Abstract: An imageable element can be imaged using non-ablative processes. This element has a non-silicone, non-crosslinked layer contiguous to and under an ink-repelling crosslinked silicone rubber layer. These elements can be used for providing lithographic printing plates useful for waterless printing (no fountain solution). Processing after imaging is relatively simple with either water or an aqueous solution consisting essentially of a surfactant or mechanical means to remove the crosslinked silicone rubber layer and a minor portion of the non-silicone, non-crosslinked layer in the imaged regions.
Abstract: The present invention relates to a photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa.
Abstract: The present invention provides a photoresist composition containing: a resin which contains a structural unit derived from a compound having an acid-labile group and which is insoluble or poorly soluble in an alkali aqueous solution but becomes soluble in an alkali aqueous solution by the action of an acid; an acid generator and a compound represented by the formula (I): wherein R1, X1, R2, u1, s1, t1 are each defined in the specification, with the proviso that sum of s1 and t1 is 1 or 2.
Type:
Application
Filed:
March 23, 2012
Publication date:
October 4, 2012
Applicant:
SUMITOMO CHEMICAL COMPANY, LIMITED
Inventors:
Koji ICHIKAWA, Hiromu SAKAMOTO, Yuichi MUKAI
Abstract: This invention addresses problems to provide a cyclic compound having a high solubility in safety solvents and a high sensitivity and being good in the shape of the resulting resist pattern, a method of producing the same, a radiation sensitive composition comprising the same, and a method of forming a resist pattern using the radiation sensitive composition. As means for solving the problem, there are provided a cyclic compound having a specific structure, a radiation sensitive composition comprising the compound, and a method of forming a resist pattern using the composition.
Type:
Application
Filed:
September 27, 2010
Publication date:
October 4, 2012
Inventors:
Hiromi Hayashi, Masatoshi Echigo, Dai Oguro
Abstract: The actinic ray-sensitive or radiation-sensitive resin composition of the present invention contains (A) a resin capable of increasing the solubility in an alkaline developer by the action of an acid, and (C) at least one selected from the group of compounds represented by the following formula (ZI-3), (ZI-4) or (ZI-5) and capable of generating an acid upon irradiation of actinic rays or radiation, wherein the resin (A) contains at least one repeating unit having a group capable of decomposing by the action of an acid to leave a leaving group having a ring structure, and the leaving group having a ring structure has at least one of a polar group as a substituent and a polar atom as a part of the ring structure, and a compound derived from the leaving group having a ring structure has a log P value of not less than 0 and less than 2.8.
Abstract: A resist composition including: a base component (A) that exhibits changed solubility in a developing solution by action of acid; and an acid generator component (B) that generates acid upon exposure, wherein the base component (A) includes a resin component (A1) containing a structural unit (a0) represented by general formula (a0-1) shown below or general formula (a0-2) shown below; and the acid generator component (B) includes an acid generator (B1) including a compound represented by general formula (b0-1) or (b0-2) shown below:
Abstract: The present invention provides a photoresist composition comprising the following components (A), (B) and (X): (A) a resin being insoluble or poorly soluble in an aqueous alkali solution but becoming soluble in an aqueous alkali solution by the action of an acid, (B) an acid generator, (X) at least one compound selected from the group consisting of a compound represented by the formula (I-a): wherein Z1 represent a C1-C20 divalent saturated aliphatic hydrocarbon group in which one or more —CH2— may be replaced by —O— or —CO—, and a compound represented by the formula (I-b): wherein R1 represents a C1-C20 monovalent saturated aliphatic hydrocarbon group in which one or more hydrogen atoms may be substituted with a hydroxyl group and one or more —CH2— may be replaced by —O— or —CO—, and n represents 0 or 1.
