Abstract: The present invention is directed to a corrosion barrier coating composition, comprising an admixture of: (1) about 60 to about 95 wt % of a one-component epoxy resin composition comprising (a) about 10-30% by weight of 4-glycidyloxy, n,n-diglycidyl aniline; (b) about 30-60% by weight of an epoxy resin, wherein the epoxy resin is epichlorohydrin ether of bisphenol A; and (c) about 3-7% by weight of strontium chromate; (2) about 1 to about 30 wt % of polytetrafluoroethylene; and (3) about 1 to about 20 wt % of glass powder, all weight percents being based on the total weight of the composition. The present invention is also directed to a substrate coated with the above corrosion barrier coating composition, and a method of coating a substrate with the above composition.

Abstract: A thermoplastic elastomer composition comprising the following components (A), (B) and (C): (A) 100 parts by weight of a thermoplastic polyester elastomer; (B) 3 to 100 parts by weight of a modified olefin resin having an epoxy group or a derivative group thereof in its molecule; and (C) 10 to 900 parts by weight of a rubbery elastomer selected from the group consisting of an olefin-based thermoplastic elastomers and styrene-based thermoplastic elastomers.

Abstract: The invention relates to Mannich bases prepared using alkyldipropylenetriamines and to addition compounds (adducts) of alkyldipropylenetriamines with acrylonitrile and ethylene oxide or propylene oxide, and to products obtained therefrom by the further addition of epoxy compounds having on average at least one epoxy group per molecule, and to the use of such products as hardeners for curable epoxy resin systems.

Abstract: A film-type adhesive for electronic components comprises a polyimide resin made up of specific repeating units and having a weight-average molecular weight of 5,000-150,000 in combination with an epoxy resin bearing at least two glycidyl groups per molecule. The adhesive has a weight ratio of the polyimide resin to the epoxy resin within a range of 50/50 to 5/95, and a film thickness of 20-150 &mgr;m. Such a film-type adhesive makes it possible to simplify and shorten the duration of assembly operations for electronic components having various types of adherend surfaces.

Abstract: The invention relates to transparent, undiscolored and uncrosslinked, radiation-curable binders of low additive content, obtainable by polymer-analogous reaction of epoxy-functional (meth)acrylate copolymers (A) with an unsaturated monocarboxylic acid (B), the reaction a) of the copolymer (A) taking place with at least 2 equivalents of the carboxylic acid (B), b) in the absence of reaction accelerators and inhibitors, c) in a continuously operated reactor, d) without solvent, e) at from 130 to 170° C., f) with a degree of conversion of at least 90% within an average residence time which is as short as possible but sufficient, and which is below 13 to 22 minutes. The reaction products contain virtually no byproducts and are advantageous binders for clearcoat materials and powder coating materials.

Abstract: A composition comprises from 60-98 weight percent of a casting resin such as an epoxy resin, from 2-30 weight percent of an alcohol or sugar such as 3 (4), 8 (9)-bis(hydroxymethyl)tricyclo[5.2.1.02,6]decane, from 0.2 to 2.0 weight percent of a thermal initiator such as an onium salt, from 0.2-2.0 weight percent of a bonding agent such as 3-glycidyloxypropyltrimethoxysilane, from 0-3.0 weight percent of a flow improver, from 0.2-5.0 weight percent of a metal complex with an organic ligand such as an amino acid, acetate, carbonic acid, amine and acetylacetonate including zinc di-(2-ethylhexanoate) and from 0-4 weight percent of a thixotropic agent and/or a flow modifier.

Abstract: A multi-component curable composition which is reactive upon admixing of the components and which comprises: (i) an acrylic polymer having acetoacetoxy functionality; and (ii) an acetoacetoxy functional derivative of a low molecular weight polyol; and (iii) a crosslinking component comprising at least one imine functional compound having an average of at least two imine groups per molecule which are reactive with acetoacetoxy functionality.

