Abstract: Pigment pastes suitable for the production of cathodically depositable electrodeposition lacquers (CEC) obtainable by dispersion of pigments and/or fillers in an aqueous paste resin containing tertiary-bonded amino nitrogen, whereby epoxy compounds and, if not already present, acid are added to the aqueous paste resin in the presence of pigments and/or fillers, process for their production and CEC coating compounds containing the same.

Abstract: The invention is directed to a method for making composite articles, including optical lenses, which includes the steps of obtaining a substrate; placing a semi-solid-like polymerizable composition in contact with at least one of the front or back surface of the substrate; compressing or heating the resulting semi-solid/substrate sandwich between two mold halves, where the mold contacting the semi-solid polymerizable material has a desired surface geometry; and exposing the semi-solid/substrate sandwich to a source of polymerizing energy. The resulting composite article has the desirable characteristics of the substrate but is also easily fabricated as a result of the semi-solid molding process. Also included within the present invention is a composite article comprising a substrate portion and at least one layer of a cured resin bonded to the substrate portion, the cured resin comprising an interpenetrating crosslinked polymer network of reactive plasticizer within a dead polymer.

Abstract: The present invention provides low stress non-hermetic conformal coatings for the protection of microelectronic devices, such as a Microelectromechanical system (MEMS) based multichip module from adverse environments. The induced stress from these two coatings due to the thermal cycling and manufacture processing will not cause any influence on sensing accuracy of the piezopressure sensor or similar functional MEMS devices. Furthermore, the conformal coatings have the merits of low glass transition temperature, good elongation, low moisture uptake and mobile ion permeation, room temperature curability and good contamination resistance to the jet fume, which promise a high reliability for the aerospace and avionics application. One conformal coating comprises a composition/formulation containing a rubber, siloxane or urethane oligomer modified epoxy and an organic hardener, and optionally an organic diluent and a curing catalyst.

Abstract: The present invention relates to a thermoplastic resin composition which has an improved impact resistance while maintaining mechanical properties such as strength and rigidity. In the present invention, a thermoplastic resin (A) is mixed with a polytetrafluoroethylene-containing mixed powder (B) consisting of a polytetrafluoroethylene (b1) having a particle diameter of 10 &mgr;m or less and an organic polymer (b2). In this case, the polytetrafluoroethylene-containing mixed powder (B) is mixed so that the amount of a polytetrafluoroethylene component is from 0.0001 to 20 parts by weight based on 100 parts by weight of the thermoplastic resin (A), and a polymer having an epoxy group was used as the organic polymer (b2). The thermoplastic resin composition of the present invention can be widely used in the fields of automotive parts, electric and electronic parts, and precision instrument parts.

Abstract: A phenolic resin composition in which the phenolic resin can be smoothly cured at a low temperature while inhibiting the generation of free formaldehyde and trapping free phenol. An epoxy compound is dispersed or dissolved as a hardener in an aqueous phenolic resin solution. The epoxy compound functions not only as a hardener for the phenolic resin but as a trapping agent for free phenol. The phenolic resin has been sulfoalkylated and/or sulfialkylated so as to have improved hydrophilicity.

Abstract: The invention provides a novel binder resin composition. A binder resin composition characterized by comprising carboxyl group-containing chlorinated syndiotactic polyolefin resin with chlorine content of 0.1 to 40 wt. %, grafting level of &agr;,&bgr;-unsaturated carboxylic acid and/or its acid anhydride of 10 wt. % and weight average molecular weight of 30000 to 220000 and organic solvent. The carboxyl group-containing chlorinated syndiotactic polyolefin obtainable from polyolefin resin produced using metallocene compound exhibits good state of solution even if the chlorine content may be low, and is excellent in the adherence to polyolefinic prime material and the solvent resistance.

Abstract: A composition comprises (A) an exopy resin and (B) a vinyl polymer having a reactive functional group selected from the group consisting of an alcoholic hydroxyl, phenolic hydroxyl, amino, amido and carboxyl group prepared by living radical polymerization, particularly the atom transfer radical polymerization of a vinyl polymer having a halogen atom and conversion of the halogen atom to a reactive functional group.

