Abstract: A semiconductor integrated circuit and a pattern lay-outing method for the same are disclosed, which can suppress bending or partial drop-out of a dummy pattern even when a mechanical stress acts on the dummy pattern in CMP. The semiconductor integrated circuit includes predetermined functional areas and a dummy pattern formed in a space area. The space area is positioned between predetermined functional areas. The dummy pattern includes a first metal portion formed in the shape of a frame and defining an outer edge of the dummy pattern, a second metal portion positioned on an inner periphery side of the first metal portion and formed so as to be continuous with the first metal portion, and a plurality of non-forming areas positioned in an area where the second metal portion is not formed on the inner periphery side of the first metal portion.

Abstract: A method of designing arrangement of through silicon vias (TSVs) in a stacked semiconductor device is provided The method includes: determining a plurality of TSV candidate grids representing positions, into which the TSVs are insertable, in each of a plurality of semiconductor dies stacked mutually and included in a stacked semiconductor device; creating a plurality of path graphs representing linkable signal paths for a plurality of signals transmitted through the stacked semiconductor device, respectively, based on the TSV candidate grids; determining initial TSV insertion positions corresponding to shortest signal paths for the signals based on the path graphs; and determining final TSV insertion positions by verifying the initial TSV insertion positions so that a plurality of signal networks corresponding to the shortest signal paths for the signals have routability.

Abstract: First and second pin groups are each formed from a plurality of pins associated with specific nets. Pins in the first pin group are to be wired to pins in the second pin group according to their associated nets. A candidate selection unit selects a set of pair candidates each specifying a first pair of pins in the first pin group and a second pair of pins in the second pin group. The first and second pairs of pins are associated with the same pair of nets, and their respective distances are within a specified range. A pair determination unit determines which pins in the first and second pin groups are to be wired in pairs, based on the pair candidates selected by the candidate selection unit.

Abstract: High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed.

Abstract: A method including developing a circuit schematic diagram, the circuit schematic diagram including a plurality of cells. The method further includes generating cell placement rules for the plurality of cells based on the circuit schematic diagram and developing a circuit layout diagram for the plurality of cells based on the cell placement rules. The method further includes grouping the plurality of cells of the circuit layout diagram based on threshold voltages and inserting threshold voltage compliant fillers into the circuit layout diagram. A system for implementing the method is described. A layout formed by the method is also described.

Abstract: A method for generating a layout for a device having FinFETs from a first layout for a device having planar transistors is disclosed. The planar layout is analyzed and corresponding FinFET structures are generated in a matching fashion. The resulting FinFET structures are then optimized. Dummy patterns and a new metal layer may be generated before the FinFET layout is verified and outputted.

Abstract: This disclosure relates generally to field-programmable gate arrays (FPGAs). Some implementations relate to methods and systems for partitioning FPGA circuit designs to facilitate certification. In one aspect, a method includes generating a hardware description language (HDL) implementation of a circuit design. The method additionally includes partitioning the design into a first portion and a second portion. In some implementations, the second portion corresponds to a safety-critical portion of the design while the first portion corresponds to a non-safety-critical portion. The method additionally includes generating first configuration settings for the first portion and generating second configuration settings for the second portion. The method additionally includes verifying, or providing to a third-party certification body for verification, the first configuration settings for the first portion and the second configuration settings for the second portion.

Abstract: A system and method for automatically modifying a first layout of a circuit. The first layout may describe a plurality of layers used in a fabrication process to manufacture the circuit. When performed, the fabrication process may result in a vertical electrical connection between two of the layers. However, the vertical electrical connection may not be directly specified by the first layout. The system and method may operate to apply a set of rules to the first layout to automatically generate a modified layout directly specifying a vertical electrical connection between the two layers. The set of rules may be based on knowledge of the fabrication process, and may be designed to modify the geometry of the first layout to more closely model the real geometry of the circuit that will result from the fabrication process. The modified layout may enable an electromagnetic (EM) simulation of the circuit to be accurately performed.

Abstract: Embodiments of the invention place surface-mount such as decoupling capacitors, resistors or other devices directly on the underside of a ball grid array (BGA) electronic integrated circuit (EIC) package, between BGA pads.

