Abstract: In a heat treatment apparatus, a substrate held by a holding part is irradiated with light emitted from halogen lamps to perform preheating thereon and irradiated with a flash of light emitted from flash lamps to perform flash heating thereon. Part of light which is emitted from the halogen lamps and goes toward the flash lamps passes through a window hole formed in a peripheral-light shielding member and enters the substrate held by the holding part, and its energy is used for the preheating on the substrate. On the other hand, the remaining light is blocked out by the peripheral-light shielding member.

Abstract: Methods and apparatuses to produce graphene and nanoparticle catalysts supported on graphene without the use of reducing agents, and with the concomitant production of heat, are provided. The methods and apparatuses employ radiant energy to reduce (deoxygenate) graphite oxide (GO) to graphene, or to reduce a mixture of GO plus one or more metals to to produce nanoparticle catalysts supported on graphene. Methods and systems to generate and utilize heat that is produced by irradiating GO, graphene and their metal and semiconductor nanocomposites with visible, infrared and/or ultraviolet radiation, e.g. using sunlight, lasers, etc. are also provided.

Abstract: A heat radiating device includes a base on which a heat generating member is mounted and a plurality of heat radiating members that integrally extend from a bottom face of the base. In this heat radiating device, the heat radiating members are each formed to have a circular transverse section, and are arranged such that any one of the heat radiating members is positioned on a straight line in any direction orthogonal to a direction in which the heat radiating members extend.

Abstract: Embodiments of the invention are directed to methods and apparatus for rapid thermal processing of a substrate over an extended temperature range, including low temperatures. Systems and methods for using an extended temperature pyrometry system employing a transmitted radiation detector system are disclosed. Systems combining transmitted radiation detector systems and emitted radiation detector systems are also described.

Abstract: Embodiments of the present invention provide apparatus and method for reducing non uniformity during thermal processing. One embodiment provides an apparatus for processing a substrate comprising a chamber body defining a processing volume, a substrate support disposed in the processing volume, wherein the substrate support is configured to rotate the substrate, a sensor assembly configured to measure temperature of the substrate at a plurality of locations, and one or more pulse heating elements configured to provide pulsed energy towards the processing volume.

Abstract: Provided is an annealing apparatus, which is free from a problem of reduced light energy efficiency resulted by the reduction of light emission amount due to a heat generation and capable of maintaining stable performance. The apparatus includes: a processing chamber 1 for accommodating a wafer W; heating sources 17a and 17b including LEDs 33 and facing the surface of the wafer W to irradiate light on the wafer W; light-transmitting members 18a and 18b arranged in alignment with the heating sources 17a and 17b to transmit the light emitted from the LEDs 33; cooling members 4a and 4b supporting the light-transmitting members 18a and 18b at opposite side to the processing chamber 1 to make direct contact with the heating sources 17a and 17b and made of a material of high thermal conductivity; and a cooling mechanism for cooling the cooling members 4a and 4b with a coolant.

Abstract: A heater panel is configured to heat a print medium in a printer. The heater panel includes electrical conductors that form a plurality of heating zones to emit radiant energy toward the print medium. Heating zones that correspond to edges of the print medium emit radiant energy with a greater power density than heating zones that correspond to central portions of the print medium. The heater panel has a plurality of angled positions to vary the view factor for high gain control.

Abstract: The present invention provides an oven that utilizes light emitting diode (LED) and or laser diode (LD) as heating devices. Such heating devices will enable a wide variety of heating modalities.

Abstract: A radiant heater includes a heater body having a box-like configuration, the body defining an inner cavity and including a base wall and an open end opposite the base wall. The body is fabricated from a ceramic material. The body also includes a heating element extending a length of the body and positioned to direct energy through the open end of the body.

Abstract: An infrared device is provided, in particular an infrared radiation heating device having an infrared radiator for the heating of devices exposed to weather. The infrared device includes an emitter, wherein the emitter for radiating the infrared radiation is inserted in a housing, and the emitter is protected on the emitting side by a protection unit for the emitted radiation. The infrared radiator, the inner housing wall, and the unit are arranged such that cooling takes place by natural convection. A method is also provided for operating such a device in a wind turbine.

Abstract: A micromechanical device includes a micromechanical functional structure and an electromagnetic radiation heating associated with the micromechanical functional structure, which is formed to cause a spatially and temporally defined temperature or a spatially and temporally defined temperature course in the micromechanical functional structure.

