Abstract: An integrated circuit device layout is created based on charge carrier mobility characteristics of the device's non-functional cells. The charge carrier mobility of the non-functional cells can alter behavioral characteristics such as the hold time, setup time, or leakage current of nearby functional logic cells. Accordingly, a layout tool creates the layout for the integrated circuit device by selecting and placing non-functional cells having different mobility so as to selectively alter the characteristics of nearby logic cells.

Abstract: A method for fabricating an integrated circuit is disclosed that includes, in accordance with an embodiment, providing a double patterning technology-compliant logical design for the integrated circuit, the logical design including a plurality of elements; scoring the design of one or more of the plurality of elements to produce a design score; modifying the design based at least in part on the design score; generating a mask set implementing the modified logical design; and employing the mask set to implement the logical design in and on a semiconductor substrate.

Abstract: In one embodiment, the invention is a method and apparatus for soft hierarchy-based synthesis for large-scale, high-performance circuits. One embodiment of a method for physically synthesizing a design of an integrated circuit includes compiling a logical description of the design into a flattened netlist, extracting a soft hierarchy from the flattened netlist, wherein the soft hierarchy defines a boundary on a die across which cells of the integrated circuit are permitted to move, and placing a cell of the integrated circuit on the die in accordance with the soft hierarchy.

Abstract: A method of calculating electrical interactions of circuit elements in an integrated circuit layout without flattening the entire database that describes the layout. In one embodiment, a hierarchical database is analyzed and resistance and capacitance calculations made for a repeating pattern of elements are re-used at each instance of the repeated pattern and adjusted for local conditions. In another embodiment, a circuit layout is converted into a number of tiles, wherein the resistance and capacitance calculations made for the circuit elements in the center and a boundary region of the tiles are computed separately and combined. Environmental information that affects electrical interaction between circuit elements in different levels of hierarchy is calculated at a lower level of hierarchy so that such calculations do not need to be made for each placement of a repeated cell and so that not all interacting elements need to be promoted to the same hierarchy level to compute the electrical interactions.

Abstract: A method of designing integrated circuits includes providing a design of an integrated circuit at a first scale, wherein the integrated circuit includes a shrinkable circuit including a first intellectual property (IP); and a non-shrinkable circuit including a second IP having a hierarchical structure. A marker layer is formed to cover the non-shrinkable circuit, wherein the shrinkable circuit is not covered by the marker layer. The electrical performance of the non-shrinkable circuit is simulated using a simulation tool, wherein the simulated non-shrinkable circuit is at a second scale smaller than the first scale.

Abstract: A system and method are provided for laying out an integrated circuit design into a plurality of circuit layout cells having gaps therebetween, and inserting into each given one of at least a subset of the gaps, a corresponding filler cell selected from a predefined database in dependence upon a desired effect on a performance parameter of at least one circuit cell adjacent to the given gap. The circuit layout cells may be arranged in rows, and in some embodiments the selection of an appropriate filler cell for a given gap depends upon effects desired on a performance parameter of both circuit cells adjacent to the given gap. The predefined filler cells can include, for example, dummy diffusion regions, dummy poly lines, N-well boundary shifts and etch stop layer boundary shifts. In an embodiment, circuit layout cells can be moved in order to accommodate a selected filler cell.

Abstract: A through-hole layout apparatus and method for reducing differences in layout density of through-holes. The through-hole layout apparatus includes an extractor, which extracts an existing through-hole from design data for a semiconductor integrated circuit, a calculator, which calculates a layout density of through-holes in a predetermined region for each through-hole extracted by the extractor, a selector, which selects a through-hole at the center of a predetermined region where the layout density is lower than a predetermined value as a target through-hole from among the through-holes extracted by the extractor and a through-hole adder, which determines a given position in a predetermined region centered on the target through-hole as a placement position at which a through-hole is to be added for each target through-hole selected by the selector.

Abstract: High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed.

