Abstract: A decorative applique remover for removing an applique which has been relatively permanently applied, usually by an adhesive, to a substrate as, for example, an enlarged emblem or a pin stripping or other applique on an automotive vehicle or other substrate. The applique remover preferably exists in the form of an abrading disc which is specifically designed to physically engage, lift and remove the applique from the surface of the substrate, such as the surface of an automotive vehicle. The abrading disc is designed with a rubber-like surface capable of literally rubbing the applique from the surface of the substrate without marring or otherwise deleteriously affecting the surface of the substrate, such as the paint of an automotive vehicle surface.

Abstract: A polishing pad has a first layer, a second layer, a hole and a plug. The hole is formed in the polishing pad and has a first section in the first layer of the polishing pad and a second section in a second layer of the polishing pad. The plug is embedded in the hole and has an upper portion and a lower portion. The upper portion of the plug fits into the first section of the hole, and the lower portion of the plug fits into the second section of the hole. Since the plug has a height of the polishing pad, the problem of depositions, such as water droplets, has been solved. The endpoint detection can thus be precisely controlled.

Abstract: The sanding sponge primarily is used for sanding finished dry wall. The sanding sponge is made from a cellular foam material in the shape of a right prism in which the bases have the shape of an isosceles trapezoid. The sanding sponge has an abrasive coating on the bottom surface and the two lateral surfaces, and a layer of hook and loop fastening material adhesively attached to the top surface. The sanding sponge is part of a kit including a hand sander base and a pole sander head. The hand sander base has a plate with a handle on the top surface and a layer of hook and loop fastening material on the bottom surface for removably attaching the sanding sponge. The pole sander head has a plate with a universal joint attached to the top surface and a layer of hook and loop fastening material on the bottom surface.

Abstract: A transparent portion of a polishing pad in the solid phase has an index of refraction nearly matched to the index of refraction of a fluid polishing composition for chemical mechanical polishing, which minimizes scattering of an optical beam at an interface of the transparent portion and the polishing composition.

Abstract: A composite polishing pad for use in a linear chemical-mechanical polishing apparatus is provided. The pad comprises a hard polishing pad having a polishing surface and an attachment surface opposite the polishing surface, the attachment surface comprising a border comprising an adhesive, the border surrounding a cavity, the cavity being sized and shaped to receive a soft polishing pad. The soft polishing pad is disposed completely in the cavity and completely fills the cavity, and the soft polishing pad has a first side adhered in the cavity of the hard polishing pad, and a second side comprising an adhesive, whereby the attachment surface of the hard polishing pad and the second side of the soft polishing pad are substantially in a common plane. Other composite polishing pads are also provided, as are methods for making composite pads and methods for preventing composite pads from splitting apart into their component pads.

Abstract: An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness. The pad exhibits a stable morphology that can be reproduced easily and consistently. The pad surface resists glazing, thereby requiring less frequent and less aggressive conditioning.

Abstract: A method for making high density foam semiconductor polishing pads and belts with controlled, reproducible microcellular structure by mechanical frothing. The method involves agitating a liquid polymer resin at a controlled temperature and pressure in order to produce a stable froth. Next, the resin froth is metered under pressure to a mix head where it is typically combined with a desired amount of curative before being injected or poured into a mold.

Abstract: A polishing tape makes use of a foamed material such as polyurethane foam attached to a plastic backing material. The foamed material is elastic and some of its gas holes formed inside but near one of its surfaces are exposed externally. Because of its elastic nature, it can be deformed even if there are abnormally large abrading particles contained in a liquid slurry and such abrading particles do not become embedded in the target surface being textured. These externally exposed gas holes can also serve to absorb the debris generated by the texturing and to protect the target surface from being scratched thereby. Such a tape is used for a texturing process while dropping a liquid slurry containing abrading particles and rotating the disk substrate and pressing the tape against the target surface.