Abstract: A semiconductor wafer preheated to a preheating temperature is irradiated with light from flash lamps. With the light emission from the flash lamps, a surface temperature of the semiconductor wafer is maintained at a recovery temperature during a period of 10 to 100 milliseconds to induce recovery of defects created in silicon crystals. Then, with subsequent flashing light emission from the flash lamps, the surface temperature of the semiconductor wafer will reach a processing temperature to induce activation of impurities. Increasing the surface temperature of the semiconductor wafer once to the recovery temperature and then, with the flashing light emission, to the processing temperature will also prevent cracking of the semiconductor wafer.

Abstract: A vessel including a concentrator configured to concentrate electromagnetic (EM) radiation received from an EM radiation source and a complex configured to absorb EM radiation to generate heat. The vessel is configured to receive a cool fluid from the cool fluid source, concentrate the EM radiation using the concentrator, apply the EM radiation to the complex, and transform, using the heat generated by the complex, the cool fluid to the heated fluid. The complex is at least one of consisting of copper nanoparticles, copper oxide nanoparticles, nanoshells, nanorods, carbon moieties, encapsulated nanoshells, encapsulated nanoparticles, and branched nanostructures. Further, the EM radiation is at least one of EM radiation in an ultraviolet region of an electromagnetic spectrum, in a visible region of the electromagnetic spectrum, and in an infrared region of the electromagnetic spectrum.

Abstract: On part of a surface of a metal plate that is to be heated by radiant heat transfer with a near-infrared ray, a region where reflectance for a radiant ray is made lower than that of the original surface of the metal plate is formed. As reflectance reducing treatment, painting or thermal spraying in a blackish color, plating in a blackish color, treatment for increasing roughness of the surface of the metal plate, blasting, etching, blackening, surface layer quality changing treatment of the metal plate, or the like can be adopted. The metal plate is turned into a heated metal plate partially having a different temperature by being heated by radiant heat transfer, and thereafter, the heated metal plate is subjected to thermal processing accompanied by cooling, for example, by hot stamping.

Abstract: A radiator apparatus for concentrating or dispersing energy. In one embodiment, the radiator includes a thermal conductive layer, a radiation layer, and a thermal insulation layer. The radiation layer is powered by an energy source and includes at least one radiation element embedded in at least a portion of the thermal conductive layer. The thermal insulation layer faces the thermal conductive layer. In another embodiment, the radiator includes a generally helical dome-shaped radiation member powered by an energy source and a generally dome-shaped reflection member including a reflective surface facing the radiation member. In yet another embodiment, the radiator includes a radiation member powered by an energy source and a reflection member having an at least partially ring-shaped concave reflective surface facing the radiation member for distributing energy to an at least partially hat-shaped or ring-shaped area or zone.

Abstract: In light-irradiation heating with a total irradiation time of one second or less, two-stage irradiation is performed, including a first stage of light irradiation of a semiconductor wafer, which irradiation produces an output waveform that reaches a peak at a given emission output; and a second stage of supplemental light irradiation of the semiconductor wafer, which irradiation is started after the peak, producing an emission output smaller than the above given emission output. The emission output in the second stage is two thirds or less than the above given emission output at the peak. The first-stage light-irradiation time is between 0.1 and 10 milliseconds, and the second-stage light-irradiation time is 5 milliseconds or more.

Abstract: A temperature radiator, which comprises an emission surface emitting a thermal radiation, is provided with a radiation converter to which a laser beam is irradiated. The radiation converter comprises a micro-structured receiving surface and a micro-structured emission surface. These two surfaces are surrounded by a smooth boundary. The laser radiation is absorbed at the receiving surface and converted into thermal radiation which is emitted in a uniformly distributed manner at the emission surface.

Abstract: Embodiments of the invention generally contemplate an apparatus and method for monitoring and controlling the temperature of a substrate during processing. One embodiment of the apparatus and method takes advantage of an infrared camera to obtain the temperature profile of multiple regions or the entire surface of the substrate and a system controller to calculate and coordinate in real time an optimized strategy for reducing any possible temperature non-uniformity found on the substrate during processing.

Abstract: Radiant energy from a semiconductor wafer which is determined from the theoretical value of black body radiation and the actually measured result of an output from a photodiode are brought into correspondence with each other, and a table showing a correlation therebetween is acquired and stored on a magnetic disk. When a semiconductor wafer to be treated is irradiated with flashes of light from flash lamps, the photodiode receives radiant light emitted from the semiconductor wafer. A controller determines, from the output from the photodiode, the radiant energy emitted per unit time from the semiconductor wafer irradiated with flashes of light, based on the acquired table. The controller further determines the surface temperature of the semiconductor wafer from the determined radiant energy.