Abstract: A polishing estimation/evaluation device includes a dividing unit, an overpolished area extracting unit, and a dummy modifying unit. The dividing unit divides a layout of an integrated circuit into a plurality of partial areas. The overpolished area extracting unit refers to an overpolishing condition indicating whether overpolishing occurs in a vicinity of a partial area based on a wiring density in the partial area and a wiring density in surrounding areas of the partial area, and extracts a partial area where the overpolishing occurs from the plurality of partial areas obtained by the division by the dividing unit. The dummy modifying unit modifies dummy wiring in the partial area where the overpolishing occurs extracted by the overpolished area extracting unit and/or dummy wiring in surrounding areas of the partial area to reduce the number of partial areas where the overpolishing occurs.

Abstract: Aspects of the invention relate to techniques for generating encrypted profiles for layout features. According to various implementations of the invention, a layout feature is partitioned into subdomains. The subdomains are associated with boundary nodes and internal nodes. Based on layout design and process profile data for the layout feature, a first electric parameter relationship is determined for the boundary nodes and the internal nodes. An encrypted profile for the layout feature is then generated by converting the first electric parameter relationship into a second electric parameter relationship involving the boundary nodes. The encrypted profile may be used for extracting parasitic parameters associated with the layout feature.

Abstract: A method, system, and computer program product for multi-patterning lithography (MPL) aware cell placement in integrated circuit (IC) design are provided in the illustrative embodiments. A global phase of cell movement is performed. A local phase cell movement is performed, wherein the local phase includes moving a color instance of the cell from a plurality of color instances of the cell within a row of cell in the IC design, wherein the global phase and the local phase are each performed before a final placement is produced for the IC design.

Abstract: An antenna ratio calculation section extracts components from which two or more independent metal wires are coupled to one of diffusion layer regions based on layout data read from a layout data accumulation section, determines, for each of the components, the area of each of the two or more independent metal wires and electrodes coupled to the respective metal wires, determines an antenna ratio between the area of each of the metal wires and the area of the electrode coupled to the metal wire, and determines a moderation value for moderating a design standard associated with plasma charge damage related to one of the metal wires based on the ratio of the total area of all the metal wires coupled to the one of the diffusion layer regions to the area of the one of the metal wires.

Abstract: A congestive placement preventing apparatus for modifying a circuit layout includes an analyzing module, a defining module and an extension module. The analyzing module performs a congestion analysis on the circuit layout to generate an analysis result. The defining module defines a congestion region and a share region adjacent to the congestion region on the circuit layout according to the analysis result. A density of electronic cells of the congestion region is higher than that of electronic cells of the share region. The extension module arranges a plurality of electronic cells in the congestion region to the congestion region and the share region, thereby reducing the density of electronic cells in the congestion region.

Abstract: An integrated circuit and method of generating a layout for an integrated circuit in which circuitry peripheral to an array of repetitive features, such as memory or logic cells, is realized according to devices constructed similarly as the cells themselves, in one or more structural levels. The distance over which proximity effects are caused in various levels is determined. Those proximity effect distances determine the number of those features to be repeated outside of and adjacent to the array for each level, within which the peripheral circuitry is constructed to match the construction of the repetitive features in the array.

Abstract: A method of designing an integrated circuit includes defining at least one dummy layer covering at least one of a portion of a first metallic layer and a portion of a second metallic layer of an integrated circuit. The second metallic layer is disposed over the first metallic layer. The first metallic layer, the second metallic layer and a gate electrode of the integrated circuit have a same routing direction. A logical operation is performed to a file corresponding to the at least one of the portion of the first metallic layer and the portion of the second metallic layer covered by the dummy layer so as to size at least one of the portion of the first metallic layer and the portion of the second metallic layer.

Abstract: An integrated circuit and method of generating a layout for an integrated circuit in which circuitry peripheral to an array of repetitive features, such as memory or logic cells, is realized according to devices constructed similarly as the cells themselves, in one or more structural levels. The distance over which proximity effects are caused in various levels is determined. Those proximity effect distances determine the number of those features to be repeated outside of and adjacent to the array for each level, within which the peripheral circuitry is constructed to match the construction of the repetitive features in the array.

Abstract: The disclosed integrated circuit includes a first and a second power supply wirings, a flip-flop circuit, and a switch element. The first and the second power supply wirings are connected to the common power supplies. The flip-flop circuit is required to hold the stored data even when the voltage supply from the power supplies to the integrated circuit is stopped. The flip-flop circuit is connected to the first power supply wiring. The switch element is a transistor, for example, and switches whether or not the voltage is supplied from the power supplies. The switch element is provided on the second power supply wiring.

