With Additional, Spatially Distinct Nonmetal Component Patents (Class 428/621)
  • Patent number: 5217817
    Abstract: A steel substrate is provided with an aluminum intermediate layer and a boron layer. The aluminum intermediate layer provides a substantially improved adhesion of the boron layer. The boron layer is provided by a low-temperature CVD process.
    Type: Grant
    Filed: June 11, 1992
    Date of Patent: June 8, 1993
    Assignee: U.S. Philips Corporation
    Inventors: Gerrit Verspui, Jacobus M. M. Verheijen, Andre Sikkema
  • Patent number: 5200241
    Abstract: A Si--SiC ceramic layer is bonded to a non-porous SiC substrate with the Si etched from the layer to form a relatively porous surface on the otherwise non-porous high strength SiC substrate. A quartz layer is softened by heating and forced into the pores of the porous layer to form a mechanical bond to the SiC substrate. A refractory metal layer is bonded to the quartz layer to complete the joint. A refractory metal support component is then bonded to the refractory layer whereby the quartz serves as a high strength, high temperature reaction barrier between the metal of the refractory layer and the silicon of the SiC substrate.
    Type: Grant
    Filed: May 18, 1989
    Date of Patent: April 6, 1993
    Assignee: General Electric Company
    Inventors: Herman F. Nied, Richard L. Mehan
  • Patent number: 5185211
    Abstract: A wear and erosion resistant coating for substrates having a non-nitrogen titanium-containing outer surface onto which a non-stoichiometric titanium nitride coating is deposited in which the nitrogen content in the titanium nitride coating is from 32.5 to 47 atomic weight percent.
    Type: Grant
    Filed: July 11, 1991
    Date of Patent: February 9, 1993
    Assignee: Praxair S.T. Technology, Inc.
    Inventors: Jiinjen A. Sue, Harden H. Troue
  • Patent number: 5164230
    Abstract: A steel substrate is provided first with an aluminum intermediate layer and then, by a CVD process, with an outer layer of boron.
    Type: Grant
    Filed: November 7, 1990
    Date of Patent: November 17, 1992
    Assignee: U.S. Philips Corporation
    Inventors: Gerrit Verspui, Jacobus M. M. Verheijen, Andre Sikkema
  • Patent number: 5158917
    Abstract: A method of producing shaped, self-supporting ceramic bodies includes preparing a mold by applying a permeable, conformable material to a shape-defining surface of an expendable pattern. The permeable, conformable material, when set or stable, provides a mold with a shaped surface which is defined by, and is therefore substantially congruent to, the shape-defining surface. Upon heating, the material of the expendable pattern combusts or volatilizes and thus establishes the shaped cavity mold. A molten parent metal is then vaporized with a vapor-phase oxidant in such a manner as to form a ceramic body which grows into the mold cavity, and is shaped by it. The ceramic body is recovered from the mold having a shaped surface replicating the shape-defining surface of the expandable pattern.
    Type: Grant
    Filed: October 5, 1990
    Date of Patent: October 27, 1992
    Assignee: Lanxide Technology Company, LP
    Inventor: E. Allen LaRoche, Jr.
  • Patent number: 5135817
    Abstract: Zn-Mg alloy is plated by vapor deposition on the surface of metals. Since Zn and Mg are vapor-deposited as a vapor mixture of an optional ratio on the surface of metals, plated layers of excellent corrosion resistance, peeling resistance of coating film, formability, etc. can be formed. There is disclosed a method of forming uniform vapor mixtures of Zn and Mg, and vapor-depositing them on the surface of metals as the method forming the vapor-deposited layers.
    Type: Grant
    Filed: October 23, 1990
    Date of Patent: August 4, 1992
    Assignee: Kabushiki Kaisha Kobe Seiko Sho
    Inventors: Kazutoshi Shimogori, Hiroshi Satoh, Masao Toyama, Hidetoshi Nishimoto, Koki Ikeda, Junji Kawahuku, Shoji Miyake, Shingo Nomura, Hirohiko Sakai
  • Patent number: 5134038
    Abstract: A magnetic storage medium is composed of a non-wettable substrate upon which a transient liquid metal layer is deposited and maintained as a distribution of discontinuous liquid features. A magnetic film layer is deposited on the transient liquid metal layer resulting in a reaction of the liquid metal with the magnetic film. The topology of the magnetic film is controllable by adjusting the thickness of the transient liquid metal layer.
