Abstract: Described is an article comprising a biaxially textured metal substrate and a layer of palladium deposited on at least one major surface of the metal substrate; wherein the palladium layer has desired in-plane and out-of-plane crystallographic orientations, which allow subsequent layers that are applied on the article to also have the desired orientations.

Abstract: To provide a composite material member for semiconductor device, an insulated semiconductor device and non-insulated semiconductor device using the composite material member, which are effective for obtaining a semiconductor device that alleviates thermal stress or thermal strain occurring during production or operation, has no possibilities of deformation, degeneration and rupture of each member, and is highly reliably and inexpensive. The composite material member for semiconductor device is characterized by being a composite metal plate with particles composed of cuprous oxide dispersed in a copper matrix, in which a surface of the composite metal plate is covered with a metal layer, and a copper layer with thickness of 0.5 &mgr;m or larger exists in an interface formed by the composite metal plate and the metal layer.

Abstract: In a heat shield (1), in particular for combustion chambers and for thermal fluid flow machines, the heat shield consists of a feltlike material (3) composed of compressed and sintered intermetallic fibers. Advantageously, the intermetallic fibers consist of an iron based or nickel based intermetallic phase.

Abstract: The object of the present invention is to provide a copper clad laminate with a copper-plated circuit layer, and a method for manufacturing a printed wiring board that excels the conventional ones in the aspect ratio of a circuit pattern when processed to a printed wiring board comprising a fine-pitch circuit. The object of the present invention is achieved by manufacturing a printed wiring board with the use of a copper clad laminate with a copper-plated circuit layer characterized by a copper-plated circuit layer and an outer-layer copper foil layer that satisfied the relationship in a case where a specific etchant is used, the R v value (Vsc/Vsp), which is the ratio of the dissolution rate (Vsp) of deposited copper that constitutes said copper-plated circuit layer to the dissolution rate (Vsc) of copper that constitutes said outer-layer copper foil layer, is 1.0 or more.

Abstract: A semiconductor-supporting device comprising a substrate made of an insulating material, a conductive member buried in the substrate, and a terminal connected to the conductive member and made of an electrically conductive metallic matrix-ceramic composite body.

Abstract: Lubricative stainless steel sheet and pipe having a chromate film on at least one of the surfaces of a stainless steel sheet or pipe substrate, the chromate film having an amount of adhered Cr of 5 to 100 mg/m2, and, on the chromate film, a lubricant film obtained by applying, on the chromate film, a water-base coating containing (a) a urethane resin of ether-ester type having a skeleton of bisphenol type, a skeleton of ester, and a carboxyl group, (b) an epoxy resin, and (c) a polyolefin wax, and baking the applied coating, the sum of the amount of the urethane resin of (a) and the epoxy resin of (b) being 70 to 95% by weight of the total solids of the coating, the amount of the polyolefin wax of (c) being 5 to 30% by weight of the total solids of the coating, and the lubricant film having a thickness of 0.5 to 5 micrometers and a Vickers hardness of at least 15. A method of producing a lubricative stainless steel pipe is also disclosed.

Abstract: An electrode substrate comprises a backing substrate carrying thereon a metal electrode layer and/or a recording layer, the layer or layers having a smooth surface area with a surface roughness of less than 1 nm by more than 1 &mgr;m2. The smooth surface of the metal electrode layer and/or the recording layer is formed by firstly forming the layer on another substrate having a corresponding smooth surface and then peeling the another substrate off the layer after the layer is bonded to the surface of the backing substrate, whereby the smooth surface profile of the another substrate is transferred to the surface of the layer formed on the backing substrate.

Abstract: Ion exchange membrane-based sensors, actuators and sensor/actuators and methods of making same for applications requiring sensing, actuating and controlling displacement. Sensors, actuators, and sensor/actuators are useful in biological as well as other applications. Encapsulation of the sensors, actuators, or sensor/actuators further increases the utility of the present invention. Devices according to the present invention made using lithium are preferred over those made using only sodium.

