Abstract: The present invention provides a gel time controllable epoxy adhesive, which includes a first part comprising an epoxy resin containing two or more epoxy groups in one molecule, and a second part comprising a thiol curing agent, wherein a peroxide is comprised in part A, part B and/or a third separate part C.

Abstract: A poly(phenylene ether)-poly(hydroxy ether)-poly(phenylene ether) (PPE-PHE-PPE) triblock copolymer is formed by reaction of a monohydroxy-terminated poly(phenylene ether) with a diepoxy-terminated poly(hydroxy ether) in the presence of a base. The PPE-PHE-PPE triblock copolymer is useful as a compatibilizer in blends of polar polymers and non-polar polymers. The PPE-PHE-PPE triblock copolymer is also useful as a compatibilizer for non-polar polymers and polar fillers.

Abstract: Films (or a cap layer of co-extruded films) and methods of forming the same are described herein. The films generally include a modified olefin based polymer including polypropylene and from 1 wt. % to 30 wt. % polylactic acid (PLA), wherein the modified olefin based polymer exhibits a seal initiation temperature (SIT) that is at least 5° C. less than a seal initiation temperature of the polypropylene absent the PLA and a hot tack range of at least 20° C.

Abstract: A two-component curable epoxy resin system is disclosed. The resin system includes an epoxy resin component containing at least 80% by weight of a polyglycidyl ether of a polyphenol that has an epoxy equivalent weight of up to about 200 and contains no more than 2% by weight of monohydrolyzed resin species.

Abstract: Disclosed is a toughened film forming agent for use in a fiber sizing, a finish coating or a binder composition, where the toughened film forming agent includes a film forming polymer and a toughening agent both dispersed in water. The toughening agent may be core shell polymers, rubber, thermoplastic materials, nanomaterials, nanofibers, including any combination or subset thereof. The film forming polymer may be epoxy resins, polyurethane resins, epoxy-polyurethane resins, polyester resins, epoxy-polyester resins, polyvinylacetate resins, polypropylene resins, including any combination or subset thereof.

Abstract: A thermally curable adhesive in strip or film form, having a thickness in the range of 0.1 to 5 mm, containing: a) at least one reactive epoxy prepolymer, b) at least one latent hardener for epoxies, and c) one or more elastomers that are selected from: c1) thermoplastic polyurethanes, c2) thermoplastic isocyanates, and c3) block copolymers having thermoplastic polymer blocks. Further components can additionally be contained, for example a blowing agent for foaming. The adhesive in the uncured state at 22° C. is bendable or wrappable and can be extended at least 100% before tearing. It can be laid onto a foil. It can be used, for example, for adhesive bonding of planar, tubular, or cylindrical components, preferably components made of metal, wood, ceramic, or ferrites.

Abstract: Epoxy containing phosphonate monomers, polymers, copolymers, oligomers and co-oligomers and methods for making the same are describes herein. These materials can be used to make polymers, and can be combined with other polymers, oligomers or monomer mixtures to make resins with excellent fire resistance that can be used in a variety of industrial and consumer products.

Abstract: An optically active composition is described. The composition may include a copolymer of two or more polyepoxides covalently linked by a fused arene.

Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.

Abstract: A re-epoxidized polyfunctional epoxy resin composition comprising the reaction product of: (I) an epoxidized polyfunctional epoxy resin oligomeric composition comprising a polyfunctional aliphatic or cycloaliphatic epoxy resin which has been isolated from an epoxy resin product formed as a result of an epoxidation process comprising the reaction of: (i) an aliphatic or cycloaliphatic hydroxyl-containing material; (ii) an epihalohydrin, (iii) a basic-acting substance, in the presence of (iv) a non-Lewis acid catalyst; and (v) optionally, one or more solvents; (II) an epihalohydrin; (III) a basic acting substance; in the presence of (IV) a non-Lewis acid catalyst; and (V) optionally, one or more solvents. A curable epoxy resin composition of the re-epoxidized polyfunctional epoxy resin composition and a thermoset of the curable composition is also disclosed.

Abstract: This invention relates to an epoxy resin composition, in particular a curable phosphorus containing flame retardant epoxy resin composition comprising epoxy resin and an epoxy resin chain-extending amount of a diaryl alkylphosphonate and/or diaryl arylphosphonate and a cross-linking agent. The curable flame retardant compositions are useful in e.g., printed wiring boards or molding compounds for electronic applications, protective coatings, adhesives, as well as structural and decorative composite materials.