Abstract: The invention relates to a polymeric material on the basis of renewable raw materials, containing a reaction product from 10-90% by mass of a triglyceride with at least 2 epoxy and/or aziridine groups and 5-90% by mass of a polycarboxylic acid anhydride with 0.01-20% by mass of a polycarboxylic acid.

Abstract: A lactone chain-extended polyester polyol of the present invention comprises the reaction product of a lactone and a previously chain-extended phenolic-based hydroxyl compound. The previously chain-extended phenolic-based hydroxyl compound may comprise the reaction product of (i) a lactone or an alkoxylating agent selected from the group consisting of alkylene oxides and alkylene carbonates, and (ii) a phenolic aralkylation polymer comprising the reaction product of a phenolic monomer having at least two free reactive positions; a styrene derivative; and a coupling agent. The previously chain-extended phenolic-based hydroxyl compound also may be chain-extended by reacting with a lactam to produce a lactam chain-extended polyester polyamide. The polyols and polyamides of the present invention provide unique combinations of hard and soft functionalities, which translates into materials exhibiting a unique combination of toughness and hardness.

Abstract: An adhesive composition comprising a pressure sensitive adhesive component (A), a thermosetting adhesive component (B) and a compound (C) obtained by addition/condensation reaction of a polysiloxane oligomer with a silane coupling agent. This composition is excellent in storage stability and can bond metals, etc. with large bonding strength. Further, sheeting thereof enables simplifying bonding steps.

Abstract: The present invention relates to solvent free, moisture-curable, reactive hot melt adhesive compositions that are solid at room temperature, methods of making the compositions, and laminates prepared using the compostions. The compositions are a mixture comprising an isocyanate terminated prepolymer and a thermoplastic vinyl chloride copolymer.

Abstract: An adhesive sheet not tacky at ordinary temperatures, exhibiting strong adhesion and high heat resistance by heating under low pressure for a short period of time, having no problem of adhesive protrusion and excellent in storage stability, which comprises a base material having provided on one side or both sides thereof at least one layer of a thermosetting adhesive comprising (1) a non-tacky polymer of a monomer mixture comprising from 70% to 99% by weight of a (meth)acrylic ester represented by formula (I), a homopolymer of which has a glass transition temperature of −30° C.

Abstract: The present invention provides a thermosetting organic solvent type coating capable of forming a cured coating film having a TUKON hardness at 20° C. of 15 or more and the minimum value of dynamic modulus E′ at a frequency of 110 Hz in the temperature range of 150-200° C., of 1×109 dyn/cm2 or more. The cured film formed from the coating, as compared with the cured films formed from conventional organic solvent type coatings used as a top coat for automobile (e.g. an organic solvent type coating containing, as main components, a hydroxyl group-containing acrylic resin and a melamine resin, or a carboxylic-epoxy type coating), is at least equivalent in weatherability, finish appearance, acid resistance, etc. and superior in stain resistance.

Abstract: This invention relates to a binder composition suitable for coating compositions, which binder composition contains one or more carboxy-functional polymers, one or more compounds having an epoxide function in the molecule, one or more polyols having at least two hydroxyl functions in the molecule, which polyols differ from a component A) optionally containing hydroxyl functions, components which crosslink with hydroxyl groups to form ethers and/or a triazine-based crosslinking agent, optionally one or more polyisocyanates, which may optionally be capped, optionally an anhydride component and optionally one or more catalysts for catalysing the reaction of carboxyl and epoxide groups.

Abstract: A vulcanizate that has improved damping properties where the vulcanizate is prepared by the steps comprising blending a saturated damping additive within a vulcanizable composition of matter, wherein the vulcanizable composition of matter includes a vulcanizable elastomer, and effecting vulcanization of the elastomer.

