With Additional, Spatially Distinct Nonmetal Component Patents (Class 428/621)
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Patent number: 5217817Abstract: A steel substrate is provided with an aluminum intermediate layer and a boron layer. The aluminum intermediate layer provides a substantially improved adhesion of the boron layer. The boron layer is provided by a low-temperature CVD process.Type: GrantFiled: June 11, 1992Date of Patent: June 8, 1993Assignee: U.S. Philips CorporationInventors: Gerrit Verspui, Jacobus M. M. Verheijen, Andre Sikkema
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Patent number: 5200241Abstract: A Si--SiC ceramic layer is bonded to a non-porous SiC substrate with the Si etched from the layer to form a relatively porous surface on the otherwise non-porous high strength SiC substrate. A quartz layer is softened by heating and forced into the pores of the porous layer to form a mechanical bond to the SiC substrate. A refractory metal layer is bonded to the quartz layer to complete the joint. A refractory metal support component is then bonded to the refractory layer whereby the quartz serves as a high strength, high temperature reaction barrier between the metal of the refractory layer and the silicon of the SiC substrate.Type: GrantFiled: May 18, 1989Date of Patent: April 6, 1993Assignee: General Electric CompanyInventors: Herman F. Nied, Richard L. Mehan
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Patent number: 5185211Abstract: A wear and erosion resistant coating for substrates having a non-nitrogen titanium-containing outer surface onto which a non-stoichiometric titanium nitride coating is deposited in which the nitrogen content in the titanium nitride coating is from 32.5 to 47 atomic weight percent.Type: GrantFiled: July 11, 1991Date of Patent: February 9, 1993Assignee: Praxair S.T. Technology, Inc.Inventors: Jiinjen A. Sue, Harden H. Troue
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Patent number: 5164230Abstract: A steel substrate is provided first with an aluminum intermediate layer and then, by a CVD process, with an outer layer of boron.Type: GrantFiled: November 7, 1990Date of Patent: November 17, 1992Assignee: U.S. Philips CorporationInventors: Gerrit Verspui, Jacobus M. M. Verheijen, Andre Sikkema
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Patent number: 5158917Abstract: A method of producing shaped, self-supporting ceramic bodies includes preparing a mold by applying a permeable, conformable material to a shape-defining surface of an expendable pattern. The permeable, conformable material, when set or stable, provides a mold with a shaped surface which is defined by, and is therefore substantially congruent to, the shape-defining surface. Upon heating, the material of the expendable pattern combusts or volatilizes and thus establishes the shaped cavity mold. A molten parent metal is then vaporized with a vapor-phase oxidant in such a manner as to form a ceramic body which grows into the mold cavity, and is shaped by it. The ceramic body is recovered from the mold having a shaped surface replicating the shape-defining surface of the expandable pattern.Type: GrantFiled: October 5, 1990Date of Patent: October 27, 1992Assignee: Lanxide Technology Company, LPInventor: E. Allen LaRoche, Jr.
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Patent number: 5135817Abstract: Zn-Mg alloy is plated by vapor deposition on the surface of metals. Since Zn and Mg are vapor-deposited as a vapor mixture of an optional ratio on the surface of metals, plated layers of excellent corrosion resistance, peeling resistance of coating film, formability, etc. can be formed. There is disclosed a method of forming uniform vapor mixtures of Zn and Mg, and vapor-depositing them on the surface of metals as the method forming the vapor-deposited layers.Type: GrantFiled: October 23, 1990Date of Patent: August 4, 1992Assignee: Kabushiki Kaisha Kobe Seiko ShoInventors: Kazutoshi Shimogori, Hiroshi Satoh, Masao Toyama, Hidetoshi Nishimoto, Koki Ikeda, Junji Kawahuku, Shoji Miyake, Shingo Nomura, Hirohiko Sakai
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Patent number: 5134038Abstract: A magnetic storage medium is composed of a non-wettable substrate upon which a transient liquid metal layer is deposited and maintained as a distribution of discontinuous liquid features. A magnetic film layer is deposited on the transient liquid metal layer resulting in a reaction of the liquid metal with the magnetic film. The topology of the magnetic film is controllable by adjusting the thickness of the transient liquid metal layer.Type: GrantFiled: September 4, 1991Date of Patent: July 28, 1992Assignee: International Business Machines CorporationInventors: Robert J. Baseman, Christopher V. Jahnes, Igor Y. Khandros, Seyyed M. T. Mirzamaani, Michael A. Russak
