Abstract: The present invention provides an abrasive pad for abrading a surface to be abraded in the presence of an abrasive solution, which includes a hydrophobic polymer as a base material, and in which a graft-polymer chain having a hydrophilic group is introduced into the surface of the hydrophobic polymer. The hydrophilic group possessed by the graft-polymer chain is preferably a nonionic hydrophilic group selected from the group consisting of hydrophilic groups having an N-monoalkyl substituted structure and hydrophilic groups having an N-dialkyl substituted amide group. An amount of the hydrophilic graft-polymer to be introduced into the base material is preferably 10.0% to 150.0% in terms of graft ratio.

Abstract: A method for selectively altering a polishing pad adhesive layer includes providing a mask having transparent regions and opaque regions and directing radiation toward the mask so that the radiation passes through the transparent regions and impinges onto the adhesive layer on the polishing pad. The area of the adhesive layer corresponding to the transparent regions of the mask is cured to be less adhesive. The area of the adhesive layer corresponding to the opaque regions remain adhesive.

Abstract: A cutting disc core for a circular shaped saw blade which has a circular shaped body which has a center hole and a circular peripheral edge upon which is to be mounted a plurality of spaced apart cutting segments that is to perform the cutting of the saw blade. Surrounding the center hole and formed within the body are a plurality of slits with there being a solid tab that is integrally connected to the body located between each directly adjacent pair of slits. The tab constitutes a frangible seal with the circular ring or bushing which is formed about the center hole to be removable by being forcibly physically separated from the body.

Abstract: Agglomerate abrasive grain is disclosed. The agglomerate abrasive grain can be incorporated into abrasive products such as coated abrasives, bonded abrasives, nonwoven abrasives, and abrasive brushes. A method of making agglomerate abrasive grain is also disclosed.

Abstract: A supporting disk for a surface grinding wheel comprises a glass-fiber reinforced phenolic resin body which has an upper covering layer of a textile glass fabric or a glass-yarn layer, an intermediate layer of a fiber mat, and a lower covering layer of a textile glass fabric or a glass-yarn layer.

Abstract: The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 &mgr;m or less, wherein about 75% or more of the pores have a pore size within about 20 &mgr;m or less of the average pore size. In another embodiment, porous foam has an average pore size of about 20 &mgr;m or less. In yet another embodiment, the porous foam has a multi-modal pore size distribution. The method of production comprises (a) combining a polymer resin with a supercritical gas to produce a single-phase solution and (b) forming a polishing pad from the single-phase solution, wherein the supercritical gas is generated by subjecting a gas to an elevated temperature and pressure.

Abstract: The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 &mgr;m or less, wherein about 75% or more of the pores have a pore size within about 20 &mgr;m or less of the average pore size. In another embodiment, porous foam has an average pore size of about 20 &mgr;m or less. In yet another embodiment, the porous foam has a multi-modal pore size distribution. The method of production comprises (a) combining a polymer resin with a supercritical gas to produce a single-phase solution and (b) forming a polishing pad from the single-phase solution, wherein the supercritical gas is generated by subjecting a gas to an elevated temperature and pressure.

Abstract: The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 &mgr;m or less, wherein about 75% or more of the pores have a pore size within about 20 &mgr;m or less of the average pore size. In another embodiment, porous foam has an average pore size of about 20 &mgr;m or less. In yet another embodiment, the porous foam has a multi-modal pore size distribution. The method of production comprises (a) combining a polymer resin with a supercritical gas to produce a single-phase solution and (b) forming a polishing pad from the single-phase solution, wherein the supercritical gas is generated by subjecting a gas to an elevated temperature and pressure.

Abstract: Provided is a method for manufacturing a fixed abrasive material suitable for use in CMP planarization pads from an aqueous polymer dispersion that also includes abrasive particles that involves frothing the polymer dispersion, applying the froth to a substrate, mold or carrier and curing the froth to form a fixed abrasive material having an open cell structure containing between about 5 and 85 wt % abrasive particles and a dry density of about 350 kg/m3 to 1200 kg/m3.