Abstract: The present invention comprises a method of manufacturing a brazed body. The method comprises forming a multi-layer assembly comprising: a first material capable of forming a first oxide and having a melting temperature higher than 660° C.; a first reducing metal adjacent the first material, the reducing metal capable of reducing at least a portion of the first oxide on the first material a braze adjacent to the reducing metal; and a second material adjacent the braze, the second material comprising a material having a melting temperature higher than 660° C. The method then comprises creating a vacuum around the assembly, and heating the assembly to melt the reducing metal and the braze. The assembly is then subject to cooling to thereby form the brazed body.

Abstract: A composite tube for a gun barrel consists of: an inner tubular metal liner defining a longitudinal bore axis; a resin matrix material surrounding the liner, the resin matrix material containing a plurality of elongate carbon fibers, the carbon fibers being aligned parallel with the longitudinal bore axis of the liner and under compression along the longitudinal bore axis; a muzzle piece attached to the muzzle end of the barrel; and a breech piece attached to the breech end of the barrel, so that any vibrations transmitted along the longitudinal bore axis of the liner are absorbed by the resin matrix material and so that any vibrations reaching the muzzle piece and breech piece are reflected back into the resin matrix material and thus absorbed.

Abstract: A shield for attenuating the strength and density of electromagnetic radiation emitted by electronic components includes two parallel conductors separated by an insulator. The shields are installed on the surface of electronic components by an adhesive.

Abstract: An electrostatic self-assembly method of fabricating electrostrictive and piezoelectric thin film assemblies not only provides a thinner film than is attainable by conventional methods, but provides excellent molecular-level uniformity and precise structural control, and thus large, effective piezoelectric coefficients. The method produces a thin film assembly including (a) a substrate, and (b) a film having one or a plurality of layers disposed upon the substrate, wherein at least one of the layers includes a dipolar material, and this layer of dipolar material has a uniform thickness of at most 500 nm.

Abstract: In order to produce a wire electrode having a core consisting of a copper/zinc alloy and to produce a specific sheath layer, the sheath layer is coated onto the core at a temperature at which no diffusion occurs. The wire electrode is subsequently heated at a heating speed higher than 10° C. per second, briefly annealed at temperatures above 500° C. and subsequently cooled again very rapidly at cooling speeds higher than 10° C. per second.

Abstract: A superconducting element comprising a high temperature superconducting film deposited on a stainless steel substrate that includes a composition of nickel; chromium; silicon; manganese; and iron. Optionally, carbon; phosphorous; sulfur; nitrogen; and unavoidable impurities will be present.

Abstract: This invention provides a Group III-V compound semiconductor that is free from the limitation of the shape and the size, is economical, is excellent in photo-electric characteristics (photo-electric conductivity photo-electromotive current, photo-electromotive force, quantum efficiency), can freely select the optical gap over a broad range, has high performance as a photo-semiconductor, has limited change with time, and is excellent in response, environmental resistance characteristics and high temperature resistance. The Group III-V compound semiconductor contains a Group III element and a Group V element of the Periodic Table as principal components, and contains also 0.1 atom % to 40 atom % of hydrogen atoms and 100 ppm to 20 atom %, based on the sum of the atomic numbers of the Group III element and the Group V element, of at least one element selected from among Be, Mg, Ca, Zn and Sr.

Abstract: A chromium-free agent for treating metallic surface comprising the following (i)-(iv):

Abstract: A coating for an article includes coating encapsulated micro-spheres which maintain the coating in a fluid state. The coating encapsulated micro-spheres are retained in the coating to form a matrix of hardened coating and coating encapsulated micro-spheres. Damage to the coating form a fissure which breaks open the coating encapsulated micro-spheres adjacent the fissure. The broken coating encapsulated micro-spheres release the fluid coating material contained therein. Because the coating encapsulated micro-spheres release the encapsulated coating material in the fluid state the coating material flows into the fissure to coat the exposed substrate. This provides a “self-healing” ability to the coating which protects the substrate even after the coating is damaged.