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Patent number: 5104747Abstract: A joined assembly of a ceramic member and a metallic member having a hollow cylindrical portion which is open at one end thereof, and closed at the other end, or bottom thereof. The ceramic member has a portion fitted in the cylindrical portion in such a way that any stress acting axially upon the surface of the ceramic member may be reduced at least in the vicinity of the open end of the cylindrical portion. The two members are joined together by shrinkage fitting with at least one brazing material filling the clearance between the two members, or by chemical bonding.Type: GrantFiled: October 4, 1990Date of Patent: April 14, 1992Assignee: Kabushiki Kaisha Toyota Chuo KenkyushoInventors: Hiroaki Makino, Nobuo Kamiya, Shigetaka Wada
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Patent number: 5100737Abstract: A multi-layer material comprises at least two layers of flexible material, including one layer based on electrically conductive, expanded recompressed graphite and another layer based on a metal, wherein the layer of graphite has at least one face thereof covered at every point by a layer of metal and in direct electrical contact with the layer of metal, and wherein the layer of metal is obtained by electrodeposition or by chemical deposit of at least one metal on the layer of graphite in such a way that the layer of metal adheres directly to the layer of graphite and closely matches the micro-relief thereof.Type: GrantFiled: November 7, 1990Date of Patent: March 31, 1992Assignee: Le Carbone LorraineInventors: Gabriel Colombier, Philippe Gimenez, Claude Drapier, Michel Moreau
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Patent number: 5100740Abstract: A composite structure comprising a symmetric bimetallic laminate bonded to a separate substrate is provided by eutectic bonding the bimetallic laminate to the substrate. A variety of beneficial structures can be provided.Type: GrantFiled: October 15, 1991Date of Patent: March 31, 1992Assignee: General Electric CompanyInventors: Constantine A. Neugebauer, James F. Burgess, Homer H. Glascock, II
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Patent number: 5098797Abstract: A sacrificial metallic undercoat is provided between the surface of the gas turbine engine stainless steel compressor blade and a protective overcoat of ceramic material.Type: GrantFiled: April 30, 1990Date of Patent: March 24, 1992Assignee: General Electric CompanyInventor: Roger W. Haskell
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Patent number: 5098795Abstract: The invention comprises new materials useful in a wide variety of terrestrial and space applications. In one aspect, the invention comprises a flexible cloth-like material comprising a layer of flexible woven ceramic fabric bonded with a layer of metallic foil. In another aspect, the invention includes a flexible fluid impermeable barrier comprising a flexible woven ceramic fabric layer having metal wire woven therein. A metallic foil layer is incontinuously welded to the woven metal wire. In yet another aspect, the invention includes a material comprising a layer of flexible woven ceramic fabric bonded with a layer of an organic polymer. In still another aspect, the invention includes a rigid fabric structure comprising a flexible woven ceramic fabric and a resinous support material which has been hardened as the direct result of exposure to ultraviolet light. Inventive methods for producing such material are also disclosed.Type: GrantFiled: August 10, 1988Date of Patent: March 24, 1992Assignee: Battelle Memorial InstituteInventors: Brent J. Webb, Zen I. Antoniak, John T. Prater, John G. DeSteese
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Patent number: 5080980Abstract: A ceramic package used for a semiconductor device comprises a ceramic base including a die-bonding area and wire-bonding areas defined. A metal underlayer formed on the die-bonding or wire-bonding areas essentially consists of two-plated layers of: a cobalt layer plated on the ceramic base and a nickel layer plated on the cobalt layer. The underlayer is annealed and, them, a gold-plated layer is formed on the underlayer.Type: GrantFiled: August 31, 1990Date of Patent: January 14, 1992Assignee: Shinko Electric Industries Co., Ltd.Inventors: Noboru Sakaguchi, Shinichi Wakabayashi, Yoshiro Nishiyama, Kunihiko Imai, Yoshikazu Hirabayashi
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Patent number: 5069978Abstract: Two materials having different coefficients of thermal expansion are brazed together by use of an interlayer of expanded metal therebetween. The expanded metal makes point-type contact with the two materials and accommodates stresses resulting from the expansion difference.Type: GrantFiled: October 4, 1990Date of Patent: December 3, 1991Assignee: GTE Products CorporationInventor: Howard Mizuhara
