Abstract: According to an exemplary embodiment, a method of forming a metal layer having reduced roughness includes a step of forming a seed layer over a dielectric layer. The method further includes a step of forming the metal layer over the seed layer. The seed layer causes a top surface of the metal layer to have reduced roughness. The seed layer and the metal layer can be formed in a same process chamber or in different process chambers. The dielectric layer, the seed layer, and the metal layer having reduced roughness can be utilized in an acoustic mirror structure.

Abstract: The invention relates to a band (7) for protecting electrodes (6) of a spot-welding gun for welding metal sheets (3, 4), comprising a carrier material (24), wherein at least one electrically conductive layer (16) is provided on the side (15) facing the metal sheets (3, 4). At least two layers (16, 20) are provided on the metal-sheet side (15) of the carrier material (24) in order to create such a band (7) when welding aluminum and/or aluminum alloys, by means of which the contrast of the imprint (24) of the welding spot (13) can be increased and the electrode (6) can be protected optimally, wherein the outermost layer (16) is made of tin and the layer (20) arranged therebelow is made of nickel-phosphorous. Furthermore, on the carrier material (24), at least one adhesive layer (18, 26, 27) may be provided for the layers (16, 20) superimposed.

Abstract: The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.

Abstract: A reduced-foil laminate, system, and method of making a reduced-foil laminate can include a non-metal core layer, a first outer metal layer, and a second outer metal layer having the first outer layer and second outer layer being laminated to the core layer on opposite sides of the core layer. The laminate can be symmetrical and asymmetrical. The laminate can be die-cuttable, and/or heat sealable. Embodiments of the laminate can remain substantially free from curling and may be readily denested during package processing.

Abstract: An article, process, and method for surface plasmon resonance plates are described. A substrate is covered with a thin metal film onto which a second thin metal film is deposited. The surface of the second thin metal film is converted to the metal oxide which is used to covalently bond organosilanes to the surface. Reactive organosilanes containing terminal bonding groups are arranged in a plurality of spots that are surrounded by inert organosilanes. Biomolecule attachment to the binding group is detected or measured from surface plasmon signals from the first thin metal film.

Abstract: The invention relates to a diamond electrode with synthetically produced, electrically conductive (doped) diamonds. The surface has diamond particles (5) embedded in a metal or metal alloy layer so as to produce a conductive connection to the metal or metal alloy.

Abstract: The lifespan of a layer system at high temperatures is determined by the diffusion of single elements between the substrate and the layers on the substrate. A diffusion inhibiting layer according to the invention with an adapted aluminum content which lies between the aluminum content of the substrate and the aluminum content of the bonding or corrosion protective layer prevents the diffusion of aluminum and raises therefore the lifespan of the layer system.

Abstract: A ceramic top coat is formed over a heat resistant alloy including Ni as a main component through a bond coat which contains Ni essentially as a main component, Cr, and Al. The alloy for the bond coat can include Si in the range from 0 to 10 wt. %. As a result, in a long time operation, the spalling damage of a ceramic top coat is not easily created and the deterioration of the mechanical properties is small.

Abstract: Light weight composites with high flexural strength comprise epoxy foam sandwiched between two layers of facing material have high strength and low weight and can be used to replace steel structures. The facing layer may be fibrous material especially glass or carbon fibres, the facing material is preferably embedded into the epoxy matrix. Alternatively they may be matching box structures or concentric metal tubes. The sandwich structures may be prepared by laying up the fibre; coating and/or impregnating the layer with epoxy resin, laying a layer of heat activatable foamable epoxy material, providing a further layer of the fibrous material optionally coated and/or impregnated with epoxy resin on the foamable material and heating to foam and cure the epoxy materials. Alternatively they may be formed by extrustion of the foamable material between the surface layers.