Abstract: Vacant areas of a layer of an integrated circuit design are filled with shapes connected to the appropriate nets.

Abstract: An automated method for aligning a critical datapath in an integrated circuit design inserts an artificial alignment net in the netlist which interconnects all cells in the bit stack of the datapath. The cells are placed using a wirelength optimization which assigns weights to wire sections based on the alignment direction. The rate of change of the alignment weighting value can vary during different stages of global placement. The invention is particularly suited for a force-directed placer which uses a linear system solver to obtain a globally optimum solution for placement of the cells having some overlap among the cells, and thereafter spreads the cells to reduce the overlap. Pseudo nets are also inserted which interconnect a cell and an expected location of the cell after spreading for that iteration.

Abstract: A global placement grating (GPG) is defined for a chip level to include a set of parallel and evenly spaced virtual lines. At least one virtual line of the GPG is positioned to intersect each contact that interfaces with the chip level. A number of subgratings are defined. Each subgrating is a set of equally spaced virtual lines of the GPG that supports a common layout shape run length thereon. The layout for the chip level is partitioned into subgrating regions. Each subgrating region has any one of the defined subgratings allocated thereto. Layout shapes placed within a given subgrating region in the chip level are placed in accordance with the subgrating allocated to the given subgrating region. Non-standard layout shape spacings at subgrating region boundaries can be mitigated by layout shape stretching, layout shape insertion, and/or subresolution shape insertion, or can be allowed to exist in the final layout.

Abstract: Disclosed is an improved approach for managing, tracking, and querying hierarchical data in layouts. According to some aspects, hierarchical grids are employed utilizing a scheme that organizes physical objects into a set of gradually refined grids that avoids the need to maintain duplicates while enhancing the desirable characteristics of existing schemes, including fast query times, fast data structure initialization and reduced memory footprint. Each grid-cell may be further partitioned into sub-containers to more efficiently provide space pruning during query operations. According to one approach, structures maintained to track existence of objects in a descendent hierarchy.

Abstract: A first transistor has source and drain regions within a first diffusion fin. The first diffusion fin projects from a surface of a substrate. The first diffusion fin extends lengthwise in a first direction from a first end to a second end of the first diffusion fin. A second transistor has source and drain regions within a second diffusion fin. The second diffusion fin projects from the surface of the substrate. The second diffusion fin extends lengthwise in the first direction from a first end to a second end of the second diffusion fin. The second diffusion fin is positioned next to and spaced apart from the first diffusion fin. Either the first end or the second end of the second diffusion fin is positioned in the first direction between the first end and the second end of the first diffusion fin.

Abstract: A method includes performing a place and route operation using an electronic design automation tool to generate a preliminary layout for a photomask to be used to form a circuit pattern of a semiconductor device. The place and route operation is constrained by a plurality of single patterning spacer technique (SPST) routing rules. Dummy conductive fill patterns are emulated within the EDA tool using an RC extraction tool to predict locations and sizes of dummy conductive fill patterns to be added to the preliminary layout of the photomask. An RC timing analysis of the circuit pattern is performed within the EDA tool, based on the preliminary layout and the emulated dummy conductive fill patterns.

Abstract: Within a dynamic array architecture, an irregular wire layout region within a portion of a chip level layout is bracketed by placing first and second regular wire layout shapes on a first and second sides, respectively, of the irregular wire layout region. One or more irregular wire layout shapes are placed within the irregular wire layout region. A first edge spacing is maintained between the first regular wire layout shape and a first outer irregular wire layout shape within the irregular wire layout region nearest to the first regular wire layout shape. A second edge spacing is maintained between the second regular wire layout shape and a second outer irregular wire layout shape within the irregular wire layout region nearest to the second regular wire layout shape. The first and second edge spacings are defined to optimize lithography of the regular and irregular wire layout shapes.

Abstract: Approaches for generating a hardware definition from a program specified in a high-level language. In one approach, a first set of blocks of instructions in the high-level language program is identified. Each block in the first set is bounded by a respective loop designation in the high-level language. For each block in the first set, an associated respective second set of one or more blocks of the program is identified. Each block in the second set is outside the block in the first set. A hardware definition of the program is generated and stored. For each block in the first set, the hardware definition specifies power-reducing circuitry for one or more blocks in the associated second set. The power-reducing circuitry is controlled based on a status indication from the hardware definition of the block in the first set.

