Abstract: A hydrogenation process for hydrogenating bisphenol-A-based epoxy resin under low-temperature, low-pressure conditions includes using a hydrogenation reactor that has a gas-distributing agitator functional to introduce and exhaust hydrogen gas and stir liquid reactant, so that hydrogen gas introduced into the hydrogenation reactor can be evenly distributed into a liquid reactant placed into the hydrogenation reactor to make the liquid reactant contain a high level of dissolved hydrogen, which not only enhances activity of an involved hydrogenation catalyst and accelerates hydrogenation reaction, but also allows hydrogenation reaction to be performed in a low-temperature, low-pressure environment. The hydrogenation process improve yield of the hydrogenated bisphenol-A-based epoxy resin to 99.0-99.9%, while significantly reducing building and maintaining costs for the hydrogenation reactor, thus being an economic process.

Abstract: This invention relates to a novel phosphorus-containing phenol novolac resin, use of the phosphorus-containing phenol novolac resin as a halogen-free flame retardant epoxy hardener, and an epoxy resin composition having high phosphorus content because it includes the phosphorus-containing phenol novolac resin, thereby exhibiting superior flame retardancy and heat resistance.

Abstract: Materials and Methods are provided for fabricating microfluidic devices. The materials include low surface energy fluoropolymer compositions having multiple cure functional groups. The materials can include multiple photocurable and/or thermal-curable functional groups such that laminate devices can be fabricated. The materials also substantially do not swell in the presence of hydrocarbon solvents.

Abstract: Thermoplastic toughened epoxy resin for use in making prepreg for aerospace applications. The resin includes an epoxy resin component comprising a tri functional epoxy resin and/or tetra functional epoxy, a thermoplastic component and 4,4?-Bis(p-aminophenoxy)biphenyl (BAPB) as the curing agent. The use of BAPB as a curative was found to increase the resistance of the cured resin to attack by solvents.

Abstract: The solvent resistance of epoxy resins toughened with polyethersulfone is improved by using low molecular weight polyethersulfone. The resulting thermoplastic toughened epoxy resins are useful for making prepreg for aerospace applications.

Abstract: A composition for preparing a halogen-free resin is provided, the composition including a halogen-free phosphorated epoxy, a urethane-modified copolyester, a curing agent, a filler, a surfactant, and a solvent. A halogen-free prepreg is also provided, including a glass fabric cloth and a halogen-free resin layer on the glass fabric. The halogen-free resin layer is made from the foregoing halogen-free resin.

Abstract: Telechelic resins with reactive end groups (e.g., epoxy phosphate and epoxy ester) were synthesized using bisphenol-A (BPA) epoxide. The bisphenol-A based epoxide and the telechelic resins were all modified with tetraethylorthosilicate (TEOS) oligomers to produce epoxide/polysilicate (organic/inorganic) hybrid systems. The modified epoxides were thermally cured with a melamine-formaldehyde resin, cast on steel substrates and salt spray analysis revealed that the inorganically modified epoxides provided improvement over unmodified epoxide resins with respect to both corrosion resistance and adhesion to steel substrates.

Abstract: The present invention provides curing agent compositions comprising benzylated polyalkylene polyamine compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.

Abstract: An aluminum chelate-based latent curing agent is provided which can cure a thermosetting epoxy resin at a relatively low temperature in a short period of time. A method for producing such an aluminum chelate-based latent curing agent, whose curing conditions can be relatively easily controlled, is also provided. The aluminum chelate-based latent curing agent is made latent by reacting a silsesquioxane-type oxetane derivative with an aluminum chelating agent in the presence of an alicyclic epoxy compound.

Abstract: The present invention pertains to the field of thermosetting or thermoset polymers mainly used as materials, coatings, or adhesives. The invention more specifically relates to the use of specific molecules having associative groups including a nitrogen heterocycle as a hardener or co-hardener of thermosetting polymers.

Abstract: Partially hydrogenated bisphenol-A based polymers. Coating compositions for food or beverage containers and medical devices, including a partially hydrogenated bisphenol-A based polymer. Food or beverage containers and medical devices coated with partially hydrogenated bisphenol-A based polymers. Food or beverage containers and medical devices made from partially hydrogenated bisphenol-A based polymers.