Abstract: A system and method for reducing power consumption in a reconfigurable integrated circuit. Some embodiments provide placement and routing programs that reduce the number of bits to be reconfigured. Some embodiments provide placement and routing programs that increase the number of groups of circuits that do not need reconfiguration at some times. Some embodiments include circuits that selectively block reconfiguration.

Abstract: A target integrated circuit layout having a plurality of design rules having minimum rules and standard rules used in the target integrated circuit layout is provided. First and second design rule checks are performed, where respective first and second sets of violations of the plurality of design rules and each design rule associated with the first and second sets of violations are recorded. An analysis is performed on the first and second sets of violations, each design rule associated with the first and second sets of violations, and a frequency of usage of each of the plurality of design rules, and a rule usage rate is determined having a number of minimum rules used overall and a number of overall violations of the design rules. An interactive rule database is formed having statistics associated with the rule usage rate for subsequent implementation in an integrated circuit.

Abstract: A method of designing an IC design layout having similar patterns filled with a plurality of indistinguishable dummy features, in a way to distinguish all the patterns, and an IC design layout so designed. To distinguish each pattern in the layout, deviations in size and/or position from some predetermined equilibrium values are encoded into a set of selected dummy features in each pattern at the time of creating dummy features during the design stage. By identifying such encoded dummy features and measuring the deviations from image information provided by, for example, a SEM picture of a wafer or photomask, the corresponding pattern can be located in the IC layout. For quicker and easier identification of the encoded dummy features from a given pattern, a set of predetermined anchor dummy features may be used.

Abstract: An adaptive patterning method and system for fabricating panel based package structures is described. Misalignment for individual device units in a panel or reticulated wafer may be adjusted for by measuring the position of each individual device unit and forming a unit-specific pattern over each of the respective device units.

Abstract: Mechanisms are provided for performing placement of cells in a design of a semiconductor device. An initial design of the semiconductor device is generated, the initial design comprising a first placement of cells. A preferred direction of placement associated with the cells is determined. The preferred direction is a direction along which spreading of the cells is preferred. A second design of the semiconductor device is generated by modifying the first placement of the cells to generate a second placement of cells, different from the first placement cells, based on the preferred direction of placement associated with the cells.

Abstract: A delay analysis device composed of a storage device and a data processing device analyzes a chip fabricating a semiconductor integrated circuit. Delay calculation is performed via an RC simulation with reference to a layout-implemented macro net list, macro layout data, and a cell timing library, thus producing macro delay information. An initial stage of a macro is annotated by the global clock path delay information including the edge information so as to produce a global clock delay-annotated macro net list, which is then converted into a macro delay-annotated net list. Based on the macro delay-annotated net list and timing constraint, the delay analysis device calculates delay times of signal paths and clock paths as well as clock skews with a high precision. It checks whether or not the relationship between the delay times of signal paths and clock paths meets the timing constraint, thus producing delay analysis information.

Abstract: The number of nodes in an RTL schematic is reduced in a process of cloud grouping, a process whereby nodes that are not specified to be of interest will be grouped into a cloud to the extent possible. This results in a much simplified schematic as the remaining nodes within the schematic will be those nodes that the users desire to see. Analysis of all nodes including those designated as cut nodes is performed to determine what circuitry can or cannot be simplified. The user will also have the option to revert to the original schematic if viewing more than the cut nodes is desirable.

Abstract: A method for validating standard cells stored in a standard cell library and for use in design of an integrated circuit device is described. Each standard cell of the standard cells is iteratively placed adjacent to each side and corner of itself and each other standard cell of the standard cells to produce an interim test layout comprising a first plurality of cell pair permutations. The cell pair permutations are reduced by identifying at least one of: illegal or redundant left-right and top-bottom boundaries, and removing any cell pair permutations using the identified boundaries to generate a final test layout comprising a second plurality of cell pair permutations.

Abstract: Provided is a system and method for designing the layout of integrated circuits or other semiconductor devices while directly accessing design rules and a library of design features by interfacing with a GUI upon which the design layout is displayed. The design rules may be directly linked to the design features of the pattern library and imported into the device layout. The design rules may be directly accessed while designing the layout or while conducting a design rule check and the design features from the pattern library may be used in creating the layout.