Abstract: An aqueous composition for pretreating and depositing a coating on metal substrates is provided. The coating composition includes from about 1,500 to about 55,000 ppm based on the aqueous composition of a Group IIA dissolved metal ion, from about 100 to about 200,000 ppm based on the aqueous composition of a dissolved complex metal fluoride ion wherein the metal atom is selected from Group IIIA, Group IVA, Group IVB metals, Group VA, Group VB metals; and water. The composition is free of Group IIA metal fluoride precipitate achieved by including in the composition a complex metal salt different than the salt associated with the complex metal fluoride ion, with the complex metal salt being capable of complexing free fluoride ions to prevent a precipitation reaction. A process for coating a metal substrate with such an aqueous composition is further provided.

Abstract: A holographic sealing member for a container comprises a heat actuated sealant or adhesive layer that secures the sealing member to a container, a metal foil sealing layer over and covering and adhesively bonded to the heat actuated sealant or adhesive layer, a holographic layer over and covering and adhesively bonding to the metal foil layer having an upper plastic layer and a lower embossed image layer, and a tab over and covering and adhesively bonded to the upper plastic layer that may be pulled to remove the tab and the plastic layer from a container, thereby exposing the lower embossed image layer which must then be perforated to gain access to the contents of the container.

Abstract: A highly charged ion modified device is provided that includes a first metal layer or layers deposited on a substrate and an insulator layer, deposited on the first metal layer, including a plurality of holes therein produced by irradiation thereof with highly charged ions. The metal of a further metal layer, deposited on the insulator layer, fills the plurality of holes in the insulator layer.

Abstract: A substrate for semiconductor and integrated circuit components including: a core plate containing a Group VIB metal from the periodic table of the elements and/or an anisotropic material, having a first major surface and a second major surface and a plurality of openings extending, at least partially, from the first major surface to the second major surface; and a Group IB metal from the periodic table of the elements or other high thermally conductive material filling at least a portion of the space encompassed by at least some of the openings; and optionally, a layer containing a Group IB metal from the periodic table or other high thermally conductive material disposed over at least a portion of the first major surface and at least a portion of the second major surface. The substrate can be used in electronic devices, which can also include one or more semiconductor components.

Abstract: Provided is a data recording medium having improved data recording/storage characteristics and with an improved structure to have a higher data storage capacity, and a method of recording and/or easing data using the same. The data recording medium may include a Cu electrode layer on a substrate, and a data recording layer formed of a compound including a metal and at least one non-metal selected from the group consisting of S, Se, and Te, on the Cu electrode layer. Data is recordable to or erasable from the data recording layer by changing the resistance of the data recording layer by diffusing Cu ions from the Cu electrode layer to the data recording layer or by erasing Cu ions from the data recording layer by diffusing Cu ions from the data recording layer back to the Cu electrode layer, according to a voltage pulse applied to the data recording layer.

Abstract: The invention concerns multilayered structures useful for forming capacitors, which may be embedded within printed circuit boards or other microelectronic devices. The multilayered structure comprises a pair of parallel electrically conductive layers separated by a pair of dielectric layers and a central polymerizable layer. Each of the dielectric layers and the central layer may include a filler. Capacitors formed from the multilayered structures of the invention exhibit excellent short circuit resistance as well as excellent void resistance.

Abstract: The invention is a laminate made of very thin copper sheet preferably between 0.0005 and 0.01 inches thick, aluminum sheet preferably between 0.004 and 0.04 inches thick, and adhesive between the copper and aluminum sheets. The cost of the aluminum, adhesive, and the manufacturing process combined are much less expensive than solid copper sheet of 0.020 inches in thickness. However, when the copper sheet of the laminate is on the outside, the aesthetic qualities are indistinguishable from heavyweight solid copper sheet.

Abstract: Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated layered interface material having a migration component is also described herein and includes at least one pulse-plated thermally conductive material; and at least one heat spreader component, wherein the migration component of the plated layered interface material is reduced by at least 51% as compared to the migration component of a reference layered interface material. Another layered interface material described herein includes: a) a thermal conductor; b) a protective layer; c) a layer of material to accept solder and prevent the formation of oxides; and d) a layer of solder material.