    Type: Grant
    Filed: September 4, 1991
    Date of Patent: July 28, 1992
    Assignee: International Business Machines Corporation
    Inventors: Robert J. Baseman, Christopher V. Jahnes, Igor Y. Khandros, Seyyed M. T. Mirzamaani, Michael A. Russak
  • Patent number: 5104747
    Abstract: A joined assembly of a ceramic member and a metallic member having a hollow cylindrical portion which is open at one end thereof, and closed at the other end, or bottom thereof. The ceramic member has a portion fitted in the cylindrical portion in such a way that any stress acting axially upon the surface of the ceramic member may be reduced at least in the vicinity of the open end of the cylindrical portion. The two members are joined together by shrinkage fitting with at least one brazing material filling the clearance between the two members, or by chemical bonding.
    Type: Grant
    Filed: October 4, 1990
    Date of Patent: April 14, 1992
    Assignee: Kabushiki Kaisha Toyota Chuo Kenkyusho
    Inventors: Hiroaki Makino, Nobuo Kamiya, Shigetaka Wada
  • Patent number: 5100737
    Abstract: A multi-layer material comprises at least two layers of flexible material, including one layer based on electrically conductive, expanded recompressed graphite and another layer based on a metal, wherein the layer of graphite has at least one face thereof covered at every point by a layer of metal and in direct electrical contact with the layer of metal, and wherein the layer of metal is obtained by electrodeposition or by chemical deposit of at least one metal on the layer of graphite in such a way that the layer of metal adheres directly to the layer of graphite and closely matches the micro-relief thereof.
    Type: Grant
    Filed: November 7, 1990
    Date of Patent: March 31, 1992
    Assignee: Le Carbone Lorraine
    Inventors: Gabriel Colombier, Philippe Gimenez, Claude Drapier, Michel Moreau
  • Patent number: 5100740
    Abstract: A composite structure comprising a symmetric bimetallic laminate bonded to a separate substrate is provided by eutectic bonding the bimetallic laminate to the substrate. A variety of beneficial structures can be provided.
    Type: Grant
    Filed: October 15, 1991
    Date of Patent: March 31, 1992
    Assignee: General Electric Company
    Inventors: Constantine A. Neugebauer, James F. Burgess, Homer H. Glascock, II
  • Patent number: 5098797
    Abstract: A sacrificial metallic undercoat is provided between the surface of the gas turbine engine stainless steel compressor blade and a protective overcoat of ceramic material.
    Type: Grant
    Filed: April 30, 1990
    Date of Patent: March 24, 1992
    Assignee: General Electric Company
    Inventor: Roger W. Haskell
  • Patent number: 5098795
    Abstract: The invention comprises new materials useful in a wide variety of terrestrial and space applications. In one aspect, the invention comprises a flexible cloth-like material comprising a layer of flexible woven ceramic fabric bonded with a layer of metallic foil. In another aspect, the invention includes a flexible fluid impermeable barrier comprising a flexible woven ceramic fabric layer having metal wire woven therein. A metallic foil layer is incontinuously welded to the woven metal wire. In yet another aspect, the invention includes a material comprising a layer of flexible woven ceramic fabric bonded with a layer of an organic polymer. In still another aspect, the invention includes a rigid fabric structure comprising a flexible woven ceramic fabric and a resinous support material which has been hardened as the direct result of exposure to ultraviolet light. Inventive methods for producing such material are also disclosed.
    Type: Grant
    Filed: August 10, 1988
    Date of Patent: March 24, 1992
    Assignee: Battelle Memorial Institute
    Inventors: Brent J. Webb, Zen I. Antoniak, John T. Prater, John G. DeSteese
  • Patent number: 5080980
    Abstract: A ceramic package used for a semiconductor device comprises a ceramic base including a die-bonding area and wire-bonding areas defined. A metal underlayer formed on the die-bonding or wire-bonding areas essentially consists of two-plated layers of: a cobalt layer plated on the ceramic base and a nickel layer plated on the cobalt layer. The underlayer is annealed and, them, a gold-plated layer is formed on the underlayer.
    Type: Grant
    Filed: August 31, 1990
    Date of Patent: January 14, 1992
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Noboru Sakaguchi, Shinichi Wakabayashi, Yoshiro Nishiyama, Kunihiko Imai, Yoshikazu Hirabayashi
  • Patent number: 5069978
    Abstract: Two materials having different coefficients of thermal expansion are brazed together by use of an interlayer of expanded metal therebetween. The expanded metal makes point-type contact with the two materials and accommodates stresses resulting from the expansion difference.