Abstract: Various embodiments use connectivity information or model(s), design attribute(s), and system intelligence layer(s) to make lower blocks at lower levels aware of changes made in other blocks at same or different levels to implement the design at different levels synchronously. Budgeting is performed for the design to distribute budgets to respective blocks in the design. The various budgets may be borrowed from one or more blocks and lent to a block in order for this block to meet closure requirements such that a total number of iterations of the reassembly process, which integrates lower level blocks into top level design, may be reduced or completely eliminated. The design attribute(s) or the connectivity model(s) or information is updated upon the identification of changes to provide the latest information or data for properly closing a design.

Abstract: A method of an integrated circuit (IC) design includes receiving an IC design layout. The IC design layout includes an IC feature with a first outer boundary and a first target points assigned to the first outer boundary. The method also includes generating a second outer boundary for the IC feature and moving all the first target points to the second outer boundary to form a modified IC design layout.

Abstract: A standard cell for a semiconductor device has first and second opposing boundaries and third and fourth opposite boundaries, and includes first and second active regions formed in a semiconductor substrate. The first and second active regions are a first predetermined distance (a) from the first and second boundaries, respectively. A gate electrode is formed over the first and second active regions. First and second dummy diffusions layers are formed along the third boundary and are the first predetermined distance (a) from the first and second boundaries and a second predetermined distance (b) from the first and second active regions, respectively. Third and fourth dummy diffusions layers are formed along the fourth boundary and are the first predetermined distance (a) from the first and second boundaries and a third predetermined distance (b?) from the first and second active regions, respectively.

Abstract: A system and method for detecting an invalid winding path in a layout design file includes generating a first reticle pattern file using a first path generation program, generating a second reticle pattern file using a second path generation program, comparing the first and second reticle patterns files to detect the invalid winding path. The invalid winding path includes one or more overlapping polygons.

Abstract: Fixed outline shaped and modifiable outline shaped random logic macros of an electronic circuit design are manipulated by modifying an outline of a modifiable outline shape macro based on criteria consisting of any one of a macro port weight value, a macro port ordering; a macro rapport constraint or a macro logic depth and placing resulting macros at locations on an integrated circuit (chip).

Abstract: A wiring design method and apparatus are provided. The wiring design method includes dividing a wiring region represented by wiring region data to generate a plurality of first division regions based on a first wiring rule and generating, when a second wiring rule different from the first wiring rule may be set in the first division region, second division regions with the second wiring rule in the first division region.

Abstract: A method is provided for designing an integrated circuit device. The method includes placing four transistors of a first transistor type and four transistors of a second transistor type within a gate electrode level. Each of the transistors includes a respective linear-shaped gate electrode segment positioned to extend lengthwise in a first direction. The transistors of the first and second transistor types are placed according to a substantially equal centerline-to-centerline spacing as measured perpendicular to the first direction. A first linear conductive segment is placed to electrically connect the gate electrodes of the first transistors of the first and second transistor types. A second linear conductive segment is placed to electrically connect the gate electrodes of the fourth transistors of the first and second transistor types. A third linear conductive segment is placed beside either the first or second linear conductive segment.

Abstract: An integrated circuit with standard cells with top and bottom metal-1 and metal-2 power rails and with lateral standard cell borders that lie between an outermost vertical dummy poly lead from one standard cell and an adjacent standard cell. A DPT compatible standard cell design rule set. A method of forming an integrated circuit with standard cells constructed using a DPT compatible standard cell design rule set. A method of forming DPT compatible standard cells.

Abstract: Disclosed are embodiments of an integrated circuit chip designed for reliability at low ambient temperatures. The chip substrate can be divided into zones, including at least one temperature-sensitive zone (TSZ) that contains one or more temperature-sensitive circuits. Temperature sensor(s) can be positioned in the semiconductor substrate adjacent to the TSZ. Thermal radiator(s) can be embedded in a metal wiring layer and aligned above the TSZ. The temperature sensor(s) can be operatively connected to the thermal radiator(s) and can trigger operation of the thermal radiator(s) when the temperature in the TSZ is below a predetermined threshold temperature. Additionally, an on-chip power control system can be operatively connected to the thermal radiator(s) so that operation of the thermal radiator(s) is only triggered when a circuit within the TSZ is about to be powered up. Also disclosed are associated embodiments of a system and method for designing such an integrated circuit chip.

Abstract: A method of common-centroid IC layout generation includes the following steps of acquiring a netlist of one circuit-element set; summing up the numbers of the unit element of all elements of the circuit-element set to get the total number of the unit elements and then determine the unit element array, the aspect ratio of which is closest to 1, via a combination operation; generating multiple common-centroid placements according to the unit element array and applying global routing assignment to each of the common-centroid placements; proceeding with cost evaluation in such a way that a cost calculation is applied to each of the common-centroid placements to get a corresponsive value; and comparing all of the common-centroid placements according to the values got from the cost evaluation and selecting the common-centroid placement corresponding to one of the values according to a predetermined condition for detailed routing.

Abstract: In one embodiment, creating a layout for a Printed Circuit Board (PCB) by creating n boundary lines at n locations, respectively, on the PCB and placing n sets of electronic components on the n boundary lines, respectively; and iteratively adjusting and evaluating the layout of the PCB until a set of layout requirements for the PCB has been satisfied.

Abstract: In one embodiment of the invention, a method includes reading an automatically generated timing budgeting file, including timing budget information for a plurality of partitions of an integrated circuit design; graphically displaying a time budgeting debug window on a display device; and graphically displaying a timing budget analyzer window on the display device in response to selection of a selected signal path in a path list window pane. The timing budget analyzer window graphically displays timing budgets and timing delays of a selected path for visual comparison. The time budgeting debug window includes a button with a path category menu to display one or more signal paths meeting a selected path category, and a path list window pane to display a list of one or more signal paths through one or more ports of the plurality of partitions in response to the selected path category in the path category menu.

Abstract: Techniques for placement in highly constraint chip architectures are described herein. In an example embodiment, a computer system places a digital portion of an electronic design for a programmable chip. The programmable chip comprises multiple fixed-function blocks and a plurality of pins, where each one of the multiple fixed-function blocks can be coupled only to a respective subset of the plurality of pins. The electronic design comprises a particular fixed-function block (FFB) instance that is connected to a particular input-output (IO) instance. The computer system places (e.g., by using a backtracking search) the particular FFB instance on a particular fixed-function block and the particular IO instance on a particular pin from a particular subset of the plurality of pins, where in the programmable chip the particular fixed-function block can be coupled only to the particular subset of the plurality of pins.

Abstract: A technique for implementing an clock tree distribution network having a clock buffer and a plurality of LC tanks that each take into consideration local capacitance distributions and conductor resistances. An AC-based sizing formulation is applied to the buffer and to the LC tanks so as to reduce the total buffer area. The technique is iterative and can be fully automated while also reducing clock distribution power consumption.

Abstract: Micro-electro-mechanical structure (MEMS) capacitor devices, capacitor trimming for MEMS capacitor devices, and design structures are disclosed. The method includes identifying a process variation related to a formation of micro-electro-mechanical structure (MEMS) capacitor devices across a substrate. The method further includes providing design offsets or process offsets in electrode areas of the MEMS capacitor devices across the substrate, based on the identified process variation.

Abstract: System and methods for forming an integrated circuit using a standard cell library are provided. In some aspects, a method includes arranging cells from the standard cell library into a row between upper and lower power rails. Each cell includes a plurality of lateral nodes, at least one boundary region, and at least one dummy transistor. The method includes identifying a connection pattern of adjacent ones of the cells. The connection pattern is between (i) the lateral nodes of the adjacent cells and (ii) the upper and lower power rails. The method includes removing adjacent boundary regions of the adjacent cells based on the identified connection pattern of the adjacent cells, and modifying an arrangement of adjacent dummy transistors of the adjacent cells based on the removal of the adjacent boundary regions.

Abstract: A method for generating legal colorable multiple patterning standard cell placement is provided. In this method, a standard cell library including color information can be accessed. For each standard cell, edge labels can be assigned based on colors of objects within a predetermined distance from each edge. A truth table, which indicates legal spacing between pairs of standard cells based on their edge labels, can be accessed. A plurality of standard cells of a design can then be placed based on the truth table.

