Abstract: The present invention provides a method for improving the flame retardant efficiency of a phenoxyphosphazene compound, and provides a prepreg, a laminate, and a laminate for printed circuit that are made by the method. The present invention compounds a phenoxyphosphazene compound and a dihydrobenzoxazine ring-containing compound in a halogen-free flame retardant resin composition, so as to effectively improve the flame-retardant efficiency of the phenoxyphosphazene compound. Besides, the prepreg, the laminate and the laminate for printed circuit that are made by the method for improving the flame retardant efficiency of a phenoxyphosphazene compound have excellent flame retardancy, chemical resistance, anti-CAF property, high glass transition temperature (Tg), high thermal resistance, low dielectric dissipation factor, low moisture, and low C.T.E, etc.

Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.

Abstract: There are provided a phenol resin which produces a cured product having excellent heat resistance and a low coefficient of thermal expansion, a curable resin composition containing the phenol resin as a curing agent for an epoxy resin, a cured product of the curable resin composition, and a printed circuit board having excellent heat resistance and low thermal expansibility. A novel phenol resin having a resin structure which is formed by oxidizing a polycondensate (a) of a naphthol compound and formaldehyde and in which a naphthol skeleton (n) and a naphthoquinone skeleton (q) are bonded through a methylene bond is used as a curing agent for an epoxy resin.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional epoxidized bisphenol-A novolac resin; (4) an optional oligomeric butadiene; (5) an optional organic solvent; and (6) an alkylphenol novolac resin, the alkylphenol novolac resin serving as a curing agent. The composite so prepared may have good physical properties and superior a electrical properties as compared to conventional composites, such as laminates. The prepregs used to make the laminates may have a better surface appearance as well.

Abstract: The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant resin composition. The halogen-free flame retardant resin composition comprises: (A) 40-80 parts by weight of the mixture of a phenoxyphosphazene compound (A1) and a dihydrobenzoxazine ring-containing compound (A2), and, the weight ratio between the phenoxyphosphazene compound (A1) and the dihydrobenzoxazine ring-containing compound (A2) being between 1:10 and 1:2; (B) 15-45 parts by weight of a polyepoxy compound; (C) 5-25 parts by weight of a phenolic resin type hardener; and (D) 0.1-1 parts by weight of an imidazole type compound as the curing accelerator.

Abstract: The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by -P-B-X- wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by —P—B—X— wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.

Abstract: Disclosed is a phosphorous containing phenol novolac resin, having a structure as below: In the above formula, Z is selected from — or —CH2—. Each Y is independently selected from —, —CH2—, —C(CH3)2—, —S—, —SO2—, —O—, —CO—, or —N?N—. Each X is independently selected from a hydrogen or phosphorous containing group, wherein the hydrogen and phosphorous containing group have a molar ratio of 1:0.1 to 0.1:1. Each R1 is independently selected from a hydrogen or C1-5 alkyl group. Each R2 is independently selected from a C1-5 alkyl group. m is an integer of 1 to 10, and n is 0 or 1.

Abstract: A low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); and (D) Flame retardant agent, curing agent and accelerating agent solutions.

Abstract: The present invention provides novel phosphinated compounds of monofunctional, bifunctional, multifunctional phenols represented by the following formulae and their derivatives, and preparation methods thereof:

Abstract: A method of sealing a semiconductor element which involves applying an epoxy resin composition including an epoxy resin and a phenolic resin obtained by reacting phenol, a biphenyl compound represented by the general formula (3) and benzaldehyde to a semiconductor element and curing the composition to seal the semiconductor element: wherein X in the formula (3) is a halogen, an OH group or an OCH3 group. The molar ratio of the total of the biphenyl compound and benzaldehyde relative to the phenol is from 0.27 to 0.40, and the molar ratio of benzaldehyde/biphenyl compound is from 5/95 to 40/60.

Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.

Abstract: The invention relates to a curing agent for epoxy resins, comprising a phenalkamine blended with a salted polyamine or a salted polyamine-epoxy adduct to form a curing agent for an epoxy resin, wherein at least one-third of the primary amine groups of the salted polyamine or the salted polyamine-epoxy adduct are blocked.