Abstract: The rheological properties of a crosslinkable resin system can be substantially improved by the presence of an SCC polymer (or a similar crystalline polymer which melts over a narrow temperature range). The polymer dissolves in the curable system at temperatures above the melting point of the crystalline polymer (Tp), but when the system is then cooled to a temperature below Tp, at least partially forms a separate phase in the curable system. Below Tp, this separate phase substantially increases the viscosity of the curable system (i.e. makes it thicker than the same system without the crystalline polymer). This is particularly valuable for sheet molding composites (SMCs), in which the increase in viscosity makes the composites less tacky, and for dry film resists (DFRs). Above Tp, the curable system containing the dissolved crystalline polymer has a viscosity which is substantially less than its viscosity below Tp.

Abstract: A resin matrix with resistances to alkali and acid such as a fluorene-containing epoxy acrylate and/or a benzocyclobutene resin includes at least any one of insulative organic particles and insulative composite particles having an organic component and an inorganic component with the total amount of these particles being in the range of 5-50% by volume, wherein the insulative organic particles and the organic component of the insulative composite particles are allowed to be corroded by either alkali or acid, and wherein not less than 90% by volume of the insulative organic particles and insulative composite particles have a particle diameter in the range of 1-20 micrometers.

Abstract: A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer.

Abstract: The present invention provides a thermosetting high solids coating composition comprising (A) a carboxyl-containing compound, (B) a polyepoxide, and (C) a copolymer prepared by polymerizing monomer components comprising (a) 30 to 50% by weight of vinyltrimethoxysilane and/or vinyltriethoxysilane, (b) 5 to 15% by weight of N-methylol(meth)acrylamide alkyl ether, and (c) 35 to 65% by weight of another polymerizable unsaturated monomer, and a method for forming a topcoat using said composition. The composition of the present invention is highly effective in forming a coating film excellent in resistance to both acids and scratch, and is superior in storage stability and recoat adhesion.

Abstract: An adhesive composition, which comprises either an A- or B-side epoxy, and further includes a plurality of microspheres blended into either the A-side epoxy alone, the B-side epoxy alone, or into both. The microspheres of the invention are preferably made of a thermoplastic shell. As a result of the use of this adhesive between two substrates, a thin, strong bond may be formed between those two substrates. The bond is formed by a combination of an epoxy and a plurality of the microspheres. This epoxy and microsphere combination substantially inhibits seepage of the epoxy through the holes in a first, porous substrate.

Abstract: A one-pack coating composition is disclosed. The composition comprises (A) an oligomer or polymer containing an acid anhydride group, a blocked hydroxyl group and an epoxy group as indispensable functional groups in the same or different molecules, (B) a heat-potential curing catalyst which comprises a complex of an organometallic compound and an electron-donating compound or an onium salt and which exhibits its activity upon heating, (C) an ultraviolet absorber comprising a triazine or oxalic anilide, and (D) a hindered amine light stabilizer having a piperidine ring of the following structure: wherein R represents R1—CO—, a C2 to C20 alkyl group or R1—O— (R1 being a C2 to C20 alkyl group), and R2, R3, R4 and R5 independently from each other represent a C1 to C3 alkyl group, or a phenolic antioxidant. A method for coating using this coating composition is also disclosed.

Abstract: An ion exchange resin comprising an ion exchange material dispersed or distributed throughout a polyurethane matrix. The ion exchange material is typically a second polymer which has been chemically modified after dispersion or distribution throughout the polyurethane matrix.

Abstract: A process for preparing a polymer composition useful as a prepreg comprises (a) melt-mixing at least one thermoplastic polymer above the glass transition temperature or melt temperature of the thermoplastic polymer with either (i) an uncured epoxy resin or (ii) an epoxy curing agent or a catalyst; (b) melt-mixing above the glass transition temperature or melt temperature of the thermoplastic polymer, the other of (i) an uncured epoxy resin or (ii) an epoxy curing agent or a catalyst to form a substantially uncured but essentially curable and/or polymerizable composition; (c) optionally forming a shaped product from the melt-mixed composition of (b); and (d) fast-curing and/or fast-polymerizing the optionally formed shaped product.