    Type: Grant
    Filed: October 4, 1990
    Date of Patent: December 3, 1991
    Assignee: GTE Products Corporation
    Inventor: Howard Mizuhara
  • Patent number: 5068156
    Abstract: A semiconductor package in which a ceramic substrate is joined to a copper stud by brazing. Between the substrate and the stud, first and second members are each fixed in place with a brazing material. The first member has a thermal expansion coefficient intermediate those of the copper stud and the ceramic substrate for reducing the thermal stress generated in the ceramic substrate. The second member prevents the ceramic substrate from being deformed by thermal stress. If the first member is, e.g., a Cu-W alloy used as the neck on the copper stud, it is possible to reduce the compressive stress generated in the ceramic substrate during cooling after the brazing. Further, the influence on the substrate by bimetallic deformation as a result of the combination of the copper stud and the Cu-W alloy is mitigated by a flexible second member, e.g., a copper foil. Thus, the ceramic substrate is brazed without involving any substantial stress thereon.
    Type: Grant
    Filed: September 18, 1990
    Date of Patent: November 26, 1991
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Toshikazu Ogata
  • Patent number: 5064727
    Abstract: Abradable wall structures for high temperature applications, such as in turbine housings and the like. The wall structures comprise a superalloy metal base plate supporting a superalloy metallic cellular structure, the cells of which are filled to a substantial extent with at least one ceramic core material providing high heat resistance, oxygen barrier and low thermal expansion properties. The invention involves the application of a porous or pore-forming surface composition to provide a corrosion-resistant, erosion-resistant abradable outer surface layer, the softness or porosity of which can be tailored to improve the abradability of the wall structure, while imparting oxidation-, corrosion- and erosion-resistance to the structure. The surface layer composition may comprise metal superalloy, ceramic or cermet base compositions containing fugitive or retained inert filler materials.
    Type: Grant
    Filed: January 19, 1990
    Date of Patent: November 12, 1991
    Assignee: Avco Corporation
    Inventors: Subhash K. Naik, William H. Doddman
  • Patent number: 5061567
    Abstract: A coated object comprising a glass substrate and an organomineral film, such an an organosilicon compound, deposited upon at least a portion of the glass substrate wherein the coating is of a sufficient thickness and has a sufficient refractive index so as not to absorb energy within the visible spectrum. The object may additionally comprise at least one coating layer interposed upon the substrate beneath the organomineral film to improve the optical properties of the coated object. A method for making the coated object of the invention is described wherein a plasma deposition process is utilized to deposit the organomineral film upon the surface of the glass or glass-based substrate.
    Type: Grant
    Filed: April 26, 1990
    Date of Patent: October 29, 1991
    Assignee: Saint-Gobain Vitrage
    Inventors: Jean-Pierre Brochot, Philippe Sohier, Bruno Ceccaroli
  • Patent number: 5055361
    Abstract: A new and improved bonded ceramic-metal article and the method of making the article is described. The ceramic-metal article comprises a ceramic article, such as a lanthana-strengthened yttria article, bonded to a metal article, such as niobium, by a layer of a brazing material to form a bonded ceramic-metal article. The method of bonding the ceramic article to the metal article comprises placing the brazing alloy, such as a brazing alloy consisting essentially of 63% by weight silver, 35.25% by weight copper, and 1.75% by weight titanium, between the lanthana-strengthened yttria article and the niobium article and heating the layered structure in vacuum at about 50 degrees centigrade above the liquidus temperature of the brazing alloy for a period of about 5 minutes.
    Type: Grant
    Filed: March 17, 1989
    Date of Patent: October 8, 1991
    Assignee: GTE Laboratories Incorporated
    Inventors: Edmund M. Dunn, Kang, Shinhoo, George C. Wei
  • Patent number: 5049451
    Abstract: A high-coercivity thin-film magnetic recording medium, and method of producing the medium, is disclosed. The medium has a sputtered chromium underlayer, preferably about 300-1,000 .ANG. thick, and a sputtered magnetic layer, preferably about 200-800 .ANG. thick, composed of an alloy containing between 70-80% cobalt, 10-20% chromium, 3-20% platinum, and 2-10% tantalum, formed on the chromium underlayer. The medium is characterized by high coercivity, resolution, amplitude and loop squareness value, and low bit shift.