Abstract: An object is to provide a resin composition that has excellent dielectric properties, that yields a highly heat-resistant cured product, that provides a low viscosity when made into a varnish, and that has a high Tg and a high flame retardancy without containing halogen. The resin composition contains a polyarylene ether copolymer (A) that has an intrinsic viscosity, measured in methylene chloride at 25° C., of 0.03 to 0.12 dL/g and that has an average of 1.5 to 3 phenolic hydroxyl groups in molecular terminal position per molecule, a triphenylmethane-type epoxy resin (B) that has a softening point of 50 to 70° C., and a cure accelerator (C), wherein the content of the polyarylene ether copolymer (A) is 60 to 85 mass parts where the total of the polyarylene ether copolymer (A) and the epoxy resin (B) is 100 mass parts.

Abstract: A hydrolyzed divinylarene dioxide resin composition including the reaction product of (a) a divinylarene dioxide, and (b) water; a process for making the hydrolyzed divinylarene dioxide resin composition; and a curable hydrolyzed divinylarene dioxide resin composition made therefrom. The cured product made from the above hydrolyzed divinylarene dioxide resin composition offers improved properties such as a lower viscosity and a high heat resistance compared to known cured products prepared from known epoxy resins.

Abstract: Two-component epoxy resin compositions are disclosed. The polyepoxide component comprises one or more oligomers having at least one aromatic ring substituent R4X1—in which R4 represents a substituted or unsubstituted aliphatic group having at least 4 carbon atoms, a substituted or unsubstituted cycloaliphatic group having at least 5 carbon atoms, a poly(oxyalkylene) group wherein the average number of carbon atoms per oxyalkylene unit is at least 3, or a aryl group having one or more of the foregoing substituents, bonded directly to the aryl group via a covalent bond or bonded to the aryl group via an oxy, a thio, or a carbonyloxy divalent linking group, or a combination thereof, and X1 represents a covalent bond or a divalent moiety selected from oxy, thio, carbonyloxy, and —X2C(R2)2C(R1)(OH)C(R2)2O—, in which X2 represents a covalent bond or a divalent moiety selected from oxy, thio, and carbonyloxy, R1 represents —H or —C1-14 alkyl, and each R independently represents —H or —CH3.

Abstract: A composition comprising a blend of a polyolefin, polylactic acid, and a reactive modifier. A method of producing an oriented film comprising reactive extrusion compounding a mixture comprising polypropylene, polylactic acid, a reactive modifier to form a compatibilized polymeric blend, casting the compatibilized polymeric blend into a film, and orienting the film. A method of preparing a reactive modifier comprising contacting a polyolefin, a multifunctional acrylate comonomer, and an initiator under conditions suitable for the formation of an epoxy-functionalized polyolefin wherein the epoxy-functionalized polyolefin has a grafting yield of from 0.2 wt. % to 15 wt. %.

Abstract: A hybrid epoxy resin adduct comprising, consisting of, or consisting essentially of the reaction product of: (A) a material selected from the group consisting of a hybrid polyfunctional aliphatic epoxy resin, a hybrid cycloaliphatic epoxy resin, and combinations thereof; wherein (A) is formed by contacting: (a) a hydroxyl-containing material selected from the group consisting of an aliphatic hydroxyl-containing material, a cycloaliphatic hydroxyl-containing material, and combinations thereof; (b) a material selected from the group consisting of a monoglycidyl ether-containing material, a diglycidyl ether-containing material, and combinations thereof wherein (b) is prepared from a different precursor than (a); (c) an epihalohydrin; (d) a basic acting substance; (e) a non-Lewis acid catalyst; and (f) optionally, a solvent and (B) at least one epoxide reactive compound comprising one or more compounds having two or more epoxide-reactive hydrogen atoms per molecule, is disclosed.

Abstract: The present invention relates to a curable composition, comprising at least one benzoxazine compound, and at least one sulfonic acid ester having a cyclic structure. In particular, the invention relates to the use of at least one sulfonic acid having a cyclic structure as a heat-activatable catalyst for curable composition, comprising at least one benzoxazine compound.

Abstract: An epoxy resin composition includes: epoxy resin as a main component; and diamine having phenylene oxide skeleton indicated by an equation of: A code of “X” is a hydrogen or a methyl group, and a suffix of “n” is an integer in a range between 1 and 10. In the above composition, the gelation time is short, compared with a case where the epoxy resin composition with using phenylene sulfide skeletal diamine as hardening agent of an epoxy resin.

Abstract: Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

Abstract: A curable epoxy resin composition including a defined aromatic epoxy resin component and a defined latent catalyst system, and optionally further additives, the curable composition being a single epoxy resin composition having a prolonged pot life at a processing temperature within the range of 40° C. to 70° C., wherein: (a) the epoxy resin component is a compound of formula (I) in monomeric form or in a low polymeric form thereof, or is a mixture of such compounds: the epoxy resin component having an inherent viscosity within the range of 80 mPas to 300 mPas, measured at a temperature of 50° C.; (b) the latent catalyst system includes at least one metal acetylacetonate and at least one phenolic compound.

Abstract: A structural adhesive exhibiting good humidity resistance in the uncured state, good failure mode after curing, good crash stability, and good corrosion resistance, is provided, as well as methods of use thereof. The structural adhesive and methods of use thereof are applicable, e.g., in complete knock down (CKD) assembly systems, e.g., in the assembly of automobile body structures.

Abstract: The present invention provides Mannich base derivatives of N,N?-dimethyl secondary diamine polymers including Mannich base derivatives of methylamine-terminated poly-(N-methylazetidine) and Mannich base derivatives of methylamine-terminated poly-(N-methylazacycloheptane). Amine curing agent compositions and amine-epoxy compositions containing Mannich base derivatives of N,N?-dimethyl secondary diamine polymers are also disclosed.

Abstract: The invention provides an epoxy resin composition, a novel epoxy resin, a novel phenol resin and a semiconductor encapsulating material. The cured article of the epoxy resin composition has superior characteristics in flame retardancy, heat-resistant and curing. The epoxy resin composition is a preferable resin composition using in a semiconductor device or a circuit board device, and has the structure in which a naphthalene structure is bonded with an arylene group through an oxygen atom, and the total number of the aromatic nucleus in both the naphthalene structures and the arylenes group is 2-8. The epoxy resin composition essentially includes an epoxy resin (A) having the glycidoxy group as a substituent in the aromatic nucleus and a curing agent (B).

Abstract: A curing agent composition including at least one benzylated polyamine compound. The benzylated polyamine compound is a reaction product of a benzaldehyde compound or benzyl halide compound and a polyamine according to the following formula: H2N—CH2-A-CH2-NH2 where A is a phenylene group or a cyclohexylene group. A method for making the curing agent composition and an amine-epoxy composition are also disclosed.

Abstract: A light-curing resin composition includes an epoxy resin having two or more epoxy groups in one molecule; a photopolymerization initiator including an anion component and a cation component; and an aralkyl compound having an alcoholic hydroxyl group.

Abstract: Provided is a prepreg suffering little resin particle fall-off and little resin peeling during prepreg production and during handling in order to have excellent dielectric properties for PPE and favorable adhesiveness. A PPE-containing prepreg constituted of a base material and a curable resin composition including PPE particles, wherein the prepreg is characterized in that (1) PPE extracted from the prepreg using a mixed solvent of toluene and methanol in a mass ratio of 95:5 includes PPE particles (A) insoluble in the mixed solvent, (2) the amount of PPE contained in the PPE particles (A) is 70 mass % or higher, and (3) the number-average molecular weight of the PPE contained in the PPE particles (A) is 8,000-40,000.

Abstract: The present invention relates to a lacquer composition, particularly an adhesive and corrosion-protective lacquer for rare earth magnets, on the basis of an epoxy resin mixture, a setting accelerator, a silane-based epoxy functional adhesion promoter and a solvent or a solvent mixture, wherein the lacquer composition includes 5 to 20 wt. %, with respect to the amount of solid resin in the base of the epoxy resin mixture, of a highly viscous epoxy resin based on bisphenol-A with an elastomer content of more than 30 wt. %.

Abstract: A method for the preparation of a photocurable resin by a reaction comprising the following steps i) reacting a mixture of a novolak type epoxy resin (A) and a dicyclopentadiene-phenol glycidylether resin (B) with ii) an advancement component (C) containing at least 2 phenolic hydroxyl groups per molecule; iii) reacting with an unsaturated monocarboxylic acid (D); and iv) esterification of the unsaturated group containing resin obtained from the steps of i) to iii) with a polycarboxylic acid anhydride or a carboxylic acid anhydride (E) is disclosed.

Abstract: The present disclosure relates to a curing agent for a curable resin which is a reaction product obtained from the reaction of a liquid epoxy and a polyamine component. The curing agent may be used as part of a two component curable system for the curing of unmodified epoxy resins.

