Abstract: A resin composition for semiconductor encapsulation contains an epoxy resin (A); a phenolic compound (B) containing two or more phenolic hydroxyl groups; an inorganic filler (C); and a curing accelerator (D). The epoxy resin (A) contains an epoxy resin (a1) represented by the formula (1) wherein Ar is a C6-C20 aryl group, R1 is a C1-C6 hydrocarbon group, R2 is a C1-C4 hydrocarbon group, W1 is oxygen or sulfur, RO is a C1-C6 hydrocarbon group, a=0-10, g=0-3, 0<m<1, 0<n<1, m+n=1 and m:n=1:10 to 1:1, and the resin composition has a moisture absorption rate of 0.22 weight % or less when the composition is humidified at 85° C. and 85% R.H.

Abstract: The present invention provides an epoxy resin composition that is excellent in thermal conductivity and has improved high-temperature resistance and handleability. The epoxy resin composition comprises an epoxy compound having a mesogenic skeleton and a curing agent having a biphenylaralkyl skeleton. The biphenylaralkyl skeleton-containing curing agent preferably has a softening point of 110° C. or lower. The biphenylaralkyl skeleton-containing curing agent is preferably an amorphous curing agent.

Abstract: In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.

Abstract: The invention relates to a curing accelerator for a curing resin obtained by reacting a phosphine compound (a) with a compound (b) having at least one halogen atom substituted on an aromatic ring and at least one proton atom which can be discharged, and subjecting the reaction product to dehydrohalogenation, a curing resin composition containing the curing accelerator, and an electronic component device having a device component encapsulated with the curing resin composition. The curing accelerator exhibits superior curability under moisture absorption, flow properties, reflow cracking resistance and high-temperature storage characteristics.

Abstract: A phenolic resin having not more than 5 wt% of free bisphenol and a molecular weight distribution Mw/Mn of not more than 2.0 is prepared by reacting a bisphenol and aldehyde in the presence of an alkaline catalyst at a temperature of from 0° C. to 100° C., neutralizing with an acid, adding an acid to adjust the pH to from 0 to 6, heating to a temperature of from 50° C. to 200° C, and vacuuming to recover the phenolic resin.

Abstract: An antireflective hardmask composition includes an organic solvent, and at least one polymer represented by Formulae A, B or C: In Formulae A and B, the fluorene group is unsubstituted or substituted, in Formula C, the naphthalene group is unsubstituted or substituted, n is at least 1 and is less than about 750, m is at least 1, and m+n is less than about 750, G is an aromatic ring-containing group having an alkoxy group, and R1 is methylene or includes a non-fluorene-containing aryl linking group.

Abstract: There is provided an anti-reflective coating forming composition for lithography comprising a polymer compound, a crosslinking compound, a crosslinking catalyst, a sulfonate compound and a solvent. The anti-reflective coating obtained from the composition has a high preventive effect for reflected light, causes no intermixing with photoresists, has a higher dry etching rate compared with photoresists, can form a photoresist pattern having no footing at the lower part, and can use in lithography process by use of a light such as ArF excimer laser beam and F2 excimer laser beam, etc.

Abstract: An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein. The encapsulating epoxy resin molding material for thin semiconductor devices according to this invention is excellent in fluidity, and the semiconductor device encapsulated therein, which is a semiconductor device having a semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or on a mounted substrate such as organic substrate or organic film, is free of molding defects such as wire sweep, voids etc. as shown in the Examples, and thus its industrial value is significant.

Abstract: The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1—??(1) wherein R1 represents a hydrocarbon group having 2 to 6 carbon atoms, R2 represents a hydrocarbon group having 1 to 10 carbon atoms, between a phenolic carbon and a phenolic carbon, phenol derivatives represented by the following formula (5): wherein R5 represents a C2-3 alkylene group, R6 represents a C1-10 alkylene group, G represents H, a C1-10 alkyl group, etc., and an epoxy resin composition containing (A) a curing agent of the above-mentioned formula (5) and (B) an epoxy resin as essential components.

Abstract: A multi-component curable composition which is reactive upon admixing of the components and wherein the composition comprises: A. a first component which comprises: (i) a first amine functional adduct which comprises the reaction product of a stoichiometric excess of a diamine and a compound having an epoxide group and an alpha, beta unsaturated carbonyl group; B. a second component which comprises: (i) at least one compound having an average of more than 2.0 groups per molecule which are reactive with amines.

