Circuit board with heat sink
Description
The even dashed broken lines shown in the drawings represent portions of the circuit board with heat sink that form no part of the claimed design.
Claims
The ornamental design for a circuit board with heat sink, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
| 3072734 | January 1963 | Fox |
| D255351 | June 10, 1980 | Pettijohn |
| 4235496 | November 25, 1980 | Aug |
| D292698 | November 10, 1987 | DeVita |
| 5172755 | December 22, 1992 | Samarov |
| D363920 | November 7, 1995 | Roberts |
| D396449 | July 28, 1998 | Taylor |
| 5920458 | July 6, 1999 | Azar |
| D430856 | September 12, 2000 | Wilkerson |
| D459706 | July 2, 2002 | Ebihara |
| D471524 | March 11, 2003 | Ebihara |
| 6765278 | July 20, 2004 | Parsons |
| D508681 | August 23, 2005 | Enderlein |
| D525213 | July 18, 2006 | Enderlein |
| D637193 | May 3, 2011 | Andre |
| D639756 | June 14, 2011 | Greene, Jr. |
| D642546 | August 2, 2011 | Greene, Jr. |
| D647072 | October 18, 2011 | Bentley |
| D787456 | May 23, 2017 | Matsumoto |
| D787457 | May 23, 2017 | Matsumoto |
| D798868 | October 3, 2017 | Daniel |
| D799438 | October 10, 2017 | Takahashi |
| 9883580 | January 30, 2018 | Vasoya |
| 10028413 | July 17, 2018 | Dede |
| D856948 | August 20, 2019 | Vasoya |
| D880484 | April 7, 2020 | Li |
| D883240 | May 5, 2020 | Fathauer |
| 10681801 | June 9, 2020 | Kotlar |
| D893439 | August 18, 2020 | Vasoya |
| D909319 | February 2, 2021 | Nordeen |
| D930601 | September 14, 2021 | McBride |
| D938374 | December 14, 2021 | McBride |
| D944219 | February 22, 2022 | McBride |
| 11289390 | March 29, 2022 | Yumoto |
| D949117 | April 19, 2022 | McBride |
| D956707 | July 5, 2022 | Yamauchi |
| D958762 | July 26, 2022 | McBride |
| D986191 | May 16, 2023 | Wen |
| D986192 | May 16, 2023 | Wen |
| D989014 | June 13, 2023 | McBride |
| D995456 | August 15, 2023 | Fleece |
| D995457 | August 15, 2023 | Fleece |
| D1001753 | October 17, 2023 | McBride |
| D1009815 | January 2, 2024 | McBride |
| D1010591 | January 9, 2024 | McBride |
| D1012872 | January 30, 2024 | McBride |
| 11903118 | February 13, 2024 | Sverdlik |
| D1022931 | April 16, 2024 | Kannan |
| D1051082 | November 12, 2024 | Nakazato |
| D1051866 | November 19, 2024 | Fleece |
| D1052544 | November 26, 2024 | Fleece |
| D1055879 | December 31, 2024 | Nakazato |
| D1059314 | January 28, 2025 | Zhang |
| D1102397 | November 18, 2025 | Zhang |
| 20090268390 | October 29, 2009 | King |
| 20110272179 | November 10, 2011 | Vasoya |
| 20210118769 | April 22, 2021 | Yumoto |
| 201630600978.1 | March 2017 | CN |
| 202330202371.8 | August 2024 | CN |
| 3019920001361 | December 1992 | KR |
- Heat Sink Design for Power Electronics: Tips and Best Practices, https://hillmancurtis.com/heat-sink-design-for-power-electronics/, 2022. (Year: 2022).
- Z Clip with anchor, https://radianheatsinks.com/z-clip/,2026. (Year: 2026).
- Supermicro SNK-P0046P 1U Passive Heatsink for LGA1156 LGA1150,https://www.ebay.com/itm/332355385048?_ul=US&mkevt=1&mkcid=1&mkrid=711-53200-19255-0&campid=5339137922&toolid=20006&customid=dee86607ab83166f52420fb302842c4c||&msclkid=dee86607ab83166f52420fb302842c4c&utm,Mar. 16, 2017. (Year: 2017).
- Large Aluminum Heatsink 8.66 ×7.87 ×0.7 inch / 220 ×200 ×18mm Radiator Cooler for LED Chip Electronic LCD Power Amplifier Heat Dissipation,https://www.amazon.com/dp/B0B7K8CB2W/ref=sspa_dk_detail_0?pd_rd_i=B0B7K8CB2W&pd_rd_w=Mp243&content-id=amzn1,Jan. 20, 2024. (Year: 2024).
- Non-Final Office Action for U.S. Appl. No. 29/977,292, mailed Jun. 9, 2025, 14 pages.
- Custom Heatsink Solutions by Radian,https://radianheatsinks.com/custom-heatsink/, 2024. (Year: 2024).
- 7.87 4″ (200mm) Wide Heatsink (64AS),https://heatsinkonline.com/products/787 4-wide-heatsink-64as?variant=42105917014178¤cy=USD&utm_medium=product_sync&utm_source=google&utm_content=sag_organic&utm_campaign=sag_organic&utm_campaign=gs-2022-07-05&utm_source=google&utm,Copyright © 2024. (Year: 2024).
- Heat Sink PCB,https://sfxpcb.com/producUheat-sink-pcb/, 2025. (Year: 2025).
- PCB Heat Sink for Effective Thermal Management,https://www.fs-pcba.com/pcb-heat-sink-for-optimal-pcb-thermal-management/, 2025. (Year: 2025).
Patent History
Patent number: D1139185
Type: Grant
Filed: May 21, 2025
Date of Patent: Aug 4, 2026
Assignee: Canaan Creative Co., LTD. (Beijing)
Inventors: Shaohua Zhang (Beijing), Huan Yang (Beijing), Nangeng Zhang (Beijing)
Primary Examiner: Elizabeth J Oswecki
Application Number: 30/004,719
Type: Grant
Filed: May 21, 2025
Date of Patent: Aug 4, 2026
Assignee: Canaan Creative Co., LTD. (Beijing)
Inventors: Shaohua Zhang (Beijing), Huan Yang (Beijing), Nangeng Zhang (Beijing)
Primary Examiner: Elizabeth J Oswecki
Application Number: 30/004,719
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)