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Patent number: 5068156Abstract: A semiconductor package in which a ceramic substrate is joined to a copper stud by brazing. Between the substrate and the stud, first and second members are each fixed in place with a brazing material. The first member has a thermal expansion coefficient intermediate those of the copper stud and the ceramic substrate for reducing the thermal stress generated in the ceramic substrate. The second member prevents the ceramic substrate from being deformed by thermal stress. If the first member is, e.g., a Cu-W alloy used as the neck on the copper stud, it is possible to reduce the compressive stress generated in the ceramic substrate during cooling after the brazing. Further, the influence on the substrate by bimetallic deformation as a result of the combination of the copper stud and the Cu-W alloy is mitigated by a flexible second member, e.g., a copper foil. Thus, the ceramic substrate is brazed without involving any substantial stress thereon.Type: GrantFiled: September 18, 1990Date of Patent: November 26, 1991Assignee: Mitsubishi Denki Kabushiki KaishaInventor: Toshikazu Ogata
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Patent number: 5064727Abstract: Abradable wall structures for high temperature applications, such as in turbine housings and the like. The wall structures comprise a superalloy metal base plate supporting a superalloy metallic cellular structure, the cells of which are filled to a substantial extent with at least one ceramic core material providing high heat resistance, oxygen barrier and low thermal expansion properties. The invention involves the application of a porous or pore-forming surface composition to provide a corrosion-resistant, erosion-resistant abradable outer surface layer, the softness or porosity of which can be tailored to improve the abradability of the wall structure, while imparting oxidation-, corrosion- and erosion-resistance to the structure. The surface layer composition may comprise metal superalloy, ceramic or cermet base compositions containing fugitive or retained inert filler materials.Type: GrantFiled: January 19, 1990Date of Patent: November 12, 1991Assignee: Avco CorporationInventors: Subhash K. Naik, William H. Doddman
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Patent number: 5061567Abstract: A coated object comprising a glass substrate and an organomineral film, such an an organosilicon compound, deposited upon at least a portion of the glass substrate wherein the coating is of a sufficient thickness and has a sufficient refractive index so as not to absorb energy within the visible spectrum. The object may additionally comprise at least one coating layer interposed upon the substrate beneath the organomineral film to improve the optical properties of the coated object. A method for making the coated object of the invention is described wherein a plasma deposition process is utilized to deposit the organomineral film upon the surface of the glass or glass-based substrate.Type: GrantFiled: April 26, 1990Date of Patent: October 29, 1991Assignee: Saint-Gobain VitrageInventors: Jean-Pierre Brochot, Philippe Sohier, Bruno Ceccaroli
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Patent number: 5055361Abstract: A new and improved bonded ceramic-metal article and the method of making the article is described. The ceramic-metal article comprises a ceramic article, such as a lanthana-strengthened yttria article, bonded to a metal article, such as niobium, by a layer of a brazing material to form a bonded ceramic-metal article. The method of bonding the ceramic article to the metal article comprises placing the brazing alloy, such as a brazing alloy consisting essentially of 63% by weight silver, 35.25% by weight copper, and 1.75% by weight titanium, between the lanthana-strengthened yttria article and the niobium article and heating the layered structure in vacuum at about 50 degrees centigrade above the liquidus temperature of the brazing alloy for a period of about 5 minutes.Type: GrantFiled: March 17, 1989Date of Patent: October 8, 1991Assignee: GTE Laboratories IncorporatedInventors: Edmund M. Dunn, Kang, Shinhoo, George C. Wei
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Patent number: 5049451Abstract: A high-coercivity thin-film magnetic recording medium, and method of producing the medium, is disclosed. The medium has a sputtered chromium underlayer, preferably about 300-1,000 .ANG. thick, and a sputtered magnetic layer, preferably about 200-800 .ANG. thick, composed of an alloy containing between 70-80% cobalt, 10-20% chromium, 3-20% platinum, and 2-10% tantalum, formed on the chromium underlayer. The medium is characterized by high coercivity, resolution, amplitude and loop squareness value, and low bit shift.Type: GrantFiled: December 12, 1990Date of Patent: September 17, 1991Assignee: HMT Technology CorporationInventors: Brij B. Lal, Atef H. Eltoukhy