Abstract: A partially esterified epoxy resin and an epoxy resin composition applied with the same, and a method for preparing the composition are provided. The preparation method includes the following steps. A bifunctional epoxy resin and an anhydride are mixed and heated, wherein the number of equivalent moles of the bifunctional epoxy resin is greater than that of the anhydride, to form a partially esterified epoxy resin. A curing agent is mixed into the partially esterified epoxy resin to form a mixed solution. The mixed solution is cured to form the partially esterified epoxy resin composition.

Abstract: Phosphorus-containing benzoxazine-based bisphenols and derivatives thereof are disclosed. The phosphorus-containing benzoxazine-based bisphenols are prepared by reacting DOPO with benzoxazine to form the phosphorus-containing benzoxazine-based bisphenols. The phosphorus-containing benzoxazine-based bisphenols can further to form advanced epoxy resins. The advanced epoxy resins can further be cured to form flame retardant epoxy thermosets.

Abstract: Methods for making toner particles comprising a polyester-wax resin, wherein the polyester-wax resin includes a bio-based oil that is chemically incorporated into the main chain of the polyester resin. The toner particles may be formed using emulsion aggregation methods. A toner formed from the toner particles may be used in low-oil or oil-less fusing systems.

Abstract: Provided is a curable resin composition which can provide a cured article having a low dielectric constant and a low dielectric tangent, and can also provide a cured article having excellent moldability at ordinary press-molding temperatures, excellent heat resistance and excellent adhesion properties. The present invention provides a curable resin composition containing a polyphenylene ether, wherein the average number of phenolic hydroxy groups is 0.3 or more per molecule of the polyphenylene ether, the resin flow amount of the curable resin composition upon curing is 0.3 to 15% inclusive, and a cured article having a dielectric tangent of 0.005 or less at 1 GHz and a glass transition temperature of 170° C. or higher can be produced.

Abstract: The present technology is an epoxy resin composition for a fiber-reinforced composite material comprising a phosphorus-containing epoxy resin containing phosphorus in the skeleton thereof, a dicyandiamide, and a curing promoter containing at least one selected from 1,1?-(4-methyl-1,3-phenylene)bis(3,3-dimethylurea), phenyl-dimethylurea represented by the following formula (1), and methylene-diphenyl-bisdimethylurea represented by the following formula (2); wherein the phosphorus content of the phosphorus-containing epoxy resin is at least 1.0 mass % and at most 5.0 mass % in the epoxy resin composition.

Abstract: The present disclosure relates to a water-based amine curing agent which is a reaction product obtained from the reaction of an aqueous epoxy resin dispersion and a polyamine component. The water-based amine curing agent may be used as part of a two component coating system in the curing of modified or unmodified liquid or pre-dispersed curable resin.

Abstract: A thermosetting monomer comprising at least two of an aryl-cyanato group and at least two of a phosphorus group.

Abstract: The invention relates to a fixing mortar system for embedding anchoring means in mortar in holes or crevices, based on one or more hardening epoxy-based reactive resins, characterised in that it includes silanes which may or may not have reactive groups capable of participating in the polymerisation with a synthetic resin based on the hardening epoxy-based reactive synthetic resin(s) but which in any case have Si-bonded hydrolysable groups, and to related inventive subject matter such as processes, kits and uses.

Abstract: A carbon nanostructure that is free of a growth substrate can include a plurality of carbon nanotubes that are branched, crosslinked, and share common walls with one another. The carbon nanostructure can be released from a growth substrate in the form of a flake material. Optionally, the carbon nanotubes of the carbon nanostructure can be coated, such as with a polymer, or a filler material can be present within the porosity of the carbon nanostructure. Methods for forming a carbon nanostructure that is free of a growth substrate can include providing a carbon nanostructure adhered to a growth substrate, and removing the carbon nanostructure from the growth substrate to form a carbon nanostructure that is free of the growth substrate. Various techniques can be used to affect removal of the carbon nanostructure from the growth substrate. Isolation of the carbon nanostructure can further employ various wet and/or dry separation techniques.

Abstract: An aluminum chelate latent curing agent is configured such that an aluminum chelating agent and a specific arylsilane compound or a hydrolysate thereof are held in a polymer obtained by subjecting the aluminum chelating agent, the arylsilane compound, and a polyfunctional isocyanate compound to an emulsifying treatment, and then subjecting the polyfunctional isocyanate to interfacial polymerization. The aluminum chelating agent does not have an alkoxy group bonded to the aluminum. The arylsilane compound is a compound represented by the formula (A). (Ar)mSi(OR)n ??(A) In the formula (A), m is 2 or 3, and the sum of m and n is 4. Ar represents an optionally-substituted aryl group. R represents a hydrogen atom, a methyl group, or an ethyl group. When n is two, the two Rs may be the same or different.