Abstract: The present invention is directed to a method of making a three-dimensional fixed abrasive article, and a three dimensional fixed abrasive made thereby. The method comprises providing an abrasive composition comprising a plurality of abrasive particles and a binder precursor. The binder precursor comprises a polymerizable material consisting essentially of an ethylenically unsaturated material having one or more terminal functional groups of the same type of reactive functionality, a photoinitiator, and a thermal initiator. The abrasive composition is then applied onto a backing. The method then comprises at least partially curing the binder precursor by activating the photoinitiator, and further curing the binder precursor by activating the thermal initiator to provide a three-dimensional fixed abrasive.

Abstract: A device for grinding clothing teeth and wire, or for cleaning cylinders, in a textile machine includes a grinding part having an elastic layer and grinding elements embedded throughout the elastic layer. The elastic layer is formed into a shape for being pressed against the clothing teeth, wire, or cylinder of the textile machine, and is formed of a material such that the elastic layer is worn by the clothing teeth, wire, or cylinder. In this way, the underlying embedded grinding elements are exposed.

Abstract: Abrasive discs for use with orbital sanders having dust extractor systems are provided in which the discs have an annular perforated zone intermediate between the center and the circumference of the disc in a location corresponding to the location of dust extractor ports in the cooperating backup pad..

Abstract: A coated abrasive having an abrasive surface comprising a plurality of individual abrasive structures can be modified to convey information by changing the appearance, for example by changing the size, shape or spacing of the structures to create patterns conveying the information.

Abstract: A semiconductor polishing device having a substantially cylindrical roller body made of polyvinyl acetal with a uniform material porosity having a mean flow pore pressure ranging from about 0.30 PSI to about 0.35 PSI with 80% of its pores ranging from 7 to 40 microns in size coated with a low viscosity adhesive composition of an appropriately formulated aliphatic or aromatic difunctional polyether urethane methacrylate or formulated multifunctional allphatic urethane acrylate and abrasive particles to form an adhesive skin of about 1 micron in thickness. The abrasive particles typically have a particle size ranging from about 0.05 to about 7 microns and a Mohs' hardness of at least about 7.

Abstract: An apparatus (46) for reconditioning a protective surface (30) of an optically-read digital recording disc (20) includes a turntable (48) configured to receive a center hole (24) of the disc (20) and a first motor (52), coupled to the turntable (48), for rotating the turntable (48) and the disc (20) at a first rotational speed. The apparatus further includes a buffing element (50) for removing an amount of material from the protective surface (30) as the turntable rotates the disc (20) and a second motor (54), coupled to the buffing element (50) for rotating the buffing element (50) at a second rotational speed. A timing element (56) synchronizes the first and second motors (52, 54) to substantially simultaneously cease rotation of the turntable (48) and the buffing element (50) following removal of an amount of material from the disc (20).

Abstract: In a stepping motor in which a cylindrical magnet 3 which is magnetized in an axial direction is coupled with a rotary shaft and said magnet is clamped with rotor stacks 4, 5 formed by laminating annular magnetic plates the surfaces of which are electrically insulated to form a rotor, and around the outer circumference of the rotor stator cores which are wound with stator coil are disposed, a sleeve 15 is pressed in between the magnet 3 and the rotor stacks 4, 5, and the rotary shaft and interposed therebetween. The cutting operation for the outer diameter during the manufacturing processes is carried out while holding both ends of the sleeve 15, subsequently the rotary shaft is inserted, thereby, regardless of the length of the rotary shaft, the manufacturing processes are carried out to reduce the number of the molds.

Abstract: After a hole is formed in a polishing pad, a transparent window plate is inserted into the hole. Here, a gap is left between the upper surface of the transparent window plate and the outermost surface constituting the working surface of the polishing pad. During polishing, the polishing head holding the wafer applies a load to the polishing pad by means of a load-applying mechanism, so that the polishing pad and transparent window plate are compressed. In this case, the system is arranged so that the gap remains constant, and so that a dimension equal to or greater than a standard value is maintained. Since the upper surface of the transparent window plate is recessed from the upper surface of the polishing pad, there is no scratching of the surface of the transparent window plate during dressing. Accordingly, the polishing pad has a long useful life.