Abstract: Copper matrix composites reinforced with continuous SiC and/or boron fibers.

Abstract: An article that is particularly well suited for use as a gas turbine engine component has a ceramic thermal insulation layer overlaying a bonding layer. The bonding layer is an alloy comprising iron, cobalt and/or nickel and either: the following group 1 elements (by weight percent): Chromium: 3% to 50% Aluminum: 3% to 20% Yttrium and/or a rare-earth element: 0.01% to 0.5% Lanthanum: 0.1% to 10% Hafnium: 0 to 10% Magnesium: 0 to 10% Silicon: 0 to 2%, or the following group 2 elements (by weight percent): Chromium: 3% to 50% Aluminum: 3% to 20% Yttrium and/or a rare-earth element: 0 to 0.5% Lanthanum: 0.1% to 10% Hafnium: 0.1% to 10% Magnesium: 0 to 10% Silicon: 0 to 2%.

Abstract: A nickel based single crystal superalloy comprising 6-11 wt % cobalt, 4.7-5.7 wt % chromium, 2.4-3.0 wt % molybdenum, 3.0-3.8 wt % tungsten, 3.0-3.8 wt % rhenium, 5.5-7.0 wt % aluminium, 5.0-6.0 wt % tantalum, 0.5-1.0 wt % niobium, 0-0.2 wt % hafnium, 0-150 ppm carbon, 0-100 ppm yttrium, 0-100 ppm lanthanum, 0-5 ppm sulphur and the balance nickel plus incidental impurities. The nickel based single crystal superalloy is suitable for use as a gas turbine engine turbine blade or turbine vane. It is of particular use on cooled turbine blades and turbine vanes which have ceramic thermal barrier coatings, because the superalloy is compatible with the ceramic thermal barrier coating to minimize spalling. The superalloy has lower density than other second generation single crystal superalloys but similar creep strength and oxidation resistance.

Abstract: A metal-ceramic joint assembly in which a brazing alloy is situated between metallic and ceramic members. The metallic member is either an aluminum-containing stainless steel, a high chromium-content ferritic stainless steel or an iron nickel alloy with a corrosion protection coating. The brazing alloy, in turn, is either an Au-based or Ni-based alloy with a brazing temperature in the range of 9500 to 1200° C.

Abstract: A repair process for superalloy articles is described. Worn or cracked or otherwise defective areas at the surface of a superalloy component are repaired using vapor deposition to apply a repair filler material to the defect.

Abstract: A multiphase dielectric composition for a multilayered ceramic device (10), and devices incorporating the same, including a (SrCa)TiO3 dielectric powder and a glass that is substantially free of lead having a weight ratio of about 35 to about 65 parts powder: about 65 to about 35 parts glass, and having a particle size of about 1 to about 2.5 micron (um) and having a dielectric constant (K) of about 18 to about 30 and an electrical Q of at least about 300 to about 550.

Abstract: Mechanical assembly of magnesium alloy with steel or titanium/titanium alloy parts. Because the two major metal parts in the assembly have incompatible ionization energies, a part made from aluminum or zinc alloy, the ionization energy of which in intermediary between the two, or an electric insulator intervenes to prevent electrolytic corrosion between them. Furthermore, clearances between the two major metal parts, owing for example to manufacturing tolerances, are injected with filler. The mechanical assembly may be employed in human-powered rotary machines such as spinning reels and bicycle components.

Abstract: In a surface electrode structure on a ceramic multi-layer substrate having on the surface SAW device mounting surface electrodes for mounting flip chips 30 as surface-acoustic-wave devices by gold-gold bonding and soldered parts mounting surface electrodes, at least the lowermost layer is made of a sintered silver conductor 51 which is partly buried in the ceramic multi-layer substrate 40, a nickel or a nickel alloy layer 52 being contained as an intermediate layer, and the topmost layer being a gold layer 53. Thus, it is provided a surface electrode structure on a ceramic multi-layer substrate that is suitable for both mounting of SAW devices by gold-gold bonding and mounting of other parts by soldering and which enable consistent mounting of individual parts using a ceramic multi-layer substrate to provide higher reliability.