Abstract: Polishing pads having a surface morphology that results in a high degree of planarization efficiency when planarizing a wafer surface are disclosed. One conditioned polishing pad is non-porous and has a surface height distribution with a surface roughness Ra<3 microns. Another conditioned polishing pad is porous and has a surface height probability distribution with a pad surface height Ratio R≧60%, or alternatively has an asymmetric surface height probability distribution characterized by an asymmetry factor A10≦0.50. Methods of pad conditioning and planarizing a wafer using the polishing pads are also disclosed.

Abstract: A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The fibers define interstices, and the precursors fill these interstices substantially completely before completion of the reaction. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers. The fibers may be separate, or in the form of a woven or non-woven web.

Abstract: The present invention is directed, in general, to packaged polishing pads for chemical mechanical polishing of semiconductor wafers and integrated circuits. More specifically, the invention is directed to a method of preparing and packing the pad and the packaging therefor. Prior to placing the pad on a platen and polishing with the pad, a polishing pad having an hygroscopic absorbency is soaked with an aqueous media for a time sufficient to equilibrate the pad. The pad maybe packaged by placement in a sealable moisture tight package after soaking or before soaking along with a sufficient quantity of aqueous media to allow the pad to equilibrate.

Abstract: Molded articles in the form of grinding/cut-off wheels, drill bits, reamers, knife, blade, etc., having a core section or sections comprising a moldable resin of some intensive property, e.g., hardness, concentration, etc., and a surface layer or rim or section(s) comprising another moldable resin of different magnitude of the same intensive property e.g., hardness, concentration, etc., and abrasive articles selected from one or more of diamond, cubic boron nitride (CBN), alumina, SiC, garnet, and mixtures thereof. The articles are characterized in that a) the resins comprising the sections are miscible and diffusively or convectively mixed; b) a composition ratio of the abrasive articles in the resins is decreased inwardly from a surface of said molded article on a scale of the mesh size of the abrasive and article size; and c) the resins comprising the sections are miscible and diffusively mixed.

Abstract: A polishing cloth has a surface layer stacked over a base material. The surface layer is made of a foamed layer and a non-foamed layer, the foamed layer including air bubble cells and the non-foamed layer having an externally exposed surface where linear cuts are formed. These linear cuts reach the air bubble cells such that the air bubble cells communicate with the exterior through the linear cuts. These linear cuts are controlled to be 10 &mgr;m or less in length. Such a polishing cloth is produced by applying a foamable coating material such as a foamable resin over a surface of the base material, foaming the foamable coating material to form the surface layer, and forming the linear cuts through the non-foamed layer.

Abstract: An abrasive pad is suitable for the wet-chemical grinding of a substrate surface. The novel abrasive pad has a polymer matrix with a defined water-solubility. The water-solubility is realized by the level of nonpolar and polar repeat units in the polymers.

Abstract: A method of forming a nonwoven fabric suitable for metal-finishing buffing operations includes providing a precursor web comprising polyester, staple length fibers, with hydroentanglement of the web effected to impart desired physical characteristics. Hydroentanglement is effected on a three-dimensional, image transfer device having an array of three-dimensional surface elements for patterning the fabric which is formed. Application of a binder composition lends desired durability to the fabric, with the binder composition preferably including a melamine polymeric composition to achieve the desired strength and abrasion resistance.

Abstract: Methods and apparatuses for planarizing a microelectronic substrate. In one embodiment, a planarizing pad for mechanical or chemical-mechanical planarization includes a base section and a plurality of embedded sections. The base section has a planarizing surface, and the base section is composed of a first material. The embedded sections are arranged in a desired pattern of voids, and each embedded section has a top surface below the planarizing surface to define a plurality of voids in the base section. The embedded sections are composed of a second material that is selectively removable from the first material. A planarizing pad in accordance with an embodiment of the invention can be made by constructing the embedded sections in the base section and then removing a portion of the embedded sections from the base section. By removing only a portion of the embedded sections, this procedure creates the plurality of voids in the base section and leaves the remaining portions of the embedded sections.

