Abstract: A radiation-sensitive resin composition includes a compound represented by a formula (1), and a base polymer. A represents —CO— or —CH2—. R1 represents a hydrocarbon group having 1 to 30 carbon atoms, a heterocyclic group having 3 to 30 ring atoms, or a combination of a first group and a second group. The first group is —CO—, —COO—, —OCO—, —O—CO—O—, —NHCO—, —CONH—, —NH—CO—O—, —O—CO—NH—, —NH—, —S—, —SO—, —SO2—, —SO2—O— or a combination thereof, and the second group is a hydrocarbon group having 1 to 30 carbon atoms, a heterocyclic group having 3 to 30 ring atoms or a combination thereof. A part or all of hydrogen atoms included in the hydrocarbon group and the heterocyclic group are not substituted or substituted. M+ represents a monovalent cation.

Abstract: Infrared radiation-sensitive, positive-working lithographic printing plate precursors have improved scratch resistance in their outermost imageable layer because that layer comprises a unique combination of first and second alkali solution-soluble or -dispersible resins. The first alkali solution-soluble or -dispersible resin is an acid-functionalized novolak or acid-functionalized resole resin. The second alkali solution-soluble or -dispersible resin is a polyurethane or polyurethane urea comprising a polysiloxane unit segment in the polyurethane or polyurethane urea backbone or a side chain.

Abstract: New photoresist compositions are provided that comprise a component that comprises two or more amide groups.

Abstract: Disclosed is a photosensitive resin composition which has excellent transparency, heat resistance, thermal discoloration resistance, adhesion to a substrate and electrical characteristics, while exhibiting good developability and storage stability. Specifically disclosed is a photosensitive resin composition which contains the following components (A), (B) and (C). (A) a copolymer which contains (a1) hydroxyphenyl (meth)acrylate and (a2) an unsaturated epoxy compound as copolymerization components (B) a novolac resin which contains one or more phenols selected from among dimethylphenol, trimethylphenol, methylpropylphenol, dipropylphenol, butylphenol, methylbutylphenol, dibutylphenol, and 4,4?-dihydroxy-2,2?-diphenylpropane (C) a quinonediazide group-containing compound.

Abstract: The present invention provides a photocurable composition which contains a photobase generator capable of generating a satisfactory amount of a base in a high quantum yield when irradiated even with a small quantity of light for a short time, and contains a curable compound that is rapidly cured by the generated base such that the composition is cured into a cured product. The photocurable composition comprises: a photobase generator (A) which is a salt of a carboxylic acid (a1-1) represented by the following formula (1-1) with a basic compound (a2), and a curable compound (B) which has, in one molecule thereof, at least two functional groups selected from among epoxy group, (meth)acryloyl group, isocyanato group, acid anhydride group, and alkoxysilyl group, where R1 to R7 in the above formula (1-1) each are hydrogen or an organic group, R1 to R7 may be the same or different, and two of R1 to R7 may be bonded to each other to form a ring structure.

Abstract: The invention provides a dye-containing negative curable composition containing at least a dye soluble in an organic solvent, a photopolymerization initiator, a photopolymerizable compound containing an amine structure, and an organic solvent; a color filter formed from the dye-containing negative curable composition; a method of producing the color filter; and a solid-state image sensor.

Abstract: A colored curable composition for a color filter includes: (A) a pigment in an amount of from 35 to 70 mass % with respect to the total solid content of the colored curable composition, (B) an amino resin, (C) an alkali-soluble resin, (D) a polymerizable monomer, and (E) a photopolymerization initiator, in which the proportion of (B) the amino resin to (C) the alkali-soluble resin (B/C; mass ratio) is in the range of from 1 to 10.

Abstract: Lithographic printing plate precursors can have an imageable layer that includes a polymeric binder having an acid number of at least 30 mg KOH/g of polymer to and including 150 mg KOH/g of polymer, at least 3 weight % of recurring units derived from one or more N-alkoxymethyl (alkyl)acrylamides or alkoxymethyl (alkyl)acrylates, at least 2 weight % of recurring units having pendant 1H-tetrazole groups, and at least 10 weight % of recurring units having pendant cyano groups. The use of such polymeric binders provides good bakeability and chemical solvent resistance, especially for positive-working precursors.