Abstract: A multi-layered structure material composed of a substrate of heat resistance material and a plurality of metal layers formed on at least one surface of the substrate through a pin-holeless intermediate metal layer of melting ppoint lower than that of the metal layers.

Abstract: A coated article is prepared by furnishing an nickel-base article substrate having a free sulfur content of more than 0 but less than about 1 part per million by weight. A protective layer is formed at a surface of the article substrate. The protective layer includes a platinum aluminide diffusion coating. The protective layer may be substantially yttrium-free, or have a controlled amount of yttrium. A ceramic layer may overlie the protective layer.

Abstract: The method for applying a zinc-based anticorrosion layer for reinforced concrete is characterized in that a layer consists of at least two layers, of which the first layer, directly sprayed on the concrete, is made of pure zinc and the second layer sprayed thereon is made of a zinc/alumimum alloy.

Abstract: Provided is a composite member comprising a ceramic base and a metallic member which are bonded to each other. An active metal foil is disposed on the surface of the ceramic base and a solder material comprising Au or a solder material comprising an Au-Ag alloy is disposed on the active metal foil, the active metal foil and the solder material are heated to form a bonding layer, the metallic member is disposed on the surface of the bonding layer, and these are pressed and heated to bond the bonding layer and the metallic member through solid phase bonding. Since in this composite member the bonding layer and the metallic member are bonded by solid phase bonding, the composite members can be effectively inhibited from breakage caused by residual stress at the time of bonding and, besides, is excellent in thermal cycle characteristics and thermal shock characteristics.

Abstract: Disclosed are compositions of matter which include a thin metallic and/or metallic oxide, nitride, carbide, silicide, boride, or sulfide coating disposed directly upon a polymeric substrate, in the absence of a carrier layer for the thin coating. Also disclosed are methods to make the composition and an apparatus to practice the method.

Abstract: A metal article which includes a protective coating system is described. The coating system includes a braze alloy layer and a plasma-sprayed bond coat. The bond coat may lie on top of the braze alloy layer, or the braze alloy layer may lie on top of the bond coat. In the case of a porous bond coat, partial or complete densification of the bond coat is sometimes carried out. Densification is achieved by heat treating the article, so that the braze alloy material migrates into the pores of the bond coat to a selected thickness. Related processes are also described.

Abstract: A bonding method for bonding one member having a dented portion and a second different member having an engaging protruding portion with an adhesive composition having a controlled coefficient of expansion and the resultant composite product. Three alternative techniques are used to first apply a hard solder in contact with a layer of fine particles between the two members. Then a final heating is applied under pressure to melt the hard solder. The resulting bonding layer bonds the two different fitting members.

Abstract: An article includes a substrate and an adhesion layer overlying the substrate. The adhesion layer includes a first phase including particles, and a second phase including braze alloy that bonds the particles to the substrate. The article further includes a ceramic layer overlying the adhesion layer. In one embodiment, the ceramic layer is a thermal barrier coating (TBC), formed of stabilized zirconia (ZrO2).

Abstract: A method of providing a roughened bond coat, for example in a thermal barrier coating system, comprises providing an oxidation-resistant plasma-sprayed layer onto a substrate and disposing a slurry overlayer on the oxidation-resistant plasma-sprayed layer. These steps form a roughened bond coat possessing an uneven, undulated, and irregular surface. A roughened bond coat in a thermal barrier coating system reduces de-bonding of the bond coat and a thermal barrier coating layer, which is desirable to maintain the insulation features of the thermal barrier coating system.