    Type: Grant
    Filed: December 12, 1990
    Date of Patent: September 17, 1991
    Assignee: HMT Technology Corporation
    Inventors: Brij B. Lal, Atef H. Eltoukhy
  • Patent number: 5039990
    Abstract: An article comprising a non-conductive substrate having a sub-micron thickness of an oxidizable conductive first metal coating thereon, and a second (promoter) metal which is galvanically effective to promote the corrosion of the first metal, discontinuously coated on the first metal coating. Optionally, the second metal-doped, first metal-coated substrate may be further coated with a salt, to accelerate the galvanic corrosion reaction by which the conductive first metal coating is oxidized. Also disclosed is a related method of forming such articles, comprising chemical vapor depositing the first metal on the substrate and chemical vapor depositing the second metal on the applied first metal coating, and of optionally applying a salt by salt solution contacting of the second metal-doped, first metal-coated substrate. When utilized in a form comprising fine-diameter substrate elements such as glass or ceramic filaments, the resulting product may be usefully employed as an evanescent chaff.
    Type: Grant
    Filed: December 11, 1989
    Date of Patent: August 13, 1991
    Assignee: Advanced Technology Materials, Inc.
    Inventors: Ward C. Stevens, Edward A. Sturm, Delwyn F. Cummings
  • Patent number: 5035957
    Abstract: Disclosed are coated metal articles having protective coatings which are applied to substrate metals by coating the metal surface, e.g. by dipping the substrate metal in a molten alloy of the coating metals, and then exposing the coating at an elevated temperature to an atmosphere containing a reactive gaseous species which forms an oxide, a nitride, a carbide, a boride or a silicide. The coating material is a mixture of the metals M.sub.1 and M.sub.2, M.sub.1 being zirconium and/or titanium, which forms a stable oxide, nitride, carbide, boride or silicide under the prevailing conditions. The metal M.sub.2 does not form a stable oxide, nitride, carbide, boride or silicide. M.sub.2 serves to bond the oxide, etc. of M.sub.1 to the substrate metal. Mixtures of M.sub.1 and/or M.sub.2 metals may be employed. Eutectic alloys of M.sub.1 and M.sub.2 which melt substantially lower than the melting point of the substrate metal are preferred.
    Type: Grant
    Filed: February 23, 1990
    Date of Patent: July 30, 1991
    Assignee: SRI International
    Inventors: Robert W. Bartlett, Paul J. Jorgensen, Ibrahim M. Allam, David J. Rowcliffe
  • Patent number: 5009966
    Abstract: The invention discloses a coated substrate product comprised of a titanium of titanium alloy substrate, at least one thin interlayer composed of a non-reactive noble metal and a hard outer coating selected from the group comprised of a ceramic, a hard metal, a hard metal compound and a diamond-like carbon, wherein at least the non-reactive noble metal interlayer which is immediately adjacent to the titanium or titanium alloy substrate is deposited onto the substrate by means of an electroless plating procedure, and the hard outer coating is deposited onto the non-reactive interlayer(s) by means of known chemical and physical vapor deposition techniques. The invention also discloses a method for making these coated substrate products.
    Type: Grant
    Filed: September 19, 1989
    Date of Patent: April 23, 1991
    Inventors: Diwakar Garg, Carl F. Mueller, Leslie E. Schaffer, Paul N. Dyer
  • Patent number: 5010053
    Abstract: A ceramic or glass having a thin layer of silver, gold or alloys thereof at the surface thereof. A first metal is bonded to the thin layer and a second metal is bonded to the first metal. The first metal is selected from the class consisting of In, Ga, Sn, Bi, Zn, Cd, Pb, Tl and alloys thereof, and the second metal is selected from the class consisting of Cu, Al, Pb, An and alloys thereof.
    Type: Grant
    Filed: December 19, 1988
    Date of Patent: April 23, 1991
    Assignee: Arch Development Corporation
    Inventor: Victor A. Maroni
  • Patent number: 5008157
    Abstract: A metallized article (10) having a non-conductive surface (11) and a plurality of depressions (12) in the surface (11). A first layer of metal (13) being mechanically bonded to the non-conductive surface (11), such that the mechanical bond is enhanced by the interaction of the first layer of metal (13) and the depressions (12). An intermediate layer of metal (14) bonded to the first layer (13). A finish layer of metal (15) being bonded to the intermediate layer (14). The finish layer (15) being a metal which readily accepts a high polish or shine. A process for metallizing such an article having a non-conductive surface including the steps of etching the surface of the article with fluoride containing salts and the depositing of a first layer of metal onto the etched surface. The process further including depositing an intermediate layer of metal in an electroless manner, and then depositing a finish layer of metal by electrolysis.
    Type: Grant
    Filed: November 22, 1989
    Date of Patent: April 16, 1991
    Inventor: Michael N. Paxos
  • Patent number: 5006418
    Abstract: A decorative mirror, including a transparent sheet; and at least one reflective silver layer comprised of silver deposited on one face of the transparent sheet, wherein a first silver layer of said at least one reflective silver layer has randomly distributed therein areas containing reaction products including non-metallic silver formed by reacting at least a part of the silver of said first silver layer with a substance which reacts with silver to provide reaction products including non-metallic silver so that the visible light reflectance of the decorative mirror is modified or interrupted.