Abstract: A halogenated flame retardant for a thermoplastic resin with carbonyl linkages in the main chain such as polyethylene terephthalate or polybutylene terephthalate is obtained by the modification of a brominated bisphenol A epoxy resin optionally advanced with brominated bisphenol A by reaction of the epoxy groups with a C1-C8 alcohol such as methanol or butanol to the extent that the ratio of unmodified epoxy groups to alcohol-modified epoxy groups is from 2/1 to 1/2.

Abstract: A lactone chain-extended polyester polyol of the present invention comprises the reaction product of a lactone and a previously chain-extended phenolic-based hydroxyl compound. The previously chain-extended phenolic-based hydroxyl compound may comprise the reaction product of (i) a lactone or an alkoxylating agent selected from the group consisting of alkylene oxides and alkylene carbonates, and (ii) a phenolic aralkylation polymer comprising the reaction product of a phenolic monomer having at least two free reactive positions; a styrene derivative; and a coupling agent. The previously chain-extended phenolic-based hydroxyl compound also may be chain-extended by reacting with a lactam to produce a lactam chain-extended polyester polyamide. The polyols and polyamides of the present invention provide unique combinations of hard and soft functionalities, which translates into materials exhibiting a unique combination of toughness and hardness.

Abstract: A process is disclosed for manufacturing coupled radial block copolymers of the S-B-Li type having improved optical properties, which process utilizes coupling agents having from about 3 to about 7 epoxy groups per mole.

Abstract: A curable composition formed by mixing components comprising 10 to 70 weight percent of a curable epoxy resin; an effective amount of a curative for the epoxy resin; 10 to 85 weight percent of a thermoplastic ethylene-vinyl acetate copolymer; and 5 to 60 weight percent of a thermoplastic polyester resin, the parts by weight being based on the total weight of the resin in the composition.

Abstract: The present invention provides a coupled polymer, which is prepared by reacting a living alkali metal-terminated polymer with a particular coupling agent. The coupling agent has the formula ##STR1## where R1, R3 are independently selected from the group consisting of aliphatic alkyl and alkenyl, and hydrogen, and R.sub.2 is alkylene, alkenylene, divalent cycloalkylene, divalent arenyl, or a C.sub.1-17 divalent hydrocarbyl containing ether or ketone group. By means of the particular coupling agent, the coupling efficiency is relatively high, and no harmful materials will be generated to corrode the pipes. The coupled polymer obtained has a coupling number of less than 3, and good rubbery physical properties, transparency, and wear resistance.

Abstract: A composition comprising:(a) polyethylene;(b) a cure booster selected from the group consisting of 3,9-divinyl-2,4,8,10-tetra-oxaspiro[5.5]undecane (DVS); a copolymer of ethylene and DVS; and an ethylene homopolymer or copolymer having DVS grafted thereto; and(c) an organic peroxide.

Abstract: Apparatuses and methods are disclosed for the production of a polyester/epoxy copolymer that can be applied as a liquid to a surface prior to being cured. The method of preparing the polyester/epoxy copolymer includes mixing maleic acid with dicyclopentadiene to produce a ten-carbon double ring ester, promoting esterification with the addition of a source of hydroxyl, such as an alcohol or a glycol, to a desired acid number and reacting with an epoxy. Optionally, a source of unsaturation may also be added. Examples include excess maleic anhydride, fumaric acid, excess ten carbon ester, nadic anhydride, or tetrahydrophthalic acid. Electrical components of the present invention include a cured coating of the copolymer of the present invention over at least a portion of the component. Specific, selective modifications to 100% reactive polyester/epoxy copolymer electrical varnishes can result in greatly improved moisture and chemical resistance properties.