Abstract: This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta-substituted reactive groups and a cationic or radical initiator.

Abstract: A liquid resin composition of the present invention is a liquid resin composition for bonding a semiconductor element on a support, exhibiting a tackiness of 0.05 N or less after heating at 120° C. for 10 min and a tackiness of 1 N or more at 80° C. A semiconductor wafer having an adhesive layer of the present invention is a semiconductor wafer having an adhesive layer in which the adhesive layer is formed from the above liquid resin composition. A process for manufacturing a semiconductor element of the present invention has the application step of applying an adhesive as a liquid resin composition containing a thermosetting resin and a solvent to one side of a wafer; the evaporation step of evaporating said solvent while substantially maintaining a molecular weight of said liquid resin composition to form an adhesive layer; the bonding step of bonding a dicing sheet on one side of said wafer; and the cutting step of cutting said wafer into pieces.

Abstract: Disclosed is a phosphorous containing phenol novolac resin, having a structure as below: In the above formula, Z is selected from — or —CH2—. Each Y is independently selected from—, —CH2—, —C(CH3)2—, —S—, —SO2—, —O—,—CO—, or —N?N—. Each X is independently selected from a hydrogen or phosphorous containing group, wherein the hydrogen and phosphorous containing group have a molar ratio of 1:0.1 to 0.1:1. Each R1 is independently selected from a hydrogen or C1-5 alkyl group. Each R2 is independently selected from a C1-5 alkyl group. m is an integer of 1 to 10, and n is 0 or 1.

Abstract: Phosphorus-containing compounds are disclosed which are obtainable by reacting: (A) at least one organophosphorus compound having a group selected from the group H—P?O; the group P—H and the group P—OH; and (B) at least one compound having the following Formula (I): [R?(Y)m?]m(X—O—R?)n??Formula (I) wherein R? is an organic group; Y is a functional group selected from the group consisting of hydroxy, carboxylic acid, and amine; X is a hydrocarbylene group; R? is hydrogen or a hydrocarbyl group having from 1 to 8 carbon atoms, R is alkyl or aryl group having from 1 to 12 carbon atoms; m?, m and n are, independently, numbers equal to or greater than 1; and (C) a thermosetting or thermoplastic composition.

Abstract: Disclosed is a phenol aralkyl epoxy resin having a structure wherein at least a phenol or a naphthol is bound by using an aralkyl group as a linking group and a structure represented by formula (1) below, while satisfying the condition 1 below. This epoxy resin is excellent in workability during production of a composition and is easy to control quality. Condition 1: The following relation (?) is satisfied with A being the hydroxyl equivalent (as measured in accordance with JIS K 0070) of a phenol-modified epoxy resin obtained by adding an equivalent molar amount of phenol relative to the epoxy equivalent of the epoxy resin, and B being the epoxy equivalent of the epoxy resin. 50?1000×(A?B)/B?250 (?).

Abstract: A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional epoxidized bisphenol-A novolac resin; (4) an optional oligomeric butadiene; (5) an optional organic solvent; and (6) an alkylphenol novolac resin, the alkylphenol novolac resin serving as a curing agent. The composite so prepared may have good physical properties and superior a electrical properties as compared to conventional composites, such as laminates. The prepregs used to make the laminates may have a better surface appearance as well.

Abstract: Provided is a curable resin composition that exhibits good heat resistance and low thermal expansion, and that realizes good solubility in solvents, a cured product thereof, a printed wiring board including the composition, a novel epoxy resin that imparts these properties, and a process for producing the same. A curable resin composition contains, as essential components, an epoxy resin (A) having, in its molecular structure, a glycidyloxy group and a skeleton in which a naphthalene structure and a cyclohexadienone structure are bonded to each other via methylene group(s); and a curing agent (B).