Abstract: A phosphorus-containing resin and a flame retardant resin composition containing the same are proposed. The flame retardant resin composition includes a phosphorus-containing resin, a nitrogen-containing resin hardener and a hardening promoter. Since the flame retardant resin composition has an excellent flame retardant property and heat resistance with no halogens contained and no additional flame retardant additives added therein, it can be used for producing prepregs, composite materials, laminates, printed circuit boards, copper foil adhesives, and packaging materials for semiconductors.

Abstract: The invention is directed to improved conductive adhesives for solder-free interconnections in microelectronic assembly processes such as for chip carrier-to-substrate attachment. These adhesives are characterized by low tensile modulus, low resistivity, high adhesion strength, and durability of these properties during reliability stress conditions of thermal shock, thermal aging, and temperature/humidity (85° C./85%) exposure of the assembled devices. The adhesives contain a homogeneous solution of a siloxane containing epoxide, a curing agent, a curing catalyst and an organic polymeric or oligomeric additive. A conductive filler is added to the solution forming the filler. Preferred fillers are Ag coated with Pd and Ag coated with Au.

Abstract: This invention relates to an aromatic oligomer which is useful as a modifier of epoxy resin compositions, to a phenolic resin composition comprising said aromatic oligomer and to an epoxy resin composition comprising said aromatic oligomer and is useful for encapsulating electric and electronic parts and as a circuit board material. The aromatic oligomer of this invention is obtained by polymerizing monomers mainly consisting of aromatic olefins comprising 20 wt % or more of acenaphthylenes and shows a softening point of 80-250° C. The phenolic resin composition or epoxy resin composition of this invention is obtained by incorporating 3-200 parts by weight of the aromatic oligomer per 100 parts by weight of phenolic resin or epoxy resin. The cured epoxy resin of this invention is obtained by curing the epoxy resin composition.

Abstract: A phosphorous epoxy resin of the invention being obtainable by reacting an organophosphorus compound, a trifunctional epoxy resin and a bifunctional epoxy resin optionally together with a bifunctional phenol compound. A flame-resistant highly thermally stable epoxy resin composition is also provided, which contains the above phosphorous epoxy resin. A cured product with excellent flame resistance and thermal stability can be obtained from the phosphorous epoxy resin, which cured product is useful as a prepreg or a laminate.

Abstract: An epoxy resin composition according to the present invention is an epoxy resin composition with a viscosity at 25° C. of no more than 1000 mPa· s, incorporating (A) at least one of a bisphenol type epoxy resin (A1) and a phenol novolak type epoxy resin (A2), a polyvalent epoxy resin formed from a mononuclear aromatic backbone (B) and an aromatic amine curing agent (C), wherein a cured product produced by curing the epoxy resin composition displays a breaking elongation of at least 5%.

Abstract: A thermosetting weatherable powder coating composition applyable to a temperature sensitive substrate by means of electrostatic spray or fluidized bed, and curable at low temperature to form a textured surface to hide irregularities on the surface of the underlying substrate. The powder coating composition includes a hardener with a functionality of 2 or greater capable of reacting with an acid or anhydride functional group, a polymeric coreactant with a functionality of 2 or greater capable of reacting with the hardener, a carboxylic acid functional polyester and optionally, a catalyst, but no texturing agent. The polymeric coreactant is made by polymerizing an ethylenically unsaturated monomer and at least one carboxyl acid functional ethylenically unsaturated monomer or anhydride functional ethylenically unsaturated monomer, and mixtures thereof.

Abstract: A liquid epoxy resin composition includes (A) a liquid epoxy resin, (B) an optional curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) an indene-styrene or indene-chroman-styrene copolymer having a Mn of 200-2,000 in an amount of 0.1-20 parts by weight per 100 parts by weight of components (A) and (B) combined. The indene polymer (E) is previously melt mixed with a part or all of the liquid epoxy resin (A) prior to compounding with the remaining components. A semiconductor device sealed with the cured product of the liquid epoxy resin composition remains reliable.