Abstract: A filament lamp has a bulb comprised of a straight light emitting tube from which a pair of flat hermetically sealed portions extend, a plurality of coiled filaments arranged within the light emitting tube, in the tube axis direction a pair of internal leads are connected to ends of the filament by a respective one of a plurality of metal foils that are embedded in the hermetically sealed portions, and external leads are connected to the metal foils. The width of metal foils embedded in the hermetically sealed portions is increased so as not to cause them to melt even when an electric current to be supplied to the filament lamp is increased, the hermetically sealed portions being made wider than the external diameter of the light emitting tube and the width between outer margins of the metal foils in a direction at right angles of the tube axis is greater than the internal diameter of the light emitting tube.

Abstract: An apparatus for annealing a substrate includes a substrate stage having a substrate mounting portion configured to mount the substrate; a heat source having a plurality of heaters disposed under the substrate mounting portion, the heaters individually preheating a plurality areas defined laterally in the substrate through a bottom surface of the substrate; and a light source facing a top surface of the substrate, configured to irradiate a pulsed light at a pulse width of about 0.1 ms to about 100 ms on the entire top surface of the substrate.

Abstract: Flash lamps connected to short-pulse circuits and flash lamps connected to long-pulse circuits are alternately arranged in a line. The duration of light emission from the flash lamps connected to the long-pulse circuits is longer than the duration of light emission from the flash lamps connected to the short-pulse circuits. A superimposing of a flash of light with a high peak intensity from the flash lamps that emit light for a short time and a flash of light with a gentle peak from the flash lamps that emit light for a long time can increase the temperature of even a deep portion of a substrate to an activation temperature or more without heating a shallow portion near the substrate surface more than necessary. This achieves the activation of deep junctions without causing substrate warpage or cracking.

Abstract: Flash lamps connected to short-pulse circuits and flash lamps connected to long-pulse circuits are alternately arranged in a line. The duration of light emission from the flash lamps connected to the long-pulse circuits is longer than the duration of light emission from the flash lamps connected to the short-pulse circuits. A superimposing of a flash of light with a high peak intensity from the flash lamps that emit light for a short time and a flash of light with a gentle peak from the flash lamps that emit light for a long time can increase the temperature of even a deep portion of a substrate to an activation temperature or more without heating a shallow portion near the substrate surface more than necessary. This achieves the activation of deep junctions without causing substrate warpage or cracking.

Abstract: An oven is configured with a cooking cavity for receiving a cooking load, a circuit for current supplied by one or more stored energy devices such as rechargeable batteries, and a heater comprising one or more radiant lamps to be driven by the current, the one or more radiant lamps being sized and positioned for heating the cooking load. The lamps are driven by current discharged from the batteries to radiantly heat a cooking load. An application of this stove configuration is in a toaster which is capable of toasting slices of bread in a matter of seconds.

Abstract: A heating apparatus comprises a wall for surrounding and defining a heating space, a heating element mounted on the inner side of the wall, reflecting members for reflecting the heat emitted from the heating element. Also, a moving unit joined to one end of each of the reflecting members for moving the reflecting members. Moreover, pivotal members joined to the reflecting members beside more their respective other side than one side of the reflecting members for controlling as pivots the movement of the reflecting member driven by the moving unit.

Abstract: An article supports a workpiece during thermal processing. At least three elongated support members, e.g., support pins, extend upwardly from an element such as support arms for supporting the workpiece. Each of the support members includes a first portion adjacent to the workpiece. A second portion extends downwardly from the first portion. The first portion can have a thermal response faster than the thermal response of the workpiece and the second portion can have a slower thermal response. A removable element may be mounted to the support member for adjusting the thermal response of the support member. With removable elements, the support members can be adjusted to cause no net transfer of heat to or from the workpiece.

Abstract: A heat treatment apparatus for performing prescribed heat treatment to a subject (W) to be treated is provided with a processing chamber in which air can be exhausted; a mounting table arranged in the processing chamber, for placing on an upper plane the subject to be treated; a plurality of thermoelectric conversion elements arranged on an upper part of the mounting table; a light transmitting window for covering a ceiling portion of the processing chamber airtight; and a gas introduction unit for introducing a required gas into the processing chamber. A heating unit which includes a plurality of heating light sources including a semiconductor light emitting element for emitting heating light to the subject to be treated, is provided above the light transmitting window. Thus, heating efficiency is improved and temperature can be increased and reduced at a higher speed for the subject to be treated.