Abstract: A multi characterized CMP (Chemical Mechanical Polishing) pad structure includes a lower pad and an upper pad. The lower pad includes a lower central soft pad region and a lower peripheral soft pad region formed outwardly of the lower central soft pad region, with both the lower central soft pad region and the lower peripheral soft pad region being located in a same plane of the lower pad. The upper pad is disposed on the lower pad, and includes an upper central hard pad region and an upper peripheral soft pad region formed outwardly of the upper central hard pad region, both the upper central hard pad region and the upper peripheral soft pad region being located in the same plane of the upper pad. The lower peripheral soft pad region has a lower hardness factor relative to the lower central soft pad region, and the upper peripheral soft pad region has substantially the same hardness factor as the lower central soft pad region.

Abstract: In a power grinder (1) with a motor (6) and a gear (7) that drive an oscillating drive means (2), which moves a grinding belt (3) secured to it to reciprocate, a simple change of the grinding belt (3) is made possible by providing that the grinding belt (3) has a hook-and-loop closure (4), or the grinding belt (3) is disposed with its first end (11) on the drive means (2), and its second end (12) is connected to a handle (13).

Abstract: A pad for processing substrates such as a pad for CMP and methods of using the pad: the pad is capable of allowing the substrate to be optically monitored during the process. In one embodiment, at least a portion of the pad includes an optical filter for attenuating optical noise so that optical signals used for monitoring the substrate provide a more accurate representation of the process status. The optical filter is capable of transmitting the optical signal while reducing the amount of optical noise. In another embodiment, the surface of the filter is recessed from the polishing surface of the pad so that the filter surface is subjected to less abrasion during polishing processes and during pad conditioning.

Abstract: A polishing tool uses a fixed abrasive polisher which can perform polishing of an object with good surface accuracy for a long period of time. A mixture of abrasive grains, having an average particle diameter of 0.01 to 2.0 &mgr;m, and comprising at least one of cerium oxide, manganese oxide, titanium oxide, zirconia, silica, and iron oxide, and polyimide resin particles or phenolic resin particles having an average particle diameter of 0.1 to 20 &mgr;m is heated at a temperature of 120 to 250° C. under a pressure of 9,800 to 49,000 kPa (100 to 500 kg/cm2) to mold the mixture into a desired shape. This can provide a polisher 4 having abrasive grains dispersed in a thermosetting resin, and having abrasive grains of 20 to 60% by volume, a binder of 30 to 50% by volume, pores of not more than 40% by volume, and a Rockwell hardness of not less than 30 in terms of the H scale. This polisher is attached to a surface plate by an epoxy adhesive to produce a polishing tool.

Abstract: An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness. The pad exhibits a stable morphology that can be reproduced easily and consistently. The pad surface resists glazing, thereby requiring less frequent and less aggressive conditioning.

Abstract: An arrangement for polishing a workpiece in a chemical mechanical polishing apparatus has a rotatable platen with an aperture that allows a laser interferometric measuring device to measure the surface condition of a workpiece being polished. A transparent block is flexibly attached to the top surface of the platen over the platen aperture to rotate with the platen. A polishing pad is disposed on the top surface of the platen, and has a hole extending through the pad configured to fit over the transparent block attached to the platen.

Abstract: An integrally molded brush. A preferred embodiment of the integrally molded brush includes a) a generally planar hub having an outer periphery, where the hub has a thickness of at least 0.05 inches; and b) a plurality of bristles extending from the outer periphery of the hub, where each of the bristles includes a bristle tip opposite the hub, where the bristle tip has a thickness up to 0.03 inches, and where the molded brush comprises a thermoplastic polymeric material. The present invention also provides a method of molding an integrally molded brush. A preferred embodiment of the method includes the steps of: a) heating a thermoplastic polymer to allow the thermoplastic polymer to be injected into a mold; b) injecting the thermoplastic polymer into a mold, wherein the mold includes a hub section and a plurality of bristle sections in fluid communication with the hub section, where the bristle tip section has a thickness up to 0.