Abstract: An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects the reflected light. The electrical signal produced by the detector is conducted to a hub located at the central aperture of the polishing pad. The disposable polishing pad is removably connected, both mechanically and electrically to the hub. The hub contains electronic circuitry that is concerned with supplying power to the optical sensor and with transmitting the electrical signal to a non-rotating station. Several techniques are described for accomplishing these tasks. The system permits continuous monitoring of an optical characteristic of a surface that is being polished, even while the polishing machine is in operation, and permits the end point of the polishing process to be determined.

Abstract: An endless belt for a belt type polishing machine comprises a support fabric and a polymer layer of relatively low hardness. The polymer layer is formed with drainage grooves. The support fabric may comprise a non woven or woven material, or a membrane with oriented reinforcing yarns. A further version comprises a spiral-link fabric supporting a woven or non woven layer carrying the polymer layer. The polymer layer may be a double layer, the upper of which is either harder or softer than the lower layer.

Abstract: Methods and apparatuses for planarizing a microelectronic substrate. In one aspect of the invention, a first portion of an energy-sensitive, non-sacrificial planarizing pad material is exposed to a selected energy without exposing a second portion of the material to the selected energy source. The planarizing pad material is exposed to a solvent to remove material from one of the first or second portions of the planarizing pad material at a faster rate than removing material from the other of the first and second portions. The process forms a plurality of recesses directly in the surface of the planarizing pad which are configured to support a planarizing liquid proximate to the surface of the planarizing pad material during planarization of the microelectronic substrate. Alternatively, the process can form a mold having protrusions that are pressed into the planarizing pad to define the recesses in the pad.

Abstract: Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. The contact element electrically couples the adapter and the ball with is retained in the housing between seat and the adapter.

Abstract: A method and apparatus for using fixed abrasive polishing pads that contain posts for chemical mechanical polishing (CMP). The posts have different shapes, different sizes, different heights, different materials, different distribution of abrasive particles and different process chemicals. This invention also includes preconditioning fixed abrasive articles comprising a plurality of posts so that the posts have equal heights above the backing to achieve a uniform texture. This invention relates to improvements with respect to in situ rate measurement (ISRM) devices. The invention resides in providing a mechanical means, such as a notch, to determine when approaching the end of the abrasive web roll. The invention resides in coding the web throughout its length to enable determining the location of different portions of the web. This invention resides in providing perforations in the sides or end of the web for improved handling.

Abstract: A polishing cloth used for a chemical mechanical polishing comprises a base body holding a slurry on the surface and serving to mechanically polish the surface of a target object to be polished. Fine particles soluble in a solvent are dispersed in the base body.

Abstract: A cleaning sheet has a foamed sheet and a polishing layer with abrading particles on its surface. Mutually disconnected indentations are formed through the polishing layer reaching the foamed sheet in a uniform point pattern including a plurality of mutually adjacent ginkgo-leaf shaped figures for collecting cullet and dust particles therethrough into air bubbles opening on the upper surface of the foamed sheet.

Abstract: Embodiments of the invention include methods and apparatus for electrodialytic polishing of various layers formed on semiconductor substrates. In certain embodiments the use of electrodialytic processes in conjunction with chemical mechanical forces to achieve a copper interconnect with a desired level of planarity and process performance. In certain embodiments electrodialytic polishing uses an electrodialytic polish pad, which is an active pad which has copper binding groups provided in its core structure and has an added capability of allowing electrical conductivity. An electrodialytic polish pad allows transfer of cations or anions through a membrane in the presence of an electric field and into a cathodic electrolyte. Under the influence of an electric field the electrodialytic polish pad and/or electrodialytic pads are continuously refreshed to bind cations.