Abstract: Epoxy resin compositions comprising (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a structure in which two benzene rings can be directly conjugated, carbon atoms having an sp2 type atomic orbital accounting for at least 50% of all the carbon atoms, (B) a &bgr;-naphthol type phenolic resin curing agent, (C) a curing accelerator, and (D) an inorganic filler cure into products having satisfactory solder crack resistance on use of lead-free solder and improved flame retardance despite the absence of halogenated epoxy resins and antimony compounds and are thus suited for semiconductor encapsulation.

Abstract: Provided is a novel epoxy compound useful, in photolithography, as a monomer for preparing a photoresist material excellent in transparency and affinity to a substrate.

Abstract: Liquid rubbers that are ordinarily immiscible in liquid thermoset resins can be made miscible by the addition of at least one non-functional aromatic end-group to the polymer chains of such liquid rubber compositions. Processes for preparing such new liquid rubber compositions and miscible rubber/resin blends are also provided. In addition, these new liquid rubber compositions can be controlled to phase separate into rubbery microdomains upon curing of thermoset resins, including unsaturated polyester thermoset resins. The resulting new composite materials are found to improve the fracture toughness of cured thermoset resins while maintaining dimensional and heat resistance.

Abstract: Novel polysilazane-modified polyamine hardeners for epoxy resins, such classes as glycidyl ether epoxy resins and novolac epoxy resins, including reaction mixtures, compositions and reaction products comprising such hardeners, impart enhanced high temperature properties, higher char yields and better adhesion properties to the cured epoxy resins relative to the same epoxy resins cured using unmodified polyamine hardeners.

Abstract: The present invention provides a powder coating composition for forming a multilayer film, obtainable by dry blending a lower layer-forming thermosetting powder coating material (A) and an upper layer-forming thermosetting powder coating material (B), wherein at least one of the following conditions is satisfied: (I) the material (A) contains an onium salt compound; (II) particles of 45 &mgr;m or smaller diameter account for at least 90 wt. % of each of the materials (A) and (B); and (III) the material (A) is higher than the material (B) in melt viscosity (Pa·s) measured at 130° C.

Abstract: Epoxy compounds of formula (1) are provided wherein W is CH2, O or S, X and Y are —CR1R2— or —C(═O)—, k is 0 or 1, R1 and R2 are H or alkyl, or R1 and R2, taken together, may form an aliphatic hydrocarbon ring with the carbon atom to which they are connected. A resist composition comprising a polymer having recurring units of the epoxy compound as a base resin is sensitive to high-energy radiation, has excellent sensitivity, resolution, etching resistance, and minimized swell and lends itself to micropatterning with electron beams or deep-UV.

Abstract: There are provided a curable resin composition composed of an epoxy compound having an ionic polymerizability and viscosity of not more than 1,000 cP at 25° C., an acrylic resin having an ionic polymerizable functional group, and a thermally-activating ionic polymerization catalyst which can be dissolved by heating and crystallized by cooling, a method for the preparation thereof, and a coated article using the curable resin composition.

Abstract: Heterofunctional polyethylene glycol or polyethylene oxide, represented by one of the following formula (I) to (IV): 1

Abstract: A connecting material for bonding and connecting elements to be bonded together, each element having electrodes thereon in a correspondingly confronting relationship to each other. The material is highly reliable in the strength of bonding of the elements and in building up electroconductive connection between the corresponding electrodes and can provide mechanical bonding and electrical connection effectively even when bonding an element of a polyimide resin film with a counter element, without the occurrence of a reduction in the reliability of the electrical conductance, even in services under a high temperature and high humidity. The connecting material contains an adhesive component containing a thermosetting resin and has, after having been cured, characteristic features of a modulus of elasticity at 30° C. in the range of 0.9-3 Gpa, a glass transition temperature of at the lowest 100° C. and a tensile elongation percentage of at least 3%.

Abstract: Liquid rubbers that are ordinarily immiscible in liquid thermoset resins can be made miscible by the addition of at least one non-functional aromatic end-group to the polymer chains of such liquid rubber compositions. Processes for preparing such new liquid rubber compositions and miscible rubber/resin blends are also provided. In addition, these new liquid rubber compositions can be controlled to phase separate into rubbery microdomains upon curing of thermoset resins, including unsaturated polyester thermoset resins. The resulting new composite materials are found to improve the fracture toughness of cured thermoset resins while maintaining dimensional and heat resistance.