Type:
Application
Filed:
March 29, 2012
Publication date:
October 4, 2012
Applicant:
SUMITOMO CHEMICAL COMPANY, LIMITED
Inventors:
Koji ICHIKAWA, Yukako ANRYU, Satoshi YAMAGUCHI
Abstract: An object of the present invention is to provide a sulfonium salt that has sufficient photosensitivity by active energy rays, such as visible light, ultraviolet rays, electron beams, and X-rays. The present invention is a sulfonium salt represented by formula (1). It is noted that R1 is a group represented by formula (2); R2 and R3 each represent an aryl group having 6 to 30 carbon atoms, a heterocyclic hydrocarbon group having 4 to 30 carbon atoms, an alkyl group having 1 to 30 carbon atoms, an alkenyl group having 2 to 30 carbon atoms, or an alkynyl group having 2 to 30 carbon atoms; X? represents a monovalent polyatomic anion; R4 to R6 each represent an alkyl group, or the like; k represents an integer of 0 to 4; m represents an integer of 0 to 3; n represents an integer of 0 to 4; and A represents a group represented by —S—, —O—, —SO—, —SO2—, or —CO—.
Abstract: Disclosed are a photosensitive resin composition for a color filter and a color filter using the same. The photosensitive resin composition for a color filter includes (A) an acrylic-based binder resin including a structural unit represented by the following Chemical Formula 1, wherein the substituents of Chemical Formula 1 are the same as defined in the specification; (B) an acrylic-based photopolymerizable monomer; (C) a photopolymerization initiator; (D) a pigment; and (E) a solvent.
Type:
Grant
Filed:
August 1, 2011
Date of Patent:
October 2, 2012
Assignee:
Cheil Industries Inc.
Inventors:
Chang-Min Lee, Kil-Sung Lee, Jun-Seok Kim, Seong-Yong Uhm, Sang-Won Cho
Abstract: A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
Abstract: The invention provides a resin composition for laser engraving, containing at least (A) a polymerizable compound having two or more ethylenic unsaturated bonds, a carbon-sulfur bond being contained at the site where two among the two or more ethylenic unsaturated bonds are connected and (B) a binder polymer. The invention further provides an image forming material containing the resin composition, a relief printing plate precursor having a relief forming layer which contains the resin composition, a relief printing plate precursor having a relief forming layer which contains a product formed by subjecting the resin composition to cross-linking, a method for manufacturing a relief printing plate including subjecting the relief printing plate precursor having the relief forming layer which contains the resin composition to cross-linking, and a relief printing plate manufactured by the manufacturing method.
Type:
Grant
Filed:
March 16, 2009
Date of Patent:
October 2, 2012
Assignee:
FUJIFILM Corporation
Inventors:
Takashi Kawashima, Atsushi Sugasaki, Kenta Yoshida
Abstract: Provided is an actinic ray-sensitive or radiation-sensitive resin composition comprising (A) a specific compound represented by a general formula, (B) a resin which is alkali-insoluble or sparingly alkali-soluble and becomes easily alkali-soluble in the presence of an acid, and (C) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; a film formed using the composition; and a pattern forming method using the same.
Type:
Application
Filed:
November 30, 2010
Publication date:
September 27, 2012
Applicant:
FUJIFILM CORPORATION
Inventors:
Tomotaka Tsuchimura, Takayuki Ito, Toru Fujimori, Kana Fujii
Abstract: A method for forming a pattern includes forming a photosensitive film by coating a photosensitive resin composition on a substrate, exposing the photosensitive film to light through a mask that includes a light transmission region and a non-light transmission region, coating a developing solution on the photosensitive film, and forming a photosensitive film pattern by baking the photosensitive film, wherein the photosensitive resin composition includes an alkali soluble base resin, a photoacid generator and a photoactive compound.
Type:
Application
Filed:
September 2, 2011
Publication date:
September 27, 2012
Inventors:
Jeong Won KIM, Jin Ho JU, Jong Kwang LEE, Min KANG, Tae Gyun KIM
Abstract: A black curable composition for a wafer level lens is provided which exhibits excellent developability during formation of a pattern and imparts excellent adhesion with a lens to a formed light-shielding film. The black curable composition contains an inorganic pigment, a specific dispersion resin, a polymerization initiator, and a polymerizable compound. The inorganic pigment is preferably titanium black.
Abstract: The present invention provides a resin composition for laser engraving containing at least an acetylene compound and a binder polymer, a relief printing plate precursor for laser engraving using the same, a relief printing plate, and a method for producing a relief printing plate.