Abstract: Provided is a fluid heating device capable of suppressing reduction of heating efficiency even if a fluid mainly containing sulfuric acid is heated. The fluid heating device of the present invention is a fluid heating device for heating chemicals mainly containing sulfuric acid, and includes a translucent inner tube 3a composed of quartz or the like; a lamp heater 4 disposed in the inner tube; a translucent outer tube 2 disposed outside the inner tube, which is composed of quartz or the like; translucent side plates 15a and 15b disposed on both sides of the outer tube, which include quartz or the like; and an amorphous carbon pipe 1 disposed between the outer tube and the inner tube, which functions as a light-absorbing material, wherein the amorphous carbon pipe 1 is disposed so as to be brought into contact with chemicals passing through a space between the outer tube and the inner tube.

Abstract: A capacitor, a coil, a flash lamp, and a switching element such as an IGBT are connected in series. A controller outputs a pulse signal to the gate of the switching element. A waveform setter sets the waveform of the pulse signal, based on the contents of input from an input unit. With electrical charge accumulated in the capacitor, a pulse signal is output to the gate of the switching element so that the flash lamp emits light intermittently. A change in the waveform of the pulse signal applied to the switching element will change the waveform of current flowing through the flash lamp and, accordingly, the form of light emission, thereby resulting in a change in the temperature profile for a semiconductor wafer.

Abstract: An apparatus for heat treating a substrate includes a substrate holder unit including a substrate stage on which a substrate is to be placed and which is made of one of a carbon and a carbon covered material, and a heating unit which is provided above the substrate stage and includes a heat dissipation surface opposing the substrate stage, and heats the substrate placed on the substrate stage in noncontact therewith radiation heat from the heat dissipation surface. In addition, a chamber contains the substrate holder unit and the heating unit, and an elevating device vertically moves at least one of the substrate holder unit and the heating unit in the chamber to bring the substrate stage and the heat dissipation surface of the heating unit close to each other or apart from each other. The substrate holder unit includes a radiation plate which is arranged under the substrate stage at a gap therefrom, and a reflection plate which is arranged under the radiation plate at a gap therefrom.

Abstract: A radiant heating for heating the building material in a laser sintering device and a laser sintering device having such a radiant heating are described. The radiant heating has a sheet-like heat radiating element (113, 213, 313), which is characterized in that it is made of a material, that has a low thermal inertia with a thermal diffusivity of preferably more than 1.5·10?4 m2/s and preferably has a thickness of 2 mm or less.

Abstract: The invention relates to a method and to a device for at least locally heating a plate including at least one layer (2) to be at least locally heated by at least one main, light flow pulse, and including at least one priming region (4) located deeply relative to the front surface of said layer to be heated, wherein the main flow (7) is capable of heating said layer to be heated (2) while the temperature of the latter is within a high temperature range (PHT), and a priming a secondary heating means (9) capable of heating said priming region from a temperature within a low temperature range (PBT) up to a temperature within said high temperature range (PHT).

Abstract: A high emissivity coating applied to a sauna heating element and a method for fabricating a sauna heating element with a high emissivity coating is described. In one illustrative embodiment, a sauna heating element comprises a substrate, and a film coating applied to the substrate, the film coating applied as a first liquid layer and a second powder layer. In another illustrative embodiment, a process is provided for fabricating a sauna heating element with a high emissivity coating.

Abstract: A portable, collapsible radiant heater includes a base and a support mounted to the base. The support has a collapsed position wherein the base is configured to at least partially receive the support, and an extended position wherein the support extends upwardly from the base. A heater-head for generating radiant heat is connected to the support. A reflector is mounted to one of the heater-head and the support. The reflector at least partially surrounds the heater-head for downwardly reflecting radiant heat generated by the heater-head. The reflector and heater-head are reciprocally movable between the collapsed position wherein the reflector and heater-head are in close proximity to the base and the extended position wherein the reflector and heater-head are distant from the base.

Abstract: Provided is an electric fireplace comprising adaptations to permit the electric fireplace to accept electrical energy at first rate from an associated AC power supply and adaptations to permit the electric fireplace to output energy at second rate, where the second rate exceeds the first rate.