Abstract: A moldable thermosetting composition comprises a poly(arylene ether), a thermosetting resin, a toughening agent, and an amine cure agent. The compositions may be conveniently prepared without solvents, and the poly(arylene ether) may be provided in the form of an easily dissolved solid concentrate with the thermosetting resin.

Abstract: The invention contains a process for the surface postcrosslinking of water-absorbing polymers in which the polymers are treated with a surface postcrosslinking solution and during or after the treatment are postcrosslinked by means of an increase in temperature and are dried, wherein the crossiinker comprises a bis-2-oxazolidinone or a poly-2-oxazolidinone comprising structural units of the formula in which R1 is branched or unbranched C1-C18-alkylene, branched or unbranched C2-C18-alkenylene, C5-C18-cycloalkylene, phenylene, naphthylene, anthracenylene, hydrocarbon-substituted phenylene, naphthylene or anthracenylene or another substituted or unsubstituted C6-C18-arylene radical, R2 is branched or unbranched C1-C18-alkylene and n is an integer from 1 to 50 or a mixture of bis-2-oxazolidinones and poly-2-oxazolidinones dissolved in an inert solvent.

Abstract: A halogen-free dielectric resin mixture is described for use in microvia and other similar applications. The resin mixture contains a cyanate ester monomer or prepolymer a bismaleimide, an epoxy and a flame inhibiting compound selected from the group consisting of a phosphinic acid anhydride, a phosphonic acid andydride and a phosphonic acid half-ester. The flame inhibitor is present in an amount wherein the elemental phosphorus content is between about 2% and about 20% by weight, based on the weight of the resin mixture. The resin mixture can also include one or more coloring, fluorescent and UV absorbing agents. Prepregs based on the resin mixture with inorganic or organic reinforcing agents, as well as circuit boards and chip carriers made from the prepregs are also described. A resin coated article for use in microvia laser applications is likewise included.

Abstract: The present invention relates to the catalysis of the curing rate of epoxy hybrid powder coatings by organic amines or ammonia under mild conditions.

Abstract: Here are disclosed an epoxy resin composition comprising, as essential components, (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a phenolic curing agent, (C) a phenoxy resin containing a bisphenol S skeleton and having a weight average molecular weight of 5,000 to 100,000, and (D) a curing accelerator, particularly preferred being the epoxy resin composition wherein the epoxy resin (A) contains a phosphorus atom, the phenolic curing agent (B) contains a nitrogen atom, and the phenoxy resin (C) contains a bisphenol S skeleton and a biphenyl skeleton, an adhesive film formed by coating the above epoxy resin composition of the present invention on a supporting base film, and a prepreg obtainable by coating and/or impregnating a sheet-shape reinforced base material made of a fiber with the resin composition, as well as a multilayer printed-wiring board made by using them and a process for manufacturing the same, whereby the object may be realized of providing an epoxy resin composition w

Abstract: It is an object of the present invention to provide a resin composition excellent in throwing power as well as corrosion prevention and capable of providing coating films excellent in impact resistance, and a cationic electrodeposition coating composition containing the resin composition.

Abstract: A norbornene resin composition comprising 100 parts by weight of a thermoplastic norbornene polymer and 1 to 150 parts by weight of a thermosetting resin.

Abstract: The rheological properties of a crosslinkable resin system are modified by the presence of a side chain crystalline (SCC) polymer (or a similar crystalline polymer which melts over a narrow temperature range). The polymer dissolves in the curable system at temperatures above the melting point of the crystalline polymer (Tp), but when the system is then cooled to a temperature below Tp, at least partially forms a separate phase in the curable system. Below Tp, this separate phase substantially increases the viscosity of the curable system (i.e. makes it thicker than the same system without the crystalline polymer). This is particularly valuable for sheet molding composites (SMCs) in which the increase in viscosity makes the composites less tacky, and for dry film resists (DFRs). Above Tp, the curable system containing the dissolved crystalline polymer has a viscosity which is substantially less than its viscosity below Tp.