Abstract: Disclosed are a photosensitive resin composition that includes (A) a cardo-based resin including repeating units represented by the following Chemical Formulae 1 and 2, wherein the substituents of Chemical Formulae 1 and 2 are the same as defined in the specification, (B) reactive unsaturated compound, (C) a pigment, (D) an initiator, and (E) a solvent, and a light blocking layer using the photosensitive resin composition.
Type:
Grant
Filed:
June 16, 2011
Date of Patent:
September 25, 2012
Assignee:
Cheil Industries Inc.
Inventors:
Chang-Min Lee, Kil-Sung Lee, Jun-Seok Kim, Jung-Sik Choi
Abstract: Disclosed is a positive photosensitive resin composition which contains a polisiloxane, a naphthoquinone diazide compound, and a solvent. The positive photosensitive resin composition is characterized in that the polysiloxane has: an organosilane-derived structure represented by the general formula (1): at a content ration of 20-80% inclusive of Si relative to the overall number of moles of Si atoms in the polysiloxane; and an organosilane-derived structure represented by general formula (2): The positive photosensitive resin composition exhibits high heat resistance, high transparency, and enables high sensitivity, high resolution patterning. The positive photosensitive resin composition can be used to form cured films such as planarization films used in TFT substrates, interlayer insulating films, core materials and cladding materials, and can be used in elements having cured films such as display elements, semiconductor elements, solid-state imaging elements, and optical waveguide elements.
Type:
Application
Filed:
December 20, 2010
Publication date:
September 20, 2012
Applicant:
TORAY INDUSTRIES INC.
Inventors:
Takenori Fujiwara, Keiichi Uchida, Yugo Tanigaki, Mitsuhito Suwa
Abstract: The object of the present invention is to provide a radiation-sensitive colored composition which can supress the generation of the contamination of the device. A radiation-sensitive colored composition including: (A) a dye containing of from 10 ppm to 1000 ppm of a halogen ion; (B) a polymerizable compound; and (C) a solvent.
Abstract: The present invention provides a polymerizable composition including (A) a photoradical polymerization initiator represented by following Formula (1), the photoradical polymerization initiator having a molar absorption coefficient with respect to light at a wavelength of 365 nm in ethyl acetate of from 4,000 to less than 10,000; (B) a polymerizable compound; and (C) a colorant. In Formula (1), X represents CH2, S etc., R1 represents a halogen atom, a nitro group, a cyano group etc., R2 represents an alkyl group, an aryl group etc., and R3 represents a hydrogen atom, —SRa (Ra is an alkyl group etc.) etc.
Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes any of the compounds (A) of general formula (I) below that when exposed to actinic rays or radiation, generates an acid and a resin (B) whose rate of dissolution into an alkali developer is increased by the action of an acid. (The characters used in general formula (I) have the meanings mentioned in the description.
Abstract: A method of making a flexographic printing form precursor for laser engraving including the steps of (i) providing at least one layer of a curable composition on a substrate; (ii) curing the at least one layer; wherein the curable composition defining an outermost layer includes at least 0.5% by weight relative to the total weight of the composition of an organo-silicon compound including at least one polymerizable group; and a urethane (meth)acrylate oligomer having three or less polymerizable groups.
Abstract: A color filter and a liquid crystal display device with the color filter that includes a substrate; and a color layer formed on the substrate and constituting color pixels of a plurality of colors, wherein the color layer is formed through a curing of a color composition comprising at least acrylic resin and a coloring agent, wherein the acrylic resin contains a copolymer formed of a first vinyl monomer having a benzyl group and a second vinyl monomer having a carboxyl group, the first vinyl monomer having a function of regulating a retardation of a color layer, the copolymer having a weight average molecular weight of 3000 to 11000 and an acid value of solid matter falling within the range of 30 to 85.
Abstract: A salt represented by the formula (I) and a resist composition containing the salt are provided, wherein Q1, Q2, L1, ring W1, Re1, Re2, Re3, Re4, Re5, Re6, Re7, Re8, Re9, Re10, Re11, Re12, Re13 and Z are defined in the specification.
Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes a resin that is decomposed when acted on by an acid to thereby increase its solubility in an alkali developer, a compound that generates an acid when exposed to actinic rays or radiation, and any of basic compounds of general formula (1) below.
Type:
Application
Filed:
March 15, 2012
Publication date:
September 13, 2012
Applicant:
FUJIFILM CORPORATION
Inventors:
Kana FUJII, Tomotaka TSUCHIMURA, Toru FUJIMORI, Hidenori TAKAHASHI, Takayuki ITO
Abstract: The invention provides a photosensitive resin composition that can form resists with excellent adhesiveness for conductive layers and that does not easily produce conductive layer discoloration, as well as a photosensitive film employing the composition. A preferred photosensitive film (1) according to the invention comprises a support (11), resin layer (12) and protective film (13), where the resin layer (12) is composed of a photosensitive resin composition comprising a binder polymer, a photopolymerizing compound, a photopolymerization initiator and a benzotriazole derivative represented by the following general formula (1).
Abstract: The present invention relates to a photosensitive resin composition for a color filter and a color filter fabricated using the same. The photosensitive resin composition includes (a) an acrylic-based resin, (b) a photopolymerizable monomer, (c) a photopolymerization initiator, (d) a pigment, and (e) a solvent. The acrylic-based resin is a copolymer including a repeating unit of an ethylenic unsaturated monomer including a carboxyl group and a repeating unit of an ethylenic unsaturated monomer including an alkoxy 4-oxo butanoic acid group. The photosensitive resin composition for a color filter can have residue removing characteristics, and is capable of forming fine pixels and providing a color filter having high resolution.
Type:
Grant
Filed:
March 4, 2010
Date of Patent:
September 11, 2012
Assignee:
Cheil Industries Inc.
Inventors:
Kil-Sung Lee, Jae-Hyun Kim, Chang-Min Lee, Eui-June Jeong
Abstract: Disclosed is a color composition for a color filter, which includes at least acrylic resin and a coloring agent. The acrylic resin contains a copolymer formed of a first vinyl monomer having a benzyl group and a second vinyl monomer having a carboxyl group, the copolymer having a weight average molecular weight of 3,000 to 11,000, and an acid value of solid matter of the copolymer being confined to 30 to 85.
Abstract: A chemically amplified resist composition is provided comprising (A) a specific tertiary amine compound, (B) a specific acid generator, (C) a base resin having an acidic functional group protected with an acid labile group, which is substantially insoluble in alkaline developer and turns soluble in alkaline developer upon deprotection of the acid labile group, and (D) an organic solvent. The resist composition has a high resolution, improved defect control in the immersion lithography, and good shelf stability.
Abstract: The present invention provides a salt represented by the formula (I): wherein Q1 and Q2 independently each represent a fluorine atom or a C1-C6 perfluoroalkyl group, L1 represents a C1-C17 divalent saturated hydrocarbon group in which one or more —CH2— can be replaced by —O— or —CO—, L2 represents a single bond or a C1-C6 alkanediyl group in which one or more —CH2— can be replaced by —O— or —CO—, Y represents a C3-C18 alicyclic hydrocarbon group which can have one or more substituents, and one or more —CH2— in the alicyclic hydrocarbon group can be replaced by —O—, —CO— or —SO2—, and Z+ represents an organic counter ion.
Type:
Application
Filed:
February 28, 2012
Publication date:
September 6, 2012
Applicant:
SUMITOMO CHEMICAL COMPANY, LIMITED
Inventors:
Koji ICHIKAWA, Hiromu SAKAMOTO, Takahiro YASUE
Abstract: Negative-working imageable elements have an imageable layer comprising a free radically polymerizable component, an initiator composition capable of generating radicals sufficient to initiate polymerization of the free radically polymerizable component upon exposure to imaging radiation, a radiation absorbing compound, one or more polymeric binders, and at least 5 weight % of core-shell particles comprising a hydrophobic polymeric core and a hydrophilic polymeric shell that is covalently bound to the polymeric core. The hydrophilic polymeric shell has one or more zwitterionic functional groups. These elements can be imaged such as by IR lasers to provide lithographic printing plates.