    Type: Grant
    Filed: August 28, 1989
    Date of Patent: April 9, 1991
    Assignee: Glaverbel
    Inventors: Albert Servais, Bernard Somerhausen
  • Patent number: 5004652
    Abstract: A high-coercivity thin-film magnetic recording medium, and method of producing the medium, is disclosed. The medium has a sputtered chromium underlayer, preferably about 600-1,000 .ANG. thick, and a sputtered magnetic layer, preferably about 200-800 .ANG. thick, composed of an alloy containing between 70-80% cobalt, 10-20% chromium, 8-20% platinum, and 2-10% tantalum, formed on the chromium underlayer. The medium is characterized by high coercivity, resolution, amplitude and loop squareness value, and low bit shift.
    Type: Grant
    Filed: August 15, 1990
    Date of Patent: April 2, 1991
    Assignee: HMT Technology Corporation
    Inventors: Brij B. Lal, Atef H. Eltoukhy
  • Patent number: 5002837
    Abstract: Zn-Mg alloy is plated by vapor deposition on the surface of metals. Since Zn and Mg are vapor-deposited as a vapor mixture of an optional ratio on the surface of metals, plated layers of excellent corrosion resistance, peeling resistance of coating film, formability, etc. can be formed. There is disclosed a method of forming uniform vapor mixtures of Zn and Mg, and vapor-depositing them on the surface of metals as the method forming the vapor-deposited layers.
    Type: Grant
    Filed: January 4, 1989
    Date of Patent: March 26, 1991
    Assignee: Kabushiki Kaisha Kobe Seiko Sho
    Inventors: Kazutoshi Shimogori, Hiroshi Satoh, Masao Toyama, Hidetoshi Shimoto, Koki Ikeda, Junji Kawahuku, Shoji Miyake, Shingo Nomura, Hirohiko Sakai
  • Patent number: 5001019
    Abstract: Joined ceramic and metal is characterized by ceramic and metal thermally joined through an intermediate layer. The intermediate layer is composed of 20-70% by weight of silver, 1-20% by weight of palladium, 10-60% by weight of nickel and 1-10% by weight of titanium. The joined ceramic and metal has sufficient joining strength both at normal temperature and at high temperature, because the joined ceramic and metal suffers little deterioration even at high temperature. Since the joined ceramic and metal has the characteristics of ceramic such as resistance to heat, corrosion and wear, it can be used for a structure operated at high temperature such as a gas turbine engine, a turbo charger rotor, a piston, a suction valve, and an exhaust valve.
    Type: Grant
    Filed: September 21, 1989
    Date of Patent: March 19, 1991
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Masaya Ito, Katsumi Miyama
  • Patent number: 4999256
    Abstract: A microstructurally toughened ceramic-particle-reinforced metal-matrix composite article is disclosed. The article includes discrete regions of ceramic-particulate-reinforced metal matrix which enclosed within and separated from each other by a network of unreinforced metal. The article exhibits high tensile strength, high elastic modulus and high impact resistance.
    Type: Grant
    Filed: October 24, 1988
    Date of Patent: March 12, 1991
    Assignee: United Technologies Corporation
    Inventors: Karl M. Prewo, Vincent C. Nardone, James R. Strife
  • Patent number: 4985310
    Abstract: Disclosed is a multilayered metallurgical structure for an electronic component. The structure includes a base metallurgy which includes one or more layers of chromium, titanium, zirconium, hafnium, niobium, molybdenum, tantalum, cooper and/or aluminum. Directly on the base metallurgy is a layer of cobalt. The structure may also include a layer of noble or relatively noble metal such as gold, platinum, palladium and/or tin directly on the cobalt.
    Type: Grant
    Filed: September 5, 1989
    Date of Patent: January 15, 1991
    Assignee: International Business Machines Corp.
    Inventors: Birendra N. Agarwala, Keith F. Beckman, Alice H. Cooper-Joselow, Chandrasekhar Narayan, Sampath Purushothaman, Sudipta K. Ray
  • Patent number: 4983468
    Abstract: A metallic slide member is disclosed which is advantageously used in combination with an opponent ceramic slide member. The metallic slide member is capable of forming a metal coat lubricating layer on a sliding surface of the ceramic slid member through a metal at a sliding surface of the metallic slide member being transferred onto the ceramic slide member when the metallic slide member slide relative to the ceramic member. Thereby, excellent wear resistance of the metallic slide member can be maintained with respect to the ceramic slide member.