Abstract: In layout design step of the semiconductor integrated circuit manufacturing method, when it is found that the wiring length between an external terminal and an IO block (external terminal I/F circuit) corresponding to the external terminal increases after a floorplan of a circuit including a functional block and the IO block is determined, placement of the IO block is determined such that the IO block is placed close to the external terminal to alleviate constraints on the wiring between the IO block and the external terminal, and timing adjustment circuits whose number is determined according to the wiring length of a bus (or a shared bus) connecting a data transfer circuit and the IO block is inserted into the bus.

Abstract: Differences between block interfaces of a partitioned logic block in two floorplans of an integrated circuit can be determined by comparing an image of pins of a partitioned logic block in a first floorplan of the integrated circuit with an image of pins of the partitioned logic block in a second floorplan of the integrated circuit. The second floorplan can represent a new floorplan design resulting from a change to an integrated circuit design represented by the first floorplan. If no differences exist between pins of the partitioned logic block in the first and second floorplans, information representing the partitioned logic block in the second floorplan can be substituted with information representing the partitioned logic block in the first floorplan.

Abstract: A method for creating a layout for design representation of an electronic circuit with at least one port. The method includes segmenting the at least one port in the design representation into different regions, classifying the different regions of the at least one port according to timing and/or electronic and/or layout characteristics, assigning a priority for each classified region of the at least one port according to rules based on the timing and/or electronic and/or layout characteristics, and routing the design representation by accessing at least one of the classified regions of the port according to an order of the assigned priorities.

Abstract: A basic cell circuit architecture having plurality of cells with fixed transistors configurable for the formation of logic devices and single and dual port memory devices within a structured ASIC is provided. Different configurations of ensuing integrated circuits are achieved by forming variable interconnect layers above the fixed structures. The circuit architecture can achieve interconnection of transistors within a single cell or across multiple cells. The interconnection can be configured to form basic logic gates as well as more complex digital and analog subsystems. In addition, each cell contains a layout of transistors that can be variably coupled to achieve a memory device, such as a SRAM device. By having the capability of forming a logic circuit element, a memory device, or both, the circuit architecture is both memory-centric and logic-centric, and more fully adaptable to modern-day SoCs.

Abstract: A method of inserting dummy patterns is provided. The method includes: determining an applicable area in which dummy patterns shall be inserted and an inapplicable area in which dummy patterns shall not be inserted on a chip; and inserting dummy patterns starting from one side of the inapplicable area and arranging the inserted dummy patterns into circles. The method of the present invention ensures that dummy patters are preferentially inserted around the device that requires protection by dummy patterns, so that good uniformity of chip pattern densities is guaranteed and within-wafer uniformity is improved, thus improving the yield and performance of semiconductor devices.

Abstract: A wire-spacing verification method for a computer includes calculating a characteristic impedance of each wire model disposed in a substrate model on a basis of a propagation rate of a signal in the wire model and rise time or fall time of an element model for transmitting the signal, calculating a reference impedance for predetermined sections, creating a distribution map in a direction of a section length with respect to the characteristic impedance of each of the sections for which the reference impedance is calculated, calculating an index indicating a degree of mismatch with the reference impedance, on a basis of the created distribution map, and making an approval/denial determination on the wire model on a basis of the index.

Abstract: A device includes a definition unit which defines a directional graph having a grid point as a node and a line connecting adjacent grid points as a branch, a generation unit which sets a branch connecting a grid pointing a wiring prohibited area in the branches of the directional graph to the capacity of “0”, and which sets another branch to the capacity of “1”, and which connects the starting point or the end point to each grid point of the wiring terminal indicated by wiring information, thereby generating a flow network, a search unit which searches the flow network for a path of a flow having the maximum amount of flow from the starting point to the end point, and a determination unit which determines a wiring path connecting the grid point indicated by the wiring information according to the search result of the path.

Abstract: Methods and systems for migrating circuit layouts. A floorplan layout is built for a target circuit using a subset of constraints that characterize a layout structure of an original circuit. Shape-constraint-based scaling is used on the floorplan layout by scaling parts of the floorplan layout in accordance with a plurality of different scaling ratios such that portions of the floorplan layout are concurrently scaled with the plurality of different scaling ratios. Cells are placed at locations defined by the floorplan layout. The floorplan layout is checked with shape-constraint-based legalization using all of the constraints to produce a migrated layout.