Abstract: Provided is a resist composition including a resin (A) containing any of repeating units (a) of general formulae (RI-a) and (RI-b) below, any of repeating units (b) of general formula (R2) below, any of repeating units (c) of general formula (R3) below and a repeating unit (d) being different from the repeating units (c) and containing a group that when acted on by an acid, is decomposed, a compound (B) that when exposed to actinic rays or radiation, is decomposed to thereby generate an acid, and any of compounds (C) of general formula (PDA-1) below.
Type:
Application
Filed:
February 27, 2012
Publication date:
August 30, 2012
Applicant:
FUJIFILM CORPORATION
Inventors:
Tadahiro ODANI, Hidenori TAKAHASHI, Kana FUJII
Abstract: A resist composition of the invention includes: (A1) a resin having a structural unit represented by the formula (I), (A2) a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid and (B) an acid generator represented by the formula (II), wherein R1, A1, R2, Q1, Q2, L1, ring W1, and Z+ are defined in the specification.
Abstract: A resist composition includes (A1) a resin having a structural unit represented by the formula (I), (A2) a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid and (B) an acid generator having an acid-labile group. wherein R1 represents a hydrogen atom or a methyl group; A1 represents a C1 to C6 alkanediyl group; R2 represents a C1 to C10 hydrocarbon group having a fluorine atom.
Type:
Application
Filed:
February 24, 2012
Publication date:
August 30, 2012
Applicant:
SUMITOMO CHEMICAL COMPANY, LIMITED
Inventors:
Koji ICHIKAWA, Satoshi YAMAGUCHI, Yuki SUZUKI
Abstract: A resist composition of the present invention has (A1) a resin having a structural unit represented by the formula (I), (A2) a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid, (B) an acid generator and (D) a compound represented by the formula (II). wherein R1 represents a hydrogen atom or a methyl group; A1 represents a C1 to C6 alkanediyl group; R2 represents a C1 to C10 hydrocarbon group having a fluorine atom, R3 and R4 in each occurrence independently represent a C1 to C12 hydrocarbon group, a C1 to C6 alkoxyl group, a C2 to C7 acyl group, a C2 to C7 acyloxy group, a C2 to C7 alkoxycarbonyl group, a nitro group or a halogen atom; m? and n? independently represent an integer of 0 to 4.
Abstract: A resist composition containing; (A1) a resin having a structural unit represented by the formula (I), (A2) a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid, (B) an acid generator, and (D) a salt having an anion represented by the formula (IA), wherein R1, A1, R2, R1A and R2A are defined in the specification.
Type:
Application
Filed:
February 24, 2012
Publication date:
August 30, 2012
Applicant:
SUMITOMO CHEMICAL COMPANY, LIMITED
Inventors:
Koji ICHIKAWA, Tatsuro MASUYAMA, Satoshi YAMAGUCHI
Abstract: A resist composition contains (A1) a resin having a structural unit represented by the formula (I), (A2) a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid, and (B) an acid generator represented by the formula (II). wherein R1 represents a hydrogen atom or a methyl group; A1 represents a C1 to C6 alkanediyl group; R2 represents a C1 to C10 hydrocarbon group having a fluorine atom; R3 and R4 independently represent a fluorine atom or a C1 to C6 perfluoroalkyl group; X1 represents an C1 to C17 divalent saturated hydrocarbon group; R5 represents a group having cyclic ether structure; and Z1+ represents an organic cation.
Type:
Application
Filed:
February 24, 2012
Publication date:
August 30, 2012
Applicant:
SUMITOMO CHEMICAL COMPANY, LIMITED
Inventors:
Koji ICHIKAWA, Yuichi MUKAI, Satoshi YAMAMOTO
Abstract: A photosensitive composition comprises (A) a resin whose solubility in an alkali developer is increased by the action of an acid, and (B) a compound that generates an acid when exposed to actinic rays or radiation, wherein the resin (A) contains two or more repeating units respectively having acid-decomposable groups that are different from each other in the acid decomposition ratio at an image formation sensitivity.