    Type: Grant
    Filed: March 21, 1989
    Date of Patent: January 8, 1991
    Assignee: NGK Insulators Ltd.
    Inventor: Isao Oda
  • Patent number: 4981761
    Abstract: A ceramic and metal bonded composite comprising an intermediate metal plate interposed between a ceramic member and a metal member and brazed thereto, the intermediate metal plates carries on its juncture surface a central square projection having substantial area, pins arranged near the four corners and fins between the corners, the central square projection mechanically and thermally couples the ceramic member and the metal member together with the brazing layer and the pins and fins also mechanically and thermally couple the both members together with the brazing layer, while permitting relative displacement between the both members through their plastic deformation, thereby preventing crack generation in the ceramic member.
    Type: Grant
    Filed: May 31, 1989
    Date of Patent: January 1, 1991
    Assignee: Hitachi, Ltd.
    Inventors: Takahiko Ookouchi, Hiromi Kagohara
  • Patent number: 4980243
    Abstract: Solders for directly soldering together ceramic parts consisting essentially of 70 to 99% silver, 0.5 to 15% by weight indium or 0.5 to 10% by weight tin and 0.5 to 15% by weight titanium or zirconium, or mixtures thereof. These solders are very ductile, are workable at comparatively low temperatures and provide very firm bonding.
    Type: Grant
    Filed: July 7, 1989
    Date of Patent: December 25, 1990
    Assignee: Degussa Aktiengesellschaft
    Inventors: Willi Malikowski, Wolfgang Weise
  • Patent number: 4978586
    Abstract: The invention relates to a steel substrate with metal coatings for the reinforcement of vulcanizable elastomers, as well as a method for the continuous manufacture of a thus coated substrate and elastomer objects reinforced with said substrate.The substrate is provided with a first coating and a second coating at least covering part of the first one and a bonding layer being present between the two said coatings. The second coating comprises e.g. cobalt that can be applied by plasma sputtering. The coating combination can be easily adapted to the specific elastomer compositions and the reinforcement requirements aimed at.
    Type: Grant
    Filed: October 14, 1988
    Date of Patent: December 18, 1990
    Assignee: N. V. Bekaert S.A.
    Inventors: Daniel Chambaere, Wilfred Coppens, Hugo Lievens, Roger De Gryse, Robert Hoogewijs, Joost Vennik, Lucien Fiermans
  • Patent number: 4929516
    Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component for dissipating thermal stresses is disposed between the substrate and the semiconductor die to dissipate stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed between the substrate and the die with a silver-tin sealing composition. A bonding material may be used alone to bond a die to a substrate and dissipate stresses from thermal cycling.
    Type: Grant
    Filed: February 10, 1986
    Date of Patent: May 29, 1990
    Assignee: Olin Corporation
    Inventors: Michael J. Pryor, Julius C. Fister, Narendra N. Singhdeo, Deepak Mahulikar, Satyam C. Cherukuri
  • Patent number: 4917963
    Abstract: Bonding between a metallic conductor and a substrate is improved by using a primer layer having a graded composition which continuously varies from a composition predominant in a metal which bonds well to the substrate at the substrate-primer layer interface to a composition predominant in the metal of the conductor at the conductor-primer layer interface. Specifically, the bonding characteristics of copper to polyimide substrate are improved by using a chromium-copper graded composition primer layer which is chromium-rich at the substrate-primer layer interface and copper-rich at the conductor-primer layer interface.
    Type: Grant
    Filed: October 28, 1988
    Date of Patent: April 17, 1990
    Assignee: Andus Corporation
    Inventor: Wilfred C. Kittler
  • Patent number: 4917968
    Abstract: A structure which is resistant to corrosion at high temperatures comprises a ductile layer of a platinum group metal, such as iridium, and a layer of a refractory metal having a high strength at high temperatures, such as rhenium. A solid solution of the two metals is present between and metallurgically bonded to the two metal layers. Further, the structure may include a layer of ceramic such as zirconia or hafnia on the exposed face of the platinum group metal layer.
    Type: Grant
    Filed: April 15, 1988
    Date of Patent: April 17, 1990
    Assignee: ULTRAMET
    Inventors: Robert H. Tuffias, John Harding, Richard Kaplan
  • Patent number: 4896001
    Abstract: A method and apparatus for protecting an object against adverse electric effects which comprises:applying a continuous multiplicity of layers of a light weight protective continuous wrapper which is metallized on opposite sides and wider than the object, thereby to control the extent of the anti-electric protection.