Abstract: A production method of granular epoxy resin includes an epoxy resin preparing step of preparing an epoxy resin which is solid at ordinary temperature by reaction between a phenol compound and epihalohydrin; a purifying processing step of refining the prepared epoxy resin which is solid at ordinary temperature so that the total content of compounds having a molecular weight of 200 or less is 0.28% by mass or less of the entire epoxy resin; and a pulverizing step of pulverizing the refined epoxy resin obtained by the purifying processing step under conditions so as not to make the total content of compounds having a molecular weight of 200 or less exceeding 0.3% by mass, wherein the epoxy resin which is solid at ordinary temperature prepared by the epoxy resin preparing step is mainly composed of at least one selected from oligomers represented by the following general formula (1) and oligomers represented by the following general formula (2).

Abstract: The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1—??(1) wherein R1 represents a hydrocarbon group having 2 to 6 carbon atoms, R2 represents a hydrocarbon group having 1 to 10 carbon atoms, between a phenolic carbon and a phenolic carbon, phenol derivatives represented by the following formula (5): wherein R5 represents a C2-3 alkylene group, R6 represents a C1-10 alkylene group, G represents H, a C1-10 alkyl group, etc., and an epoxy resin composition containing (A) a curing agent of the above-mentioned formula (5) and (B) an epoxy resin as essential components.

Abstract: A one-component heat curable epoxide composition which have an excellent storage stability and can be cured in a short period of time at a relatively low temperature, and in particular, have a property of generating outgas in a smaller amount, and providing cured product with an excellent heat resistance, is provided. The composition comprises 100 parts by weight of (A) an epoxide having more than one epoxy group on average in the molecule, and 1 to 40 parts by weight of (B) a curing compound which is prepared by reacting with heating (a) aminoalkylimidazole of the general formula: (b) an amine having two nitrogen atoms with one or two active hydrogen atoms and having at least one cyclic structure group in the molecule therein, (c) urea, and (d) a diepoxide having two epoxy groups on average in the molecule.

Abstract: An objective of this invention is to provide an epoxy resin composition for encapsulating a semiconductor free from a harmful substance out of regard for the environment, which exhibits excellent soldering heat resistance and a higher productivity, as well as a semiconductor device manufactured by encapsulating therewith. This invention relates to a epoxy resin composition for encapsulating a semiconductor comprising, as essential components, (A) an epoxy resin having a particular structure and (B) a phenolic resin comprising a phenolic resin component having a particular structure as a main component, which contains a component having up to three aromatic rings in one molecule in 0.8% or less in an area ratio as determined by GPC analysis, as well as a semiconductor device manufactured by encapsulating a semiconductor chip with the composition.

Abstract: A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).

Abstract: The present invention provides an adhesive for laminates containing, as a main component, an epoxy resin composition comprising an epoxy resin and an epoxy resin-curing agent, the epoxy resin composition being formed into an epoxy resin cured product containing a skeleton structure represented by the formula (1): in an amount of at least 40% by weight. Since the adhesive of the present invention reveals not only a suitable adhesion to various film materials but also a high gas-barrier property, only a single layer formed therefrom can realize both an excellent gas-barrier property and an excellent adhesion property in combination, so that it is possible to produce a high gas-barrier laminated film for a packaging material without forming a separate gas-barrier layer therein.

Abstract: An underfill composition includes a thermosetting resin and a thermally cleavable component that releases sulfonic acid upon thermal activation. The underfill composition is applied to flip-chip technology during no-flow underfill mounting of the flip-chip to a mounting substrate. The mounting substrate can be further mounted on a board. A process includes formation of the underfill composition. A method includes assembly of the underfill composition with the flip-chip, and further can include assembly of the mounting substrate to a board. A computing system is also included that uses the underfill composition.