Abstract: A composition comprising a reaction product of reactants comprising (a) a compound comprising (i) a polysulfide moiety and (ii) an oxygen atom in a ?-position to a sulfur link having the formula: where each R is independently selected from H or a C1 to C20 organyl group, R? is independently selected from a C1 to C20 organyl group, R?? is independently selected from H or a C1 to C20 organyl group, and x has an average of greater than 2, (b) a compound comprising a nucleophilic moiety; and (c) a compound comprising a moiety reactive to active hydrogen.

Abstract: The present invention relates to a silicone containing encapsulant composition. One embodiment of the encapsulant composition comprises (a) 30˜60 weight % of an epoxy resin; (b) 30˜60 weight % of an acid anhydride curing agent; (c) 0.1˜30 weight % of a Carbinol function silicone resin which can form a homogeneous mixture with (a) and (b) described above; and (d) 0.1˜5 weight % of a reactive UV absorber or HALS; and reactive anti-oxidant and/or phosphor containing flame retardant. The encapsulant composition can be used for a solid state light emitting device to achieve low internal stress and better -anti-yellowing performance.

Abstract: This invention provides an improved synthesis of polymer conjugates of formula (I), of agricultural, therapeutic, and food additive compounds. In particular, a process is described for the preparation of conjugates by treating primary or secondary alcohol substituents of active compounds with polymeric nucleophiles using “Mitsunobu” or related reaction conditions.

Abstract: A method of producing a tool or mould is claimed which comprises (A) application of a seamless modelling paste comprising at least one resin system (a) and at least one hardener system (b) onto a substrate to form a continuous film of curable material (B) curing the seamless modelling paste. The composition used comprises a resin system (a) comprising an epoxy resin (a1) having an average epoxy functionality above 2 and the hardener system (b) comprising an amine compound (b1) having an average amine functionality above 2.

Abstract: A method of making a filled resin includes the steps of: Providing a wiped film evaporator with an internal evaporator chamber maintained under vacuum and having an internal chamber wall maintained at an elevated temperature; introducing solvent-borne particles and organic matrix into the internal chamber; and compounding the solvent-borne particles and the organic matrix in the internal evaporator chamber by forming a thin film against the internal chamber wall, the thin film including organic matrix and particles, and the vacuum conditions and elevated temperature being sufficient to remove solvent from the particles and organic matrix to provide the filled resin. Less than about 10% of the particles in the resulting filled resin are agglomerated.

Abstract: The present invention relates to a curing accelerating compound-silica composite material capable of giving excellent storage stability to a curable resin composition, which is obtained by subjecting one or more compounds selected from compounds represented by the general formula (I-1) below and partial condensates thereof to a sol-gel reaction in the presence of a curing accelerating compound and water; a curable resin composition comprising the same; and an electronic component device comprising a device sealed with the curable resin composition.

Abstract: There are provided an adhesive film for a solar cell electrode providing a solar cell capable of reducing adverse effects on photovoltaic cells caused by heating or pressure and having sufficient solar cell characteristics, and a method for manufacturing a solar cell module using the same. The adhesive film for a solar cell electrode is an adhesive film used for electrical connection between photovoltaic cell surface electrodes and wiring members, wherein the adhesive film contains a crystalline epoxy resin, a curing agent and a film forming material.

Abstract: Phosphorus-containing compounds are disclosed which are obtainable by reacting: (A) at least one organophosphorus compound having a group selected from the group H—P?O; the group P—H and the group P—OH; and (B) at least one compound having the following Formula (I): [R?(Y)m?]m(X—O—R?)n??Formula (I) wherein R? is an organic group; Y is a functional group selected from the group consisting of hydroxy, carboxylic acid, and amine; X is a hydrocarbylene group; R? is hydrogen or a hydrocarbyl group having from 1 to 8 carbon atoms, R is alkyl or aryl group having from 1 to 12 carbon atoms; m?, m and n are, independently, numbers equal to or greater than 1. These compounds are useful for making flame retardant epoxy and polyurethane resins and ignition resistant thermoplastic resins, each of which is useful for a variety of end uses requiring flame retardancy or ignition resistance. Flame retardant epoxy resins may be used to make electrical laminates.

Abstract: A resin composition for semiconductor encapsulation realizing excellent soldering resistance and flame resistance and having excellent flowability and curing properties, and a semiconductor device. The resin composition for semiconductor encapsulation includes (A) an epoxy resin containing (a) an epoxy resin represented by formula (1), (B) a compound having two or more phenolic hydroxyl groups in its molecule, (C) an inorganic filler, and (D) a curing accelerator: wherein each of R1 and R2 represents a hydrogen atom or a hydrocarbon group with 4 or less carbon atoms and may be the same or different; and ‘n’ represents a mean value that is a positive number of from 0 to 5; in the formula (1).

