Cover ring of top plate for semiconductor manufacturing apparatus
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Description
The dot-dash lines in the drawings illustrate boundaries of sectional views and form no part of the claimed design.
Claims
The ornamental design for a cover ring of top plate for semiconductor manufacturing apparatus, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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D888903 | June 30, 2020 | Gunther |
D891382 | July 28, 2020 | Koppa |
D930782 | September 14, 2021 | Ryu |
D933725 | October 19, 2021 | Koppa |
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D940670 | January 11, 2022 | Kim |
D941371 | January 18, 2022 | Lavitsky |
D944946 | March 1, 2022 | Adachi |
D949319 | April 19, 2022 | Jung |
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- Taiwanese Office Action (TW OA) dated Feb. 25, 2022 issued in Taiwanese patent application No. 110302988 and its English translation.
Patent History
Patent number: D1052546
Type: Grant
Filed: Feb 15, 2023
Date of Patent: Nov 26, 2024
Assignee: NuFlare Technology, Inc. (Kanagawa)
Inventors: Takuto Umetsu (Kanagawa), Masayoshi Yajima (Kanagawa), Kunihiko Suzuki (Kanagawa)
Primary Examiner: Derrick E Holland
Assistant Examiner: Caleb M Baker
Application Number: 29/884,700
Type: Grant
Filed: Feb 15, 2023
Date of Patent: Nov 26, 2024
Assignee: NuFlare Technology, Inc. (Kanagawa)
Inventors: Takuto Umetsu (Kanagawa), Masayoshi Yajima (Kanagawa), Kunihiko Suzuki (Kanagawa)
Primary Examiner: Derrick E Holland
Assistant Examiner: Caleb M Baker
Application Number: 29/884,700
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)