Abstract: The invention features a polyamine epoxide adduct, prepared by admixing a source of epoxy group with a polyamine, and allowing the epoxy groups to react with the terminal amino groups of the polyamine so as to form the polyamine epoxy adduct. The polyamine epoxide adduct of the invention can be used as a component for preparing a polyurea polymer, thereby providing the resulting polyurea polymer with improved adhesiveness and greater chemical resistance to acidic conditions. Polyurea polymer coatings prepared from polyamine epoxide adducts demonstrate better chemical resistance and adhesion when applied to substrates than do conventionally prepared polyurea formulations.

Abstract: The present invention provides a novel (meth)acrylate ester-based resin composition which, for example, exhibits various good properties such as weather resistance, heat resistance, water resistance, acid resistance, alkali resistance, warm water resistance, impact resistance, processability, flexibility, hardness, elongation, transparency, luster, fleshy property, mirroring property, pigment dispersibility, and driability when being used, for example, as crosslinking type paints, adhesives, pressure sensitive adhesives, and fiber-processing materials, and has so low a resin viscosity as to be utilizable as a resin for coping with environmental pollution of such as low-VOC paints.

Abstract: The invention provides new compositions of matter that are capable of forming cross-linked polymeric materials upon reaction with various known epoxy-containing compositions. Thus, the compositions of this invention are useful in the manufacturing of prepregs and laminates for PWB applications among many other uses. Preferred compositions of this invention include substituted hydroxyarylphosphine oxide mixtures, the glycidyl ether derivatives, or the epoxy resin oligomer adducts derived therefrom. The materials provide for laminates that have higher glass transition temperatures, improved thermal stability, and that are free of halogen.

Abstract: Lubricative stainless steel sheet and pipe having a chromate film on at least one of the surfaces of a stainless steel sheet or pipe substrate, the chromate film having an amount of adhered Cr of 5 to 100 mg/m2, and, on the chromate film, a lubricant film obtained by applying, on the chromate film, a water-base coating containing (a) a urethane resin of ether-ester type having a skeleton of bisphenol type, a skeleton of ester, and a carboxyl group, (b) an epoxy resin, and (c) a polyolefin wax, and baking the applied coating, the sum of the amount of the urethane resin of (a) and the epoxy resin of (b) being 70 to 95% by weight of the total solids of the coating, the amount of the polyolefin wax of (c) being 5 to 30% by weight of the total solids of the coating, and the lubricant film having a thickness of 0.5 to 5 micrometers and a Vickers hardness of at least 15. A method of producing a lubricative stainless steel pipe is also disclosed.

Abstract: The present invention is directed to an adhesive composition, which comprises an epoxy resin, a coupling agent, filler, and an effective amount of an amine-curing agent or curative for said epoxy resin. Advantageously, tri-functional and/or tetrafunctional epoxy resins and/or acrylate monomers will be incorporated into the adhesive composition in order to reduce open time and enhance substrate adhesion. Advantageously, a mixture of amines will be used in the curative including aliphatic amines, which have low viscosities and efficiently wet the substrate for enhancing adhesion; polyamines, which can be used to manipulate open time and allow for improved ratio tolerance of the adhesive system; and amine-terminated rubbers (ATBN), which can improve impact resistance and the toughness of the cured adhesive. Preferred coupling agents are silanes.

Abstract: The present invention is related with a dielectric composition for the manufacture of an insulating structure of the type that comprises at least a dielectric resin. The composition comprises granules of a thermoset polymer and a dielectric resin in a ratio thermoset polymer/dielectric resin in the scale of 2:1 to 20:1, which allows it to support voltages of at least 45 kV and to have resistances of at least 25 M&OHgr;. The invention further comprises dielectric structures obtained from the composition, which can be increased in their dielectric strength by means of a layer of dielectric resin.