Abstract: An aqueous metal oxide sol slurry has been developed for removal of low dielectric constant materials. The slurry is formed directly in solution utilizing non-dehydrated chemically active metal oxide sols which are formed in a colloidal suspension or dispersion. The oxide sols have not undergone any subsequent drying and the particles are believed to be substantially spherical in structure, dimensionally stable and do not change shape over time. The sol particles are mechanically soft and heavily hydrated which reduces surface damage even in the case where soft polymer or porous dielectric films are polished. The sol particles are formed of a chemically active metal oxide material, or combinations thereof, or can be coated on chemically inactive oxide material such as silicon dioxide or can be coformed therewith. The oxide sols can include a bi-modal particle distribution. The slurry can be utilized in CMP processes, with or without conditioning.

Abstract: A non-woven abrasive article of interlaced fibers and abrasive particles and a binder which is preformed into a predetermined three dimensional shape and a method for manufacturing the same. The abrasive article is preformed by a thermal setting the abrasive article while it is maintained in a predetermined three dimensional shape or by heating the article to its glass transition temperature and then cooling the article below the glass transition temperature while it is maintained in a predetermined three dimensional shape. This method allows the manufacture of preformed abrasive articles in various three dimensional shapes, including, for example, a bull nosed shape suitable for finishing a concavely curved surface.

Abstract: There is provide a polishing member including photocatalyst particles that exhibit photocatalysis on light irradiation, and a support material that supports the photocatalyst particles. There is also provided a method of manufacturing a semiconductor device, including polishing a surface of a workpiece that is to be used as at least a portion of the semiconductor device with the polishing member with a fluid interposed between the polishing member and the surface of the workpiece while performing light irradiation onto the polishing member.

Abstract: A polishing solution is dispensed onto a polishing pad that has a polishing surface, a substrate is brought into contact with the polishing surface, relative motion is created between the substrate and the polishing pad, a light beam is directed through a window in the polishing pad to impinge the substrate, and an intensity of a reflected light beam from the substrate is monitored. The polishing solution has a first refractive index, and the window has a second index of refraction that is approximately equal to the first index of refraction.

Abstract: An objective of the present invention is to provide a composition for polishing pad that is excellent in formability, abrasion resistance and small in temperature dependence of Young's modulus and a polishing pad therewith. The composition for polishing pad of the present invention comprises a water-insoluble matrix and a water-soluble particle dispersed in the water-insoluble matrix. The water-insoluble matrix contains a crosslinked ethylene-vinyl acetate copolymer and/or a crosslinked 1,2-polybutadiene and each of these is contained by a prescribed amount against the total of the water-insoluble matrix.

Abstract: The present invention describes an apparatus that includes a polish pad, the polish pad including a first through-opening; a vertical distribution layer located below the polish pad, the vertical distribution layer connected to the through-opening; a lateral distribution layer located below the vertical distribution layer, the lateral distribution layer connected to the vertical distribution layer; and a slurry dispense located over a front-side of the polish pad, the slurry dispense to provide a slurry to be transported through the polish pad to the lateral distribution layer. The present invention further describes a method including dispensing a slurry at a front-side of a polish pad; flowing the slurry to a location below the polish pad; flowing the slurry upwards and outwards, towards edges of the polish pad; and distributing the slurry to an upper surface of the polish pad.

Abstract: The present invention relates to a polishing pad which is characterized in that it is of micro rubber A-type hardness at least 80°, has closed cells of average cell diameter no more than 1000 &mgr;m, is of density in the range 0.4 to 1.1 and contains polyurethane and polymer produced from a vinyl compound. When planarizing local unevenness on a semiconductor substrate with the polishing pad relating to the present invention, the polishing rate is high, the global step height is low, dishing does not readily occur at the metallic interconnects, clogging and permanent set of the surface layer region do not readily occur and the polishing rate is stable.

Abstract: A homogeneous fixed abrasive polishing article, or pad, including a matrix of a cured resin coated soft filler material having at least one working surface and an abrasive uniformly distributed throughout the filler material. A method for manufacturing the polishing pad includes the steps of mixing a binder, solvent and filler material together; drying the resin coated filler material; grinding the resin coated filler material; sieving the resin coated filler material; mixing an abrasive material with the resin coated filler material; sieving the abrasive material and the resin coated filler material thereby creating a powder material; transferring the powder material to a mold to form a working surface for the polishing pad; compressing the powder material; and curing the powder material. Alternatively, the abrasive may be mixed with the binder, solvent and filler material in the first step instead of later in the process.