Abstract: A powdered epoxy coating composition for coating a substrate. The coating composition comprises: (a) from about 50 wt % to about 90 wt % of at least one epoxy resin; (b) from about 1 wt % to about 30 wt % of at least one catechol novolak-type adhesion promoter; and (c) from about 0.1 wt % to about 5 wt % of magnesium oxide. The coating may also include from about 10 wt % to about 48 wt % of an inorganic filler. The coating composition provides improved adhesion at high temperature operating conditions and improved resistance to damage by cathodic disbondment for pipe, rebar, and other substrates.

Abstract: This invention relates to compositions useful as adhesives and more particularly to the preparation of epoxy-based adhesive composition with improved impact resistance and good adhesion to oily metal substrates.

Abstract: The present invention provides a curable resin composition which exhibits the following properties: excellent basic performances such as heat resistance; sufficient optical characteristics such as transparency; and excellent demoldability when a molded body of the composition is demolded at the time of molding. The present invention further provides a molded body obtainable by molding the curable resin composition and a production method thereof. A curable resin composition for molded bodies, including a thermocurable resin, wherein the curable resin composition for molded bodies includes at least one compound selected from the group consisting a compound having a boiling point of 260° C. or less at one atmospheric pressure, a silicon compound having a polyoxyalkylene chain, a silicon compound having an aryl group, and a silicon compound having a polyoxyalkylene chain and an aryl group.

Abstract: One embodiment of the invention includes a shape memory polymer which functions similar to a gecko footpad. A shape memory polymer may exhibit adhesive properties when heated above its glass transition temperature. A shape memory polymer may function as a reversible dry adhesive.

Abstract: The present invention encompasses polymer compositions comprising aliphatic polycarbonate chains containing functional groups that increase the polymer's ability to wet or adhere to inorganic materials. In certain embodiments, chain ends of the aliphatic polycarbonates are modified to introduce silicon-containing functional groups, boron-containing functional groups, phosphorous-containing functional groups, sulfonic acid groups or carboxylic acid groups.

Abstract: One embodiment of the invention includes a shape memory polymer which functions similar to a traditional mechanical clamp. A shape memory polymer may exhibit adhesive properties when heated above its glass transition temperature. The shape memory polymers may function as a reversible dry adhesive clamp.

Abstract: A thermosetting resin composition contains an active ester resin (A) and an epoxy resin (B) as essential components, the active ester resin (A) having a resin structure which includes a polyaryleneoxy structure (I) and in which aromatic carbon atoms in a plurality of the polyaryleneoxy structures (I) are linked through a structural site (II) represented by a structural formula 1 (wherein Ar represents a phenylene group, a phenylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms, a naphthylene group, or a naphthylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms).

Abstract: Disclosed are a thermosetting light-reflective resin composition, a method for preparing the same, an optical semiconductor element-mounted reflector produced therefrom, and an optical semiconductor device including the same. More specifically, disclosed are a thermosetting light-reflective resin composition which includes a polyhydric polyol having two or more hydroxyl groups and thus exhibits superior discoloration resistance and entails little deterioration in reflectance, a method for preparing the same, an optical semiconductor element-mounted reflector produced therefrom and an optical semiconductor device including the same.

Abstract: A method that includes applying a color enhancing composition to a substrate and drying the color enhancing composition, where the color enhancing composition includes a carrier fluid; chromatically selective scattering particles having a particle size distribution as measured by (weight average diameter)/(number average diameter) of less than or equal to 1.1; and an absorber of visible light.

Abstract: A method of accelerating a curing process in resin overflow systems for use in casting processes includes the step of adding a curing accelerator for the resin into the resin overflow system. In addition, a resin overflow container and a compartment with a curing accelerator for use in casting processes are provided.

Abstract: A method for modifying a rate of temperature change of an epoxy resin composition in a resin container during a resin casting process is proposed. The resin composition has at least one epoxy monomer component and a curing agent. A passivation agent for the curing agent is added to the epoxy resin composition. A resin container arrangement for use in such a resin transfer moulding process, a composite product having an epoxy resin composition, and a use of an organic acid in an epoxy resin casting process as a passivation agent for modifying the rate of temperature change in a resin container containing an epoxy resin composition are proposed.