Abstract: A pattern-forming method includes providing a resist film on a substrate using a radiation-sensitive composition. The resist film is exposed. The exposed resist film is developed using a developer solution. The developer solution includes no less than 80% by mass of an organic solvent. The radiation-sensitive composition includes at least two components including a first polymer and a radiation-sensitive acid generator. The first polymer includes a structural unit having an acid-labile group. One or more components of the radiation-sensitive composition have a group represented by a formula (1). A? represents —N?—SO2—RD, —COO?, —O? or —SO3?. —SO3? does not directly bond to a carbon atom having a fluorine atom. RD represents a linear or branched monovalent hydrocarbon group, or the like. X+ represents an onium cation.

Abstract: Compounds of the formula (I) and (II) M1, M2 and M3 independently of one another are no bond, a direct bond, CO, O, S, SO, SO2 or NR14; provided that at least one of M1, M2 or M3 is a direct bond, CO, O, S, SO, SO2 or NR14; M4 is a direct bond, CR?3R?4, CS, O, S, SO, or SO2; Y is S or NR18; R1 for example is hydrogen, C3-C8cycloalkyl, phenyl or napthyl, both of which are optionally substituted; R2 for example is C1-C20alkyl; R?2 has one of the meanings given for R2; R3 and R4 are for example hydrogen, halogen, C1-C20alkyl; R?3, R?4, R?3 and R?4 independently of one another have one of the meanings given for R3 and R4; and R5 is for example hydrogen, halogen, C1-C20alkyl; provided that in the compounds of the formula (I) at least two oxime ester groups are present and provided that at least one specified substituent R2 or R?2 is present; exhibit an unexpectedly good performance in photopolymerization reactions.

Abstract: The present invention provides an acid generator generates a sulfonic acid represented by the following general formula (1) in response to high-energy beam or heat: To provide a novel acid generator which is suitably used as an acid generator for a resist composition, which solves the problems of LER and a depth of focus and can be effectively and widely used particularly without degradation of a resolution, a chemically amplified resist composition using the same, and a patterning process.

Abstract: A resist composition including: a base component (A) that exhibits changed solubility in a developing solution by the action of acid; a photoreactive quencher (C); and an acid generator component (B) that generates acid upon exposure, wherein the photoreactive quencher (C) contains a compound (C) represented by general formula (c1) shown below. In the formula, X represents a cyclic group of 3 to 30 carbon atoms which may have a substituent; R1 represents a divalent linking group; R2 represents an arylene group which may have a substituent, and each of R3 and R4 independently represents an aryl group which may have a substituent; R3 and R4 may be mutually bonded with the sulfur atom to form a ring; R5 represents a hydroxy group, a halogen atom, an alkyl group of 1 to 5 carbon atoms, an alkoxy group or a fluorinated alkyl group; p represents an integer of 0 to 2; and q represents an integer of 0 to 3.

Abstract: Disclosed is a method of producing a thin film transistor substrate having high light sensitivity, heat-resistance, impact resistance, and a photosensitive composition used by the same, the method including forming data wires on an insulating substrate, forming an organic insulating film on the data wires by applying a photosensitive composition comprising a terpolymer, where the terpolymer is derived from monomers of an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride, or a mixture thereof, an unsaturated epoxy group-containing compound, and an olefinic compound.

Abstract: A catalyst precursor resin composition includes an organic polymer resin; a fluorinated-organic complex of silver ion; a monomer having multifunctional ethylene-unsaturated bonds; a photoinitiator; and an organic solvent. The metallic pattern is formed by forming catalyst pattern on a base using the catalyst precursor resin composition reducing the formed catalyst pattern, and electroless plating the reduced catalyst pattern. In the case of forming metallic pattern using the catalyst precursor resin composition, a compatibility of catalyst is good enough not to make precipitation, chemical resistance and adhesive force of the formed catalyst layer are good, catalyst loss is reduced during wet process such as development or plating process, depositing speed is improved, and thus a metallic pattern having good homogeneous and micro pattern property may be formed after electroless plating.