Abstract: A V-shaped Corner Sanding Pad for sanding sheetrock and drywall corners. The V-shape sanding pad includes a pair of sanding surfaces, a leading edge, a pair of back surfaces, and an interior corner. Secured within the interior corner is a V-shaped reinforcing member that in a normal, non-use mode is spaced from the leading edge of the sanding pad. Secured on opposite sides of the reinforcing corner is a hook or loop fastener for securing the sanding pad to a carrier.

Abstract: A hand held corner sanding sponge includes a backing layer of an open-celled foam material having first and second major surfaces that meet at a right angle and third and fourth major surfaces that meet at a right angle. The cross-sectional dimension between the intersection of the first and second major surfaces from the intersection of the third and fourth major surfaces is about 4 inches to about 6 inches. First and second side surfaces are located between the first and second major surface and the third and fourth major surfaces forming a generally hexagonal shape. The cross-sectional dimension between the first and second side surfaces is about 3 inches to about 4 inches. A layer of flexible adhesive is adhered to at least the first and second major surfaces of the backing layer. A layer of abrasive particles is adhered to the major surfaces by the flexible adhesive.

Abstract: An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission.

Abstract: A polishing tool is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. A fixed abrasive polishing tool includes abrasive particles which are subjected to surface treatment by a coupling agent, and resin for fixing said abrasive particles.

Abstract: An abrasive article includes a plurality of abrasive particles securely affixed to a substrate with a corrosion resistant matrix material. The matrix material includes a sintered corrosion resistant powder and a brazing alloy. The brazing alloy includes an element which reacts with and forms a chemical bond with the abrasive particles, thereby securely holding the abrasive particles in place. A method of forming the abrasive article includes arranging the abrasive particles in the matrix material, and applying sufficient heat and pressure to the mixture of abrasive particles and matrix material to cause the corrosion resistant powder to sinter, the brazing alloy to flow around, react with, and form chemical bonds with the abrasive particles, and allow the brazing alloy to flow through the interstices of the sintered corrosion resistant powder and form an inter-metallic compound therewith.

Abstract: The invention relates to a method for protecting an underwater surface (3) against pollution due to fouling, in particular a metal surface, upon which a coating (4) is applied, whereby the coating (4), in the presence of water, is brushed or polished smooth with at least one brush (8) having brushes (9) made of synthetic material in which a grinding agent (10) is embedded. In the coating (4), glass flakes (5) are embedded to which silver is bonded.

Abstract: The present invention provides abrasive articles and methods of making abrasive articles. The abrasive articles have a polymeric material that includes (1) a reaction product of components that include (a) an epoxy-functional material, (b) at least one of a cyclic anhydride or a diacid derived therefrom, and (c) a polyfunctional (meth)acrylate; and/or (2) a polymeric material preparable by combining at least (a) an epoxy-functional material, (b) at least one of a cyclic anhydride or a diacid derived therefrom, and (c) a polyfunctional (meth)acrylate.

Abstract: To address the deficiencies of the prior art, the present invention provides a polishing pad comprising a thermoplastic polymer and a method of manufacturing therefor. More specifically, the present invention polishing pad fabricated from an extruded amorphous thermoplastic and free of a gate vestige. The invention also provides a method of manufacturing a polishing pad that is free from a gate vestige pad from an extruded amorphous thermoplastic.

Abstract: The present invention, in a preferred embodiment, is a new and improved hand-held manual sander that comprises a sander body, a hand grip, a mounting plate and a working surface. More specifically, the sander body includes a cylindrically shaped member designed to reduce fatigue to the hand during extended use of sander. The hand grip is adapted to the size of a palm for a single handed grip around the sander. A finger recess around the periphery of the hand grip portion is designed to further facilitate one-handed use. The mounting plate extends from the sander body. The working surface is associated with the bottom of the mounting plate. The outer periphery of the mounting plate substantially defines the size of the working surface and, therefore, the size of working materials such as sandpaper. The working surface consists of hook type materials of hook and loop mechanical attachment systems.