Abstract: An abrasive pad removably attachable to a driven rotatable shaft and including a plurality of angularly offset abrasive members. Each abrasive member includes an outwardly facing surface having an abrasive disposed thereon. A first abrasive member is partially received within a loop formed by a second abrasive member. Likewise the second abrasive member is partially received within a loop formed by a third abrasive member. Finally, the third abrasive member is partially received within a loop formed by a fourth abrasive member. Each abrasive member is angularly offset from a radially adjacent abrasive member by approximately 45° with each abrasive member lying substantially in a single plane. Also disclosed is a method for forming such an abrasive pad.

Abstract: The present invention provides a polishing pad. The polishing pad includes a base pad, such as a felt pad, having an outer surface, and a water-repellant film located on the outer surface. The water-repellant film typically provides the base pad with a water absorbency factor of less than about five percent. In another embodiment, the polishing pad has an outer surface having an outer edge and first and second opposing surfaces joined by the outer edge. The polishing pad, in a preferred embodiment, has the water-repellant film located on the outer edge and one of the first and second opposing surfaces. Located on the water-repellant film on one of the first and second opposing surfaces, in another embodiment, is a pressure sensitive adhesive.

Abstract: A polishing tape makes use of a foamed material such as polyurethane foam attached to a plastic backing material. The foamed material is elastic and some of its gas holes formed inside but near one of its surfaces are exposed externally. Because of its elastic nature, it can be deformed even if there are abnormally large abrading particles contained in a liquid slurry and such abrading particles do not become embedded in the target surface being textured. These externally exposed gas holes can also serve to absorb the debris generated by the texturing and to protect the target surface from being scratched thereby. Such a tape is used for a texturing process while dropping a liquid slurry containing abrading particles and rotating the disk substrate and pressing the tape against the target surface.

Abstract: A cleaning apparatus for cleaning and decontaminating the internal working components of a piece of electronic equipment along a predetermined media path includes a base material having first and second surfaces. The apparatus also includes a cleaning substrate disposed on the first surface for cleaning at least one internal working component of the electronic equipment; and an adhesive substrate disposed on one of the first and second surfaces for decontaminating at least one internal working component of the electronic equipment.

Abstract: Conductive, highly abrasion-resistant coatings on mouldings, consisting of at least one conductive layer and at least one highly abrasion-resistant layer, a process for their production and their use.

Abstract: An abrasive element for grinding samples during supply of liquid lubricant includes a layer of binding agent containing grains of a grinding agent and particles of an organic acid, the organic acid being soluble in the lubricant and the particles thereof having sizes of 5 to 250 &mgr;m.

Abstract: A polishing pad comprising a polishing pad substrate and at least one solid catalyst, the polishing pad being useful to remove metal layers from a substrate.

Abstract: A method and apparatus for planarizing a microelectronic substrate. The apparatus can include a planarizing medium having a relatively hard polishing pad and a planarizing liquid disposed on a generally non-porous planarizing surface of the polishing pad. The planarizing liquid can include a colloidal suspension of colloidal particles having generally smooth external surfaces. The colloidal particles can have a variety of shapes, including a spherical shape, a cylindrical shape, a cubic shape, and a hexagonal shape, among others. The colloidal particles can be formed from a variety of materials, including silicon dioxide, manganese oxide, and cerium oxide.

Abstract: An apparatus (46) for reconditioning a protective surface (30) of an optically-read digital recording disc (20) includes a turntable (48) configured to receive the disc (20) and a first motor (52) for rotating the turntable (48) and the disc (20). The apparatus further includes a buffing element (122) and a second motor (54) for rotating the buffing element (122). A timing element (56) synchronizes the first and second motors (52, 54) to substantially simultaneously cease rotation of the turntable (48) and the buffing element (122) following removal of an amount of material from the disc (20). The buffing element (122) includes a foam pad (124) having a discoid portion (126) and an annular portion (128) encircling a perimeter (132) of the discoid portion (126). The annular portion (128) is more resistant to compression than the discoid portion (126). A buffing pad (82) is in fixed relation with the foam pad (124).