Abstract: A thermosettable resin composition including (a) at least one thermosetting resin; (b) at least one polymeric glycidyl reactive diluent; and (c) a hardener; a process for producing the thermosettable resin composition; a cured product comprising the cured thermosettable composition; and a process for producing the cured resin thermoset product including (I) admixing (a) at least one thermosetting resin; (b) at least one polymeric glycidyl reactive diluent; and (c) a hardener; and (II) curing the mixture of step (I).

Abstract: The invention relates to a method for producing two- and three-dimensionally structured, microporous and nanoporous webs made up of nanofibers in any form with a very high covering or depositing degree of the fibers by means of a predefined conductive mold (template) as a collector and to the use of the webs according to the invention. The three-dimensional structure formation can be influenced in a directed manner by the deposition density of the nanofibers generated by means of an electrospinning process, which deposition density is adjustable through the accumulation time of the fibers.

Abstract: The present invention relates to a novel epoxy resin having improved heat-resistance, thermal expansion properties and processability, and to a thermosetting resin composition comprising the same. To this end, the present invention provides an epoxy resin of Chemical Formula 1 as disclosed in the Description, an epoxy resin composition comprising the same, and a packaging, substrate and transistor formed thereof. When a composition that contains an epoxy resin with a specific side functional group according to the present invention and/or an epoxy resin with a specific core structure is cured, a filler forms a strong chemical bond with the epoxy resin, thereby maximizing filling effects of the filler for the epoxy resin. Moreover, with the specific core structure, heat resistance and heat expansion properties of a cured product are substantially improved (CTE is reduced), and enhanced glass transition properties, strength and processability are demonstrated.

Abstract: Derivatized solid epoxy resins of the formula (I), which are outstandingly suitable as impact modifiers; and compositions which include such derivatized solid epoxy resins and are outstandingly suitable as one-component heat-curable adhesives, and as structural foams which have a high impact resistance and high mechanical stability.

Abstract: A substance includes diamond particles having a maximum linear dimension of less than about 1 ?m and an organic compound attached to surfaces of the diamond particles. The organic compound may include a surfactant or a polymer. A method of forming a substance includes exposing diamond particles to an organic compound, and exposing the diamond particles in the presence of the organic compound to ultrasonic energy. The diamond particles may have a maximum linear dimension of less than about 1 ?m. A composition includes a liquid, a plurality of diamond nanoparticles dispersed within the liquid, and an organic compound attached to surfaces of the diamond nanoparticles. A method includes mixing a plurality of diamond particles with a solution comprising a liquid solvent and an organic compound, and exposing the mixture including the plurality of diamond nanoparticles and the solution to ultrasonic energy.

Abstract: Room temperature curing epoxy adhesives are described. The adhesives contain an epoxy resin, an acetoacetoxy-functionalized compound, a metal salt catalyst, a first amine curing agent having an equivalent weight of at least 50 grams per weight of amine equivalents and a second amine curing agent having an equivalent weight of no greater than 45 grams per weight of amine equivalents.

Abstract: An amine functional adduct is obtained by admixing a stoichiometric excess of a cycloaliphatic diamine and a compound having an epoxide group and an alpha, beta unsaturated carbonyl group.

Abstract: The shape memory polymers disclosed are a reaction product of at least one reagent containing two active amino-hydrogen or two active phenolic-hydrogen with at least one multifunctional cross linking reagent which contains at least three or more active amino- or phenolic-hydrogen or is a reagent containing at least three glycidyl ether moieties which is then further mixed with at least one diglycidyl ether reagent whereupon the resulting mixture is cured and has a glass transition temperature higher than 00 C. This reaction creates crosslinking between the monomers and polymers such that during polymerization they form a crosslinked thermoset network.

Abstract: Pre-impregnated composite material (prepreg) is provided that can be cured to form composite parts that have high levels of damage tolerance. The matrix resin includes a thermoplastic particle component that is a blend of particles that have a melting point above the curing temperature and particles that have a melting point at or below the curing temperature.

