Semiconductor module
Latest ASAHI KASEI MICRODEVICES CORPORATION Patents:
Description
The thinner lines other than a thicker line in the front view, the rear view, the left side view the right side view, the top view, and the bottom view represents a shape of a three-dimensional shape.
Claims
The ornamental design for a semiconductor module, as shown and described.
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Patent History
Patent number: D1046799
Type: Grant
Filed: Sep 9, 2021
Date of Patent: Oct 15, 2024
Assignee: ASAHI KASEI MICRODEVICES CORPORATION (Tokyo)
Inventors: Osamu Shirata (Tokyo), Yusuke Hidaka (Tokyo)
Primary Examiner: Garth Rademaker
Assistant Examiner: Suzanne E Tisdell
Application Number: 29/807,156
Type: Grant
Filed: Sep 9, 2021
Date of Patent: Oct 15, 2024
Assignee: ASAHI KASEI MICRODEVICES CORPORATION (Tokyo)
Inventors: Osamu Shirata (Tokyo), Yusuke Hidaka (Tokyo)
Primary Examiner: Garth Rademaker
Assistant Examiner: Suzanne E Tisdell
Application Number: 29/807,156
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)