Abstract: Disclosed is a method and apparatus for concentrated thermal radiation heat transfer from an electrically produced source of light. Whereby, the electromagnetic energy is conveyed from the source through lens assemblies for collection and distribution. The concentrated thermal radiation can be utilized locally or remotely through optical fiber systems. It can be collected on metal or other collecting surfaces and can heat various mediums. The heated medium can then be transferred by way of ventilation, pumps. or natural dispersion. The concentrated heat can be utilized without the use of a collection surface directly into its surroundings. In this embodiment the light from the source can also be put to use without the need for optical fiber systems or other devices. The array of lens assembles and optical fiber systems can be molded together out of plastic, glass, or other materials to minimize the cost of manufacturing.

Abstract: A method of heat-treating a workpiece includes generating an initial heating portion and a subsequent sustaining portion of an irradiance pulse incident on a target surface area of the workpiece. A combined duration of the initial heating portion and the subsequent sustaining portion is less than a thermal conduction time of the workpiece. The initial heating portion heats the target surface area to a desired temperature and the subsequent sustaining portion maintains the target surface area within a desired range from the desired temperature. Another method includes generating such an initial heating portion and subsequent sustaining portion of an irradiance pulse, monitoring at least one parameter indicative of a presently completed amount of a desired thermal process during the irradiance pulse, and modifying the irradiance pulse in response to deviation of the at least one parameter from an expected value.

Abstract: A substrate stage mechanism (10) configured to place a substrate (W) thereon inside a process container of a substrate processing apparatus (100) and having a substrate heating function for heating the substrate (W) includes a substrate table (11) including a base body (11a) configured to place the substrate (W) thereon and a heating element (13) provided to the base body (11a) and configured to heat the substrate (W); a support member (12) having an upper end connected to the substrate table (11) and a lower end attached to the process container; and a heating device (17) configured to heat the support member (12).

Abstract: The present invention relates to a pH sensitive particle, a method of preparation thereof, and a use thereof. More particularly, the invention provides a pH sensitive metal nanoparticle and its use for medical treatment utilizing cell necrosis during photothermal therapy. The pH sensitive metal nanoparticle based on this invention consists of a pH sensitive ligand compound whose charge changes depending on the pH of the metal nanoparticle. The particle can be collected in cells, such as cancer cells which present an abnormal pH environment. The pH sensitive metal nanoparticle based on this invention can induce cell death through a photothermal procedure after aggregation. Therefore, the invention enables medical treatment using cell necrosis for e.g. cancer treatment.

Abstract: A capacitor, a coil, a flash lamp, and a switching element such as an IGBT are connected in series. A controller outputs a pulse signal to the gate of the switching element. A waveform setter sets the waveform of the pulse signal, based on the contents of input from an input unit. With electrical charge accumulated in the capacitor, a pulse signal is output to the gate of the switching element so that the flash lamp emits light intermittently. A change in the waveform of the pulse signal applied to the switching element will change the waveform of current flowing through the flash lamp and, accordingly, the form of light emission, thereby resulting in a change in the temperature profile for a semiconductor wafer.

Abstract: A first flash heating is performed in which a flash lamp emits a first flashing light to a semiconductor wafer having been heated to a first preheating temperature equal to or lower than 650 degrees C. by a light emission from a halogen lamp so that the temperature of a surface of the semiconductor wafer reaches 1000 degrees C. or higher. Then, a second flash heating is performed in which a second flashing light is emitted to the semiconductor wafer having been further heated by a light emission of the halogen lamp. Performing the first flash heating can suppress diffusion of impurity in the subsequent second flash heating. In the second flash heating, the impurity is activated and introduced crystal defects are recovered.

Abstract: In the rapid heat treatment apparatus according to the present invention, the pyrometer comprises a light receiving rod that is used to receive radiated light emitted from a wafer; a light source that is installed to radiate light onto a wafer through the light receiving load; and a light sensing part that receives radiated light reflected after being radiated from the light source to the wafer and light emitted from the wafer to measure the temperature of the wafer, wherein a transparent protective cap is installed on the light receiving load so that the light receiving load is not contaminated by by-products formed after the wafer is heated. According to the present invention, contamination is prevented by the transparent protective cap so that any difficulty experienced from replacing an expensive light receiving rod is eliminated, and the need for initial setting of the pyrometer is also eliminated, so that process downtime is reduced and process efficiency is enhanced.

Abstract: A heating apparatus for heating a target object W is provided with a plurality of heating light sources, including LED elements for applying heating light having a wavelength within a range from 360 to 520 nm to the object. Thus, a temperature of only the shallow surface of the object, such as a semiconductor wafer, is increased/reduced at a high speed in uniform temperature distribution, irrespective of the film type.