Abstract: A resist composition contains (A) a resin having a structural unit represented by the formula (I), (B) an acid generator and (D) a compound represented by the formula (II), wherein R1, ring X1, R3, R4, m, and n are defined in the specification.
Type:
Application
Filed:
February 24, 2012
Publication date:
August 30, 2012
Applicant:
SUMITOMO CHEMICAL COMPANY, LIMITED
Inventors:
Koji ICHIKAWA, Takahiro YASUE, Akira KAMABUCHI
Abstract: A resist film formed by using a chemical amplification type resist composition containing (A) a high molecular compound having a structure wherein a hydrogen atom of a phenolic hydroxyl group is substituted by a group represented by the following general formula (I), (B) a compound generating an acid upon irradiation with actinic rays or radiation, and an organic solvent, and the film thickness is 10 to 200 nm. wherein, R1 represents a hydrocarbon group, R2 represents a hydrogen atom or a hydrocarbon group, and Ar represents an aryl group. R1 may also bind to Ar to form a ring which may also contain a heteroatom. * represents a binding position with an oxygen atom of the phenolic hydroxyl group.
Abstract: A resist composition including a base component (A) which exhibits changed solubility in a developing solution under action of acid, a basic-compound component (C) and an acid-generator component (B) which generates acid upon exposure, the component (B) including a compound represented by formula (b1), and the component (C) including at least one compound represented by formulas (c1) to (c3) (wherein Z1 represents a ring skeleton-containing hydrocarbon group, Q1 represents a divalent linking group containing oxygen, Y1 represents a fluorinated alkylene group, M+ represents an organic cation, R1 represents a fluorinated alkyl group or a hydrocarbon group, L1+ and L2+ represents a sulfonium or an iodonium, Z2 represents a hydrogen atom or a hydrocarbon group, Y2 represents a single bond or a divalent linking group containing no fluorine, R2 represents an organic group, Y3 represents an alkylene group or an arylene group; and Rf represents a fluorine-containing hydrocarbon group).
Abstract: A composition. The composition includes a polymer and a photosensitive acid generator capable of generating a first amount of acid upon exposure to a first dose of radiation and a second amount of acid upon exposure to a second dose of radiation. The second amount of acid is greater than the first amount of acid. The second dose is greater than the first dose. The composition includes a photosensitive base generator capable of generating a first amount of base upon exposure to the first dose and a second amount of base upon exposure to the second dose, where the first amount of base is greater than the first amount of acid and the second amount of base is less than the second amount of acid. The photosensitive base generator may include benzoin carbamates, O-carbamoylhydroxylamines, O-carbamoyloximes, aromatic sulfonamides, ?-lactones, N-(2-Arylethenyl)amides, azides, amides, oximines, quaternary ammonium salts, or amineimides.
Type:
Application
Filed:
May 2, 2012
Publication date:
August 23, 2012
Applicant:
International Business Machines Corporation
Inventors:
Kuang-Jung Chen, Wu-Song Huang, Ranee Wai-Ling Kwong, Sen Liu, Pushkara R. Varanasi
Abstract: A resist composition comprising a salt of a mono- to tetrafunctional carboxylic acid with a metal selected from magnesium, chromium, manganese, iron, cobalt, nickel, copper, zinc, silver, cadmium, indium, tin, antimony, cesium, zirconium, and hafnium, and a solvent is improved in film uniformity when coated, and exhibits a high resolution, high sensitivity, and minimal LER when processed by the EB or EUV lithography.
Abstract: A resist composition comprising a complex of a ?-diketone with a metal selected from magnesium, chromium, manganese, iron, cobalt, nickel, copper, zinc, silver, cadmium, indium, tin, antimony, cesium, zirconium, and hafnium, and a solvent is improved in film uniformity when coated, and exhibits a high resolution, high sensitivity, and minimal LER when processed by the EB or EUV lithography.
Abstract: A lithographic printing plate precursor includes a cyanine dye, characterized in that the cyanine dye includes two different chromophoric groups, a chromophoric group that has its main absorption in the infrared region and another chromophoric group that has its main absorption in the visible light region.