Abstract: Binders for aqueous corrosion protection systems, comprising products A′ABC of reaction of epoxy resins, fatty acids, and amines, having a number average molar mass Mn of at least 5000 g/mol, obtained by reacting epoxide compounds A′ containing at least two epoxide groups per molecule and reaction products ABC of epoxide compounds A, fatty acids B, and amines C, wherein, where appropriate, the epoxide compounds A′ and/or the epoxide compounds A have been modified prior to further reaction, in whole or in part, by reaction with compounds D containing at least one acid group or hydroxyl group reactive toward epoxide groups, and wherein, where appropriate, the amines C have been modified prior to further reaction, in whole or in part, by reaction with aliphatic or aromatic monoepoxide compounds A″ or mixtures thereof

Abstract: A process for preparing an epoxy group-containing curable polyphenylene ether (PPE) resin. The process involves introducing an epoxy group-containing functional group to the terminal end of PPE (Mn>3000) by modifying the hydroxy and ester groups on the terminal end. Thus, a curable PPE resin (Mn>3000) including an epoxy group on the terminal end can be obtained. The modified PPE resin contains epoxy groups and has high glass transition temperature.

Abstract: A substantially non-gelled polymeric composition is disclosed and comprises the reaction product of an A polymer which is an addition polymer having 3.5 or more reactive functional groups per polymer chain and a B polymer having about 2 to about 3 functional groups per polymer chain that are co-reactive with the reactive functional groups of the A polymer. Also disclosed is a process for preparing such polymeric compositions, powder coatings and 100% solids ink resins prepared with such polymeric compositions, and a method for deglossing a powder coating using such polymeric compositions.

Abstract: An epoxy resin composition comprising: (i) an epoxy resin having a melt viscosity of from 0.1 dPa to 5 dPa at 150 ° C. and having two or more repeating units each comprising: a methylene bond substituted by at least an aromatic ring; and a benzene ring substituted by at least a glycidyloxy group, wherein said aromatic ring is at least one member selected from the group consisting of (a) condensed aromatic rings and (b) combinations of aromatic rings in which two or more aromatic monocycles or condensed aromatic rings are connected directly to each other via a single bond; and (ii) a curing agent.

Abstract: A cationically polymerizable liquid composition is formed from a cationically polymerizable mixture (A) and a solid resin (B) that is compatible with the mixture (A) at room temperature and has a softening point of at least 40° C., so that the composition has a viscosity at 25° C. of 20 Pa·sec or below. The cationically polymerizable mixture (A) is formed from a monofunctional monomer (A-1) having in the molecule only one cyclic ether structure represented by formula (1) below, a polyfunctional monomer (A-2) having in the molecule at least two cyclic ether structures represented by formula (1) below, and a latent cationic polymerization initiator (A-3). A tacky polymer formed by cationic polymerization of the composition is also disclosed.

Abstract: A thermosetting resin composition comprising (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): 1

Abstract: An adhesive composition for bonding of semiconductor chips to their chip mounting components comprising a curable polymer composition that comprises a spherical filler having an average particle size from greater than 100 to 1,000 &mgr;m and an aspect ratio of 1 to 1.5. Semiconductor devices according to this invention are characterized in that a semiconductor chip therein is bonded to the mounting component for said chip by the aforementioned adhesive.

Abstract: New polymers and anti-reflective or fill compositions including those polymers are provided.

Abstract: Provided is an industrially advantageous insulating film obtainable from a resin composition comprising (A) 100 parts by weight of a polyphenylene oxide having a structural unit of the following formula (1): 1

Abstract: Novel adhesive compositions are described that include an epoxyamine and, preferably, a curing agent. The adhesive composition can be used in surgical settings such as implanting bioprostheses and/or in manufacturing of bioprostheses. Biocompatible substrates can be adhered together by an adhesive bond formed by curing of the epoxyamine adhesive composition.

Abstract: Polyoxymethylene resin composition comprising 40 to 99.5 parts by weight of polyoxymethylene resin (A), and 0.5 to 60 parts by weight of resin consisting of a polyamide elastomer (B) and an acid-modified olefinic resin (C) having an acid modification rate of 0.05 to 15 wt. %, a ratio of (B)/(c) being in a range of 10/90 to 90/10% by weight, has a much distinguished impact resistance and a good antistatic property, while maintaining the heat stability inherent to the polyoxymethylene resin, as compared with the conventional one, and is suitable for use in OA appliances, VTR appliances, music-image- information appliances, communication appliances, automobile interior and exterior furnishings and industrial sundries.

Abstract: A flame retardant phosphorus element-containing epoxy resin composition substantially free of halogen, including: