Abstract: An epoxy and rubber microcomposite is formed by adding a carboxy-terminated or amine-terminated rubber component having a glass transition temperature less than zero degrees centigrade to a bisphenol A based epoxy resin component; heating the mixture to 150 degrees centigrade; cooling and curing with a suitable curing agent. A phase segregation occurs between the epoxy resin component and the rubber component to form discrete, spherical rubbery domains with the epoxy compound. Because the glass transition temperature of the rubbery domains is below zero degrees centigrade; the rubbery domains act as acoustic windows within the high-modulus epoxy compound.

Abstract: The invention relates to a curing agent for epoxy resins, comprising a phenalkamine blended with a salted polyamine or a salted polyamine-epoxy adduct to form a curing agent for an epoxy resin, wherein at least one-third of the primary amine groups of the salted polyamine or the salted polyamine-epoxy adduct are blocked.

Abstract: A variety of curing agents for epoxy resins and methods for preparation thereof are disclosed, including compounds having the structures of formulas III and IV: wherein each of R1, R2, R3, R4, and R5 is independently selected from the group consisting of H, methyl, ethyl, n-propyl, iso-propyl, a butyl, and phenyl. Epoxy-based compositions including various curing agents are also disclosed. Other epoxy curatives containing amino, phenol, and/or imine groups are disclosed.

Abstract: Provided are a method for producing a phosphorus-containing phenolic compound in which reactivity is considerably excellent in the reaction between a phosphorus-containing compound and an aromatic nucleus of a phenol; in the case of using a polyhydric phenol or a phenolic resin as the phenol, a novel phosphorus-containing phenolic compound that serves as a curing agent for an epoxy resin and imparts excellent heat resistance to a cured product; a curable resin composition containing the novel phosphorus-containing phenolic compound; a cured product of the curable resin composition; a printed wiring board; and a semiconductor sealing material. An aromatic aldehyde (a1) having an alkoxy group as a substituent on an aromatic nucleus is allowed to react with an organic phosphorus compound (a2) intramolecularly having a P—H group or a P—OH group. The resultant reaction product is then allowed to react with a phenol (a3).

Abstract: The present invention relates to an etheramine mixture containing a monoether diamine and its method of production by alkoxylating an initiator with an alkylene oxide to produce a precursor polyol and reductively aminating the precursor polyol to form the etheramine mixture. The etheramine mixture may be used in variety of applications including as a curing agent for an epoxy resin or as a reactant in the production of polyurea.

Abstract: A low viscosity toughened epoxy resin formulation including a divinylbenzene dioxide as a component in the formulation; wherein the formulation is useful for the manufacture of thermoset polymers.

Abstract: The present invention relates to a method for producing amphiphilic functionalized highly branched melamine-polyamine polymers by condensing melamine and optionally a melamine derivate having at least one different amine having at least two primary amino groups and optionally also with urea and/or at least one urea derivative and/or with at least one at least difunctional diisocyanate or polyisocyanate and/or at least one carbolic acid having at least two carboxyl groups or at least one derivative thereof, optionally quaternizing a portion of the amino groups of the polymer thereby obtained, reacting the polymer thus obtained with at least one compound capable of undergoing a condensation or addition reaction with amino groups, and optionally quaternizing at least part of the amino groups of the polymer obtained in the first step.

Abstract: This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta-substituted reactive groups and a cationic or radical initiator.

Abstract: Biocompatible polymers having polymer backbones with at least one secondary amine suitable for diazeniumdiolation are disclosed. Specifically, methods for providing secondary amines-containing polymers using epoxide-opening reactions are provided. More specifically, nitric oxide-releasing medical devices made using these polymers are disclosed.

Abstract: This invention pertains to a method of modifying biocides obtained from biological sources, namely polyphenols. The modified biocide may have protective groups to reduce or prevent the oxidation of these phenols. The protective groups may also control the rate of hydrolyzation with regards to biocide efficacy. This invention also includes a method wherein the modified biocide may be incorporated and stabilized into a substrate like plastic.

Abstract: Inventive composite materials are provided. The composite is preferably a nano-composite, and comprises an asphaltene, or a mixture of asphaltenes, blended with a polymer. The polymer can be any polymer in need of altered properties, including those selected from the group consisting of epoxies, acrylics, urethanes, silicones, cyanoacrylates, vulcanized rubber, phenol-formaldehyde, melamine-formaldehyde, urea-formaldehyde, imides, esters, cyanate esters, allyl resins.

Abstract: An epoxy resin composition prepared from a dihydroxydiphenyl-cycloalkane compound to form a diglycidyl ether of dihydroxydiphenyl cycloalkane compound which may be useful for making various products including, for example, powder coatings, composites and electrical laminates.

Abstract: Embodiments include an amine adduct obtainable by reacting an amine compound having at least two amino groups and a monoalkylpolyalkylene glycidyl ether having the formula (C2H3O)—CH2—O—(CH2—(CHR1)—O)n, —R2, wherein n is 1 to 50, each R1 is independently H or CH3, and R2 is an alkyl group. Embodiments include a curable composition including a resin component and a hardener component that includes the amine adduct.

Abstract: An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).

Abstract: Described herein are metal amidine complexes in combination with a second compound useful as catalysts in a number of polymerization reactions, including polyurethane and epoxy polymerization reactions. Also described herein are various coating compositions and methods of using same for coating substrates using the metal amidine complexes in combination with a second compound.

Abstract: A process for applying a coating to a substrate and broadcasting solid decorative or protective materials onto the liquid surface of the coating before it completely cures or dries, wherein the coating is a multi-component curable composition which is reactive upon admixing of the components and wherein the composition comprises at least a first amine functional adduct and at least one compound reactive with amines.

Abstract: Disclosed is a curable formulation comprising a resin; all, or a substantial part, of which comprises one or more fatty acid esters, or their derivatives, obtained from plant oils. Due to the high viscosity of known curable resin materials, and in particular cationically photocurable and thermally curable resins epoxy resins, reactive diluents are conventionally added in order to reduce viscosity and render them suitable for certain methods of application, such as flexography and inkjet printing. However, if an excessive amount of reactive diluent is added to a formulation, the concentration of resin may be so low as to prevent a formulation from curing to form a cured, cross-linked material with acceptable properties. Thus the minimum viscosity of known formulations is limited by the amount of low viscosity reactive diluent which may be added to comparatively high viscosity resins.

Abstract: The use of 1,3-substituted imidazolium salts of the formula I in which R1 and R3 independently of one another are an organic radical having 1 to 20 C atoms, R2, R4, and R5 independently of one another are an H atom or an organic radical having 1 to 20 C atoms, it also being possible for R4 and R5 together to form an aliphatic or aromatic ring, and X is a dicyanamide anion as latent catalysts for curing compositions comprising epoxy compounds.

Abstract: The present invention describes guanidine derivatives of the general formula (I) having the stated meanings for the residues R1, R2 and R3 as accelerators for cold-curing epoxy resin compositions. The curing of cold-curing epoxy resin systems may advantageously be accelerated with the assistance of these compounds.

Abstract: An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride.

Abstract: It is an object of the present invention to provide an epoxy resin curing agent which has a favorable pot life and good storage stability as a curing agent for epoxy resins and from which an epoxy resin cured product having good water resistance and hardness is obtained through curing. The present invention is an epoxy resin curing agent containing a secondary or tertiary branched thiol compound having a substituent on a carbon atom at the ?-position to a thiol group, and is also an epoxy resin composition comprising a polyvalent epoxy compound and the epoxy resin curing agent.

Abstract: The invention relates to a copolymer of ethylene oxide or propylene oxide and at least one substituted oxirane bearing an ionic group. The copolymer is characterized in that its chain comprises repeat units —O—CH2—CH(—CH2—O—SO3?Li+)—, repeat units —O—CH2—CHR— in which R is H or CH3, optionally, repeat units —O—CH2—CH(—CH2R?)— in which R? is a functional group. x Uses: electrolyte in electrochemical, selective-membrane and reference-membrane devices.

Abstract: A liquid resin composition of the present invention is a liquid resin composition for bonding a semiconductor element on a support, exhibiting a tackiness of 0.05 N or less after heating at 120° C. for 10 min and a tackiness of 1 N or more at 80° C. A semiconductor wafer having an adhesive layer of the present invention is a semiconductor wafer having an adhesive layer in which the adhesive layer is formed from the above liquid resin composition. A process for manufacturing a semiconductor element of the present invention has the application step of applying an adhesive as a liquid resin composition containing a thermosetting resin and a solvent to one side of a wafer; the evaporation step of evaporating said solvent while substantially maintaining a molecular weight of said liquid resin composition to form an adhesive layer; the bonding step of bonding a dicing sheet on one side of said wafer; and the cutting step of cutting said wafer into pieces.

Abstract: A thermosetting resins composite, composed of: epoxy resin which can have a total polymerization with bismaleimide, occupying 1.75%-18.0% solids weight of the composite; bismaleimide compounds, occupying 0.15%-12.5% solids weight of the composite; free radical initiator, its mole fraction of which its addition accounts for reaction monomer total is 0.01%-0.15%; inhibitor, whose amount is the half to double of the initiator; styrene-maleic anhydride copolymers, occupying 17.5%-47.0% solids weight of the composite; filler, occupying 20%-60% solids weight of the composite; solvent, occupying 30%-50% solids weight of the composite; flame retardant which can be used in CCL industries.

Abstract: Disclosed are oligomeric phosphonates, and in particular, hyperbranched oligophosphonates, that include oligophosphonates, random or block co-oligo(phosphonate ester)s and co-oligo(phosphonate carbonate)s produced using a condensation process terminated with hydroxyl, epoxy, vinyl, vinyl ester, isopropenyl, isocyanate groups, and the like. These materials can be used as a reactive additive to other polymers, oligomers or monomer mixtures to impart flame resistance without diminishing melt processability which is important in the fabrication of polymers for many applications.

Abstract: Disclosed are oligomeric phosphonates including oligophosphonates, random or block co-oligo(phosphonate ester)s and co-oligo(phosphonate carbonate)s produced using a condensation process terminated with hydroxyl, epoxy, vinyl, vinyl ester, isopropenyl, isocyanate groups, and the like. These materials can be used as a reactive additive to other polymers, oligomers or monomer mixtures to impart flame resistance without diminishing melt processability which is important in the fabrication of polymers for many applications.

Abstract: An adhesive film composition includes an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group, a film-forming resin, a silylated phenolic curing resin, an epoxy resin, a curing accelerator, and a filler.

Abstract: The present invention discloses a resin composition and a prepreg produced using the resin composition. The resin composition comprises, as essential components: 100 parts by mass of a component (A) which is an epoxy resin; 41 to 80 parts by mass of a component (B) which is thermoplastic resin particles; and 20 to 50 parts by mass (in terms of diaminodiphenylsulfone) of a component (C) which is diaminodiphenylsulfone microencapsulated with a coating agent. The thermoplastic resin particles (B) comprise at least thermoplastic resin particles (B1) having an average particle diameter of 1 to 50 ?m and thermoplastic resin particles (B2) having an average particle diameter of 2 to 100 ?m at a mass ratio of 3:1 to 1:3. The average particle diameter ratio D2/D1 of the average particle diameter D2 of the thermoplastic resin particles (B2) to the average particle diameter D1 of the thermoplastic resin particles (B1) is 2 or more.

Abstract: The present invention discloses novel bottom anti-reflective coating compositions where a coating from the composition has an etch rate that can be regulated by the etch plate temperature.

Abstract: The present invention provides a cyanate ester resin composition, and a prepreg and a laminated made from the cyanate ester resin composition. The cyanate ester resin composition includes a cyanate ester resin containing the structure expressed by the following structure formula (1): wherein, R1, R2 and R3 are hydrogen atom, alkyl or aralkyl; and n is an integer between 1 and 50. The cyanate ester resin composition of the present invention has excellent thermal resistance, low water absorption, and good elastic modulus, etc. The prepreg, the laminate, and the metal foil clad laminate made from the cyanate ester resin composition have excellent thermal resistance, mechanical property and humidity resistance, and low water absorption, etc., thereby adapted for making substrate material of high density PCB, and have a very high industrial application value.

Abstract: The present invention provides a cyanate ester resin composition, and a prepreg and a laminated made from the cyanate ester resin composition. The cyanate ester resin composition includes a cyanate ester resin containing the structure expressed by the following structure formula (1): wherein, R1, R2 and R3 are hydrogen atom, alkyl or aralkyl; and n is an integer between 1 and 50. The cyanate ester resin composition of the present invention has excellent processability, thermal resistance and humidity resistance, and low water absorption, etc. The prepreg, the laminate, and the metal foil clad laminate made from the cyanate ester resin composition have excellent processability, thermal resistance and humidity resistance, and low water absorption, etc., thereby adapted for making substrate material of high density PCB, and have a very high industrial application value.

Abstract: A composition of matter consisting of a stable solution containing a polymer derived from a solution of a polymer containing trace metals, the derived method comprising the steps of: (a) providing a polymer solution containing a polymer, a first solvent and trace metals; (b) passing said polymer solution through an acidic cation ion exchange material to remove said trace metals therefrom and thereby forming a polymer solution containing free acid radicals; (c) precipitating said polymer from said polymer solution of step b by contacting with a second solvent wherein the polymer is substantially insoluble therein; (d) filtering said solution and said second solvent to thereby form a solid polymer cake; and (e) contacting said cake from step d with sufficient quantities of additional said second solvent in order to remove free acid radicals there from.

Abstract: A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.

Abstract: The present invention relates to an adhesive film, a dicing die bonding film and a semiconductor device. More specifically, the adhesive film of the present invention is characterized by comprising a base film and an adhesive layer and having a yield strength of 20 to 50 gf and a slope of tensile elastic region of 30 to 80 gf/mm at a thickness of 5 to 50 ?m. In the present adhesive film, the yield strength and the slope of tensile elastic region are controlled so that the incidence of burrs may be predicted and controlled depending on thickness of an adhesive layer. The dicing die bonding film, and the semiconductor device comprising the same have lower incidence of burrs and an excellent workability and reliability.

Abstract: Disclosed are curable epoxy compositions comprising imidazolium monocarboxylate salts as curing catalysts and method for curing same. The imidazolium monocarboxylate salt is suitable for use as latent catalysts that effect curing upon heating to a curing temperature threshold. The curable compositions prepared therefrom are used to prepare coated substrates, and to produce conformally sealed printed wiring boards. Of particular utility are curable compositions comprising 2-ethyl-4-methyl imidazolium monocarboxylate salts.

Abstract: Discussed are heat-curable epoxy resin compositions containing at least one epoxy resin with, on average, more than one epoxide group per molecule, at least one curing agent for epoxy resins, which is activated by an increased temperature and at least one terminally blocked polyurethane prepolymer. Said epoxy resin compositions are particularly suitable for use as one-component, heat-curable adhesives and are characterized by excellent mechanical properties, high glass transition temperatures and high impact resistance.

Abstract: The present invention provides compounds produced by the reaction of glycidyl ethers and glycidyl esters with ether compounds including N,N,N?-trimethyl-bis-(aminoethyl)ether. N,N,N?-trimethyl-bis-(aminoethyl)ether and its derivatives can be used as polyurethane catalysts.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: The use of 1,3-substituted imidazolium salts of the formula I in which R1 and R3 independently of one another are an organic radical having 1 to 20 C atoms, R2, R4, and R5 independently of one another are an H atom or an organic radical having 1 to 20 C atoms, it also being possible for R4 and R5 together to form an aliphatic or aromatic ring, and X is a thiocyanate anion as latent catalysts for curing compositions comprising epoxy compounds.

Abstract: A polymer includes a reaction product of an epoxy resin, a first crosslinking agent, and a second crosslinking agent. The first crosslinking agent is reactive with the epoxy resin and has a first molecular weight. The second crosslinking agent is reactive with the epoxy resin and has a second molecular weight of at least ten times greater than the first molecular weight. The polymer has a first phase having a first glass transition temperature and a second phase having a second glass transition temperature that is lower than the first glass transition temperature. The polymer is transformable between a first shape and a second shape at the first glass transition temperature.