Abstract: Epoxy adhesive compositions containing a rubber-modified epoxy resin contain a bisphenol. The bisphenol can be pre-reacted with the rubber-modified epoxy resin to advance the resin. The adhesives are resistant to thermal degradation as can occur in so-called “overbake” conditions, in which the adhesive is heated to high temperatures for prolonged periods of time. In addition, expanded microballoons are included in epoxy structural adhesives to promote a desired fracture mode.

Abstract: A curable composition including (a) at least one cyclic diamine, (b) at least one non-heterocyclic amine that has a pKa value of approximately 9.5 to about 12 at 25° C. for the most basic amine group in the non-heterocyclic amine molecule, (c) at least one epoxy resin, and (d) at least one alkylated phenol; (i) wherein the equivalents of the amine hydrogens from the cyclic diamine compared to the total amine hydrogens from both the cyclic diamine and the non-heterocyclic amine in the composition are greater than about 5%; (ii) wherein the ratio of the equivalents of the total amine hydrogens in the composition to the equivalents of the total epoxies in the composition is greater than or equal to about 1; and (iii) wherein the alkylated phenol is in an amount greater than about 10 wt % of the curable composition.

Abstract: An underfill composition is formulated to increase the surface tension thereof for use in capillary underfilling of an integrated circuit die that is coupled to a mounting substrate. A method includes mixing a surface tension-increasing additive with a bulk polymer and a hardener and allowing the underfill composition to flow between the integrated circuit die and the mounting substrate. An article is achieved by the method. The article can be assembled into a computing system.

Abstract: A reversible adhesive system for coupling together two objects may consist of two shape memory polymers with molecular “hooks and loops” on the surfaces (i.e. the surface away from each of the objects). Utilizing the shape memory properties of the polymers, the molecular hooks and molecular loops may be brought together to form non-covalent bonds, leading to macroscopic adhesion. Upon heating, the adhesive bond can be separated with a small peeling force. The adhesive bonding and debonding can be repeated for multiple cycles with significant adhesion retention.

Abstract: An alcohol-soluble, water-insoluble, disinfectant composition and a method of using the same for disinfecting and for providing a prolonged antimicrobial property to a variety of surfaces, including skin. The composition comprises an antimicrobial polymer that is capable of imparting an antimicrobial property to a surface without the use of a metal or metal-containing compound. The composition is applied to a surface and allowed to evaporate leaving a coating of antimicrobial polymer.

Abstract: The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent.

Abstract: The invention provides a benzoxazine resin composition having excellent resistance to heat and moisture and providing excellent handleability when made into prepreg, and prepreg and a fiber-reinforced composite material prepared from the composition. The composition contains (A) a compound having in its molecule a benzoxazine ring represented by the formula (1), (B) an epoxy resin, (C) a curing agent, and (D) a toughness improver: (R1: C1 to C12 chain alkyl group, etc., and H is bonded to at least one of C of the aromatic ring at o- or p-position to the carbon atom to which the oxygen atom is bonded).

Abstract: This invention relates to the thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate. Similarly, the compositions are useful for mounting onto circuit board semiconductor chips themselves. Reaction products of the compositions of this invention are controllably reworkable when subjected to appropriate conditions. And significantly, unlike many commercial rapid curing underfill sealants (“snap cure underfills”), the inventive compositions possess an exotherm under 300 J/g or demonstrate package stability at 55° C. for 7 days, and therefore do not require special packaging to be transported by air courier, or special approval from international transportation authorities, such as the U.S. Department of Transportation, to permit such air transport.

Abstract: The invention provides a process for preparing organically modified siloxanes by catalysed reaction of siloxanes having at least one SiH group with a compound having a double bond.

Abstract: The present invention relates to cationically curable compositions for curing on a surface comprising a cationically curable component, an accelerator species comprising at least one vinyl ether functional group and an initiator component capable of initiating cure of the cationically curable component. The initiator comprises at least one metal salt, which is chosen so that it is reduced at the surface, and where the standard reduction potential of the initiator component is greater than the standard reduction potential of the surface, and where when the composition is placed in contact with the surface, the metal salt of the initiator component of the composition is reduced at the surface, thereby initiating cure of the cationically curable component of the composition. The accelerator species comprising at least one vinyl ether functional group greatly enhances the rate of cure. No catalytic component is required in the composition for efficient cure.