Abstract: Radio frequency-transmissive compositions having reduced dissipation factors, microelectronic devices, and in particular, wireless radio frequency communication devices which utilize such compositions, and methods of forming the same are described. In one implementation, a liquid resin is provided and a solid organic polymer filler material is provided within the resin to impart a degree of radio frequency transmissivity which is greater than that of the resin alone, i.e. the composition has a reduced dissipation factor. An exemplary resin comprises epoxy and an exemplary filler material is a polytetrafluoroethylene powder. In another implementation, such composition is formed or applied over a substrate which includes an antenna formed thereon and cured to provide a solid coating. The substrate can also have integrated circuitry and a battery mounted thereon to provide a wireless communication device. In such a case, the composition can be formed over and cured atop the integrated circuitry and the battery.

Abstract: A thermoplastic resin composition can be obtained by adding about 0.1 to 20 parts by weight of a diene-series block copolymer (2) to 100 parts by weight of a resin composition containing a polycarbonate-series resin (1) as a basic component of which the proportion of terminal hydroxy groups relative to the whole of the terminals is 1 mole % or above (about 5 to 40 mole %). The polycarbonate-series resin base may further comprise a thermoplastic resin composition (3) such as a rubber-modified styrenic resin. The block copolymer component (2) includes an epoxy-modified block copolymer, etc. When added an organophosphorus compound as a flame retardant (4), or a fluorine-containing resin as a flame-retartant auxiliary (5), a halogen-free flame-retardant thermoplastic resin composition can be obtained. A thermoplastic resin with an improved flowability and impact strength can be obtained by modifying a polymer blend of the polycarbonate-series resin and the styrenic-series resin in quality.

Abstract: The present invention provides a thermosetting epoxy resin composition which copes with both storage stability and curing properties at a low temperature. A thermosetting epoxy resin composition of the present invention comprises (A) an epoxy resin, and (B) a fine powder-treated curing agent which comprises a curing agent in the solid state at room temperature, and particle surfaces of which are adhered with a fine powder having a center particle size of 2 .mu.m or less in a weight ratio of said solid curing agent to said fine powder in the range between 1:0.001 to 1:0.7, for hiding active sites on the surface of the curing agent. This composition is useful as an adhesive, a sealant, a coating material, a paint, a potting material, and a molding material.

Abstract: The present invention relates to a powder coating for application to packaging containers,1) the powder coating comprisingA) at least one thermoplastic,B) if desired, at least one thermoset, preferably an epoxy resin having an epoxy equivalent weight of from 400 to 3000,C) if desired, pigments, fillers, catalysts, typical powder coating additives such as degassing agents, levelling agents, free-radical scavengers and antioxidants, and2) the powder coating having a particle-size distribution such thata) at least 90 percent by mass of the powder-coating particles have a size of between 1 and 120 .mu.m,b) the maximum size of the powder-coating particles is .ltoreq.150 .mu.m for at least 99 percent by mass of the particles, andc) the mean size of the powder-coating particles in between 1 and 60 .mu.m, preferably from 1 to 30 .mu.m.

Abstract: A curable composition comprising a) a curable epoxy resin, a thermoplastic ethylene-vinyl acetate copolymer resin, and an effective amount of a photocatalyst for the curable epoxy resin, wherein the composition is free from hydrocarbon polyolefins and wherein the sum of a) and b) is 100 weight percent.

Abstract: The present invention provides a coating composition comprising one or more curable resins which contain, among the resins, free acrylic moieties and free or reacted epoxy moieties, and a ketone blocked polyamine type curing agent, the ingredients being chosen to provide in the coating after curing, more than 50% by weight of cured epoxy groups and less than 50% by weight of cured acrylic groups.

Abstract: A composition for preparing a reactive hot melt composition comprises (a) a thermoplastic polymer which comprises a polyolefin having an epoxy group, and (b) a radiation polymerizable component containing (b-1) an aliphatic alkyl (meth)acrylate and (b-2) an acrylic compound having a functional group reactive with an epoxy group. A reactive hot melt composition is obtained by polymerizing this composition so as to polymerize the radiation polymerizable component.The reactive hot melt composition which can be easily hot melt coated, crosslinked quickly in the absence of radiation or moisture after bonding adherends, does not form moisture during crosslinking, and has high flowability during hot melting.