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Patent number: 5039990Abstract: An article comprising a non-conductive substrate having a sub-micron thickness of an oxidizable conductive first metal coating thereon, and a second (promoter) metal which is galvanically effective to promote the corrosion of the first metal, discontinuously coated on the first metal coating. Optionally, the second metal-doped, first metal-coated substrate may be further coated with a salt, to accelerate the galvanic corrosion reaction by which the conductive first metal coating is oxidized. Also disclosed is a related method of forming such articles, comprising chemical vapor depositing the first metal on the substrate and chemical vapor depositing the second metal on the applied first metal coating, and of optionally applying a salt by salt solution contacting of the second metal-doped, first metal-coated substrate. When utilized in a form comprising fine-diameter substrate elements such as glass or ceramic filaments, the resulting product may be usefully employed as an evanescent chaff.Type: GrantFiled: December 11, 1989Date of Patent: August 13, 1991Assignee: Advanced Technology Materials, Inc.Inventors: Ward C. Stevens, Edward A. Sturm, Delwyn F. Cummings
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Patent number: 5035957Abstract: Disclosed are coated metal articles having protective coatings which are applied to substrate metals by coating the metal surface, e.g. by dipping the substrate metal in a molten alloy of the coating metals, and then exposing the coating at an elevated temperature to an atmosphere containing a reactive gaseous species which forms an oxide, a nitride, a carbide, a boride or a silicide. The coating material is a mixture of the metals M.sub.1 and M.sub.2, M.sub.1 being zirconium and/or titanium, which forms a stable oxide, nitride, carbide, boride or silicide under the prevailing conditions. The metal M.sub.2 does not form a stable oxide, nitride, carbide, boride or silicide. M.sub.2 serves to bond the oxide, etc. of M.sub.1 to the substrate metal. Mixtures of M.sub.1 and/or M.sub.2 metals may be employed. Eutectic alloys of M.sub.1 and M.sub.2 which melt substantially lower than the melting point of the substrate metal are preferred.Type: GrantFiled: February 23, 1990Date of Patent: July 30, 1991Assignee: SRI InternationalInventors: Robert W. Bartlett, Paul J. Jorgensen, Ibrahim M. Allam, David J. Rowcliffe
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Patent number: 5009966Abstract: The invention discloses a coated substrate product comprised of a titanium of titanium alloy substrate, at least one thin interlayer composed of a non-reactive noble metal and a hard outer coating selected from the group comprised of a ceramic, a hard metal, a hard metal compound and a diamond-like carbon, wherein at least the non-reactive noble metal interlayer which is immediately adjacent to the titanium or titanium alloy substrate is deposited onto the substrate by means of an electroless plating procedure, and the hard outer coating is deposited onto the non-reactive interlayer(s) by means of known chemical and physical vapor deposition techniques. The invention also discloses a method for making these coated substrate products.Type: GrantFiled: September 19, 1989Date of Patent: April 23, 1991Inventors: Diwakar Garg, Carl F. Mueller, Leslie E. Schaffer, Paul N. Dyer
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Patent number: 5010053Abstract: A ceramic or glass having a thin layer of silver, gold or alloys thereof at the surface thereof. A first metal is bonded to the thin layer and a second metal is bonded to the first metal. The first metal is selected from the class consisting of In, Ga, Sn, Bi, Zn, Cd, Pb, Tl and alloys thereof, and the second metal is selected from the class consisting of Cu, Al, Pb, An and alloys thereof.Type: GrantFiled: December 19, 1988Date of Patent: April 23, 1991Assignee: Arch Development CorporationInventor: Victor A. Maroni
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Patent number: 5008157Abstract: A metallized article (10) having a non-conductive surface (11) and a plurality of depressions (12) in the surface (11). A first layer of metal (13) being mechanically bonded to the non-conductive surface (11), such that the mechanical bond is enhanced by the interaction of the first layer of metal (13) and the depressions (12). An intermediate layer of metal (14) bonded to the first layer (13). A finish layer of metal (15) being bonded to the intermediate layer (14). The finish layer (15) being a metal which readily accepts a high polish or shine. A process for metallizing such an article having a non-conductive surface including the steps of etching the surface of the article with fluoride containing salts and the depositing of a first layer of metal onto the etched surface. The process further including depositing an intermediate layer of metal in an electroless manner, and then depositing a finish layer of metal by electrolysis.Type: GrantFiled: November 22, 1989Date of Patent: April 16, 1991Inventor: Michael N. Paxos