    Type: Grant
    Filed: January 27, 1986
    Date of Patent: January 23, 1990
    Assignee: Dennison Manufacturing Company
    Inventors: Warren R. Pitts, Richard G. Miekka, Daniel J. White
  • Patent number: 4869970
    Abstract: An electromagnetic radiation attenuating coating comprising an electronic housing base material coating with a first electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus rich in copper and a second electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel land cobalt, and phosphorus rich in nickel. The coating provides superior radiation attenuation and comprises fewer processing steps in its formation.
    Type: Grant
    Filed: November 9, 1987
    Date of Patent: September 26, 1989
    Assignee: Shipley Company Inc.
    Inventors: Michael Gulla, Terrell A. Benjamin, Mark Farsi
  • Patent number: 4853295
    Abstract: In the electroplated steel sheets for automobile use, the chipping resistance, water-resistant adhesion, unpainted corrosion resistance, post-painted corrosion resistance, and resistance to secular exposure are improved by superimposing a chemical conversion layer between electroplated layers of zinc and iron, nickel, cobalt, or alloys thereof.
    Type: Grant
    Filed: May 13, 1987
    Date of Patent: August 1, 1989
    Assignee: Nippon Steel Corporation
    Inventors: Yoshio Shindo, Koichi Wada, Fumio Yamazaki
  • Patent number: 4851295
    Abstract: A composite film is provided which has a first layer of WSi.sub.x, where x is greater than 2, over which is disposed a second layer of a tungsten complex consisting substantially of tungsten with a small amount of silicon therein, typically less than 5%. Both layers are deposited in situ in a cold wall chemical vapor deposition chamber at a substrate temperature of between 500.degree. and 550.degree. C.. Before initiating the deposition process for these first and second layers, the substrate onto which they are to be deposited is first plasma etched with NF.sub.3 as the reactant gas, then with H.sub.2 as the reactant gas, both steps being performed at approximately 100 to 200 volts self-bias. WSi.sub.
    Type: Grant
    Filed: November 4, 1986
    Date of Patent: July 25, 1989
    Assignee: Genus, Inc.
    Inventor: Daniel L. Brors
  • Patent number: 4849302
    Abstract: An electrolytically metallized article and process therefore, the process including the steps of electrolytically depositing a metal layer onto a surface of the substrate; and structuring the metal layer to provide regularly distributed openings therein, which openings extend through to the substrate and have an interval between adjacent openings which permits, during any subsequent heat treatment of the metallized substrate, the escape of volatile and volatilizable substances included in the metal layer and the substrate during the electrolyte deposition. The interval between adjacent openings is preferably such that the structured metal layer has no continuous metal portion measured between adjacent openings which exceeds 2 mm.
    Type: Grant
    Filed: November 16, 1987
    Date of Patent: July 18, 1989
    Assignee: Licentia Patent-Verwaltungs-GmbH
    Inventor: Robert Ostwald
  • Patent number: 4844988
    Abstract: A diamond composite combined with a cobalt-containing substrate, comprising: a sintered mass of diamond, in which practically all the diamond particles are joined immediately with adjacent particles, a mass of cobalt-containing carbide, said latter mass being larger than the former and said first and latter masses being of a same cross section at the opposed ends, and an intermediate layer of a solid material which consists of Mo, Co and C with a minor proportion of inevitable impurities and which comprises a molybdenum carbide exhibiting a melting point within 200 degrees C. of that of the first said carbide material, said layer intervening between the masses and having a total radial cross sectional area of at least 80% but not greater than 97% of that of the diamond mass and carbide masses at the joint and a thickness of, at least, 25 microns over the whole cross sectional area and method for producing the same.
    Type: Grant
    Filed: December 22, 1987
    Date of Patent: July 4, 1989
    Assignee: The Ishizuka Research Institute, Ltd.
    Inventors: Hiroshi Ishizuka, Satoshi Hayakawa
  • Patent number: 4837089
    Abstract: A composite sintered compact consisting of a sintered body portion, which contains at least one of high density boron nitride and diamond, and a cermet or metal portion bonded to the sintered body portion through an amorphous metal interposed between the sintered body portion and the cermet or metal portion at their bonding area, has high hardness and strength, and further has excellent handleability, heat resistance and toughness during the whole processes ranging from its production to its consumption.