Abstract: Provided is a nonlinear optical material, an optical recording material, an optical recording method, a photosensitive material, a photopolymerization initiator, and a photosensitizer. One exemplary aspect of the present invention is a photosensitive material used for photolithography for forming a pattern by irradiating a photoresist with excitation light which includes a donor molecule 11 that is excited by the excitation light, and an acceptor molecule 12 that is excited by energy transfer or charge transfer from the excited donor 11.

Abstract: A low surface energy photoresist composition is described that comprises a silicone-polyether block copolymer, wherein the silicone block comprises 35 wt. % or more of said copolymer. When compounded with a photoresist composition, the composition enables the release of a phototool from the photoresist layer.

Abstract: A polymer is prepared from an adamantane methacrylate monomer whose alcoholic hydroxyl group is protected with an alicyclic-containing tertiary alkyl group. A photoresist composition comprising the polymer displays a high sensitivity and a high dissolution contrast during both alkaline development and organic solvent development.

Abstract: A polymer comprising recurring units having an acid-eliminatable group on a side chain and aromatic ring-bearing cyclic olefin units is used to formulate a chemically amplified negative resist composition. Any size shift between the irradiated pattern and the formed resist which can arise in forming a pattern including isolated feature and isolated space portions is reduced, and a high resolution is obtained.

Abstract: A photosensitive element comprises a support, a photosensitive layer and a protective film laminated in that order, wherein the photosensitive layer is composed of a photosensitive resin composition containing a binder polymer, a photopolymerizing compound, a photopolymerization initiator and a compound with a maximum absorption wavelength of 370-420 nm, and the protective film is composed mainly of polypropylene.

Abstract: An infrared sensitive, positive-working, image forming composition and element are disclosed. The image forming composition comprises a 1,1-di[(alkylphenoxy)ethoxy]cyclohexane, an infrared absorbing dye having a maximum absorption peak in the range of from about 700 nm to about 1100 nm, and a novolac polymer. The composition is applied and dried on a planar, hydrophilic substrate to form an image forming element, in particular, a planographic printing plate. Upon imagewise exposure to a near-infrared radiation source, the infrared dye absorbs light in the exposed areas and converts it to heat, which causes a disruption in the matrix of the image forming composition. Upon development with an aqueous alkaline developer, the exposed areas are removed while the nonexposed areas remain, thus forming a positive image.

Abstract: Compounds of the formula (I), wherein R1, R2, R3, R4, R5, R6, R7 and R8 for example independently of each other are hydro-gen, C1-C20alkyl, (II), COR16 or NO2, provided that at least one pair of R1 and R2, R2 and R3, R3 and R4, R5 and R6, R6 and R7, or R7 and R8 is (III); R9, R10, R11 and R12 for example independently of each other are hydrogen, C1-C20alkyl which optionally substituted; or R9, R10, R11, and R12 independently of each other are unsubstituted or substituted phenyl; X is CO or a direct bond; R13 is for example C1-C20alkyl which optionally is substituted, C2-C12alkenyl, C4-C8cycloalkenyl, C2-C12alkinyl, C3-C10-cycloalkyl, phenyl or naphthyl both of which are optionally substituted; R14 is for example hydrogen, C3-C8cycloalkyl, C2-C5alkenyl, C1-C20alkoxy, C1-C20alkyl, phenyl or naphthyl; R15 is for example C6-C20aryl or C5-C20heteroaryl; R16 is for example C6-C20aryl which is unsubstituted or substituted by one or more C1-C20alkoxy or C1-C20alkyl; are in particular suitable as photoinitiators for c

Abstract: A curable composition containing (A) a polymerizable compound having an alkyleneoxy group having two or more carbon atoms, (B) a polymerizable compound lacking an alkyleneoxy group having two or more carbon atoms, (C) an i-line absorber, (D) a photopolymerization initiator, (E) an alkali-soluble resin, and (F) a pigment, wherein a mass ratio [(A)/((A)+(B))] is from 0.5 to 0.9, and an i-line transmittance obtainable when the curable composition is formed into a coating film having a thickness of 0.7 ?m, is 10% or less. The curable composition of the invention has enhanced adhesiveness upon forming a micro pattern, and can reduce development residues in unexposed non-cured areas. The curable composition of the invention is suitable for the use in color filters.