Abstract: An electronic component includes external electrodes formed on a base member, each external electrode including a plurality of layers of which the outermost layer is a tin plating layer. The tin plating layer has a polycrystalline structure, and atoms of a metal other than tin are diffused into the tin crystal grain boundaries. Alternatively, each external electrode includes a plurality of layers including a thick-film electrode formed on the base member, a nickel layer or a nickel alloy layer formed on the thick-film electrode and a tin plating layer formed on the nickel layer or the nickel alloy layer. The tin plating layer has a polycrystalline structure and nickel atoms are diffused into the tin crystal grain boundaries. Methods for fabricating electronic components and a circuit board provided with a plurality of electronic components are also disclosed.

Abstract: An elongated steel object is covered with a coating layer having 1) an electrode potential exceeding the electrode potential of steel, or 2) a rate of corrosion which is lower than the rate of corrosion of steel and is treated with a corrosion inhibiting composition.

Abstract: A coating for use on a superalloy substrate comprising a diffusion barrier as an intermediate layer overlying the substrate and underlying a protective coating having a high aluminum content. The diffusion barrier layer is characterized by having low solubility for aluminum from either the substrate or the protective coating. Further, the diffusion barrier layer has low interdiffusivity for elements from the substrate and the coating, a minimal impact on the mechanical properties of the article which is coated, a minimal thermal expansion mismatch with both the substrate and the high aluminum content protective coating, and can be applied readily using existing coating application techniques. The diffusion barrier is preferably a single phase alloy or intermetallic compound.

Abstract: A thin multilayer coating having reflection properties in the infrared and/or in the solar radiation range of the low-emissivity type for windows comprises a lower dielectric antireflection treatment layer, at least one silver-based functional layer, at least one metallic protection layer adjacent to the silver layer and an upper dielectric antireflection treatment layer. The upper dielectric antireflection treatment layer comprises a lower partial layer made of SnO2, ZnO, TiO2, Bi2O3 or Al2O3 and an upper partial layer made of a mixed oxide based on zinc and aluminium, especially one having a spinel structure of the ZnAl2O4 type.

Abstract: Disclosed is an alloy coating which can be advantageously applied to members for high temperature apparatuses so as to prolong the service life of the members. The alloy coating comprises an alloy. This alloy comprises: at least one member, as a base, selected from the group consisting of Re, Ir, Nb, Ta, Mo, and W; and at least one alloying element for imparting corrosion resistance. A method for forming the alloy coating, and a member for high temperature apparatuses, to which the alloy coating has been applied, are also disclosed.

Abstract: A dielectric layer has an opening which communicates with a metal line therebeneath. A layer of silver is deposited over the structure and into the opening, and copper is deposited by electroplating in the opening. An additional silver layer is the deposited, and an anneal step is undertaken so that the copper is surrounded or encapsulated by alloy containing copper and silver. After removal of appropriate portions of the silver layers, the copper remains encapsulated or encased by copper-silver alloy.

Abstract: An environmental overlay coating for articles used in hostile thermal environments, such as turbine, combustor and augmentor components of a gas turbine engine. The overlay coating is predominantly beta-phase NiAl with limited alloying additions of zirconium and chromium. The overlay coating is useful as an environmental coating and as a bond coat that improves the spallation resistance of a thermal barrier coating (TBC) system.

Abstract: An improved gas phase synthesized diamond, CBN, BCN, or CN thin film having a modified region in which strain, defects, color and the like are reduced and/or eliminated. The thin film can be formed on a substrate or be a free-standing thin film from which the substrate has been removed. The thin film can be stably and reproducibly modified to have an oriented polycrystal structure or a single crystal structure. The thin film is modified by being subjected to and heated by microwave irradiation in a controlled atmosphere. The thin film has a modified region in which a line width of the diamond spectrum evaluated by Raman spectroscopy of 0.1 microns or greater is substantially constant along a film thickness direction of the thin film, and the line width of the modified region is 85% or less of a maximum line width of the residual portion of the film thickness.

