Semiconductor module

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Description

FIG. 1 is a front view of a semiconductor module showing our new design;

FIG. 2 is a rear view of the semiconductor module thereof;

FIG. 3 is a left view of the semiconductor module thereof;

FIG. 4 is a right view of the semiconductor module thereof;

FIG. 5 is a top side view of the semiconductor module thereof; and,

FIG. 6 is a bottom side view of the semiconductor module thereof.

The thinner lines other than a thicker line in the front view, the rear view, the left side view the right side view, the top view, and the bottom view represents a shape of a three-dimensional shape.

Claims

The ornamental design for a semiconductor module, as shown and described.

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Patent History
Patent number: D1046799
Type: Grant
Filed: Sep 9, 2021
Date of Patent: Oct 15, 2024
Assignee: ASAHI KASEI MICRODEVICES CORPORATION (Tokyo)
Inventors: Osamu Shirata (Tokyo), Yusuke Hidaka (Tokyo)
Primary Examiner: Garth Rademaker
Assistant Examiner: Suzanne E Tisdell
Application Number: 29/807,156