Abstract: A photocurable and thermosetting composition comprises (A) a carboxyl group-containing resin having at least one carboxyl group in its molecule, (B) a photopolymerization initiator having an oxime linkage represented by the following general formula (I), (C) a reactive diluent, and (D) an epoxy compound having two or more epoxy groups in its molecule. The above-mentioned photopolymerization initiator (B) is incorporated into a formulation which is different from at least a formulation into which the above-mentioned carboxyl group-containing resin (A) and the above-mentioned reactive diluent (C) are incorporated to formulate a system comprising at least two parts.

Abstract: Disclosed is a color filter photosensitive resin composition that includes (A) an acryl-based binder resin having at least one carboxyl group, (B) an acryl-based photopolymerizable monomer, (C) a photopolymerization initiator, and (D) a solvent, where at least one of the acryl-based binder resin or the acryl-based photopolymerizable monomer includes a blue dye functional group. The color filter photosensitive resin composition can be prepared into a color filter having uniformity, almost no residue, and high resolution due to ultrafine pixels of 1.4 ?m or less.

Abstract: A method of forming a resist pattern, including: step (1) in which a resist composition containing a base component (A) that exhibits increased solubility in an alkali developing solution and a compound represented by general formula (C1) is applied to a substrate to form a resist film, step (2) in which the resist film is subjected to exposure, step (3) in which baking is conducted after step (2), and step (4) in which the resist film is subjected to an alkali development, thereby forming a negative-tone resist pattern; and the resist composition used in step (1): wherein R1 represents a group which forms an aromatic ring together with the two carbon atoms bonded to the R1 group; R2 represents a hydrogen atom or a hydrocarbon group; and R3 represents a hydrogen atom, a carboxy group or a hydrocarbon group of 1 to 15 carbon atoms.

Abstract: A resist additive represented by Formula 1 below and a resist composition including the additive are disclosed. The resist additive improves hydrophobicity of the surface of the resist film to prevent materials from being leached in water during exposure of immersion lithography and is converted to have hydrophilicity by deprotection reaction during development. As a result, a micropattern of a resist film with excellent sensitivity and high resolution is formed. In Formula 1, the substituents are defined as described in the specification.

Abstract: An actinic ray- or radiation-sensitive resin composition according to the present invention comprises a sulfonic acid-generating compound that is decomposed by an action of an acid to generate a sulfonic acid having a volume of 240 ?3 or more and a compound that generates the acid when exposed to actinic rays or radiation.

Abstract: Disclosed is an organic antireflective film composition which includes a monomer containing two or more thiol groups and a monomer containing two or more vinyl groups, as crosslinking agents. When the organic antireflective film composition is used, an antireflective film formed from the composition can be rapidly etched in an ultrafine pattern forming process, and the curing rate can be increased, while the etching rate is increased, without using an acid generator and a curing agent or by using the agents only in small amounts.

Abstract: A film includes base and a photosensitive layer formed on the base. The photosensitive layer substantially includes a first photosensitive agent, a second photosensitive agent, and a thermosol. The first photosensitive agent is water-soluble. The second photosensitive agent is an aromatic ketone compound or a benzoin ether compound. The method for manufacturing the film and the masking method using the film is also provided.

Abstract: A photoresist composition for manufacturing a color filter, the photoresist composition includes a first red colorant and a yellow colorant represented by Chemical Formula 1, wherein R1 and R2 each independently represent a C1 to C10 alkyl group, wherein A1, A2, A3, and A4 each independently represent a C1 to C10 alkyl group, —CN, —PO3H2, —C(O)OH, or a hydrogen atom, m is an integer of 1 to 10, and optionally wherein at least one —CH2— of R1 and R2 if present is independently replaced with —O—, —C(O)—, —C(O)O—, or —OC(O)—.

Abstract: A molecular glass compound includes (A) a tetrameric reaction product of a specific aromatic compound having at least one hydroxy group, and a specific polycyclic or fused polycyclic aromatic aldehyde; and (B) an acid-removable protecting group as an adduct with the hydroxy group of the aromatic compound and/or a hydroxy group of the polycyclic or fused polycyclic aromatic aldehyde. A photoresist composition including the molecular glass compound, and a coated substrate including a layer of the photoresist composition are also disclosed.