Abstract: An aqueous multi-component epoxy coating composition having less than 3% by weight of VOCs and curable upon admixing the components comprises (a) a first component of (i) a stable epoxy dispersion of an epoxy resin, from 5 to 20 weight percent of a mixture of surfactants comprising a low temperature nonionic surfactant having a molecular weight of from 1,000 to 7,000; a high temperature nonionic surfactant having a molecular weight of greater than 7,000 to 20,000 and an anionic surfactant, and (b) a second component of (i) a water miscible polyamine, wherein the composition further contains an associative thickener as well as thixotropic clay and/or a cellulosic thickener as additional thickener(s).

Abstract: The present invention provides modified metal surfaces, methods of preparing the same, and intermediates thereto. These materials are useful in a variety of applications including biomaterials.

Abstract: Curing agent for epoxy resins, consisting of A) 1%-99% by weight of an adduct obtainable by reacting a1) a polyethylene polyamine having up to six nitrogens in the molecule with a2) a monoglycidyl ether, the adduct of a1) and a2) preferably being isolated by removal of the excess polyethylene polyamine, and B) 99%-1% by weight of an adduct obtainable by reacting b1) a diamine or polyamine with b2) styrene, and also curable compositions further comprising an epoxide compound, and the use of these curable compositions for producing moldings and sheetlike structures, and also for applications in the adhesives and sealants sector and for epoxy-resin mortars.

Abstract: The invention relates to compositions containing at least one solid epoxide resin A, at least one polymer B of formula (1), at least one thixotropic agent C made from a urea derivative and at least one curing agent for epoxide resins D activated by high temperatures. The compositions are particularly suitable for use as adhesives. Low-temperature impact-resistant adhesives can be produced for use in particular as structural adhesives.

Abstract: The invention relates to curable compositions substantially comprising A) at least one epoxy resin, and B) at least one curing agent comprising a hetero-poly-cyclic ring system comprising at least two amino groups.

Abstract: A varnish includes resin and composite curing agent. The composite curing agent includes curing agent of polyphenylene methylphosphonate resin and curing agent of phenol resin. Glass fabric cloth is dipped into the varnish so as to form a prepreg with better thermal stability, anti-flammability, and low absorbent ability. Furthermore, the composite curing agent can be provided for higher curing rate.

Abstract: An active-hydrogen-containing (carboxyl or hydroxyl) phosphorus compound is provided. An epoxy resin semi-thermoset formed by bonding the phosphorus compound to an epoxy group is also provided. A flame-retardant epoxy resin thermoset is formed after reacting the epoxy resin semi-thermoset with a curing agent. The epoxy resin thermoset possesses excellent flame retardancy, heat stability, and high glass transition temperature (Tg), does not produce toxic and corrosive fumes during combustion, and thus is an environmentally friendly flame-retardant material.

Abstract: An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).

Abstract: Curative fibre components comprise one or more fibres for filaments of curative suitable to cure curable resins such as thermoset resin. In curative fibre components comprising a plurality of fibres of curative, the fibres can be commingled, such as twisting, to form a thread or yarn. Curative fibre components can be used to form a material in the form of a sheet, fabric, layer, textile or mat of woven or non-woven curative fibres. Curative fibre components can be used to produce composite materials such as fibre reinforced resinous composite materials. The curative fibre components can be commingled, including interwoven, stitched and layered with other fibres or fibrous materials, such as fibrous reinforcement, fibrous curable resin, fibrous thermoplastic, other non-reinforcing fibres to form composite materials, prepregs, preforms and articles.

Abstract: The use of 1,3-substituted imidazolium salts of the formula I in which R1 and R3 independently of one another are an organic radical having 1 to 20 C atoms, R2, R4, and R5 independently of one another are an H atom or an organic radical having 1 to 20 C atoms, it also being possible for R4 and R5 together to form an aliphatic or aromatic ring, X is an anion having a pKb of less than 13 (measured at 25° C., 1 bar in water or dimethyl sulfoxide), and n is 1, 2 or 3, with the exception as imidazolium salts of 1-ethyl-2,3-dimethylimidazolium acetate and 1-ethyl-2,3-dimethylimidazolium acetate-acetic acid complex, as latent catalysts for curing compositions comprising epoxy compounds.

Abstract: One embodiment includes a dry adhesive material including catechol chemically attached to the surface of a shape memory polymer molecule. The catechol content may allow the dry adhesive to be utilized in both dry and wet conditions to bond objects together. The shape memory polymer may allow the dry adhesive to be reversibly attached to the objects.