Abstract: The present invention relates to an epoxy resin varnish composition with high glass transition temperature for laminate plate, wherein the resin composition comprises: (A) a new dihydrobenzoxazine thermosetting resin obtained by reacting compounds: (a) phenolic products from reaction of di- or multifunctional epoxy resin and di-functional phenolic compounds; (b) mono- or di-functional primary amines; (c) di-functional phenols; and (d) formaldehyde or paraformaldehyde, (B) one or more epoxy resins, (C) novolac resin curing agents, and (D) curing promoters. For the epoxy resin varnish composition, crosslinking density of resin is increased due to using modified dihydrobenzoxazine thermosetting resin with multiple functional groups, so that mechanical strength and heat resistance of the obtained substrate are remarkably improved, and solubility problem of dihydrobenzoxazine in solvent is solved to greatly elevate production efficiency.

Abstract: An epoxy resin composition for encapsulating optical semiconductor element, comprising the following (A) to (D): (A) an epoxy resin component comprising a novolak type epoxy resin having at least one of the biphenyl skeleton and naphthalene skeleton in one molecule in an amount of from 50 to 100% by weight of the total weight of the epoxy resin component, (B) a curing agent component comprising a novolak type phenol resin having at least one of the biphenyl skeleton and naphthalene skeleton in one molecule in an amount of from 50 to 100% by weight of the total weight of the curing agent component, (C) an organic phosphorus flame retarder, and (D) a curing catalyst, wherein the content of an organic phosphorus flame retarder as (C) is from 1.5 to 10% by weight based on the total weight of the epoxy resin composition.

Abstract: The present invention relates to an epoxy compound, represented by a general formula (I), which is solid at ordinary temperature, has extremely low melt viscosity and has excellent curing property and which can provide a cured product which is excellent in mechanical strength, heat resistance, and moisture resistance. It also relates to a preparation method of the epoxy compound, an epoxy resin composition, and a cured product thereof. The epoxy compound is represented by the following general formula (I): (wherein R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms, and n represents an integer of 0 or more).

Abstract: An epoxy compound, represented by a general formula (I) is obtained by reacting an anthrahydroquinone compound having a following general formula (II) with epihalohydrin. (wherein R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms, and n represents an integer of 0 or more, and wherein A1, A2 each represent hydrogen atom or alkali metal atom, R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms.

Abstract: An epoxy resin composition for encapsulating a semiconductor chip, which has good flowability without deterioration in curability. Specifically, a resin composition is disclosed for encapsulating a semiconductor chip containing a phenol aralkyl type epoxy resin containing biphenylene structure(A), a phenol aralkyl type resin containing phenylene or biphenylene structure (B), an inorganic filler (C) and a curing accelerator (D) as main components, further containing a silane coupling agent (E) in 0.01 wt % to 1 wt % both inclusive of the total amount of the epoxy resin composition and a Compound (F) containing two hydroxyl groups combined with each of adjacent carbon atoms on a naphthalene ring in more than or equal to 0.01 wt % of the total amount of the epoxy resin composition.

Abstract: A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 50% by mass or more of the entire epoxy resin, or, the total content of components having a molecular weight 400 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 20% by mass or more of the entire epoxy resin. The content of low molecular weight compounds having a molecular weight 200 or less in the granular epoxy resin is 0.3% by mass or less.

Abstract: A phosphorus-containing epoxy resin has a structural unit derived from a secondary phosphine derivative represented by the following formula: wherein R1 represents an alkylene group that may have a substituent, R2 represents a cycloalkylene or arylene group that may have a substituent, and X represents an oxygen or sulfur atom.

Abstract: A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy resin composition for semiconductor encapsulation, which contains the following components (A) to (C): (A) an epoxy resin, (B) a phenol resin, and (C) a hardening accelerator, which comprises mixing the whole or a part of the components excluding the component (A) among the components containing the components (A) to (C) in advance under a reduced pressure of from 1.333 to 66.65 kPa and under a heating condition of from 100 to 230° C., and then mixing the component (A) and remaining components with the resulting mixture.

Abstract: An epoxy resin composition for semiconductor encapsulation capable of giving semiconductor devices of high reliability that do not cause short circuits even in pitch reduction in the interconnection electrode distance or the conductor wire distance therein as well as a semiconductor device using the same. The epoxy resin composition for semiconductor encapsulation, which comprises the following components (A) to (C): (A) an epoxy resin, (B) a phenolic resin, and (C) an inorganic filler for preventing semiconductors from short-circuiting in a step of semiconductor encapsulation.