Abstract: A method for forming a sol-gel on a metal surface to provide an interface for promoting adhesion between the metal surface and an organic resin involves application of at least one metal alkoxide compound having at least one labile sulfur atom, and at least one metal alkoxide compound having at least one reactive moiety which is capable of bonding with an organic resin. The metal alkoxide compound having at least one labile sulfur atom is capable of bonding to various metal surfaces, including surfaces of noble metals, such as gold, by a sulfur-metal linkage with the metal surface. The metal alkoxide compound having at least one labile sulfur atom reacts with the metal alkoxide compound having at least one reactive moiety which is capable of bonding with the organic resin to form a sol-gel which bonds to the surface of the metal, and which includes reactive moieties which are capable of bonding with an organic resin.

Abstract: Composite materials are composed of a primary metallic base material, such as a titanium metallic material, metallurgically bonded to one or more secondary materials having desirable thermal conductivity properties and having a coefficient of thermal expansion (“CTE”) that generally matches the CTE of the primary metallic material. An exemplary composite material is composed of a titanium primary material metallurgically bonded to a secondary metal matrix composite material having a high thermal conductivity, such as aluminum silicon carbide. Methods for manufacturing such composite materials are disclosed.

Abstract: A hermetic glass-to-metal seal between a conductive pin and an outer body, wherein a corrosion-resistant noble metal (e.g., gold) coating is applied to the conductive pin before the hermetic seal is formed. The noble metal-coated conductive pin is located in glass having a softening point less than about 650° C. and disposed in a cavity of the outer body. This is accomplished by inserting the coated conductive pin into a bore in a glass preform, heating the assembly to a temperature in excess of the softening point of the glass but less than about 700° C., and cooling the assembly. The coefficients of thermal expansion of the components of the assembly are preferably selected such that the resulting assembly is a hermetic compression seal.

Abstract: A process is disclosed for producing a joined article between a ceramic member and another member, which process includes the steps of brazing the ceramic member with another member by using a brazing material composed of 50 to 99 wt % of copper, 0.5 to 20 wt % of aluminum, 0.5 to 5 wt % of at least one kind of active metal selected from the group consisting of titanium, zirconium, hafnium, vanadium and niobium, thereby obtaining a joined body including the ceramic member, another member and a layer of the brazing material, and heating the brazing material layer in an oxidative atmosphere.

Abstract: A circuitized semiconductor structure comprising a layer of dielectric material, a catalyst seed layer above the layer of dielectric material, a layer of photoimageable dielectric material on the catalyst seed layer and having openings therein, a nickel layer in the openings and a layer of copper in the openings above the nickel layer and being coplanar with the top of the layer of dielectric material is provided, along with a method for its fabrication.

Abstract: A method for forming an oxide film on a substrate by a sputtering process using a target comprising a metal as the main component, wherein sputtering is carried out in an atmosphere which contains a gas containing carbon atoms.

Abstract: A highly reliable copper circuit-joined board that, in mounting a semiconductor element, a lead frame or the like on a ceramic substrate, enables the semiconductor element, the lead frame or the like to be strongly joined to the substrate without breaking or deformation of the substrate found in conventional joining methods, such as brazing and joining using a copper/copper oxide eutectic crystal. Any one of an interposing layer comprising a brazing material layer comprising silver and/or copper as a main component and an active metal or an interposing layer having a two-layer structure comprising a first interposing layer comprising the brazing material layer or a high-melting metallizing layer and a second interposing layer, having a melting point of 1000° C.

Abstract: A magnetic recording medium comprising a non-magnetic substrate having thereon a non-magnetic undercoat, a magnetic film and optionally a protective film. The magnetic film comprises a material containing Co as a main component. The non-magnetic undercoat comprises at least two layers including a first undercoat film and a second undercoat film provided on the first undercoat film. The first undercoat film comprises a material containing Cr as a main component, and the second undercoat film comprises a material selected from the group consisting of a Cr/Nb-base alloy, a Cr/W-base alloy, a Cr/V-base alloy and a Cr/Mo-base alloy as a main component.