Abstract: An abrasive article includes a fixed abrasive element, a resilient element, a rigid element disposed between the resilient element and the fixed abrasive element, and a plurality of microstructures disposed between the rigid element and the fixed abrasive element.

Abstract: Manufacture of a polishing pad for polishing a semiconductor substrate, involves, transporting a backing layer to successive manufacturing stations, supplying a fluid phase polymer composition onto the transported backing layer, shaping the fluid phase polymer composition into a surface layer having a measured thickness, and curing the polymer composition on the transported backing layer in a curing oven to convert the liquid phase polymer composition to a solid phase polishing layer attached to the transported backing layer.

Abstract: An abrasive pad and a polishing method advantageously applicable to wafers for the production of semiconductor devices are disclosed. The abrasive pad includes a pad body capable of spinning for polishing a wafer pressed against the pad body. A number of grooves are formed in the surface of the pad body, so that slurry can flow therein. The grooves intersect each other to form a number of projections aligning in the horizontal and vertical directions and each having a polygonal shape, as seen in a plan view. One of the projections faces each groove in the lengthwise direction of the groove. This configuration enhances uniform polishing and high speed, high pressure polishing while promoting efficient use of the slurry.

Abstract: A soft polishing disc with holes is composed of an abrasive member, which is obtained by radially disposing abrasive pieces each composed of a sand paper having abrasive grains coated on a soft base cloth while partially stacking the abrasive pieces and by coupling them with each other by a thermosetting resin, and ventilation holes are formed through the disc. The soft polishing disc with holes can stably grind and polish a workpiece even if it is soft or hard and has a good air ventilation property, maintains an air cooling effect for a long period of time, is difficult to be loaded with chips, increases the heat radiation property of an abrasive surface and makes it to difficult for a workpiece to be burnt.

Abstract: An improved polishing pad and process for polishing a multitude of materials is invented. The process includes steps to liberate material from the surface of the pad and in doing so form a desired surface texture for polishing, while allowing the bulk of the pad to remain solid and hence less compressible and stiffer. These material properties yield a polishing better suited for applications such as semiconductor wafer silicon dioxide, damascene tungsten metal, damascene copper polishing, and the like.

Abstract: A flexible, open-pored cleaning body having at least one scouring surface (2) provided in at least one subregion with continuously formed, raised projecting ridges (3), wherein the ridges (3) have regions C,D of different heights in the direction of their extension.

Abstract: A polishing pad for use in a linear polisher, and more specifically, for a linear chemical mechanical polishing apparatus that has improved polishing uniformity is described. The polishing pad is provided with a top surface for engaging a wafer surface to be polished. The top surface has a center portion and two oppositely situated edge portions. The polishing pad is further provided with a multiplicity of voids situated in the top surface of the pad body such that the top surface has a void-to-surface ratio that is greater in the two edge portions than in the center portion of the top surface. The present invention novel polishing pad provides a more uniform polishing across a wafer surface, together with an improved planarity after polishing.

Abstract: A polisher for polishing a repair surface to a predetermined shape and a ground paper for polishers are provided. The polisher of the present invention includes a substrate portion (30) for holding an abrasive on a surface opposite to a repair surface, a holding plate (2) provided in parallel to the substrate portion with a predetermined space therebetween, and elastic members (3) interposed between the substrate portion (30) and the holding plate (2). The substrate portion (30) has a first face plate portion (4) fixed to the holding plate (2) with a predetermined space therebetween and second face plate portions (5) which are connected to respective end portions of the first place portion (4) and are rotatable about connection lines as axes, connecting them and the first face plate portion (4). The second face plate portions (5) are rotatably provided in a predetermined range from a position where they become flush with the first face plate portion (4) in a direction that they approach the holding plate (2).

Abstract: The present invention provides a flexible abrasive product comprised of an open cell foam backing, a foraminous barrier coating and a shaped foraminous abrasive coating.