Abstract: This invention relates to epoxy resins containing indole as structural unit, indole resins and resin compositions containing said epoxy resins and indole resins useful for applications such as laminating, molding, casting and adhesion on account of their excellent fire retardance, adhesiveness, moisture resistance and heat resistance. The indole resins of this invention and the epoxy resins obtained therefrom are represented by the following general formulas I and II wherein R1 is H, alkyl or the like, X is a crosslinking group represented by —C(R2R3)— or C(R4R5)—Ar—C(R4R5)— (wherein R2-R5 are H, alkyl or the like and Ar is a benzene or biphenyl ring), G is glycidyl group and n is an integer of 1-20.

Abstract: A no flow fluxing underfill having a hardener component comprising a phenolic component and an anhydride component in a molar ratio of phenolic component to anhydride component of between about 0.1:1 and about 2:1; or between about 0.8:1 and about 1.2:1. An underfill preparation method involving blending an epoxy component and a phenolic component, heating the blend, and cooling the blend, prior to incorporation of an anhydride component.

Abstract: An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1?E?0.27 W+21.8 in the case of 30?W<60, or a value satisfying 0.30 W?13?E?3.7 W?184 in the case of 60?W?95 wherein W (wt %) is a content of the inorganic filler (C) in the cured article. The cured article of this composition forms a foamed layer during thermal decomposition or at ignition to exert flame retardancy.

Abstract: Epoxy systems having improved shelf life are disclosed. The epoxy systems are suitable for use in a number of applications, including as an adhesive or as a sealant (e.g., as a component in a melt-sealing tape). Methods of making and using the epoxy systems are also disclosed.

Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.

Abstract: A resin film comprising (A) an epoxy resin having two or more glycidyl groups in a molecule, (B) an epoxy resin curing agent, (C) a thermoplastic resin, and (D) a filler, wherein the filler content in at least either one of the surface regions on the cross-section of the film is less than the filler concentration in the central region. The resin film has not only toughness but also fire retardancy, high interlayer adhesion strength and good processability of metal plating.

Abstract: A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

Abstract: The present invention provides a resin composition suitable for molding a microscopic structure that has small cure shrinkage, good mold transfer properties and excellent properties for post-processing such as polishing processing and laser processing. Such a resin is a thermosetting resin composition comprising 95 to 35 wt % of a thermosetting resin and 5 to 65 wt % of organic filler having a particle size of 10 ?m or less. From such a resin, an ink ejecting apparatus having a microscopic structure, for example, a nozzle of a diameter of 30 ?m, is integrally molded.

Abstract: The present invention discloses an active-hydrogen-containing curing agent having a phosphorus group, and a flame retardant cured epoxy resin which can be prepared via an addition reaction between the active hydrogen and the epoxide group of an epoxy resin. The cured flame retardant epoxy resin is environmentally friendly and is suitable for printed circuit board and semiconductor encapsulation applications. The phosphorus group of the curing agent has a chemical structure as follows: wherein Ar is a substituted or un-substituted phenyl or phenoxy.

Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), (wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.

Abstract: The invention provides a method for adhering two substrates comprising: providing an adhesive film having a first surface and a second surface; irradiating the adhesive film with ultraviolet radiation to provide an activated adhesive film having a first activated surface and a second activated surface; cooling the activated adhesive film either while irradiating or immediately after irradiating the film; contacting the first activated surface with a first substrate; contacting the second activated surface with a second substrate; and applying heat and pressure to the first and second substrates to cure the activated adhesive film and to bond the substrates to one another.

Abstract: This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a latent catalyst having a structure wherein the above phosphonium borate is the recurring unit and at least two of said recurring unit are connected through at least one of the four specific groups bonded to the boron atom. This invention also provides a thermo-setting resin composition comprising such a latent catalyst and an epoxy resin molding material comprising such a latent catalyst and further provides a semiconductor device in which a semiconductor is encapsulated with said epoxy resin molding material.

Abstract: The present invention provides a cationic paint composition containing, as a vehicle component, a xylene-formaldehyde resin-modified amino group-containing epoxy resin obtained by reacting an epoxy resin having an epoxy equivalent of 180 to 2,500 with an alkyl phenol and/or a carboxylic acid, a xylene-formaldehyde resin, and an amino group-containing compound.

