from an analog-to-digital converter coupled to the electrical conductor. The counter produces two or more counts, and in some embodiments, the counts are based in part on a variable reference voltage. An interfuser may be coupled to an output of the counter. The interfuser receives the two or more counts from the counter and reads data conveyed by the data location based on the two or more counts.

Abstract: A semiconductor memory device includes a first first-type well including a first cell array for storing a data to apply the data to one of a first bit line and a first bit line bar, and a first precharge MOS transistor having a second-type channel for equalizing voltage levels of the first bit line and the first bit line bar; a first second-type well including a first sense amplifying MOS transistor having a first-type channel for sensing and amplifying the signal difference between the first bit line and the first bit line bar, and a first connection MOS transistor; and a second first-type well including a second sense amplifying MOS transistor having a second-type channel for sensing and amplifying the signal difference between the first bit line and the first bit line bar.