Abstract: Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.

Abstract: A processing tool is used to carry out a fixed-abrasive grinding process on a surface of a silicon work-piece. The processing tool includes abrasive grains made up silica grains. A primary average grain size of the silica grains is desirably 0.8 nm to 10 &mgr;m.

Abstract: Grooves are formed in a CMP pad by positioning the pad on a supporting surface with a working surface of the pad in spaced relation opposite to a router bit and at least one projecting stop member adjacent to the router bit, an outer end portion of the bit projecting beyond the stop. When the bit is rotated, relative axial movement between the bit and the pad causes the outer end portion of the bit to cut an initial recess in the pad. Relative lateral movement between the rotating bit and the pad then forms a groove which extends laterally away from the recess and has a depth substantially the same as that of the recess. The depths of the initial recess and the groove are limited by applying a vacuum to the working surface of the pad to keep it in contact with the stop member(s). Different lateral movements between the bit and the pad are used to form a variety of groove patterns, the depths of which are precisely controlled by the stop member(s).

Abstract: This invention relates to polishing pads and a method for making the polishing pad surface readily machineable thereby facilitating permanent alteration of the polishing pad surface to create an advantageous micro-texture. The advantageous micro-texture is statistically uniform and provides a polishing pad with improved break-in preconditioning time. Polishing pads of this invention find application to the polishing/planarization of substrates such as glass, dielectric/metal composites and substrates containing copper, silicon, silicon dioxide, platinum, and tungsten typically encountered in integrated circuit fabrication.

Abstract: The present invention provides a deformable pad useful for chemical mechanical polishing (“CMP”), a CMP apparatus incorporating the deformable pad of the present invention, and methods for using the deformable pad and CMP apparatus of the present invention. The deformable pad of the present invention includes a plurality of solid supports which substantially eliminate the nonuniform polishing rates in known CMP processes and may be tailored to optimize a wide array of CMP processes. The CMP apparatus of the present invention incorporates a deformable pad of the present invention and may include several other known features, such as a polishing pad, a substrate carrier, mechanical assemblies for agitating the polishing pad or substrate carrier, etc.

Abstract: The present invention relates to a polishing pad for the chemical mechanical polishing (CMP). According to the present invention, there is provided a chemical mechanical polishing pad for polishing a semiconductor wafer with chemicals containing predetermined components supplied between the semiconductor wafer and the polishing pad, comprising a base layer; and an abrasive layer which contains polishing abrasives capsulated with a material soluble in the chemicals and is formed to have a constant thickness on the top surface of the base layer. The capsulated polishing abrasives become free abrasives in the chemicals supplied upon polishing, and take part in the polishing. Capsulating the polishing abrasives can be performed by granulization or spraying. According to the polishing pad of the present invention, planarization polishing can be performed as whole. In addition, since a small amount of chemicals are used, it is advantageous in the economic and environmental aspects.

Abstract: Slurries to be supplied to the surface of a rotating glass substrate for texturing the surface to create streaks contain aggregates having diameters not larger than 0.51 &mgr;m of polycrystalline diamond particles that are dispersed in water or a water-based aqueous solution that is free of any substance having an etching effect on a glass material. A glass substrate is textured by supplying such a slurry material on its surface as the substrate is rotated and a polishing tape is pressed and run against the substrate surface.

Abstract: An improved sanding block for sanding high and extended surfaces configured for use in combination with an attached pole. The sanding block is round in shape and is rotationally mounted on a pole mount that interfaces between the sanding block and the pole which attaches to a rotatable hub of the pole mount. This allows the sanding block to rotate during use and the pole to be rotated to different angles in relation to the flat working surface of the sanding block. Adjacent surface marring is prevented by the rotation of the sanding block upon contact of a side edge with such an adjacent surface. Optionally the pole mount can be locked to prevent rotation if desired and a barrel can provide an interface between the pole and the pole mount. This barrel can be straight, angled, or adjustable for angle, in the different preferred embodiments.