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Patent number: 5006418Abstract: A decorative mirror, including a transparent sheet; and at least one reflective silver layer comprised of silver deposited on one face of the transparent sheet, wherein a first silver layer of said at least one reflective silver layer has randomly distributed therein areas containing reaction products including non-metallic silver formed by reacting at least a part of the silver of said first silver layer with a substance which reacts with silver to provide reaction products including non-metallic silver so that the visible light reflectance of the decorative mirror is modified or interrupted.Type: GrantFiled: August 28, 1989Date of Patent: April 9, 1991Assignee: GlaverbelInventors: Albert Servais, Bernard Somerhausen
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Patent number: 5004652Abstract: A high-coercivity thin-film magnetic recording medium, and method of producing the medium, is disclosed. The medium has a sputtered chromium underlayer, preferably about 600-1,000 .ANG. thick, and a sputtered magnetic layer, preferably about 200-800 .ANG. thick, composed of an alloy containing between 70-80% cobalt, 10-20% chromium, 8-20% platinum, and 2-10% tantalum, formed on the chromium underlayer. The medium is characterized by high coercivity, resolution, amplitude and loop squareness value, and low bit shift.Type: GrantFiled: August 15, 1990Date of Patent: April 2, 1991Assignee: HMT Technology CorporationInventors: Brij B. Lal, Atef H. Eltoukhy
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Patent number: 5002837Abstract: Zn-Mg alloy is plated by vapor deposition on the surface of metals. Since Zn and Mg are vapor-deposited as a vapor mixture of an optional ratio on the surface of metals, plated layers of excellent corrosion resistance, peeling resistance of coating film, formability, etc. can be formed. There is disclosed a method of forming uniform vapor mixtures of Zn and Mg, and vapor-depositing them on the surface of metals as the method forming the vapor-deposited layers.Type: GrantFiled: January 4, 1989Date of Patent: March 26, 1991Assignee: Kabushiki Kaisha Kobe Seiko ShoInventors: Kazutoshi Shimogori, Hiroshi Satoh, Masao Toyama, Hidetoshi Shimoto, Koki Ikeda, Junji Kawahuku, Shoji Miyake, Shingo Nomura, Hirohiko Sakai
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Patent number: 5001019Abstract: Joined ceramic and metal is characterized by ceramic and metal thermally joined through an intermediate layer. The intermediate layer is composed of 20-70% by weight of silver, 1-20% by weight of palladium, 10-60% by weight of nickel and 1-10% by weight of titanium. The joined ceramic and metal has sufficient joining strength both at normal temperature and at high temperature, because the joined ceramic and metal suffers little deterioration even at high temperature. Since the joined ceramic and metal has the characteristics of ceramic such as resistance to heat, corrosion and wear, it can be used for a structure operated at high temperature such as a gas turbine engine, a turbo charger rotor, a piston, a suction valve, and an exhaust valve.Type: GrantFiled: September 21, 1989Date of Patent: March 19, 1991Assignee: NGK Spark Plug Co., Ltd.Inventors: Masaya Ito, Katsumi Miyama
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Patent number: 4999256Abstract: A microstructurally toughened ceramic-particle-reinforced metal-matrix composite article is disclosed. The article includes discrete regions of ceramic-particulate-reinforced metal matrix which enclosed within and separated from each other by a network of unreinforced metal. The article exhibits high tensile strength, high elastic modulus and high impact resistance.Type: GrantFiled: October 24, 1988Date of Patent: March 12, 1991Assignee: United Technologies CorporationInventors: Karl M. Prewo, Vincent C. Nardone, James R. Strife
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Patent number: 4985310Abstract: Disclosed is a multilayered metallurgical structure for an electronic component. The structure includes a base metallurgy which includes one or more layers of chromium, titanium, zirconium, hafnium, niobium, molybdenum, tantalum, cooper and/or aluminum. Directly on the base metallurgy is a layer of cobalt. The structure may also include a layer of noble or relatively noble metal such as gold, platinum, palladium and/or tin directly on the cobalt.Type: GrantFiled: September 5, 1989Date of Patent: January 15, 1991Assignee: International Business Machines Corp.Inventors: Birendra N. Agarwala, Keith F. Beckman, Alice H. Cooper-Joselow, Chandrasekhar Narayan, Sampath Purushothaman, Sudipta K. Ray
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Patent number: 4983468Abstract: A metallic slide member is disclosed which is advantageously used in combination with an opponent ceramic slide member. The metallic slide member is capable of forming a metal coat lubricating layer on a sliding surface of the ceramic slid member through a metal at a sliding surface of the metallic slide member being transferred onto the ceramic slide member when the metallic slide member slide relative to the ceramic member. Thereby, excellent wear resistance of the metallic slide member can be maintained with respect to the ceramic slide member.Type: GrantFiled: March 21, 1989Date of Patent: January 8, 1991Assignee: NGK Insulators Ltd.Inventor: Isao Oda