Abstract: A semiconductor device has first wiring layers and a plurality of dummy wiring layers that are provided on the same level as the first wiring layers. The semiconductor device defines a row direction, and first virtual linear lines extending in a direction traversing the row direction. The row direction and the first virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the first virtual linear lines. The semiconductor device also defines a column direction perpendicular to the row direction, and second virtual linear lines extending in a direction traversing the column direction. The column direction and the second virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the second virtual linear lines.

Abstract: In an embodiment, a buffer bay is represented with a moveable object that has a location within a unit in a netlist. The location of the moveable object that represents the buffer bay is changed to a new location in the netlist if changing the location improves placement within the unit. In an embodiment, a net weight of a net that connects the moveable object to an artificial pin is considered in determining whether to change the location to the new location. In an embodiment a bounding area that encompasses the location is considered in determining whether to change the location to the new location.

Abstract: A method for designing an optimal wiring topology for electromigration avoidance is disclosed. The wiring topology includes multiple sources, multiple sinks and multiple wires. The method includes the following steps: A feasible wire, a wire of the shortest length connecting each pair of source and sink, is calculated, and the capacity of each feasible wire is decided. An initial feasible topology is found. A flow network is created based on the initial topology. Negative cycles are iteratively checked and removed until no more negative cycles.

Abstract: A method and system are described for generating a performance prediction report to assist finalizing a partitioning scheme of a block diagram model. Providing a user-defined partitioning scheme and information describing a target hardware platform used in that partitioning scheme, the present invention can generate a performance prediction report by analyzing the computational characteristics of the block diagram model.

Abstract: An embodiment of an integrated circuit is disclosed. For this embodiment, the integrated circuit includes circuit blocks. At least one transistor of a circuit block of the circuit blocks includes a portion of a semiconductor substrate having a diffusion layer. The circuit block has a relatively high diffusion pattern density as compared with others of the circuit blocks. The diffusion layer has an exposed surface active area constrained responsive to a design rule. The design rule is to limit to a maximum amount the surface active area in order to improve at least one parameter of the at least one transistor selected from a group consisting of an increase in switching speed and a decrease in leakage current of the at least one transistor of the circuit block having the relatively high diffusion pattern density.

Abstract: Methods, software, and systems implementing software provide for accepting a user's selection of a database object defining layout being displayed. The database objects can include objects defining paths and path segments. Automatic layout tools may be used in creating at least some of the objects. The user's selection begins a recursive process of automatically selecting additional database objects based on criteria designed to create an uninterrupted spine from database objects on a single interconnect layer, of the same width, and collectively arranged such that the spine has a first end and a second end, and can be traced from the first end to the second end without backtracking.

Abstract: Embodiments of the claimed subject matter are directed to methods and a system that use a standardized grid of clock buffers to automatically route clocks according to a uniform clock grid throughout an ASIC of a non-uniform arrangement of non-uniformly sized logic partitions. According to one embodiment, clock sources and sinks are mapped to grid point locations and a novel grid routing process is performed to link them together. A clock routing macro is assigned to a corresponding partition and associated with the corresponding partition or logic unit according to a partition hierarchy. The underlying routing structure and resources of a clock routing macro are automatically renamed to correspond to the local partition in a script or schedule of programmed instructions, or a routing map. The position of blockages within a partition may also be detected and alternate routes for traversing the blockage may be preemptively determined as well.

Abstract: Embodiments of the invention place surface-mount such as decoupling capacitors, resistors or other devices directly on the underside of a ball grid array (BGA) electronic integrated circuit (EIC) package, between BGA pads.

Abstract: Semiconductor devices and/or structures, and methods for fabricating the same are disclosed. Embodiments of the present invention allow for production of customized products, while also minimizing production steps, avoiding some or all photolithography steps, and reducing overall production costs. Using selective deposition and patterning methods such as printing, to form metal and/or dielectric layer(s) on substrates where one or more device circuit components are pre-made in a factory, but which require further processing to obtain an electrically functional circuit, results in the ability for a user/consumer to make custom, specific and/or unique electrically functional circuits without incurring the cost and complexity of a full fabrication to form and pattern all of the layers.