    Type: Grant
    Filed: December 14, 1987
    Date of Patent: June 6, 1989
    Assignee: Nippon Oil and Fats Company, Limited
    Inventors: Masatada Araki, Yutaka Kuroyama
  • Patent number: 4828932
    Abstract: A porous metallic material of the present invention is constructed of a laminate consisting of an expanded metal and a fibrous metallic fiber both of which are pressed to be joined to each other under pressure. This porous metallic material is excellent in bending strength and workability. The porous metallic materials may be laminated to a honeycomb structural element and a rigid plate so as to form a porous structural material. To this porous metallic material may be also laminated a decorative layer so as to form a porous decorative sound absorbing material. The present invention provides the above-mentioned products and method for manufacturing the same.
    Type: Grant
    Filed: May 11, 1987
    Date of Patent: May 9, 1989
    Assignees: Unix Corporation Ltd., Toru Morimoto
    Inventors: Toru Morimoto, Fumihiro Nakagawa
  • Patent number: 4810532
    Abstract: Hydrogenated boron-silicon alloy films having unexpected properties permitting in one embodiment the bonding together of metal and ceramic substrates by coating the surfaces to be bonded with the film mating the surfaces and heat treating the mated surfaces to expell hydrogen therefrom and to react to resulting boron-silicon alloy film with the substrates to form a liquid reaction product which forms a surface bond with the substrates or is at least partially absorbed in the substrates. In another embodiment, at least one surface of an intermetallic compound formed from elements selected from groups III and V of the periodic table is sealed against structural degradation by forming on the surface a solid boron-silicon-hydrogen alloy film. In still another embodiment, metal and organic resin substrates are protected against attack by water vapor, dissociated oxygen and molecular oxygen by forming a solid boron-silicon-hydrogen alloy film on the substrates.
    Type: Grant
    Filed: May 31, 1988
    Date of Patent: March 7, 1989
    Assignee: Lockheed Missiles & Space Company, Inc.
    Inventors: Henry W. Lavendel, John C. Robinson
  • Patent number: 4797328
    Abstract: Soft-solder alloys for connecting ceramic parts without permetallization comprising 86 to 99% lead or tin, 0 to 13% silver and/or copper, 0 to 10% indium and 1 to 10% titanium and/or zirconium.
    Type: Grant
    Filed: February 17, 1987
    Date of Patent: January 10, 1989
    Assignee: Degussa Aktiengesellschaft
    Inventors: Wolfgang Boehm, Juergen Hausselt, Wolfgang Weise, Willi Malikowsik
  • Patent number: 4786916
    Abstract: A thermal head in which a glazed layer, an improved undercoat layer, a heat generating resistor layer, an electrical power supply conductor layer and a protection layer are successively laminated to the surface of an insulating substrate, in which the undercoat layer is composed of an aluminum nitride (AlN) film. The method of manufacturing the thermal head comprises forming the aluminum nitride (AlN) film by sputtering an Al target in a gas mixture of argon and nitrogen and forming the heat generating resistor layer and the electrical power supply conductor layer, that is, three layers in total successively formed by sputtering. Because of the good heat conductivity of aluminum nitride film, the temperature distribution in the heat generating portion is made uniform and localized heat generation can be avoided, as it also prevents the destruction of the heat generating resistor layer or the protection layer due to the temperature difference upon heat generation.
    Type: Grant
    Filed: December 2, 1986
    Date of Patent: November 22, 1988
    Assignee: Alps Electric Co., Ltd.
    Inventor: Masakazu Kato
  • Patent number: 4764435
    Abstract: A metal composition usable as a brazing material for bonding a metal to a non-oxide ceramic. The brazing material contains, at least, one or more metals selected from a first group of transition metals consisting of Pt, Pd, Rh, Ir, Ru and Os, and one or more metals selected from a second group of transition metals consisting of Cr, Mn, Fe, Co, Ni and Cu. The material may further contain one or more elements selected from a third group of elements consisting of B, C, Si and P.
    Type: Grant
    Filed: June 16, 1986
    Date of Patent: August 16, 1988
    Assignee: Nippondenso Co., Ltd.
    Inventors: Hiroki Hosizaki, Hirofumi Suzuki, Terutaka Kageyama
  • Patent number: 4764442
    Abstract: An electrode for use with an electrophotographic photoconductor comprising a non-aluminum metal layer and an aluminum layer which are successively formed on a substrate, thereby constituting a double-layered electrode, and an electrophotographic photoconductor including the double layered electrode are disclosed.
    Type: Grant
    Filed: November 25, 1986
    Date of Patent: August 16, 1988
    Assignee: Ricoh Company, Ltd.
    Inventors: Satoshi Otomura, Hideki Akiyoshi