Abstract: A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating being less than 0.05% by weight; a wafer with a resin layer and a semiconductor device produced by using the tablet; and a process for producing the wafer and the semiconductor device.

Abstract: The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components including (a) the epoxidized reaction product of a multifunctional 1-alkenyl ether or 1-cycloalkenyl ether and an alkenyl carboxylic acid, the epoxidized reaction product having two or more thermally labile alpha-alkoxy ester linkages; and (b) a curing agent for the epoxy component. The epoxy composition, when cured, provides a composition which is thermally reworkable, the weak ?-alkoxy ester linkages providing for the reworkable aspect of the invention.

Abstract: A halogen-free, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum hydroxide, and (5) a cure accelerator for the epoxy resin. The composition displays necessary flame retardant properties and sufficient insulating properties after the formation of an insulating layer in a circuit board, withstands a plating process, and does not cause the bleedout of the insulation layer formed. A circuit board with flame retardant properties comprising insulation layers formed of the epoxy resin composition is also disclosed.

Abstract: Provided is a curable coating composition comprising a reactive compound having one or more structures of the formula: wherein X is a primary carbamate group, Y is a hydroxy or halide group, n is an integer of 2 or more, n? is an integer of 1 or more, and R0, R1, R2, R3, R4 and R5 may be H or a group selected from alkyl groups, aliphatic groups, cycloaliphatic groups, aromatic groups and mixtures thereof, with the provisos that at least one R1 or R2 group is selected from the group consisting of aliphatic groups, cycloaliphatic groups, aromatic groups, and mixtures thereof, and in substantially all structures primary carbamate group X is attached to a carbon atom having a lower degree of substitution than a carbon atom to which functional group Y is attached.

Abstract: The invention provides an acrylic polymer or oligomer comprising random repeating units of the formula: a method of making said polymers and curable coating compositions comprising the same.

Abstract: This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a latent catalyst having a structure wherein the above phosphonium borate is the recurring unit and at least two of said recurring unit are connected through at least one of the four specific groups bonded to the boron atom. This invention also provides a thermosetting resin composition comprising such a latent catalyst and an epoxy resin molding material comprising such a latent catalyst and further provides a semiconductor device in which a semiconductor is encapsulated with said epoxy resin molding material.

Abstract: The invention provides a primary carbamate functional material of the formula: a method of making said materials and curable coating compositions comprising the primary carbamate functional material of the invention. The primary carbamate functional material comprises the reaction product of (1) at least one material P comprising one or more functional groups (i) which are reactive with a functional group Z but which are substantially nonreactive with a primary carbamate group X of monomeric reactive compound (2), and (2) a monomeric reactive compound comprising one or more structures of a particular formula.

Abstract: A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating being less than 0.05% by weight; a wafer with a resin layer and a semiconductor device produced by using the tablet; and a process for producing the wafer and the semiconductor device.

Abstract: An object of the present invention is to provide a resin-coated copper foil for manufacturing printed wiring boards that excel in total balance of properties of flame retardation, resin flow, water resistance, and peeling strength. The resin-coated copper foil comprises a resin layer on one side of a copper foil, and is characterized in that the resin layer comprises a resin composition having the following composition: a. a high polymer having cross-linkable  5 to 30 parts by weight functional groups in the molecule, and a cross-linking agent therefor b. an epoxy resin that is liquid at  5 to 30 parts by weight room temperature c.

Abstract: A coating solution for producing a cured coating, particularly for metallic surfaces, includes (1) a binder containing organic polymers with optional organic or inorganic addictions and (2) at least one of a melamine resin, an epoxy resin, a polyurethane resin, an alkyd resin, or mixtures thereof. The coating solution, in the liquid state, contains water. The binder contains 50-100% phenolic resin, preferably based on phenol and/or resorcinol.

Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of abivalent phenol of the formula (2) and a monovalent phenol of the formula (3), H&Brketopenst;O—Y&Brketclosest;a&Parenopenst;O—X—O&Parenclosest;&Brketopenst;Y—O&Brketclosest;bH  (1) HO—X—OH  (2) Y—OH  (3) wherein —X— is represented by the formula (2′),  and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2′) and the formula (3′) being required not to be a hydrogen atom, and its use.