Abstract: A resist composition comprising: a base component (A) that exhibits changed solubility in a developing solution by the action of acid; a photoreactive quencher (C); and an acid-generator component (B) that generates acid upon exposure, wherein the photoreactive quencher (C) contains a compound represented by general formula (c1) shown below. In the formula, R1 represents a hydrogen atom or a hydrocarbon group of 1 to 20 carbon atoms which may have a substituent; each of R2 and R3 independently represents a hydrogen atom or a hydrocarbon group of 1 to 20 carbon atoms which may have a substituent; at least two of R1 to R3 may be mutually bonded to form a ring; X represents an oxygen atom or a sulfur atom; n represents 0 or 1; and Z+ represents an organic cation.

Abstract: A photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizing compound having an ethylenic unsaturated bond in the molecule, (C) a photopolymerization initiator and (D) a polymerization inhibitor, wherein the content of the (D) polymerization inhibitor is 20-100 ppm by mass based on the total solid content of the composition.

Abstract: A photosensitive resin composition comprising a (A) binder polymer, a (B) photopolymerizing compound having ethylenic unsaturated bonds in the molecule, a (C) photopolymerization initiator and a (D) polymerization inhibitor, wherein the (C) photopolymerization initiator comprises an acridine compound, and the content of the (D) polymerization inhibitor is 20-100 ppm by weight.

Abstract: The invention relates to a blue photosensitive resin composition, and the smoothness of the edge profile formed thereby after development is good. Furthermore, the contrast of a liquid crystal display device manufactured with the blue photosensitive resin composition is excellent. The invention also provides a method for manufacturing a color filter, a color filter and a liquid crystal display device are also provided in the invention.

Abstract: Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps.

Abstract: Disclosed are a photosensitive resin composition for a color filter that includes a colorant including a phthalocyanine-based compound represented by the following Chemical Formula 1 and a triarylmethane-based compound represented by the following Chemical Formula 2, wherein the substituents of Chemical Formulas 1 and 2 are the same as same as defined in the detailed description, and a color filter prepared using the same.

Abstract: A silicon compound according to the present invention is represented by the general formula (1). This silicon compound can be easily synthesized by using a hydrolysable silicon compound such as alkoxysilane and has, in its molecule, a hydrolysable group e.g. alkoxy group and a photoacid generating group capable of being dissociated to generate an acid by irradiation with a high-energy ray. R1nAmSiB4-(n+m)??(1) where R1 is each independently a hydrogen atom, a C1-C20 straight or C3-C20 branched or cyclic hydrocarbon group; a carbon atom of the hydrocarbon group may be replaced by an oxygen atom; and the hydrocarbon group may contain a fluorine atom; A is an acid decomposable group; B is a hydrolysable group; n is an integer of 0 to 2; m is an integer of 1 to 3; and n+m is an integer of 1 to 3.

Abstract: An alkali-soluble resin is provided. The alkali-soluble resin is prepared using a polyfunctional thiol compound as a chain transfer agent. The alkali-soluble resin has a lower viscosity than a resin having the same molecular weight. Further provided is a negative-type photosensitive resin composition comprising the alkali-soluble resin as a binder resin. The use of the alkali-soluble resin lowers the overall viscosity of the photosensitive resin composition to effectively reduce the height of a stepped portion of a photoresist pattern using a small amount of the photosensitive resin composition.

Abstract: Provided is an actinic-ray- or radiation-sensitive resin composition including a resin (B) containing at least either a fluorine atom or a silicon atom, the resin (B) containing any of repeating units of general formulae (I-1) and (I-2) below: Wherein each of R1s independently represents a hydrogen atom, an alkyl group or a halogen atom, X1 represents a bivalent organic group, X2 represents a single bond or a bivalent organic group, each of Ar1s independently represents a monovalent aromatic ring group, Ar2 represents a bivalent aromatic ring group, and each of L's independently represents a single bond or a bivalent organic group.

Abstract: A lithographic printing plate precursor comprising an image-recording layer, said image-recording layer being photopolymerizable upon exposure to light having a wavelength of from 300 to 500 nm and containing a mixture of sensitizers.

Abstract: A composition for radical polymerization includes a photosensitive material, a photoinitiator, a solvent, and a material for adjusting a size of a pattern. A method of forming a pattern using the composition is also disclosed.

Abstract: A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.

Abstract: A resist pattern formed by a method including forming a resist film by applying, on a substrate, a resist composition containing a base material having a solubility, in a developer liquid containing an organic solvent, that decreases according to an action of an acid, a compound which generates an acid upon irradiation, and a solvent; exposing the resist film; developing the exposed resist film; forming a first coating film by applying, on the resist pattern, a first coating forming agent containing a resin having a solubility in an organic solvent that decreases under action of an acid, and a solvent; and heating the resist pattern on which the first coating forming agent has been applied.

Abstract: The object is to provide a compound having high dissolvability in a safe solvent and high sensitivity, and also capable of obtaining a good resist pattern shape, a radiation-sensitive composition containing the same, and a resist pattern formation method using the composition. For this purpose, a compound (B) obtained by reaction between a polyphenol based cyclic compound (A) and a compound (C) having a particular structure, a radiation-sensitive composition containing the same, and a resist pattern formation method using the composition are provided.

Abstract: Disclosed are photosensitive resin composition that includes a dye including a methine-based compound represented by the following Chemical Formula 1, wherein each substituent of Chemical Formula 1 is the same as defined in the detailed description, and a metal complex, and a color filter using the same.

Abstract: The present invention relates to a hybrid photoresist composition for improved resolution and a pattern forming method using the photoresist composition. The photoresist composition includes a radiation sensitive acid generator, a crosslinking agent and a polymer having a hydrophobic monomer unit and a hydrophilic monomer unit containing a hydroxyl group. At least some of the hydroxyl groups are protected with an acid labile moiety having a low activation energy. The photoresist is capable of producing a hybrid response to a single exposure. The patterning forming method utilizes the hybrid response to form a patterned structure in the photoresist layer. The photoresist composition and the pattern forming method of the present invention are useful for printing small features with precise image control, particularly spaces of small dimensions.

Abstract: A lithographic printing plate precursor includes, in the following order: a support; an image-recording layer which is capable of forming an image by removing an unexposed area of the image-recording layer with at least one of printing ink and dampening water on a printing machine after exposure and contains an infrared absorbing dye, a polymerization initiator, a polymerizable compound and a binder polymer having an alkylene oxide group; and a protective layer containing a hydrophilic polymer which contains at least a repeating unit represented by the formula (1) as defined herein, a repeating unit represented by the formula (2) as defined herein, and a repeating unit represented by the formula (4) as defined herein, and in which a content of the repeating unit represented by the formula (4) is from 0.3 to 5.0% by mole based on total repeating units of the hydrophilic polymer.

Abstract: A chemically amplified positive resist composition comprising (A) a triarylsulfonium salt of 2,3,3,3-tetrafluoro-2-(1,1,2,2,3,3,3-heptafluoropropoxy)propionic acid, (B) an acid generator, (C) a base resin, and (D) an organic solvent is suited for ArF immersion lithography. The sulfonium salt is highly hydrophobic and little leached out in immersion water. By virtue of controlled acid diffusion, a pattern profile with high resolution can be constructed.

Abstract: The present invention relates to a negative photosensitive composition suitable for image-wise exposure and development as a negative photoresist comprising a negative photoresist composition and an inorganic particle material having an average particle size equal or greater than 10 nanometers, wherein the thickness of the photoresist coating film is less than 5 microns. The negative photoresist composition is selected from (1) a composition comprising (i) a resin binder, (ii) a photoacid generator, and (iii) a cross-linking agent; or (2) a composition comprising (i) a resin binder, (ii) optionally, addition-polymerizeable, ethylenically unsaturated compound(s) and (iii) a photoinitiator; or (3) a composition comprising (i) a photopolymerizable compound containing at least two pendant unsaturated groups; (ii) ethylenically unsaturated photopolymerizable polyalkylene oxide hydrophilic compound(s); and (iii) a photoinitiator.