Abstract: A coated article includes a substrate and a thermal barrier layer. An aluminide layer is between the substrate and the thermal barrier layer. A PtAl2 layer is between the aluminide layer and the thermal barrier layer.

Abstract: An article has a metallic substrate having a first emissivity. A thermal barrier coating atop the substrate may have an emissivity that is a substantial fraction of the first emissivity.

Abstract: The invention relates to a component having a coating system, which comprises at least one bonding coat applied directly onto the component and at least one thermal barrier coat formed on the bonding coat, the bonding coat comprising from 22 to 36 wt. % Cr, from 15 to 30 wt. % Ni, at most 55 ppm Al, and Fe as a basis.

Abstract: When an aluminum plate is bonded directly to a ceramic substrate by cooling and solidifying molten aluminum which is injected into a mold so as to contact the ceramic substrate arranged in the mold, an additive, such as a TiB alloy, Ca or Sr, for decreasing the grain size of the aluminum plate to 10 mm or less while preventing the drop in thermal conductivity of the aluminum plate from the thermal conductivity of a pure aluminum plate from exceeding 20% of the thermal conductivity of the pure aluminum plate is added to the molten aluminum. When an aluminum alloy plate of an aluminum-silicon alloy is bonded directly to a ceramic substrate by cooling and solidifying a molten aluminum-silicon alloy which is injected into a mold so as to contact the ceramic substrate arranged in the mold, an aluminum-silicon alloy containing 0.1 to 1.5 wt % of silicon and 0.03 to 0.10 wt % of boron is injected into the mold.

Abstract: A method for coating a component. The method includes applying a bond coating to an outer surface of the component using a high-velocity oxy-fuel (HVOF) process. The method also includes roughening the bond coating and applying at least one dense vertically cracked (DVC) ceramic layer to the roughened bond coating.

Abstract: A component with a hybrid structure includes a metal part partially surrounded by at least one polymer component. The metal part has at least one connecting region. The component also includes a metal reinforcement. The metal part is connected to metal reinforcement at the at least one connecting region. A method for producing such a component includes providing a metal part having at least one connecting region, at least partially surrounding the metal part by at least one polymer component, providing a metal reinforcement and connecting the metal part and the metal reinforcement at the at least one connecting region in one of a positive, non-positive and material fit.

Abstract: The present invention provides adhesiveless copper clad laminates wherein there is formed a copper film layer having high adhesiveness and insulation reliability, and a method for manufacturing such adhesiveless copper clad laminates.

Abstract: A method 10 and a laminated tool 31 which is created by the method 10 and which is formed by the selective coupling or attachment of sectional members, such as members 14, 16. The formed tool 31 includes a finished surface 36 which is formed by the selective deposition of material 30 onto surface 22.

Abstract: A layered structure includes a substrate comprising a layer of an oxide/oxide ceramic based composite material, a first oxide layer disposed directly on the substrate and formed from a material that has no greater than about 10% porosity and is substantially impermeable by water vapor, and a second oxide layer disposed directly on the first oxide layer and having a greater porosity than the first oxide layer. Either or both the first and second oxide layers of the coating system may be deposited using a plasma spraying process, a slurry deposition process which is followed by a sintering step, or an EB-PVD process.

Abstract: Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a batch fashion. In one embodiment, an adhesive payer is applied on a rear surface of a wafer. A plurality of spaced-apart adhesive pads are defined within the adhesive layer. Each adhesive pad may cover less than the entire back surface area of the component to which it is attached. A mounting member (e.g., dicing tape) may be attached to the adhesive layer and, in some embodiments, the adhesive layer may be treated so that the mounting member is less adherent to the adhesive pads than to other parts of the adhesive layer, easing removal of the adhesive pads with the microelectronic components.

Abstract: A fiber-reinforced metal-ceramic composite material having a hot ceramic side and a cool metal side and a graded ceramic-metal zone therebetween, wherein the ceramic content of said composite ranges from 100% at said hot ceramic side to 0% at said cool metal side and the metal content of said composite ranges from 0% at said hot ceramic side to 100% at said cool metal side, and wherein said fiber reinforcement is graded by coefficient of thermal expansion from the hot ceramic side to the cool metal side.

Abstract: An insulating substrate board for a semiconductor of the present invention comprises a ceramic substrate board (2) and a metal alloy layer (3) consisting of aluminum formed on one surface portion of the ceramic substrate board (2), wherein the Vickers hardness of the metal alloy layer (3) is not less than 25 and not more than 40. The metal alloy layer (3) includes silicon of not less than 0.2% by weight and not more than 5% by weight. The ceramic substrate board (2) is made of a material selected from a group consisting of alumina. aluminum nitride, and silicon nitride.

Abstract: Method for producing novel photochemically-active metal oxide-containing aqueous compositions such as TiO2 compositions coated or sprayed and dried under ambient conditions to form novel photochemically-active, colorless coatings having strong wetability and adhesion to clear substrates such as window glass. Preferably the present compositions include a suitable wetting agent or combination of agents to improve the wetability of the Titanium peroxide-containing amorphous film, allowing thinner films to be readily applied. Also the inclusion of an acrylic aliphatic urethane polymer can replace wholly or partially the titanium peroxide sol and provide additional film forming and wetability properties. The acrylic urethane polymer reduces or eliminates the amount of titanyl peroxide that is required and thereby reduces or eliminates the yellow color.

Abstract: With the objectives of alleviating the property of attacking on the mating member by scratching-off of local agglutinates on the sliding contact surface, achieving improved wear resistance, and achieving improved seizure resistance through restraint of frictional heat generation by a hard phase, a copper based sintered contact material contains shock-resistant ceramics in an amount of 0.05 to less than 0.5 wt % as non-metallic particles composed of one or more substances selected from pulverized oxides, carbides and nitrides. The shock-resistant ceramics are comprised of SiO2 and/or two or more substances selected from SiO2, Al2O3, LiO2, TiO2 and MgO.

Abstract: A coating composition that contains at least one degradable coating layer and at least one layer of barrier coating is disclosed. The coating composition can be used to make a coated substrate having improved performance over conventional coated substrates after exposure to heat and certain chemicals like halides such as chlorides, sulfur, salt, chlorine, alkali, and enamels.

Abstract: An object of the present invention is to produce an ultra-thin copper foil with a carrier which has few pinholes and small surface roughness and which has an the thickness of less than 5 ?m, and to produce the method of producing the foil, and further to produce a printed circuit board for fine pattern, a multilayer printed circuit board and a chip on film circuit board by using the ultra-thin copper foil with a carrier. The present invention provides an ultra-thin copper foil with a carrier produced by stacking a peeling layer and an ultra thin copper foil in order on the surface of a carrier copper foil which is made smooth so that the mean surface roughness of at least one side is Rz of 0.01 to 2.0 ?m by the chemical polishing, the electrochemical dissolution, or the smoothing plating processing method independently, combining two or more, or further combining the mechanical polishing.

Abstract: The invention includes a brazed ceramic ring that separates the positive and negative ends of the battery while still providing a leak-tight seal. The ceramic is aluminum oxide or zirconium oxide or zirconium oxide with 3% yttrium. The invention includes a brazing material, which is grater than 50% gold. The invention includes a titanium alloy case (Ti-6Al-4V) which is titanium with 6% aluminum and 4% vanadium as its major alloying elements. The case has the desirable properties of titanium such as high strength for a relatively low weight; and the case has the requisite ability and electro-activity to be used as a positive current carrying element where the battery's positive electrode exhibits more then 3.5 V vs. Li/Li+.

Abstract: A strengthened bond coat for improving the adherence of a thermal barrier coating to an underlying metal substrate to resist spallation without degrading oxidation resistance of the bond coat. The bond coat comprises a bond coating material selected from the group consisting of overlay alloy coating materials, aluminide diffusion coating materials and combinations thereof. Particles comprising a substantially insoluble bond coat strengthening compound and having a relatively fine particle size of about 2 microns or less are dispersed within at least the upper portion of the bond coat in an amount sufficient to impart strengthening to the bond coat, and thus limit ratcheting or rumpling thereof.

Abstract: The present invention relates to an overlay coating which has improved strength properties. The overlay coating comprises a deposited layer of MCrAlY material containing discrete nitride particles therein. The nitride particles are present in a volume fraction in the range of 0.1% to 15.0% and have a particle size in the range of from 0.1 microns to 10.0 microns. The coating may also have oxide particles dispersed therein.

Abstract: The present invention provides for a zinc-based coated steel sheet having a zinc-based coating layer and a lubricant film, which is formed on the zinc-based coating layer, containing zinc phosphate particles in an amount of 50 wt. % or more, and having substantially no reaction layer formed by reaction between the zinc-based coating and the zinc phosphate particles, and a method for the manufacture thereof. The zinc-based coated steel sheet according to the present invention has an excellent anti-peeling property, excellent frictional property, even in the non-lubricated condition which occurs at areas where the press oil film is broken, and excellent anti-galling property.

Abstract: In general, the present invention provides coating systems and processes for applying a selected coating system on a metallic substrate. The coating system includes two or more coating layers. A first layer comprises a MCrAl(Y,Hf)-type coating. The MCrAl(Y,Hf) coating is overlaid with a second coating composition that includes a metallic composition different from the MCrAl(Y,Hf) coating composition and includes one or more of: a platinum, silicon containing composition; a platinum, silicon, aluminum containing composition; a platinum, silicon, chromium containing composition; an aluminum, silicon containing composition; and an aluminum, silicon, chromium containing composition; each optionally combined with one or more of chromium, hafnium, lanthanum, manganese, yttrium and mixtures of these metals. Additionally the platinum in the metallic compositions can be exchanged in whole or in part by another noble metal.

Abstract: A multi-layer corrosion protection system and a method for applying the multi-layer corrosion protection system. The system comprises a corrosion-resistant layer plated onto a metallic substrate. The corrosion-resistant layer may be deposited using an autocatalytic (electroless) process. The corrosion-resistant layer may comprise phosphorous. The system comprises a stain-resistant layer deposited over the corrosion-resistant layer. The stain-resistant layer may be deposited using an autocatalytic (electroless) process. The stain-resistant layer may comprise nickel. The system may also comprise an inner layer plated onto the metallic substrate to prepare the metallic substrate for the application of the corrosion-resistant layer. The inner layer may comprise nickel and may be deposited using an autocatalytic (electroless) process.

Abstract: Compound preforms are provided having a first region, including a porous ceramic and a second region including a porous or solid ceramic in which the two regions differ in composition. The compound preform is infiltrated with a liquid metal which is then solidified to form a metal matrix composite.

Abstract: Braze and electrode wire assemblies, e.g., used with an implantable microstimulator, include a wire welded in the through-hole of an electrode, which electrode is brazed to a ceramic case that is brazed to a metal ring that is welded to a metal can. The braze joints are step or similar joints that self-center the case, provide lateral support during braze assembly, and provide increased surface area that prevents braze material from exuding from the joints. The end of the ceramic case that is brazed to the metal ring need not be specially machined. The shell has a reference electrode on one end and an active electrode on the other, and is externally coated on selected areas with conductive and non-conductive materials.

Abstract: An improved catalyst system that includes a metal support structure and an anti-corrosive layer on the metal support structure, and has improved resistance to corrosion and other degradation under corrosive environments. Typically, a catalyst supporting layer is applied over the anti-corrosive layer.

Abstract: With the objectives of alleviating the property of attacking on the mating member by scratching-off of local agglutinates on the sliding contact surface, achieving improved wear resistance, and achieving improved seizure resistance through restraint of frictional heat generation by a hard phase, a copper based sintered contact material contains shock-resistant ceramics in an amount of 0.05 to less than 0.5 wt % as non-metallic particles composed of one or more substances selected from pulverized oxides, carbides and nitrides. The shock-resistant ceramics are comprised of SiO2 and/or two or more substances selected from SiO2, Al2O3, LiO2, TiO2 and MgO.

Abstract: A joined body and method of producing the joined body are provided. A first member containing at least a ceramic and a second member containing at least one of a metal and a metal composite are joined with each other via a metal adhesive. The metal adhesive contains at least indium and at least one material containing at least a component capable of reducing the melting point of indium and is provided between the first and second members to provide a laminate. The laminate is heated at a temperature in a solid-liquid coexisting range of an alloy comprising indium and the indium melting point reducing component to join the first and second members.

Abstract: With the objectives of alleviating the property of attacking on the mating member by scratching-off of local agglutinates on the sliding contact surface, achieving improved wear resistance, and achieving improved seizure resistance through restraint of frictional heat generation by a hard phase, a copper based sintered contact material contains shock-resistant ceramics in an amount of 0.05 to less than 0.5 wt % as non-metallic particles composed of one or more substances selected from pulverized oxides, carbides and nitrides. The shock-resistant ceramics are comprised of SiO2 and/or two or more substances selected from SiO2, Al2O3, LiO2, TiO2 and MgO.

Abstract: A metal casting fabrication method is provided. In accordance with the method, first a metal plate is disposed in the cavity of molding dies. This metal plate includes a first surface formed with a heat insulating layer, and a second surface opposite to the first surface. With the metal plate placed in the cavity, the heat insulating layer is held in contact with the dies, while the opposite or second surface is partially exposed to the cavity. The injected molten metal properly fills the cavity from end to end since its heat is not conducted unduly to the dies via the metal plate.

Abstract: A new article of manufacture, for example a faucet or other article of hardware, has a specified decorative color, and is resistant to corrosion, abrasion and attack by chemicals. The article includes a substrate, one or more corrosion resistant layers applied to the substrate, a thin transition layer having a composition that varies systematically from a first composition to a second composition and in which the first composition has, at least in part, the function of corrosion protection, and in which the second composition determines the visible color or that portion of the substrate to which the transition layer is applied.

Abstract: The present invention is to provide an ultra-thin copper foil with a carrier which comprises a release layer, a diffusion preventive layer and a copper electroplating layer laminated in this order, or a diffusion preventive layer, a release layer and a copper electroplating layer laminated in this order on the surface of a carrier foil, wherein a surface of the copper electroplating layer is roughened; a copper-clad laminated board comprising the ultra-thin copper foil with a carrier being laminated on a resin substrate; a printed wiring board comprising the copper-clad laminated board on the ultra-thin copper foil of which is formed a wiring pattern; and a multi-layered printed wiring board which comprising a plural number of the above printed wiring board being laminated.

Abstract: The invention is a method of bonding a ceramic part (6) to a metal part (4) by heating a component assembly (2) comprised of the metal part (4), the ceramic part (6), and a thin laminated interlayer material (8) placed between the two parts and heated at a temperature that is greater than the temperature of the eutectic formed within the laminated interlayer material (8) or between the metal part (4) and the laminated interlayer material (8), but that is less than the melting point of the ceramic part (6) or of the metal part (4). The component assembly (2) is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a strong bond between the ceramic part (6) and the metal part (4). The compact interlayer material (8?) may be further comprised of two or more sets of metal alloy spheres (16, 16?) each having distinct compositions.

Abstract: Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a batch fashion. In one embodiment, an adhesive payer is applied on a rear surface of a wafer. A plurality of spaced-apart adhesive pads are defined within the adhesive layer. Each adhesive pad may cover less than the entire back surface area of the component to which it is attached. A mounting member (e.g., dicing tape) may be attached to the adhesive layer and, in some embodiments, the adhesive layer may be treated so that the mounting member is less adherent to the adhesive pads than to other parts of the adhesive layer, easing removal of the adhesive pads with the microelectronic components.