Abstract: A composition for preparing a halogen-free resin is provided, the composition including a halogen-free phosphorated epoxy, a urethane-modified copolyester, a curing agent, a filler, a surfactant, and a solvent. A halogen-free prepreg is also provided, including a glass fabric cloth and a halogen-free resin layer on the glass fabric. The halogen-free resin layer is made from the foregoing halogen-free resin.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: Phosphorus-containing compounds are disclosed which are obtainable by reacting: (A) at least one organophosphorus compound having a group selected from the group H—P?O; the group P—H and the group P—OH; and (B) at least one compound having the following Formula (I): [R?(Y)m?]m(X—O—R?)n??Formula (I) wherein R? is an organic group; Y is a functional group selected from the group consisting of hydroxy, carboxylic acid, and amine; X is a hydrocarbylene group; R? is hydrogen or a hydrocarbyl group having from 1 to 8 carbon atoms, R is alkyl or aryl group having from 1 to 12 carbon atoms; m?, m and n are, independently, numbers equal to or greater than 1. These compounds are useful for making flame retardant epoxy and polyurethane resins and ignition resistant thermoplastic resins, each of which is useful for a variety of end uses requiring flame retardancy or ignition resistance. Flame retardant epoxy resins may be used to make electrical laminates.

Abstract: The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected onto an adherend, the film for flip chip type semiconductor back surface having a ratio of A/B falling within a range of 1 to 8×103 (%/GPa), in which A is an elongation ratio (%) of the film for flip chip type semiconductor back surface at 23° C. before thermal curing and B is a tensile storage modulus (GPa) of the film for flip chip type semiconductor back surface at 23° C. before thermal curing.

Abstract: An underfill composition is formulated to increase the surface tension thereof for use in capillary underfilling of an integrated circuit die that is coupled to a mounting substrate. A method includes mixing a surface tension-increasing additive with a bulk polymer and a hardener and allowing the underfill composition to flow between the integrated circuit die and the mounting substrate. An article is achieved by the method. The article can be assembled into a computing system.

Abstract: The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent.

Abstract: An active-hydrogen-containing (carboxyl or hydroxyl) phosphorus compound is provided. An epoxy resin semi-thermoset formed by bonding the phosphorus compound to an epoxy group is also provided. A flame-retardant epoxy resin thermoset is formed after reacting the epoxy resin semi-thermoset with a curing agent. The epoxy resin thermoset possesses excellent flame retardancy, heat stability, and high glass transition temperature (Tg), does not produce toxic and corrosive fumes during combustion, and thus is an environmentally friendly flame-retardant material.

Abstract: An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a curing agent in the form of a naphthalene type phenolic resin, (C) an inorganic filler, and (D) a phosphazene compound is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.

Abstract: The present invention provides a brominated epoxy resin, which has a molecular segment of low polarity in the polymer chain, while the molecular segment of low polarity is attributed to the symmetric or saturated cyclic alphatic molecular structure with low “molecular dipole moment” characteristics; making a printed circuit board for high frequency signal transformation applications needs a proper copper clad laminate which processes the properties of a low dielectric constant and of a low dissipation factor; a copper clad laminate can meet above requirements by using the inventive resin as a laminate binder. The inventive resin is prepared by the following steps: 1. Reacting a 2,6-disubstituted mono-phenol compound (A) with an aldehyde or a cyclic diene compound (B), so as to obtain a bisphenol compound (C) having a high symmetry or saturated aliphatic heterocyclic structure; 2.

Abstract: A novel hydroxyl-functional polyether derived from the reaction of (a) a divinylarene dioxide, particularly a divinylarene dioxide derived from divinylbenzene such as divinylbenzene dioxide (DVBDO); and (b) a diphenol; wherein the reaction product is thermally stable and exhibits an absence of self-polymerization (crosslinking or gelling) upon heating at elevated temperatures. The novel hydroxyl-functional polyether offers improved properties compared to known hydroxyl-functional polyethers such as solid epoxy resins, phenolic epoxy resins (hardeners), and poly(hydroxyl ethers).