Abstract: The present invention provides a prepreg having an excellent self adhesiveness to a honeycomb core, a low porosity when used as skin panels, an excellent surface smoothness due to a low surface porosity, and good tackiness and drapability. This invention also provides a honeycomb sandwich panel having a skin panel peel strength, an excellent impact resistance and an excellent hot water resistance, and a composition for a fiber reinforced composite material made from the prepreg and honeycomb sandwich panel. The fiber reinforced composite material made from the prepreg of the present invention can be used for airplanes, automobiles and other industrial applications, particularly as structural materials of airplanes, because of its excellent mechanical properties.

Abstract: Improved powder coating compositions containing novel polysiloxanes having various reactive functional groups are disclosed. The compositions are particularly useful as thermosetting powder coating compositions where they provide excellent filiform corrosion resistance.

Abstract: A process for preparing an epoxidized organic polymer by dispersing or suspending a solid organic polymer in an organic solvent and epoxidizing the dispersed or suspended polymer with a peroxide. The epoxidized polymer thus obtained is usable for coating materials, resin modifiers, rubber modifiers or adhesives, thus being extremely useful. The epoxidized organic polymer is useful to prepare a thermoplastic resin composition having improved mechanical strength, and comprising a thermoplastic resin, an epoxidized EPDM and an acid anhydride. The thermoplastic composition can be used to prepare a primer composition including a 100 parts by weight of an epoxidized EPDM and 50 to 70 parts by weight of a product of chlorination of a polyolefin modified with an unsaturated carboxylic acid or an anhydride thereof.

Abstract: A low density polymer composition including a polymer component capable of being cured, a low density filler in an amount sufficient to reduce the density of the polymer and a thixotrope present in a sufficient amount to impart a sufficient viscosity and to inhibit separation of the filler from the polymer until after the polymer is cured. The resulting lightweight, filled polymer composition is a strong electrical insulator, has low shrinkage, a low coefficient of thermal expansion, low cured density and a soft filler that does not harden the polymer. Methods of preparing and using the low density polymer compositions are also disclosed.

Abstract: A thermally curable adhesive composition that includes a fluxing agent that also acts as an adhesive is provided. The composition includes: (a) a fluxing agent represented by the formula RCOOH, wherein R comprises a moiety having two or more carbon-carbon double bonds wherein in one embodiment, at least one is within an acrylate or methacrylate group, and which may further contain at least one aromatic moiety; (b) a carboxylic acid neutralizing agent; (c) optionally, a crosslinkable diluent; (d) optionally, a source of free radical initiators; and (e) optionally, a resin. The composition can be applied directly onto the surface(s) of devices that are to be joined electrically and mechanically. These devices include, printed circuit substrates, connectors, components, cables, and other electrical devices having metallization patterns to be soldered together by means of a solder-bumped pattern on one or both surfaces.

Abstract: The present invention provides a thermosetting organic solvent type coating capable of forming a cured coating film having a TUKON hardness at 20.degree. C. of 15 or more and the minimum value of dynamic modulus E' at a frequency of 110 Hz in the temperature range of 150-200.degree. C., of 1.times.1O.sup.9 dyn/cm.sup.2 or more. The cured film formed from the coating, as compared with the cured films formed from conventional organic solvent type coatings used as a top coat for automobile (e.g. an organic solvent type coating containing, as main components, a hydroxyl group-containing acrylic resin and a melamine resin, or a carboxylic-epoxy type coating), is at least equivalent in weatherability, finish appearance, acid resistance, etc. and superior in stain resistance.

Abstract: The present invention provides a method of coupling PEG or related polymers to a substance by reductive amination. An activated PEG having an aldehyde hydrate moiety is prepared and is conveniently used as an intermediate for coupling PEG to a variety of biomolecules by reductive amination. The method of making PEG-conjugated biomolecules in accordance with the present invention avoids the condensation and oxidation reactions that are inherent in the coupling methods employed heretofore in the prior art using PEG aldehyde. As a result, high purity of PEG-conjugates can be achieved.