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Patent number: 4981761Abstract: A ceramic and metal bonded composite comprising an intermediate metal plate interposed between a ceramic member and a metal member and brazed thereto, the intermediate metal plates carries on its juncture surface a central square projection having substantial area, pins arranged near the four corners and fins between the corners, the central square projection mechanically and thermally couples the ceramic member and the metal member together with the brazing layer and the pins and fins also mechanically and thermally couple the both members together with the brazing layer, while permitting relative displacement between the both members through their plastic deformation, thereby preventing crack generation in the ceramic member.Type: GrantFiled: May 31, 1989Date of Patent: January 1, 1991Assignee: Hitachi, Ltd.Inventors: Takahiko Ookouchi, Hiromi Kagohara
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Patent number: 4980243Abstract: Solders for directly soldering together ceramic parts consisting essentially of 70 to 99% silver, 0.5 to 15% by weight indium or 0.5 to 10% by weight tin and 0.5 to 15% by weight titanium or zirconium, or mixtures thereof. These solders are very ductile, are workable at comparatively low temperatures and provide very firm bonding.Type: GrantFiled: July 7, 1989Date of Patent: December 25, 1990Assignee: Degussa AktiengesellschaftInventors: Willi Malikowski, Wolfgang Weise
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Patent number: 4978586Abstract: The invention relates to a steel substrate with metal coatings for the reinforcement of vulcanizable elastomers, as well as a method for the continuous manufacture of a thus coated substrate and elastomer objects reinforced with said substrate.The substrate is provided with a first coating and a second coating at least covering part of the first one and a bonding layer being present between the two said coatings. The second coating comprises e.g. cobalt that can be applied by plasma sputtering. The coating combination can be easily adapted to the specific elastomer compositions and the reinforcement requirements aimed at.Type: GrantFiled: October 14, 1988Date of Patent: December 18, 1990Assignee: N. V. Bekaert S.A.Inventors: Daniel Chambaere, Wilfred Coppens, Hugo Lievens, Roger De Gryse, Robert Hoogewijs, Joost Vennik, Lucien Fiermans
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Patent number: 4929516Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component for dissipating thermal stresses is disposed between the substrate and the semiconductor die to dissipate stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed between the substrate and the die with a silver-tin sealing composition. A bonding material may be used alone to bond a die to a substrate and dissipate stresses from thermal cycling.Type: GrantFiled: February 10, 1986Date of Patent: May 29, 1990Assignee: Olin CorporationInventors: Michael J. Pryor, Julius C. Fister, Narendra N. Singhdeo, Deepak Mahulikar, Satyam C. Cherukuri
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Patent number: 4917963Abstract: Bonding between a metallic conductor and a substrate is improved by using a primer layer having a graded composition which continuously varies from a composition predominant in a metal which bonds well to the substrate at the substrate-primer layer interface to a composition predominant in the metal of the conductor at the conductor-primer layer interface. Specifically, the bonding characteristics of copper to polyimide substrate are improved by using a chromium-copper graded composition primer layer which is chromium-rich at the substrate-primer layer interface and copper-rich at the conductor-primer layer interface.Type: GrantFiled: October 28, 1988Date of Patent: April 17, 1990Assignee: Andus CorporationInventor: Wilfred C. Kittler
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Patent number: 4917968Abstract: A structure which is resistant to corrosion at high temperatures comprises a ductile layer of a platinum group metal, such as iridium, and a layer of a refractory metal having a high strength at high temperatures, such as rhenium. A solid solution of the two metals is present between and metallurgically bonded to the two metal layers. Further, the structure may include a layer of ceramic such as zirconia or hafnia on the exposed face of the platinum group metal layer.Type: GrantFiled: April 15, 1988Date of Patent: April 17, 1990Assignee: ULTRAMETInventors: Robert H. Tuffias, John Harding, Richard Kaplan
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Patent number: 4896001Abstract: A method and apparatus for protecting an object against adverse electric effects which comprises:applying a continuous multiplicity of layers of a light weight protective continuous wrapper which is metallized on opposite sides and wider than the object, thereby to control the extent of the anti-electric protection.Type: GrantFiled: January 27, 1986Date of Patent: January 23, 1990Assignee: Dennison Manufacturing CompanyInventors: Warren R. Pitts, Richard G. Miekka, Daniel J. White