Abstract: Provided are: an adamantane derivative represented by the following general formula (I) giving a cured product excellent in optical characteristics such as transparency and light resistance, durabilities such as heat resistance, and electrical characteristics such as dielectric constant; a method of producing the adamantane derivative; a resin composition containing the adamantane derivative and an epoxy resin curing agent; and a sealing agent for an optical semiconductor using the resin composition: where: Y represents a group selected from a hydrocarbon group, a hydroxyl group, a carboxyl group, and an ?O group formed by two Y's being combined together; Z represents a cyclic ether group; n represents an integer of 0 or more; and p represents an integer of 2 to 4 and q represents an integer of 0 to 14, while satisfying 2?p+q?16.

Abstract: An encapsulant composition for a light-emitting diode is provided. One embodiment of the encapsulant composition comprises: (a) about 100 parts by weight of at least one liquid bi-functional epoxy resin containing about 40˜50 weight % of aromatic ring; (b) about 55˜120 parts by weight of a curing agent comprising at least one bi-functional thiol curing agent containing aromatic ring and at least one aliphatic tetra-functional thiol curing agent, wherein the curing agent contains about 10˜50 weight % of aromatic ring and about 20˜35 weight % of sulfur; and (c) about 0.05˜0.5 parts by weight of a catalyst. The encapsulant composition having a high refractive index can be used for a solid state light emitting device to enhance light extraction efficiency.

Abstract: Disclosed is a phenolic resin having flame retardance, fast curing property and low melt viscosity, which is useful for a curing agent for epoxy resin-based semiconductor sealing materials. Also disclosed are a method for producing such a phenolic resin and use of such a phenolic resin. Specifically disclosed is a phenolic resin obtained by reacting a phenol, a bismethylbiphenyl compound and an aromatic aldehyde at such a ratio that the molar ratio of the total of the bismethylbiphenyl compound and the aromatic aldehyde relative to the phenol is 0.10-0.60, and the aromatic aldehyde/the bismethylbiphenyl compound (molar ratio) is from 5/95 to 50/50. Also specifically disclosed is an epoxy resin composition composed of such a phenolic resin and an epoxy resin.

Abstract: A thermosetting resin composition include a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent, and a filler. The liquid epoxy resin is liquid at 20° C. and has at least two epoxy groups in a molecule. A solid epoxy resin is solid at 40° C. and has at least three epoxy groups in a molecule. A semisolid epoxy resin is solid at 20° C. and liquid at 40° C. and has at least two epoxy groups in a molecule. A ratio of mass of the liquid epoxy resin to a sum of mass of the solid epoxy resin and mass of the semisolid epoxy resin is about 1:1 to about 1:10, and a ratio of the mass of the solid epoxy resin to the mass of the semisolid epoxy resin is about 1:0.5 to about 1:2.

Abstract: The disclosure relates to composites having increased distortional deformation, and/or decreased dilatation load, as expressed within the von Mises strain relationship, which provide increased von Mises strain results. These composites may provide enhanced composite mechanical performances.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: An adamantane derivative of formula (I), a compound of formula (VII) or (VIII), compositions containing them, and optical electronic members using the resin compositions. In the formulas, W represents, for example, a hydrogen atom, X is bonded to a bridge-head adamantane carbon and represents, for example, a group of represented by the general formula (II), Y represents a group of formula (V) or (VI), R1 represents a methyl group or an ethyl group, R2 represents a C1 to C10 hydrocarbon group which may contain O or S, m is an integer of 2 to 4, k is an integer of 0 to (16?m) and p and q are each an integer of 1 to 5.

Abstract: An underfill composition is formulated to increase the surface tension thereof for use in capillary underfilling of an integrated circuit die that is coupled to a mounting substrate. A method includes mixing a surface tension-increasing additive with a bulk polymer and a hardener and allowing the underfill composition to flow between the integrated circuit die and the mounting substrate. An article is achieved by the method. The article can be assembled into a computing system.

Abstract: To provide an epoxy resin giving a cured object having high heat resistance, which is improved in impact resistance and moisture resistance as compared with conventional high-heat-resistance epoxy resins. The epoxy resin is obtained by glycidylating one or more phenol compounds comprising 95% or more 1,1,2,2-tetrakis (hydroxyphenyl)ethane, and is characterized in that in an examination by gel permeation chromatography, the epoxy resin has a tetranucleus-form content of 50 to 90% by area and an octanucleus-form content of at least 5% by area and has a total chlorine content of 5,000 ppm or smaller.