Abstract: A polymer includes a reaction product of an epoxy resin, a first crosslinking agent, and a second crosslinking agent. The first crosslinking agent is reactive with the epoxy resin and has a first molecular weight. The second crosslinking agent is reactive with the epoxy resin and has a second molecular weight of at least 2.5 times greater than the first molecular weight. The polymer has a first phase having a first glass transition temperature at which the polymer is transformable between a first shape and a second shape. The second crosslinking agent is crystallizable within the polymer and thereby has a melting temperature that is detectable within the polymer.

Abstract: Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct.

Abstract: A multi-component curable composition which is reactive upon admixing of the components and wherein the composition comprises a first component which comprises a first amine functional adduct and a second amine functional adduct; and a second component which comprises at least one compound having an average of more than 2.0 groups per molecule which are reactive with amines.

Abstract: Nanocomposite materials and methods of making composite materials reinforced with carbon nanotubes are disclosed. The composite material includes an array of functionalized and aligned carbon nanotubes having a degree of functionalization of about 1% to about 10%; and a polymeric matrix material bonded to the array of functionalized and aligned carbon nanotubes.

Abstract: The present invention relates to a polymer material with a functionalised surface and also to a method for in situ functionalisation of polymer materials. Furthermore, the invention comprises the use of the polymer materials.

Abstract: Silicone pressure sensitive adhesive compositions including amphiphilic copolymers. The amphiphilic copolymers are based on a polydimethylhydrogensiloxane or polydimethylsiloxane based macroinitiator. A medical device including said pressure sensitive adhesive compositions for securing the device to human skin or tissue.

Abstract: The present invention provides curing agent compositions comprising benzylated polyalkylene polyamine compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.

Abstract: Provided is a curable resin composition that exhibits good heat resistance and low thermal expansion, and that realizes good solubility in solvents, a cured product thereof, a printed wiring board including the composition, a novel epoxy resin that imparts these properties, and a process for producing the same. A curable resin composition contains, as essential components, an epoxy resin (A) having, in its molecular structure, a glycidyloxy group and a skeleton in which a naphthalene structure and a cyclohexadienone structure are bonded to each other via methylene group(s); and a curing agent (B).

Abstract: A composition comprising a particulate Solid, an organic medium and a compound with an alkyleneoxy compound with an inorganic acidic polar head group (Z), wherein the compound is defined by Formula (1) and salts thereof: U—(Y)x-T-N(G)r(B—Z)q (Formula 1) wherein U is independently R?—N—(C)-T?-O—, or R—O—; R or R? may be the same or different and are independently H or C1-50-optionally substituted hydrocarbyl, or hydrocarbonyl group (acyl group), or the residue of an epoxide, or the residue of an optionally substituted (meth) acrylic ester or amide group; Y is C2-4-alkyleneoxy; T or T? is independently C2-4 alkylene; B is an alkylene group, such as, methylene; Z is an inorganic acidic polar head group, such as, a sulphur or phosphorus acidic polar head group; G and G? may be the same or different and are independently H or C1-50-optionally substituted hydrocarbyl or C1-50-optionally substituted hydrocarbyl or hydrocarbonyl group or the residue of an epoxide, or the residue of an optionally substituted (meth) ac

Abstract: A hydrogenation process for hydrogenating bisphenol-A-based epoxy resin under low-temperature, low-pressure conditions includes using a hydrogenation reactor that has a gas-distributing agitator functional to introduce and exhaust hydrogen gas and stir liquid reactant, so that hydrogen gas introduced into the hydrogenation reactor can be evenly distributed into a liquid reactant placed into the hydrogenation reactor to make the liquid reactant contain a high level of dissolved hydrogen, which not only enhances activity of an involved hydrogenation catalyst and accelerates hydrogenation reaction, but also allows hydrogenation reaction to be performed in a low-temperature, low-pressure environment. The hydrogenation process improve yield of the hydrogenated bisphenol-A-based epoxy resin to 99.0-99.9%, while significantly reducing building and maintaining costs for the hydrogenation reactor, thus being an economic process.