Abstract: A finFET block architecture uses end-to-end finFET blocks in which the fin lengths are at least twice the contact pitch, whereby there is enough space for interlayer connectors to be placed on the proximal end and the distal end of a given semiconductor fin, and on the gate element on the given semiconductor fin. A first set of semiconductor fins having a first conductivity type and a second set of semiconductor fins having a second conductivity type can be aligned end-to-end. Interlayer connectors can be aligned over corresponding semiconductor fins which connect to gate elements.

Abstract: A mechanism is provided for determining connectivity while minimizing wiring in an electronic system. The mechanism identifies a configuration of the electronic system, a location of each module in a plurality of modules within the electronic system and at least one constraint with regard to wiring the electronic system, the location of each module being identified using three-dimensional coordinates. The mechanism routes a separate cable from each module in the plurality of modules to each of the other modules in the plurality of modules without violating any constraints, thereby forming a plurality of cables. The mechanism then generates a cabling list indicating how each cable in the plurality of cables is to be routed in the electronic system in order to not violate any constraints and provide connectivity while minimizing wiring.

Abstract: A floorplanning method for an analog integrated circuit layout is disclosed. A first-type block is defined as a movable and deformable block with rectangle constraint, and a second-type block is defined as a fixed-size block without rectangle constraint. Each block in the floorplan is classified to the first-type or the second-type block. In a shape determination stage, a target shape is determined among candidates of the first-type block, the first-type block accordingly being modified to the target shape, resulting in at least one overlap in the floorplan. In an overlap elimination stage, neighboring blocks of each said overlap are analyzed, the overlap being then eliminated by utilizing surrounding space, resulting in unused space in the floorplan. In an enlargement stage, the unused space is utilized for enlarging the first-type block.

Abstract: A method of generating an area efficient power switch cell includes receiving, by a cell library design tool, a specification of a power switch circuit to be established as a power switch cell in a cell library. The cell library design tool also receives one or more attributes of the power switch cell including a height of the cell boundary and receiving, by the cell library design tool, a layout placement constraint requiring the power switch cell to be placed in a semiconductor layout so as to bridge two parallel rows of doped wells. The parallel rows of doped wells are interleaved with doped substrate and the doping of the wells is of a different type than that of the substrate. Based on the specification of the power switch circuit, the one or more attributes, and the layout placement constraint, the cell library design tool generates the power switch cell.

Abstract: A method includes defining an array including a plurality of unit cells, receiving unit cell density parameters in a computing apparatus, and defining a plurality of sub-arrays of unit cells using the computing apparatus. The computing apparatus defines density features disposed between adjacent sub-arrays. The computing apparatus generates density feature density parameters based on the unit cell density parameters and at least one density limit.

Abstract: Approaches for placing and routing a circuit design on a programmable integrated circuit (IC) are disclosed. One partial reconfiguration (PR) resource portion of the circuit design is selected from a plurality of PR resource portions of the design. Uncontained resources in the PR resource portion is identified. The PR resource portion, less the uncontained resources, is placed in an assigned region, and the uncontained resources is placed on the programmable IC unconstrained by the assigned region of the PR resource portion. The design is routed from the placed PR resource portion to the placed uncontained resources, and the process is repeated for each unplaced PR resource portion. After placing the plurality of PR resource portions and routing to uncontained resources in the plurality of PR resource portions, unplaced portions of the circuit design are placed and routed.

Abstract: A computer aided design system can determine coverage of a metal layer mosaic. The system can apply a tile pattern to a design including at least one layer. Then, the system can identify at least one tile of the tile pattern that violates at least one first design rule. After that, the system can apply a sub-tile pattern to an area identified in the identifying the at least one tile of the tile pattern that violates the design rule. The system further can identify at least one sub-tile of the sub-tile pattern that violates at least one second design rule. Finally, the system can apply a deep-sub-tile pattern to an area identified in the identifying the at least one sub-tile of the sub-tile pattern that violates the second design rule.