Abstract: A set of spacing clips and a method of use therefor are described. Polishing pads utilized in wafer polishing machines, such as the MirraTrak™ and MiraMesa™ polishers made by Applied Materials, Inc., must be centered on polisher's platens. The polishing pads are generally of a larger diameter than the platens, and are held on the platen by a pressure-sensitive adhesive present on the backside of the pads. Each centering clip has two surfaces that are spaced apart from each other by the distance that a polishing pad will overhang the platen when properly centered on the platen. One surface of each of two centering clips is butted up against the edge of the circular pad and clamped to the pad. As the pad is lowered into place on the circular platen, the other surface of each clip is butted against the outside edge of the platen, ensuring that the pad will be centered on the platen when the adhesive backed pad contacts the platen.

Abstract: A polishing member for use in the chemical mechanical planarization of a semiconductor wafer has a first surface for contacting the semiconductor wafer, a second surface opposite the first surface oriented away from the wafer. A plurality of grooves formed in the second surface. The plurality of grooves enable the polishing member to conform to the surface of the wafer and provide uniform polishing of the wafer. In one embodiment the polishing member comprises a linear belt having at least two portions mated at a joint. The plurality of grooves reduce the stress on the joints by increasing the flexibility of the belt thereby reducing the risk of delamination of the belt and joints.

Abstract: A belt for polishing a workpiece such as a semiconductor wafer in a chemical mechanical polishing system includes a polymeric layer forming an endless loop and having a polishing surface on one side of the endless loop. The belt is manufactured by molding a polymeric material such as urethane in a cylindrical mold. The belt is thus made from a single layer, reducing weight, size, cost and maintenance requirements.

Abstract: The invention provides individually made abrasive discs with the primary abrasive surface around the periphery of the disc where the bulk of the abrading action occurs when the disc is in use. The invention also provides a process by which these discs can be made using a unique grain feeding technique which is capable of depositing abrasive grain on a backing surface accurately and in annular patterns.

Abstract: Provided are an abrasive tape suitable for finishing of surfaces or the like of precision components such as optical connector ferrules and semiconductor wafers, and a process for producing it. A coating agent in which abrasive particles having an average particle size in the range of 1 to 200 m&mgr; are dispersed in a binder resin solution. The coating agent is applied, with intervention of a primer layer if necessary, onto a base for abrasive tape to form an abrasive layer, thus obtaining an abrasive tape.

Abstract: This invention relates to polishing pads and a method for making the polishing pad surface readily machineable thereby facilitating permanent alteration of the polishing pad surface to create an advantageous micro-texture. The advantageous micro-texture is statistically uniform and provides a polishing pad with improved break-in preconditioning time. Polishing pads of this invention find application to the polishing/planarization of substrates such as glass, dielectric/metal composites and substrates containing copper, silicon, silicon dioxide, platinum, and tungsten typically encountered in integrated circuit fabrication.

Abstract: The invention relates to a flexible abrasive body having a pliable support which exhibits one layer made from a pliable substrate on one side of which there is a full-coverage first metal coating and on this a second metal coating in which the abrasive material is at least partly embedded. In order to obtain an abrasive body of this kind with high thermal conductance, excellent flexibility, high dimensional stability and compactness, the support 9 consisting of substrate 2 and first metal coating 10 exhibits a constant thickness and the first metal coating 10 exhibits a flat, smooth surface and minimized coating thickness. The second metal coating 14 and also the first metal coating 10 are preferably provided with breaking points 18.

Abstract: A polishing pad including a polishing pad substrate and a catalyst having multiple oxidation states wherein the catalyst containing polishing pad is used in conjunction with an oxidizing agent to chemically mechanically polish metal features associated with integrated circuits and other electronic devices.

Abstract: A polishing pad comprising a region that is at least translucent, wherein the translucent region comprises a matrix polymer and a filler, is provided herein. Also provided is a method for producing a polishing pad comprising a region that is at least translucent, which method comprises (a) providing a porous matrix polymer, (b) filling at least a portion of the pores of the matrix polymer with a filler to provide a region that is at least translucent, and (c) forming a polishing pad comprising the region that is translucent. A method of polishing a substrate, particularly a semiconductor substrate, comprising the use of the polishing pad of the present invention also is provided herein.