Abstract: The invention provides a powdered crosslinkable textile binder composition for producing polymer bonded textile moldings or sheet materials, comprisinga) a powdered copolymer obtainable by emulsion polymerization and subsequent drying of one or more monomers selected from the group consisting of vinyl esters, acrylic esters, methacrylic esters, vinylaromatics and vinyl chloride and of 0.01 to 25% by weight, based on the total weight of the copolymer, of one or more ethylenically unsaturated carboxyl-containing monomers, the copolymer having a glass transition temperature Tg or a melting point of greater than 40.degree. C. and a molecular weight Mw of 60,000 to 300,000, andb) at least one powdered compound having two or more epoxide or isocyanate groups and a melting point of 40.degree. C. to 150.degree. C.

Abstract: A method for reacting a methylene-containing component such as an acrylic polymer prepared from acetoacetoxyalkyl (meth)acrylate and an alkene-containing component such as a polyfumarate, polymaleate, a polyester containing both fumarate and maleate groups or a polyacrylate comprises the reaction of a tertiary amine such as triethylene diamine and an epoxide such as a glycidyl-functional (meth)acrylic polymer in the presence of the methylene-containing component and alkene-containing component. The tertiary amine can be incorporated into the alkene-containing component such as the reaction of an unsaturated polyester with a compound having both tertiary amine and primary or secondary amine groups. The tertiary amine can be incorporated into the methylene-containing component such as an acrylic polymer derived from a tertiary amino-functional monmer and acetoacetoxyalkyl (meth)acrylate.

Abstract: Curable film-forming compositions containing epoxy functional copolymers, polycarboxylic acid crosslinking agents, and triaryltin compound having the chemical structure of (Ar).sub.3 SnOR wherein the aryl groups are the same or different and at least one aryl group is substituted with at least one atom or group selected from the group consisting of carbon, nitrogen, oxygen, sulfur, phosphorous, silicon and halogen and R is selected from the group consisting of hydrogen, alkyl, and acyl groups are disclosed. The compositions do not release benzene during cure. The compositions may be powder or liquid and are useful as clear coats, particularly in a color-plus-clear composite coating system.

Abstract: A storage-stable, curable film-forming composition is provided comprising: (i) a crosslinking agent selected from an aminoplast, a blocked polyisocyanate, and mixtures thereof; and (ii) a hydroxyl functional acrylic polymer further containing a plurality of alkoxysilane groups of the structure: ##STR1## wherein R.sub.1 is hydrogen or methyl, and R.sub.2 is a divalent group. The acrylic polymer is prepared in a solvent medium comprising an alcohol. The curable film-forming composition is suitable for use in color-plus-clear composite coating compositions.

Abstract: The invention provides a thermosetting powder coating composition comprising (A) a vinyl copolymer having a number average molecular weight of 1,500 to 6,000, a molecular weight distribution of 1.0 to 1.5 as represented by a weight average molecular weight/a number average molecular weight and a glass transition temperature of 40 to 100.degree. C., the copolymer containing at least one species of functional group selected from the class consisting of epoxy group, carboxyl group and hydroxyl group, and (B) a curing agent. The thermosetting powder coating composition of the invention is superior in any of the finished appearance of coating film and the blocking resistance.

Abstract: Anti-reflective coatings and methods for forming these anti-reflective coatings are disclosed that have a polymer chemistry and optical characteristics suitable for suppressing the light that reflects off a circuit substrate during a photo-lithographic process. These anti-reflective coatings include a phenolic polymer material and an epoxide-containing polymer material that can be combined in a select proportion to form a thermally curable polymeric anti-reflective coating. The select proportions of the combined materials tailors the optical characteristic of the anti-reflective coating to attenuate energy about a select range of wavelengths.