Abstract: Compounds of the formula I or II wherein R1 is C1-C10haloalkylsulfonyl, halobenzenesulfonyl, C2-C10haloalkanoyl, halobenzoyl; R2 is halogen or C1-C10haloalkyl; Ar1 is phenyl, biphenylyl, fluorenyl, naphthyl, anthracyl, phenanthryl, or heteroaryl, all of which are optionally substituted; Ar?1 is for example phenylene, naphthylene, diphenylene, heteroarylene, oxydiphenylene, phenylene-D-D1-D-phenylene or —Ar?1-A1-Y1-A1-Ar?1—; wherein these radicals optionally are substituted; Ar?1 is phenylene, naphthylene, anthracylene, phenanthrylene, or heteroarylene, all optionally substituted; A1 is for example a direct bond, —O—, —S—, or —NR6—; Y1 inter alia is C1-C18alkylene; X is halogen; D is for example —O—, —S— or —NR6—; D1 inter alia is C1-C18alkylene; are particularly suitable as photolatent acids in ArF resist technology.
Abstract: A negative-working imageable element has an imageable layer and a topcoat layer that contains a composition that will change color upon exposure to imaging infrared radiation. The imageable element can be imaged and developed on-press to provide images with improved contrast for print-out.
Type:
Grant
Filed:
July 9, 2008
Date of Patent:
August 14, 2012
Assignee:
Eastman Kodak Company
Inventors:
Jianfei Yu, Jianbing Huang, Kevin B. Ray
Abstract: Disclosed is a method of making polysiloxane and polysilsesquioxane based hardmask respond to radiations with positive tone and negative tone simultaneously. Unradiated films are insoluble in developers, showing positivity tone. Radiated films are insoluble in developers as well, showing negative tone. Only half-way radiated films are soluble in developers. The dual-tone photo-imageable hardmask produces splitted patterns. Compositions of dual-tone photo-imageable hardmask based on the chemistry of polysiloxane and polysilsesquioxanes are disclosed as well. Further disclosed are processes of using photo-imageable hardmasks to create precursor structures on semiconductor substrates with or without an intermediate layer.
Abstract: The present invention relates to a composition comprising a photoresist polymer and a fluoropolymer. In one embodiment, the fluoropolymer comprises a first monomer having a pendant group selected from alicyclic bis-hexafluoroisopropanol and aryl bis-hexafluoroisopropanol and preferably a second monomer selected from fluorinated styrene and fluorinated vinyl ether. The invention composition has improved receding contact angles with high refractive index hydrocarbon fluids used in immersion lithography and, thereby, provides improved performance in immersion lithography.
Type:
Grant
Filed:
June 27, 2008
Date of Patent:
August 7, 2012
Assignee:
International Business Machines Corporation
Inventors:
Hiroshi Ito, Daniel Paul Sanders, Linda Karin Sundberg
Abstract: A pattern of ink is printed on a substrate, such as corrugated paperboard with a relief printing form made from a photosensitive element. An in-situ mask is formed for the photosensitive element, the element is exposed to actinic radiation through the in-situ mask in an environment having an inert gas and a concentration of oxygen between 190,000 and 100 ppm, and the exposed element is treated to form the relief printing form having a pattern of printing areas. Printing is accomplished by securing the relief printing form to a print press, applying the ink to the printing areas on the printing form, and contacting the ink from the printing areas to the substrate to transfer the pattern of ink onto the substrate.
Abstract: The present invention relates to a photosensitive resin composition and a photosensitive material comprising the same. The photosensitive resin composition according to an exemplary embodiment of the present invention may comprise two multi-functional monomers where structures of side chains comprising unsaturated double bonds are different from each other while a composition ratio is changed. Accordingly, in the exemplary embodiment of the present invention, processability is excellent, and it is possible to decrease defects by a rupture when a LCD substrate is sealed and substrate separation defects due to an impact to the LCD products by improving an adhesion property to a lower substrate after a hard baking process.
Type:
Application
Filed:
January 18, 2012
Publication date:
July 26, 2012
Applicant:
LG CHEM, LTD.
Inventors:
Ho Chan JI, Sunghyun KIM, Dongchang CHOI, Kyung Soo CHOI, Geun Young CHA, Sang Chul LEE