Abstract: A circuit analysis tool is provided, enabled as computer software instructions, for budgeting time delays between integrated circuit (IC) modules. The instructions accept a command enabling an IC floor-plan including a first module and a second module. The first module includes a first circuit element having a signal output interface, and an output port. The second module includes an input port, and a second circuit element having a signal input interface. A command is accepted defining a maximum delay value, and a first delay value is estimated between the first circuit element signal output interface and the first module output port. A second delay value is estimated between the second circuit element signal input interface and the second module input port, and a third delay value is estimated between the first module output port and the second module input port. The first, second, and third delay values are summed, creating a time budget estimate.

Abstract: To considerably reduce the cell layout change after timing optimization to reduce the term of layout design by estimating timing and an area after the timing optimization. During the period of initial layout processing using a net list, a timing constraint, a floor plan, a layout library, a timing library, etc., a library for estimating timing/area for estimating the timing and area after the timing optimization is created in advance and whether the timing constraint can be met is estimated. A cell in a path that hardly meets the timing constraint is placed in proximity and conversely, a cell that easily meets the timing constraint is placed at a distance. At this time, an area increase is also estimated so that wiring congestion does not occur.

Abstract: A method of manufacturing a semiconductor device, including the steps of: acquiring information on a graphic composing a physical layout of a semiconductor integrated circuit; carrying out calculation for a transferred image in the physical layout; carrying out calculation for a signal delay based on the physical layout, and obtaining a wiring not meeting a specification having the signal delay previously set therein; and setting a portion into which a repeater is to be inserted based on at least one result of results obtained from the information on the graphic and calculation for the transferred image, respectively, with respect to the wiring not meeting the specification.

Abstract: In one embodiment of the invention, a method includes partitioning an integrated circuit design into a hierarchy of a top level and a plurality of partitions, wherein the top level includes a top level netlist and each partition includes a partition netlist; receiving data path timing budgets and clock path timing budgets for each of the plurality of partitions of the integrated circuit design; and generating a timing budget model of each partition in response to the respective data path timing budgets and clock path timing budgets, wherein each timing budget model includes an intra-partition clock timing constraint for each respective partition for independent implementation of the top level.

Abstract: A semiconductor device, includes a first wiring pattern in a first region, a second wiring pattern in a second region, and at least one first dummy pattern formed in the first region and at least one second dummy pattern formed in the second region. A total area of the at least one first dummy pattern is the same as a total area of the at least one second dummy pattern and a total length of pattern periphery of the at least one second dummy pattern is longer than a total length of pattern periphery of the at least one first dummy pattern. The first region and the second region have same area.

Abstract: An embodiment of a method for enabling a high level modeling system for implementing a circuit design in an integrated circuit device includes: receiving a high-level characterization of the circuit design; receiving a portable location constraint associated with elements of the circuit design; and generating, by a computer, a low-level characterization of the circuit design based upon the high-level characterization and the portable location constraint.

Abstract: The invention concerns a method and devices for analyzing the feasibility of a computer system composed of subsystems, each having functions. After having determined the functional architecture of the computer system comprising at least one subsystem and at least one function, the characteristics of the functions implemented are imported from a database. The user determines the number of subsystems and the number of connectors per subsystem. He then distributes the functions to the subsystems and enters the characteristics of the connectors and the characteristics of the subsystems. The computer system is analyzed in light of the information provided by the user and the characteristics of the functions implemented in order to determine the feasibility of the computer system.

Abstract: Techniques are described for increasing the density of structures in a layout circuit design, while reducing undesired total interconnect capacitance that might otherwise be created by the increase in structure density. Data representing a pattern of fill structures is added to the fill regions of the design for one of the layers. Data representing a pattern of fill structures then is added to the fill regions of the design for another of the layers adjacent to the first layer. In the design for the second conductive layer, however, the pattern of fill structures is offset from the pattern of fill structures added to the design for the first layer in a direction substantially parallel to the layers. The offset may be selected to minimize or otherwise reduce the amount of overlap between the fill structures along a direction substantially perpendicular to the layers, thereby reducing the total interconnect capacitance associated with the layers.