Cover ring of top plate for semiconductor manufacturing apparatus

- NuFlare Technology, Inc.
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Description

FIG. 1 is a perspective view of a cover ring of top plate for semiconductor manufacturing apparatus showing our new design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a front elevational view thereof, the rear elevational view being a mirror image thereof;

FIG. 4 is a right-side elevational view thereof, the left-side elevational view being a mirror image thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a sectional view taken along line 7-7 of FIG. 5.

The dot-dash lines in the drawings illustrate boundaries of sectional views and form no part of the claimed design.

Claims

The ornamental design for a cover ring of top plate for semiconductor manufacturing apparatus, as shown and described.

Referenced Cited
U.S. Patent Documents
6238513 May 29, 2001 Arnold
D525127 July 18, 2006 Cogley
D658693 May 1, 2012 Suzuki
D716239 October 28, 2014 Lau
D717746 November 18, 2014 Lau
D827592 September 4, 2018 Ichino
D876504 February 25, 2020 Lee
D888903 June 30, 2020 Gunther
D891382 July 28, 2020 Koppa
D930782 September 14, 2021 Ryu
D933725 October 19, 2021 Koppa
D934315 October 26, 2021 Lavitsky
D940670 January 11, 2022 Kim
D941371 January 18, 2022 Lavitsky
D944946 March 1, 2022 Adachi
D949319 April 19, 2022 Jung
D992614 July 18, 2023 Sasaki
D992615 July 18, 2023 Sasaki
Foreign Patent Documents
D208042 November 2020 TW
Other references
  • Taiwanese Office Action (TW OA) dated Feb. 25, 2022 issued in Taiwanese patent application No. 110302988 and its English translation.
Patent History
Patent number: D1052546
Type: Grant
Filed: Feb 15, 2023
Date of Patent: Nov 26, 2024
Assignee: NuFlare Technology, Inc. (Kanagawa)
Inventors: Takuto Umetsu (Kanagawa), Masayoshi Yajima (Kanagawa), Kunihiko Suzuki (Kanagawa)
Primary Examiner: Derrick E Holland
Assistant Examiner: Caleb M Baker
Application Number: 29/884,700