Abstract: The invention relates to solid thermosetting resin compositions and resin-coated foils, glass cloth reinforced resin-coated foils using the same and their use in the manufacturing of printed circuit boards.

Abstract: The invention relates to a liquid resin composition intended for manufacturing abrasives that comprises at least one novolac resin having a glass transition temperature less than or equal to 60° C., at least one reactive diluent and optionally at least one crosslinking agent. Application of the resin composition for producing abrasive articles, especially bonded abrasives and coated abrasives. It also relates to the abrasive articles comprising abrasive grains connected by such a liquid resin composition.

Abstract: An organic solvent free process to make an aqueous co-dispersion of epoxy resins and at least phenolic novolac resins is reported. The compositions of such co-dispersions are based on blends of epoxy resins and at least a phenolic novolac resin within the profile viscosity versus temperature in the ranges from 1 500 000 to 300 mPas at 80° C. and 10 000 to 20 mPas at 120° C.

Abstract: An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1?E?0.27 W+21.8 in the case of 30?W<60, or a value satisfying 0.30 W?13?E?3.7 W?184 in the case of 60?W?95 wherein W (wt %) is a content of the inorganic filler (C) in the cured article. The cured article of this composition forms a foamed layer during thermal decomposition or at ignition to exert flame retardancy.

Abstract: A curable composition comprising a) an epoxy resin containing on average more than one epoxy group per molecule, and b) as curing agent a composition comprising b1) 40-100 wt % of a reaction product from the reaction of b1a) at least one diglycidyl- and/or at least one monoglycidylether with b1b) a composition comprising a volatile monoamine and a polyamine, said composition b1b) is used in an amount to provide an excess amino groups relative to epoxy groups from b1a), and whereby the excess of monoamine is removed off from the reaction product, b2) 0-60 wt % of a polyamine, and b3) 0-25 wt % of a polyphenol novolac, and whereby the sum of components b1), b2) and b3) is 100 wt %, providing long pot life combined with fast cure times at low temperatures, thus making said compositions especially useful for marine and offshore coatings, industrial maintenance, construction, tank and pipe linings, adhesive, automobile and electrical potting applications.

Abstract: An alicyclic diepoxy compound (A) represented by formula (I) is produced in high purity and high yield at low cost, by epoxidizing the corresponding alicyclic diolefin compound with an organic percarboxylic acid. The curable epoxy resin composition has high reactivity for various curing agents, low viscosity, and excellent workability. A cured product thereof shows useful physical properties for uses in coatings, inks, adhesives, sealants, and encapsulants, etc. It is of extremely high quality as an epoxy resin composition for the encapsulation of electronic parts. A stabilizer for an electrical insulating oil (the alicyclic diepoxy compound or an electrical insulting oil containing the compound) is low in acid value, and the stabilizer improves the properties of the insulating oil. A cured product obtained by curing a casting epoxy resin composition for electrical insulation has excellent properties such as high bending strength, high Tg, and low permittivity.

Abstract: The invention relates to composites having increased distortional deformation, and/or decreased dilatation load, as expressed within the von Mises strain relationship, which provide increased von Mises strain results. These composites may provide enhanced composite mechanical performances.

Abstract: An epoxy resin composition which comprises an epoxy resin (A), a curing agent (B), a curing accelerator (C) and a component retarding curing of the epoxy resin (D) which is at least one component selected from components (a), (b) and (c) represented by general formulae [1], [2] and [3], respectively, a semiconductor device having a semiconductor element encapsulated by using the composition, and a process for providing latency to an epoxy resin composition. The epoxy resin exhibits excellent storage stability, excellent fluidity and curing property during encapsulating by molding and excellent resistance to soldering without forming cleavages or cracks by the soldering treatment at high temperatures in accordance with the lead-free soldering. An epoxy resin composition can be provided with latency by adjusting the amounts of the curing accelerator and the component for retarding curing.