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Patent number: 4869970Abstract: An electromagnetic radiation attenuating coating comprising an electronic housing base material coating with a first electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus rich in copper and a second electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel land cobalt, and phosphorus rich in nickel. The coating provides superior radiation attenuation and comprises fewer processing steps in its formation.Type: GrantFiled: November 9, 1987Date of Patent: September 26, 1989Assignee: Shipley Company Inc.Inventors: Michael Gulla, Terrell A. Benjamin, Mark Farsi
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Patent number: 4853295Abstract: In the electroplated steel sheets for automobile use, the chipping resistance, water-resistant adhesion, unpainted corrosion resistance, post-painted corrosion resistance, and resistance to secular exposure are improved by superimposing a chemical conversion layer between electroplated layers of zinc and iron, nickel, cobalt, or alloys thereof.Type: GrantFiled: May 13, 1987Date of Patent: August 1, 1989Assignee: Nippon Steel CorporationInventors: Yoshio Shindo, Koichi Wada, Fumio Yamazaki
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Patent number: 4851295Abstract: A composite film is provided which has a first layer of WSi.sub.x, where x is greater than 2, over which is disposed a second layer of a tungsten complex consisting substantially of tungsten with a small amount of silicon therein, typically less than 5%. Both layers are deposited in situ in a cold wall chemical vapor deposition chamber at a substrate temperature of between 500.degree. and 550.degree. C.. Before initiating the deposition process for these first and second layers, the substrate onto which they are to be deposited is first plasma etched with NF.sub.3 as the reactant gas, then with H.sub.2 as the reactant gas, both steps being performed at approximately 100 to 200 volts self-bias. WSi.sub.Type: GrantFiled: November 4, 1986Date of Patent: July 25, 1989Assignee: Genus, Inc.Inventor: Daniel L. Brors
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Patent number: 4849302Abstract: An electrolytically metallized article and process therefore, the process including the steps of electrolytically depositing a metal layer onto a surface of the substrate; and structuring the metal layer to provide regularly distributed openings therein, which openings extend through to the substrate and have an interval between adjacent openings which permits, during any subsequent heat treatment of the metallized substrate, the escape of volatile and volatilizable substances included in the metal layer and the substrate during the electrolyte deposition. The interval between adjacent openings is preferably such that the structured metal layer has no continuous metal portion measured between adjacent openings which exceeds 2 mm.Type: GrantFiled: November 16, 1987Date of Patent: July 18, 1989Assignee: Licentia Patent-Verwaltungs-GmbHInventor: Robert Ostwald
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Patent number: 4844988Abstract: A diamond composite combined with a cobalt-containing substrate, comprising: a sintered mass of diamond, in which practically all the diamond particles are joined immediately with adjacent particles, a mass of cobalt-containing carbide, said latter mass being larger than the former and said first and latter masses being of a same cross section at the opposed ends, and an intermediate layer of a solid material which consists of Mo, Co and C with a minor proportion of inevitable impurities and which comprises a molybdenum carbide exhibiting a melting point within 200 degrees C. of that of the first said carbide material, said layer intervening between the masses and having a total radial cross sectional area of at least 80% but not greater than 97% of that of the diamond mass and carbide masses at the joint and a thickness of, at least, 25 microns over the whole cross sectional area and method for producing the same.Type: GrantFiled: December 22, 1987Date of Patent: July 4, 1989Assignee: The Ishizuka Research Institute, Ltd.Inventors: Hiroshi Ishizuka, Satoshi Hayakawa
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Patent number: 4837089Abstract: A composite sintered compact consisting of a sintered body portion, which contains at least one of high density boron nitride and diamond, and a cermet or metal portion bonded to the sintered body portion through an amorphous metal interposed between the sintered body portion and the cermet or metal portion at their bonding area, has high hardness and strength, and further has excellent handleability, heat resistance and toughness during the whole processes ranging from its production to its consumption.Type: GrantFiled: December 14, 1987Date of Patent: June 6, 1989Assignee: Nippon Oil and Fats Company, LimitedInventors: Masatada Araki, Yutaka Kuroyama