Abstract: A heating apparatus including a filament arranged in a vacuum heating vessel comprises a base plate arranged in the vacuum heating vessel to fix the filament at a predetermined position with respect to a conductive heater forming one surface of the vacuum heating vessel. The base plate comprises a plate body having a carbon fiber.

Abstract: There is provided a heat processing furnace capable of quickly increasing and decreasing a temperature, while achieving improvement in durability. A heat processing furnace 2 comprises: a processing vessel 3 for accommodating an object to be processed w and performing thereto a heat process; and a cylindrical heater 5 disposed to surround an outer circumference of the processing vessel 3, for heating the object to be processed w. The heater 5 includes a cylindrical heat insulating member 16, and heating resistors 18 arranged along an inner circumferential surface of the heat insulating member 16. Each of the heating resistors 18 is formed of a strip-shaped member that is bent into a waveform having peak portions and trough portions. Pin members 20 are arranged in the heat insulating member 16 at suitable intervals therebetween, the pin members 20 holding the heating resistor 18 such that the heating resistor 18 is movable in a radial direction of the heater.

Abstract: In combination with a highway tractor of the type having an operator's cab mounted on a frame, a vertical pivotal coupling means coupled to the frame behind the cab adapted to be coupled to a trailer, and an aerodynamic structure at the top of the cab which includes a plurality of LED bulbs and a heat generating element in the front of the aerodynamic structure. A front panel of glass or plastic material having information such as a logo containing letters and/or images located on its first surface, second surface or embedded surface covers the LED bulbs with a weatherproof seal. Light from the LED bulbs provides illumination for the information on the front panel to be viewed from the front of the highway tractor and heat from the heat generating element helps to keep the front panel having information such as a logo free of snow and/or ice.

Abstract: A frying-and-baking oven includes a baking outer pot, a heating cover assembly covering the outer pot, and a frying inner pot disposed between the outer pot and the heat cover assembly. The heating cover assembly includes a cover, an actuator, a hot-air supplying module, and a speed-reducing mechanism. The actuator has a driving shaft. The hot-air supplying module has an air-blowing impeller and a heating element. The driving shaft drives the air-blowing impeller to blow the hot airflow generated by the heating element. The driving shaft also drives a transmission shaft of the speed-reducing mechanism and in turn a stirring member to rotate at a low speed, thereby stirring food materials in the inner pot. With this arrangement, the food materials received in the inner pot can be stirred automatically and cooked sufficiently. Further, the oven can cook the food materials by baking or frying, which increases the functionality and convenience thereof.

Abstract: A filament lamp includes multiple filament assemblies having filaments connected to paired leads, arrayed in order within a light emitting tube and following a tube axis thereof. Each lead is electrically connected in a seal area. Each filament is powered independently. The light emitting tube includes insulating walls or inner tubes between the filaments and leads that have openings through which the leads pass, and located along the tube axis in proximity to the inner wall of the light emitting tube. Multiple lead accommodation spaces corresponding to the number of leads are provided in the light emitting tube by the insulating walls with each lead passing through an opening in the insulating wall and placed without short circuits in its lead accommodation space.

Abstract: A heat treating device including a treatment room for accommodating therein a substrate, a plurality of light sources, which is disposed above the treatment room, for irradiating the substrate, a first reflector, whose inner surface is a reflective surface of a dome shape, for reflecting and directing a part of light emitted from each light source to the substrate, and a plurality of second reflectors, each of which is provided for each light source, for reflecting and focusing light emitted from each light source and directing it to the substrate. The reflective surface of each of the second reflectors is a part of a spheroidal surface or a curved surface approximate to it surrounding a first focal point in such a manner that the first focal point is formed at a position near each light source and a second focal point is formed on a side of the substrate.

Abstract: A radiant heating system comprises a thermally sprayed resistive heating layer bonded to an underlayment building material substrate. The substrate can comprise a sub-flooring material and the heating system can comprise a radiant floor heating system. The resistive heating layer can be thermally sprayed directly onto a sub-floor or similar underlayment material, including cementitious backing material or a sound reduction board. A finished floor surface, such as a tile, wood or laminate surface, can be provided over the substrate and thermally sprayed heater to provide a radiant floor heater. In other embodiments, a radiant heating system includes a thermally sprayed heater bonded to a flooring overlay, such as a laminate board, to a heater insert, such as a flexible polymer film or a mica-based material, or to a concrete substrate. Methods of fabricating radiant heating systems include thermally-spraying a resistive material on a sub-floor or flooring overlay.