Semiconductor wafer processing tool

- Lam Research Corporation
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Description

FIG. 1 is a perspective view of a semiconductor wafer processing tool, showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a semiconductor wafer processing tool, as shown and described.

Referenced Cited
U.S. Patent Documents
D260237 August 18, 1981 Fuzere
D292979 December 1, 1987 Chow
D323628 February 4, 1992 Takao
D328168 July 21, 1992 Bartle
D350490 September 13, 1994 Takao
D350942 September 27, 1994 Pellet
D376688 December 24, 1996 Gallagher
D431040 September 19, 2000 Makabe
D571739 June 24, 2008 Hosaka
D571740 June 24, 2008 Hosaka
D616394 May 25, 2010 Sato
D616395 May 25, 2010 Sato
D672645 December 18, 2012 Giannini
D732487 June 23, 2015 Lai
D732488 June 23, 2015 Lai
D758329 June 7, 2016 Lai
D764278 August 23, 2016 Tulin
D764909 August 30, 2016 Tulin
D803908 November 28, 2017 Yamaguchi
D822081 July 3, 2018 Yamaguchi
D863055 October 15, 2019 Hudson
D871466 December 31, 2019 Okada
D874413 February 4, 2020 Hart
D887832 June 23, 2020 Boersma
Other references
  • “Korean Application Serial No. 30-2019-0034113, Notice of Preliminary Rejection dated Mar. 17, 2020”, w/o English Translation, 4 pgs.
Patent History
Patent number: D935424
Type: Grant
Filed: May 6, 2019
Date of Patent: Nov 9, 2021
Assignee: Lam Research Corporation (Fremont, CA)
Inventor: Eller Y. Juco (Tualatin, OR)
Primary Examiner: Michael C Stout
Assistant Examiner: Fritzgerald L Butac
Application Number: 29/690,193