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Patent number: 4828932Abstract: A porous metallic material of the present invention is constructed of a laminate consisting of an expanded metal and a fibrous metallic fiber both of which are pressed to be joined to each other under pressure. This porous metallic material is excellent in bending strength and workability. The porous metallic materials may be laminated to a honeycomb structural element and a rigid plate so as to form a porous structural material. To this porous metallic material may be also laminated a decorative layer so as to form a porous decorative sound absorbing material. The present invention provides the above-mentioned products and method for manufacturing the same.Type: GrantFiled: May 11, 1987Date of Patent: May 9, 1989Assignees: Unix Corporation Ltd., Toru MorimotoInventors: Toru Morimoto, Fumihiro Nakagawa
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Patent number: 4810532Abstract: Hydrogenated boron-silicon alloy films having unexpected properties permitting in one embodiment the bonding together of metal and ceramic substrates by coating the surfaces to be bonded with the film mating the surfaces and heat treating the mated surfaces to expell hydrogen therefrom and to react to resulting boron-silicon alloy film with the substrates to form a liquid reaction product which forms a surface bond with the substrates or is at least partially absorbed in the substrates. In another embodiment, at least one surface of an intermetallic compound formed from elements selected from groups III and V of the periodic table is sealed against structural degradation by forming on the surface a solid boron-silicon-hydrogen alloy film. In still another embodiment, metal and organic resin substrates are protected against attack by water vapor, dissociated oxygen and molecular oxygen by forming a solid boron-silicon-hydrogen alloy film on the substrates.Type: GrantFiled: May 31, 1988Date of Patent: March 7, 1989Assignee: Lockheed Missiles & Space Company, Inc.Inventors: Henry W. Lavendel, John C. Robinson
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Patent number: 4797328Abstract: Soft-solder alloys for connecting ceramic parts without permetallization comprising 86 to 99% lead or tin, 0 to 13% silver and/or copper, 0 to 10% indium and 1 to 10% titanium and/or zirconium.Type: GrantFiled: February 17, 1987Date of Patent: January 10, 1989Assignee: Degussa AktiengesellschaftInventors: Wolfgang Boehm, Juergen Hausselt, Wolfgang Weise, Willi Malikowsik
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Patent number: 4786916Abstract: A thermal head in which a glazed layer, an improved undercoat layer, a heat generating resistor layer, an electrical power supply conductor layer and a protection layer are successively laminated to the surface of an insulating substrate, in which the undercoat layer is composed of an aluminum nitride (AlN) film. The method of manufacturing the thermal head comprises forming the aluminum nitride (AlN) film by sputtering an Al target in a gas mixture of argon and nitrogen and forming the heat generating resistor layer and the electrical power supply conductor layer, that is, three layers in total successively formed by sputtering. Because of the good heat conductivity of aluminum nitride film, the temperature distribution in the heat generating portion is made uniform and localized heat generation can be avoided, as it also prevents the destruction of the heat generating resistor layer or the protection layer due to the temperature difference upon heat generation.Type: GrantFiled: December 2, 1986Date of Patent: November 22, 1988Assignee: Alps Electric Co., Ltd.Inventor: Masakazu Kato
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Patent number: 4764435Abstract: A metal composition usable as a brazing material for bonding a metal to a non-oxide ceramic. The brazing material contains, at least, one or more metals selected from a first group of transition metals consisting of Pt, Pd, Rh, Ir, Ru and Os, and one or more metals selected from a second group of transition metals consisting of Cr, Mn, Fe, Co, Ni and Cu. The material may further contain one or more elements selected from a third group of elements consisting of B, C, Si and P.Type: GrantFiled: June 16, 1986Date of Patent: August 16, 1988Assignee: Nippondenso Co., Ltd.Inventors: Hiroki Hosizaki, Hirofumi Suzuki, Terutaka Kageyama
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Patent number: 4764442Abstract: An electrode for use with an electrophotographic photoconductor comprising a non-aluminum metal layer and an aluminum layer which are successively formed on a substrate, thereby constituting a double-layered electrode, and an electrophotographic photoconductor including the double layered electrode are disclosed.Type: GrantFiled: November 25, 1986Date of Patent: August 16, 1988Assignee: Ricoh Company, Ltd.Inventors: Satoshi Otomura, Hideki Akiyoshi