Abstract: The invention provides, in some aspects, a method of automated diagram generation that includes inputting a description of a plurality of entities and connectivity relationships in which those entities participate with one another; assigning the entities to each of one or more groups groups; assigning the entities to each of one or more columns, each of which has one or more lanes; determining a candidate layout of columns for placement into one or more workspaces based on widths assigned to those columns; assigning connectivity relationships of one or more entities in at least one column to each of one or more lanes based on the column(s) to which entities participating in those connectivity relationships are assigned; assigning widths to at least one of the columns as a function of those lane assignments; and outputting a representation of that candidate layout.

Abstract: A system may include a database configured to store information including characteristics of a plurality of components. The system may further include a server in communication with the database and configured to: receive design parameters indicative of a plurality of power supply loads to be powered; determine a plurality of power supply architectures that may be used to provide power supply solutions satisfying the plurality of loads, each power supply architecture including at least one position requiring a component configured to satisfy a load requirement; for each one of at least a subset of the plurality of power supply architectures, determine, based on the characteristics of the plurality of components, at least one component configured to satisfy the corresponding load requirement for each position of the one of the power supply architectures; and generate at least one power supply design in accordance with the power supply architectures and the determined components.

Abstract: A semiconductor device wherein a delay chain is integrated; the semiconductor device having a semiconductor layer. The delay chain includes a plurality of delay cells placed in the semiconductor layer and electrically connected to each other so as to form the delay chain. The semiconductor device includes a first and second metal lines respectively connected to a supply voltage and a reference voltage and placed in a longitudinal direction on a surface of the semiconductor layer; each delay cell of the plurality of cells is electrically connected with the first and second metal lines. Any delay cell and its successive or preceding delay cells of the delay chain are placed in a transversal direction with respect to the first or the second metal line.

Abstract: Disclosed are improved methods, systems, and computer program products for implementing flexible models to perform efficient prototyping of electronic designs, which allows for very efficient analysis of the electronic designs. The flexible models allow many of the existing tools for designing electronics to perform more efficiently.

Abstract: Roughly described, the invention includes layouts and masks for an integrated circuit, in which the diffusion shape for a transistor includes a transversely extending jog on one or both transversely opposite sides, the jog having inner and outer corners, at least one of which is located relative to the gate conductor longitudinally such that during lithographic printing of the diffusion shape onto the integrated circuit, the corner will round and extend at least partly into the channel region. The invention also includes aspects for a system and method for introducing such jogs, and for an integrated circuit device having a non-rectangular channel region, the channel region being wider where it meets the source region than at some other longitudinal position under the gate.

Abstract: Among other things, one or more systems and techniques for defining a group bounding box for related cells of an integrated circuit, and generating a new layout for the integrated circuit comprising the group bounding box are provided herein. That is, one or more group bounding boxes are defined based upon positional values of related cells. Such group bounding boxes are placed within the new layout based upon a placement technique, such as an objective function that takes into account wire length, timing, and cell density, for example. The one or more group bounding boxes are sized or reshaped to reduce cell overlap within the new layout. In this way, the new layout comprises related cells, bound by one or more group bounding boxes, that are placed within the new layout according to a configuration that mitigates wire length and timing delay of the integrated circuit.

Abstract: Methods, computer program products, and systems are disclosed associated with calculating a routability metric for a second IC design using inputs from the compilation to a first IC design. The first and second IC designs are alternative implementation options for a user circuit design, such as FPGA and structured ASIC options. Information about user design demands on routing resources of one IC design are considered along with information about the projected supply of routing resources in another IC design, to produce a routing metric. The routing metric may be mapped to a degree of difficulty indicator, and either may be used to condition a compile of the user circuit to the second IC design or be used in other ways.

Abstract: A system and method are provided for laying out an integrated circuit design into a plurality of circuit layout cells having gaps therebetween, and inserting into each given one of at least a subset of the gaps, a corresponding filler cell selected from a predefined database in dependence upon a desired effect on a performance parameter of at least one circuit cell adjacent to the given gap. The circuit layout cells may be arranged in rows, and in some embodiments the selection of an appropriate filler cell for a given gap depends upon effects desired on a performance parameter of both circuit cells adjacent to the given gap. The predefined filler cells can include, for example, dummy diffusion regions, dummy poly lines, N-well boundary shifts and etch stop layer boundary shifts. In an embodiment, circuit layout cells can be moved in order to accommodate a selected filler cell.